TPS2062DGNR

TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES Check for Samples: TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 FEATURES APPLICATIONS • • • • • • 1 2 • • • • • • • • • • 70-mΩ High-Side MOSFET 1-A Continuous Current Thermal and Short-Circuit Protection Accurate Current Limit (1.1 A min, 1.9 A max) Operating Range: 2.7 V to 5.5 V 0.6-ms Typical Rise Time Undervoltage Lockout Deglitched Fault Report (OC) No OC Glitch During Power Up 1-μA Maximum Standby Supply Current Bidirectional Switch Ambient Temperature Range: -40°C to 85°C Built-in Soft-Start UL Listed - File No. E169910 Heavy Capacitive Loads Short-Circuit Protections TPS2062/TPS2066 D AND DGN PACKAGE (TOP VIEW) TPS2061/TPS2065 D AND DGN PACKAGE (TOP VIEW) GND IN IN EN 1 2 3 4 † OUT OUT OUT 8 7 6 5 OC GND IN † EN1 † EN2 GND IN IN1 GND OC † EN 8 7 6 5 OC1 OUT1 OUT2 OC2 TPS2063/TPS2067 D PACKAGE (TOP VIEW) TPS2061/TPS2065 DBV PACKAGE (TOP VIEW) OUT 1 2 3 4 † EN1 † EN2 GND IN2 † EN3 NC 1 2 3 4 5 6 7 8 16 15 14 OC1 OUT1 OUT2 13 12 11 10 9 OC2 OC3 OUT3 NC NC † All Enable Inputs Are Active High For TPS2065, TPS2066, and TPS2067 DESCRIPTION The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and short-circuits are likely to be encountered. This device incorporates 70-mΩ N-channel MOSFET power switches for power-distribution systems that require multiple power switches in a single package. Each switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2009, Texas Instruments Incorporated TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION (CONTINUED) When the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1.5 A typically. AVAILABLE OPTION AND ORDERING INFORMATION TA RECOMMEND ED MAXIMUM CONTINUOUS LOAD CURRENT ENABLE TYPICAL SHORTCIRCUIT CURRENT LIMIT AT 25°C PACKAGED DEVICES (1) NUMBER OF SWITCHES Active low Single Active high Active low -40°C to 85°C Dual Active high 1A Active low 1.5 A Active high Active low TPS2061DGN TPS2061D - TPS2065DGN TPS2065D - TPS2062DGN TPS2062D - TPS2066DGN TPS2066D - - TPS2063D - - TPS2067D - - - TPS2061DBV - - TPS2065DBV Single Active high (1) (2) SOIC (D) Triple SOT23 (DBV) (2) MSOP (DGN) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2062DR). The printed circuit board layout is important for control of temperature rise when operated at high ambient temperatures. spacer ORDERING INFORMATION TA -40°C to 85°C (1) (2) 2 SOIC(D) (1) STATUS MSOP (DGN) (1) STATUS SOT23 (DBV) (2) STATUS TPS2061DG4 Active TPS2061DGNG4 Active - - TPS2062DG4 Active TPS2062DGNG4 Active - - TPS2065DG4 Active TPS2065DGNG4 Active - - TPS2066DG4 Active TPS2066DGNG4 Active - - - - - - TPS2061DBV Active - - - - TPS2065DBV Active For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. The printed circuit board layout is important for control of temperature rise when operated at high ambient temperatures. Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) UNIT Input voltage range, VI(IN) (2) Output voltage range, VO(OUT) -0.3 V to 6 V (2) -0.3 V to 6 V , VO(OUTx) Input voltage range, VI(EN), VI(EN), VI(ENx), VI(ENx) -0.3 V to 6 V Voltage range, VI(OC), VI(OCx) -0.3 V to 6 V Continuous output current, IO(OUT), IO(OUTx) Internally limited Continuous total power dissipation See Dissipation Rating Table Operating virtual junction temperature range, TJ Electrostatic discharge (ESD) protection (1) (2) -40°C to 150°C Human body model 2 kV Charge device model (CDM) 500 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. DISSIPATING RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING D-8 (1) 585.82 mW 5.8582 mW/°C 322.20 mW 234.32 mW DGN-8 (2) 1712.3 mW 17.123 mW/°C 941.78 mW 684.33 mW D-16 (1) 898.47 mW 8.9847 mW/°C 494.15 mW 359.38 mW 285 mW 2.85 mW/°C 155 mW 114 mW 704 mW 7.04 mW/°C 387 mW 281 mW DBV-5 (3) (1) (2) (3) Power ratings are based on the low-k board (1 signal, 1 layer). Power ratings are based on the high-k board (2 signal, 2 plane) with PowerPAD™ vias to the internal ground plane. Lower ratings are for low-k printed circuit board layout (single -sided). Higher ratings are for enhanced high-k layout, (2 signal, 2 plane) with a 1mm2 copper pad on pin 2 and 2 vias to the ground plane. RECOMMENDED OPERATING CONDITIONS Input voltage, VI(IN) Input voltage, VI(EN), VI(EN), VI(ENx), VI(ENx) Continuous output current, IO(OUT), IO(OUTx) Operating virtual junction temperature, TJ MIN MAX 2.7 5.5 UNIT V 0 5.5 V 0 1 A -40 125 °C ELECTRICAL CHARACTERISTICS over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 1 A, VI(ENx) = 0 V, or VI(ENx) = 5.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS (1) MIN TYP MAX UNIT POWER SWITCH rDS(on) tr tf (1) Static drain-source on-state resistance, 5-V operation and 3.3-V operation VI(IN) = 5 V or 3.3 V, IO = 1 A, -40°C ≤ TJ ≤ 125°C 70 135 mΩ Static drain-source on-state resistance, 2.7-V operation VI(IN) = 2.7 V, IO = 1 A, -40°C ≤ TJ ≤ 125°C 75 150 mΩ VI(IN) = 5.5 V 0.6 1.5 Rise time, output Fall time, output VI(IN) = 2.7 V VI(IN) = 5.5 V VI(IN) = 2.7 V CL = 1 μF, RL = 5 Ω, TJ = 25°C 0.4 1 0.05 0.5 0.05 0.5 ms Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. Copyright © 2003–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 3 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 1 A, VI(ENx) = 0 V, or VI(ENx) = 5.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS (1) MIN TYP MAX UNIT ENABLE INPUT EN OR EN VIH High-level input voltage 2.7 V ≤ VI(IN) ≤ 5.5 V VIL Low-level input voltage 2.7 V ≤ VI(IN) ≤ 5.5 V II Input current VI(ENx) = 0 V or 5.5 V, VI(ENx) = 0 V or 5.5 V ton Turnon time CL = 100 μF, RL = 5 Ω 3 toff Turnoff time CL = 100 μF, RL = 5 Ω 10 2 0.8 -0.5 0.5 V μA ms CURRENT LIMIT IOS Short-circuit output current VI(IN) = 5 V, OUT connected to GND, device enabled into short-circuit IOC_TRIP Overcurrent trip threshold VI(IN) = 5 V, current ramp (≤ 100 A/s) on OUT TJ = 25°C 1.1 1.5 1.9 -40°C ≤ TJ ≤ 125°C 1.1 1.5 2.1 TPS2061, TPS2062, TPS2065, TPS2066 1.6 2.3 2.7 TPS2063, TPS2067 1.6 2.4 3.0 A A SUPPLY CURRENT (TPS2061, TPS2065) Supply current, low-level output No load on OUT, VI(ENx) = 5.5 V, or VI(ENx) = 0 V TJ = 25°C 0.5 1 -40°C ≤ TJ ≤ 125°C 0.5 5 Supply current, high-level output No load on OUT, VI(ENx) = 0 V, or VI(ENx) = 5.5 V TJ = 25°C 43 60 -40°C ≤ TJ ≤ 125°C 43 70 Leakage current OUT connected to ground, VI(EN) = 5.5 V, or VI(EN) = 0 V -40°C ≤ TJ ≤ 125°C 1 μA Reverse leakage current VI(OUTx) = 5.5 V, IN = ground TJ = 25°C 0 μA Supply current, low-level output No load on OUT, VI(ENx) = 5.5 V, or VI(ENx) = 0 V TJ = 25°C 0.5 1 -40°C ≤ TJ ≤ 125°C 0.5 5 Supply current, high-level output No load on OUT, VI(ENx) = 0 V, or VI(ENx) = 5.5 V TJ = 25°C 50 70 -40°C ≤ TJ ≤ 125°C 50 90 Leakage current OUT connected to ground, VI(/ENx) = 5.5 V, or VI(ENx) = 0 V -40°C ≤ TJ ≤ 125°C 1 μA Reverse leakage current VI(OUTx) = 5.5 V, IN = ground TJ = 25°C 0.2 μA TJ = 25°C 0.5 2 -40°C ≤ TJ ≤ 125°C 0.5 10 TJ = 25°C 65 90 -40°C ≤ TJ ≤ 125°C 65 110 1 μA 0.2 μA μA μA SUPPLY CURRENT (TPS2062, TPS2066) μA μA SUPPLY CURRENT (TPS2063, TPS2067) Supply current, low-level output No load on OUT, VI(ENx) = 0 V Supply current, high-level output No load on OUT, VI(ENx) = 5.5 V Leakage current OUT connected to ground, VI(ENx) = 5.5 V, or VI(ENx) = 0 V -40°C ≤ TJ ≤ 125°C Reverse leakage current VI(OUTx) = 5.5 V, INx = ground TJ = 25°C μA μA UNDERVOLTAGE LOCKOUT Low-level input voltage, IN 2 Hysteresis, IN TJ = 25°C 2.5 75 V mV OVERCURRENT OC1 and OC2 Output low voltage, VOL(OCx) IO(OCx) = 5 mA Off-state current VO(OCx) = 5 V or 3.3 V OC deglitch OCx assertion or deassertion 4 8 0.4 V 1 μA 15 ms THERMAL SHUTDOWN (2) Thermal shutdown threshold 135 Recovery from thermal shutdown 125 Hysteresis (2) 4 °C °C 10 °C The thermal shutdown only reacts under overcurrent conditions. Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 DEVICE INFORMATION Pin Functions (TPS2061 and TPS2065) PINS D or DGN Package NAME DBV Package I/O DESCRIPTION TPS2061 TPS2065 TPS2061 TPS2065 4 - 4 - I Enable input, logic low turns on power switch EN - 4 - 4 I Enable input, logic high turns on power switch GND 1 1 2 2 2, 3 2,3 5 5 I Input voltage EN IN OC OUT PowerPAD™ Ground 5 5 3 3 O Overcurrent, open-drain output, active-low 6, 7, 8 6, 7, 8 1 1 O Power-switch output - - - - Internally connected to GND; used to heat-sink the part to the circuit board traces. Should be connected to GND pin. Functional Block Diagram (See Note A) CS IN OUT Charge Pump EN (See Note B) Driver Current Limit OC UVLO Thermal Sense GND Deglitch Note A: Current sense Note B: Active low (EN) for TPS2061. Active high (EN) for TPS2065. Copyright © 2003–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 5 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com Pin Functions (TPS2062 and TPS2066) PINS NAME I/O NO. DESCRIPTION TPS2062 TPS2066 EN1 3 - I Enable input, logic low turns on power switch IN-OUT1 EN2 4 - I Enable input, logic low turns on power switch IN-OUT2 EN1 - 3 I Enable input, logic high turns on power switch IN-OUT1 EN2 - 4 I Enable input, logic high turns on power switch IN-OUT2 GND 1 1 IN 2 2 I Input voltage OC1 8 8 O Overcurrent, open-drain output, active low, IN-OUT1 OC2 5 5 O Overcurrent, open-drain output, active low, IN-OUT2 OUT1 7 7 O Power-switch output, IN-OUT1 OUT2 6 6 O Power-switch output, IN-OUT2 PowerPAD™ - - Ground Internally connected to GND; used to heat-sink the part to the circuit board traces. Should be connected to GND pin. Functional Block Diagram OC1 Thermal Sense GND Deglitch EN1 (See Note B) Driver Current Limit Charge Pump (See Note A) CS OUT1 UVLO (See Note A) IN OUT2 CS Charge Pump Driver Current Limit OC2 EN2 (See Note B) Thermal Sense Deglitch Note A: Current sense Note B: Active low (ENx) for TPS2062. Active high (ENx) for TPS2066. 6 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 Pin Functions (TPS2063 and TPS2067) PINS NAME I/O DESCRIPTION TPS2063 TPS2067 EN1 3 – I Enable input, logic low turns on power switch IN1-OUT1 EN2 4 – I Enable input, logic low turns on power switch IN1-OUT2 EN3 7 – I Enable input, logic low turns on power switch IN2-OUT3 EN1 – 3 I Enable input, logic high turns on power switch IN1-OUT1 EN2 – 4 I Enable input, logic high turns on power switch IN1-OUT2 I Enable input, logic high turns on power switch IN2-OUT3 EN3 – 7 GND 1, 5 1, 5 IN1 2 2 I Input voltage for OUT1 and OUT2 IN2 6 6 I Input voltage for OUT3 NC Ground 8, 9, 10 8, 9, 10 OC1 16 16 O No connection Overcurrent, open-drain output, active low, IN1-OUT1 OC2 13 13 O Overcurrent, open-drain output, active low, IN1-OUT2 OC3 12 12 O Overcurrent, open-drain output, active low, IN2-OUT3 OUT1 15 15 O Power-switch output, IN1-OUT1 OUT2 14 14 O Power-switch output, IN1-OUT2 OUT3 11 11 O Power-switch output, IN2-OUT3 Copyright © 2003–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 7 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com Functional Block Diagram OC1 Thermal Sense GND Deglitch EN1 (See Note B) Driver Current Limit (See Note A) CS OUT1 UVLO (See Note A) CS IN1 Driver OUT2 Current Limit OC2 EN2 (See Note B) VCC Selector Thermal Sense Deglitch Charge Pump (See Note A) IN2 CS EN3 Driver OUT3 Current Limit (See Note B) OC3 UVLO Thermal Sense GND Deglitch Note A: Current sense Note B: Active low (ENx) for TPS2063; Active high (ENx) for TPS2067 8 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION OUT RL tf tr CL VO(OUT) 90% 90% 10% 10% TEST CIRCUIT 50% VI(EN) 50% toff ton VO(OUT) 50% VI(EN) 90% 50% toff ton 90% VO(OUT) 10% 10% VOLTAGE WAVEFORMS Figure 1. Test Circuit and Voltage Waveforms VI(EN) 5 V/div RL = 5 W, CL = 1 mF TA = 255C VI(EN) 5 V/div RL = 5 W, CL = 1 mF TA = 255C VO(OUT) 2 V/div VO(OUT) 2 V/div t − Time − 500 ms/div Figure 2. Turnon Delay and Rise Time With 1-μF Load Copyright © 2003–2009, Texas Instruments Incorporated t − Time − 500 ms/div Figure 3. Turnoff Delay and Fall Time With 1-μF Load Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 9 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) RL = 5 W, CL = 100 mF TA = 255C VI(EN) 5 V/div VI(EN) 5 V/div RL = 5 W, CL = 100 mF TA = 255C VO(OUT) 2 V/div VO(OUT) 2 V/div t − Time − 500 ms/div t − Time − 500 ms/div Figure 4. Turnon Delay and Rise Time With 100-μF Load VI(EN) 5 V/div Figure 5. Turnoff Delay and Fall Time With 100-μF Load VIN = 5 V RL = 5 W, TA = 255C VI(EN) 5 V/div 220 mF 470 mF IO(OUT) 500 mA/div IO(OUT) 500 mA/div t − Time − 500 ms/div Figure 6. Short-Circuit Current, Device Enabled Into Short 10 Submit Documentation Feedback 100 mF t − Time − 1 ms/div Figure 7. Inrush Current With Different Load Capacitance Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) VO(OC) 2 V/div VO(OC) 2 V/div IO(OUT) 1 A/div IO(OUT) 1 A/div t − Time − 2 ms/div t − Time − 2 ms/div Figure 8. 2-Ω Load Connected to Enabled Device Figure 9. 1-Ω Load Connected to Enabled Device TYPICAL CHARACTERISTICS TURNON TIME vs INPUT VOLTAGE TURNOFF TIME vs INPUT VOLTAGE 1.0 2 CL = 100 mF, RL = 5 W, TA = 255C 0.9 0.8 CL = 100 mF, RL = 5 W, TA = 255C 1.9 Turnoff Time − mS Turnon Time − ms 0.7 0.6 0.5 0.4 1.8 1.7 0.3 0.2 1.6 0.1 0 2 3 4 5 VI − Input Voltage − V Figure 10. Copyright © 2003–2009, Texas Instruments Incorporated 6 1.5 2 3 4 5 VI − Input Voltage − V 6 Figure 11. Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 11 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) RISE TIME vs INPUT VOLTAGE FALL TIME vs INPUT VOLTAGE 0.25 0.6 0.5 0.2 0.4 Fall Time − ms Rise Time − ms CL = 1 mF, RL = 5 W, TA = 255C CL = 1 mF, RL = 5 W, TA = 255C 0.3 0.15 0.1 0.2 0.05 0.1 0 2 3 4 5 VI − Input Voltage − V 0 6 2 Figure 13. TPS2061, TPS2065 SUPPLY CURRENT, OUTPUT ENABLED vs JUNCTION TEMPERATURE TPS2062, TPS2066 SUPPLY CURRENT, OUTPUT ENABLED vs JUNCTION TEMPERATURE VI = 5.5 V 50 VI = 5 V 40 30 VI = 2.7 V 20 VI = 3.3 V 10 0 −50 6 70 I I (IN) − Supply Current, Output Enabled − µ A I I (IN) − Supply Current, Output Enabled − µ A 4 5 VI − Input Voltage − V Figure 12. 60 0 50 100 TJ − Junction Temperature − 5C Figure 14. 12 3 Submit Documentation Feedback 150 VI = 5.5 V 60 50 VI = 5 V VI = 3.3 V 40 30 VI = 2.7 V 20 10 0 −50 0 50 100 150 TJ − Junction Temperature − 5C Figure 15. Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 TYPICAL CHARACTERISTICS (continued) TPS2063, TPS2067 SUPPLY CURRENT, OUTPUT ENABLED vs JUNCTION TEMPERATURE TPS2061, TPS2065 SUPPLY CURRENT, OUTPUT DISABLED vs JUNCTION TEMPERATURE 80 VI = 5.5 V 70 VI = 5 V 60 VI = 3.3 V 50 40 VI = 2.7 V 30 20 10 0 −50 I I (IN) − Supply Current, Output Disabled − µ A I I (IN) − Supply Current, Output Disabled − µ A 0.5 0 50 100 TJ − Junction Temperature − 5C VI = 5.5 V 0.45 VI = 5 V 0.4 0.35 0.3 VI = 2.7 V VI = 3.3 V 0.25 0.2 0.15 0.1 0.05 0 −50 150 0 50 100 Figure 16. Figure 17. TPS2062, TPS2066 SUPPLY CURRENT, OUTPUT DISABLED vs JUNCTION TEMPERATURE TPS2063, TPS2067 SUPPLY CURRENT, OUTPUT DISABLED vs JUNCTION TEMPERATURE 0.5 0.5 0.45 VI = 5.5 V VI = 5 V 0.4 0.35 0.3 VI = 2.7 V VI = 3.3 V 0.25 0.2 0.15 0.1 0.05 0 −50 150 TJ − Junction Temperature − 5C I I (IN) − Supply Current, Output Disabled − µ A I I (IN) − Supply Current, Output Enabled − µ A 90 0 50 100 TJ − Junction Temperature − 5C Figure 18. Copyright © 2003–2009, Texas Instruments Incorporated 150 0.45 VI = 5.5 V VI = 5 V 0.4 0.35 0.3 VI = 3.3 V VI = 2.7 V 0.25 0.2 0.15 0.1 0.05 0 −50 0 50 100 TJ − Junction Temperature − 5C 150 Figure 19. Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 13 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) STATIC DRAIN-SOURCE ON-STATE RESISTANCE vs JUNCTION TEMPERATURE SHORT-CIRCUIT OUTPUT CURRENT vs JUNCTION TEMPERATURE 1.56 120 IO = 0.5 A I OS − Short-Circuit Output Current − A On-State Resistance − mΩ 100 r DS(on) − Static Drain-Source VI = 2.7 V 1.54 Out1 = 5 V Out1 = 3.3 V 80 Out1 = 2.7 V 60 40 20 1.52 VI = 3.3 V 1.5 1.48 1.46 1.44 VI = 5 V 1.42 VI = 5.5 V 1.4 1.38 1.36 1.34 0 −50 0 50 100 −50 150 TJ − Junction Temperature − 5C 100 Figure 21. THRESHOLD TRIP CURRENT vs INPUT VOLTAGE UNDERVOLTAGE LOCKOUT vs JUNCTION TEMPERATURE 150 2.3 UVLO Rising UVOL − Undervoltage Lockout − V TA = 255C Load Ramp = 1A/10 ms 2.3 Threshold Trip Current − A 50 Figure 20. 2.5 2.1 1.9 1.7 1.5 2.5 3 3.5 4 4.5 5 VI − Input Voltage − V Figure 22. 14 0 TJ − Junction Temperature − 5C Submit Documentation Feedback 5.5 6 2.26 2.22 UVLO Falling 2.18 2.14 2.1 −50 0 50 100 150 TJ − Junction Temperature − 5C Figure 23. Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 TYPICAL CHARACTERISTICS (continued) CURRENT-LIMIT RESPONSE vs PEAK CURRENT 200 Current-Limit Response − µ s VI = 5 V, TA = 255C 150 100 50 0 0 Copyright © 2003–2009, Texas Instruments Incorporated 2.5 5 7.5 Peak Current − A Figure 24. 10 12.5 Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 15 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com APPLICATION INFORMATION POWER-SUPPLY CONSIDERATIONS TPS2062 2 Power Supply 2.7 V to 5.5 V IN OUT1 0.1 µF 8 3 5 4 7 Load 0.1 µF 22 µF 0.1 µF 22 µF OC1 EN1 OUT2 6 OC2 Load EN2 GND 1 Figure 25. Typical Application A 0.01-μF to 0.1-μF ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. OVERCURRENT A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault is present long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted before the device is enabled or before VI(IN) has been applied (see Figure 15). The TPS206x senses the short and immediately switches into a constant-current output. In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload occurs, high currents may flow for a short period of time before the current-limit circuit can react. After the current-limit circuit has tripped (reached the overcurrent trip threshold), the device switches into constant-current mode. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is exceeded (see Figure 18). The TPS206x is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its constant-current mode. OC RESPONSE The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown condition is encountered after a 10-ms deglitch timeout. The output remains asserted until the overcurrent or overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause a momentary overcurrent condition; however, no false reporting on OCx occurs due to the 10-ms deglitch circuit. The TPS206x is designed to eliminate false overcurrent reporting. The internal overcurrent deglitch eliminates the need for external components to remove unwanted pulses. OCx is not deglitched when the switch is turned off due to an overtemperature shutdown. 16 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 V+ TPS2062 GND Rpullup OC1 IN OUT1 EN1 OUT2 EN2 OC2 Figure 26. Typical Circuit for the OC Pin POWER DISSIPATION AND JUNCTION TEMPERATURE The low on-resistance on the N-channel MOSFET allows the small surface-mount packages to pass large currents. The thermal resistances of these packages are high compared to those of power packages; it is good design practice to check power dissipation and junction temperature. Begin by determining the rDS(on) of the N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the highest operating ambient temperature of interest and read rDS(on) from Figure 20. Using this value, the power dissipation per switch can be calculated by: • PD = rDS(on)× I2 Multiply this number by the number of switches being used. This step renders the total power dissipation from the N-channel MOSFETs. The thermal resistance, RθJA = 1 / (DERATING FACTOR), where DERATING FACTOR is obtained from the Dissipation Ratings Table. Thermal resistance is a strong function of the printed circuit board construction , and the copper trace area connecting the integrated circuit. Finally, calculate the junction temperature: • TJ = PD x RθJA + TA Where: • TA= Ambient temperature °C • RθJA = Thermal resistance • PD = Total power dissipation based on number of switches being used. Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees, repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally sufficient to get a reasonable answer. THERMAL PROTECTION Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for extended periods of time. The TPS206x implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. In an overcurrent or short-circuit condition, the junction temperature rises due to excessive power dissipation. Once the die temperature rises above a minimum of 135°C due to overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit, and after the device has cooled approximately 10°C, the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The OCx open-drain output is asserted (active low) when an overtemperature shutdown or overcurrent occurs. Copyright © 2003–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 17 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 www.ti.com UNDERVOLTAGE LOCKOUT (UVLO) An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input voltage falls below approximately 2 V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The UVLO also keeps the switch from being turned on until the power supply has reached at least 2 V, even if the switch is enabled. On reinsertion, the power switch is turned on, with a controlled rise time to reduce EMI and voltage overshoots. UNIVERSAL SERIAL BUS (USB) APPLICATIONS The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for differential data, and two lines are provided for 5-V power distribution. USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V from the 5-V input or its own internal power supply. The USB specification defines the following five classes of devices, each differentiated by power-consumption requirements: • Hosts/self-powered hubs (SPH) • Bus-powered hubs (BPH) • Low-power, bus-powered functions • High-power, bus-powered functions • Self-powered functions SPHs and BPHs distribute data and power to downstream functions. The TPS206x has higher current capability than required by one USB port; so, it can be used on the host side and supplies power to multiple downstream ports or functions. HOST/SELF-POWERED AND BUS-POWERED HUBS Hosts and SPHs have a local power supply that powers the embedded functions and the downstream ports (see Figure 27). This power supply must provide from 5.25 V to 4.75 V to the board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report overcurrent conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. 18 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 www.ti.com SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 Downstream USB Ports D+ D− VBUS 0.1 µF 33 µF GND Power Supply 3.3 V 5V D+ TPS2062 2 IN OUT1 0.1 µF VBUS 0.1 µF 8 3 USB Controller D− 7 5 4 33 µF GND OC1 EN1 D+ OC2 EN2 OUT2 GND D− 6 VBUS 0.1 µF 33 µF GND 1 D+ D− VBUS 0.1 µF 33 µF GND Figure 27. Typical Four-Port USB Host / Self-Powered Hub BPHs obtain all power from upstream ports and often contain an embedded function. The hubs are required to power up with less than one unit load. The BPH usually has one embedded function, and power is always available to the controller of the hub. If the embedded function and hub require more than 100 mA on power up, the power to the embedded function may need to be kept off until enumeration is completed. This can be accomplished by removing power or by shutting off the clock to the embedded function. Power switching the embedded function is not necessary if the aggregate power draw for the function and controller is less than one unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port. LOW-POWER BUS-POWERED AND HIGH-POWER BUS-POWERED FUNCTIONS Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and can draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of 44 Ω and 10 μF at power up, the device must implement inrush current limiting (see Figure 28). With TPS206x, the internal functions could draw more than 500 mA, which fits the needs of some applications such as motor driving circuits. Copyright © 2003–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067 19 TPS2061, TPS2062, TPS2063 TPS2065, TPS2066, TPS2067 SLVS490I – DECEMBER 2003 – REVISED OCTOBER 2009 Power Supply 3.3 V D+ D− VBUS www.ti.com TPS2062 2 10 µF 0.1 µF IN OUT1 GND 8 3 USB Control 5 4 7 0.1 µF 10 µF Internal Function 0.1 µF 10 µF Internal Function OC1 EN1 OC2 EN2 OUT2 GND 1 6 Figure 28. High-Power Bus-Powered Function USB POWER-DISTRIBUTION REQUIREMENTS USB can be implemented in several ways, and, regardless of the type of USB device being developed, several power-distribution features must be implemented. • Hosts/SPHs must: – Current-limit downstream ports – Report overcurrent conditions on USB VBUS • BPHs must: – Enable/disable power to downstream ports – Power up at