TPS62134AEVM-595

www.ti.com Table of Contents User’s Guide TPS62134x Buck Converter Evaluation Module User's Guide ABSTRACT This user’s guide describes the characteristics, operation, and use of Texas Instrument's TPS62134x evaluation modules (EVMs). The TPS62134xEVM-595 facilitates the evaluation of the TPS62134x Step-Down Converter with Low Power Mode Input and Output Voltage Selection device. The device outputs a user-selectable output voltage between 0.8 V and 1.05 V with a low-power mode from input voltages between 3 V and 17 V. These devices are compatible with the Intel® Skylake platform’s special power requirements for the VccIO, VccPRIM_CORE, and VccEDRAM / VccEOPIO rails. This user’s guide includes setup instructions for the hardware, a printed-circuit board layout for the EVM, a schematic diagram, a bill of materials, and test results for the EVM. Table of Contents 1 Introduction.............................................................................................................................................................................2 1.1 Performance Specification................................................................................................................................................. 3 1.2 Modifications...................................................................................................................................................................... 3 2 Setup........................................................................................................................................................................................4 2.1 Input/Output Connector Descriptions................................................................................................................................. 4 2.2 Setup..................................................................................................................................................................................4 3 TPS62134xEVM-595 Test Results..........................................................................................................................................5 4 Board Layout...........................................................................................................................................................................6 5 Schematic and Bill of Materials.............................................................................................................................................9 5.1 Schematic.......................................................................................................................................................................... 9 5.2 Bill of Materials.................................................................................................................................................................10 6 Revision History....................................................................................................................................................................11 List of Figures Figure 1-1. Loop Response Measurement Modification.............................................................................................................. 3 Figure 3-1. Thermal Performance (VIN = 17 V, VOUT = 1.05 V, Load = 3.2 A)............................................................................. 5 Figure 3-2. Loop Measurement (VIN = 12 V, VOUT = 1 V, Load = 3 A)......................................................................................... 5 Figure 4-1. Assembly Layer.........................................................................................................................................................6 Figure 4-2. Top Silk Layer............................................................................................................................................................6 Figure 4-3. Top Layer...................................................................................................................................................................7 Figure 4-4. Internal Layer 1......................................................................................................................................................... 7 Figure 4-5. Internal Layer 2......................................................................................................................................................... 8 Figure 4-6. Bottom Layer............................................................................................................................................................. 8 Figure 5-1. TPS62134xEVM-595 Schematic...............................................................................................................................9 List of Tables Table 1-1. Performance Specification Summary..........................................................................................................................3 Table 5-1. TPS62134xEVM-595 Bill of Materials.......................................................................................................................10 Trademarks Intel® is a registered trademark of Intel. All trademarks are the property of their respective owners. SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 TPS62134x Buck Converter Evaluation Module User's Guide Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated 1 Introduction www.ti.com 1 Introduction The TPS62134x is a synchronous, step-down converter in a 3×3-mm, 16-pin QFN package. Four different versions are available and each has their own EVM: TPS62134AEVM-595 (PWR595-001), TPS62134BEVM-595 (PWR595-002), TPS62134CEVM-595 (PWR595-003), and TPS62134DEVM-595 (PWR595-004). The versions differ in their output voltage setpoints and low-power mode output voltage. The TPS62134A is compatible with the Intel Skylake platform's VccIO rail. The TPS62134B and TPS62134D are compatible with the Intel Skylake platform's VccPRIM_CORE rail. The TPS62134C is compatible with the Intel Skylake platform's VccEDRAM / VccEOPIO rail. 2 TPS62134x Buck Converter Evaluation Module User's Guide SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com Introduction 1.1 Performance Specification Table 1-1 provides a summary of the TPS62134xEVM-595 performance specifications. All specifications are given for an ambient temperature of 25°C. Table 1-1. Performance Specification Summary Specification Test Conditions Input voltage Min Typ Max Unit 3 17 V Output voltage setpoint TPS62134AEVM-595, LPM = High 0.85 0.975 V Output voltage setpoint TPS62134BEVM-595, LPM = High 0.8 0.95 V Output voltage setpoint TPS62134CEVM-595, LPM = High 0.8 1.05 V Output voltage setpoint TPS62134DEVM-595, LPM = High 0.85 1 V 0 3.2 A Output current Soft-start time VIN ≥ 5 V 0 Ramp time of VOUT, VOUT = 0.95 V 3 180 A µs 1.2 Modifications The printed-circuit board (PCB) for this EVM is designed to accommodate any version of the integrated circuit (IC). Additional input and output capacitors can also be added. Finally, the loop response of the IC can be measured. 1.2.1 Input and Output Capacitors C9 is provided for an additional input capacitor. This capacitor is not required for proper operation but can be used to reduce the input voltage ripple. C5, C6, C7, and C8 are provided for additional output capacitors. These capacitors are not required for proper operation but can be used to reduce the output voltage ripple and to improve the load transient response. The total output capacitance must remain within the recommended range in the data sheet (SLVSC20) for proper operation. 1.2.2 Loop Response Measurement The loop response of the TPS62134xEVM-595 can be measured with two simple changes to the circuitry. First, install a 10-Ω, 0603-sized resistor across the pads of R2 in the middle of the back of the PCB. Second, cut the plane between the via near the VOS pin and the output capacitor C2 and the inductor. This change is shown in Figure 1-1. With these changes, an ac signal (10-mV, peak-to-peak amplitude recommended) can be injected into the control loop across the added resistor. The results of this test are shown in Figure 3-2. Figure 1-1. Loop Response Measurement Modification SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 TPS62134x Buck Converter Evaluation Module User's Guide Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated 3 Setup www.ti.com 2 Setup This section describes how to properly use the TPS62134xEVM-595. 2.1 Input/Output Connector Descriptions J1 – VIN Positive input connection from the input supply for the EVM J2 – S+/S– Input voltage sense connections. Measure the input voltage at this point. J3 – GND Return connection from the input supply for the EVM J4 – VOUT Output voltage connection J5 – S+/S– Output voltage sense connections. Measure the output voltage at this point. J6 – GND Output return connection J7 – PG/GND The PG output appears on pin 1 of this header with a convenient ground on pin 2 J8 – SS/GND The SS pin voltage appears on pin 2 of this header with a convenient ground on pin 1 J9 – Vdd/GND An externally applied voltage must be applied on pin 2 of this header with a convenient ground on pin 1. This voltage must remain between 0.8 V and 6 V. This voltage level sets the logic high level for the VID0, VID1, and LPM pins as well as the PG pin pull-up voltage. JP1 – EN EN pin input jumper. Place the supplied jumper across ON and EN to turn on the IC. Place the jumper across OFF and EN to turn off the IC. JP2 – VID0 VID0 pin input jumper. Place the supplied jumper across HIGH and VID0 to set the VID0 pin high. Place the jumper across LOW and VID0 to set the VID0 pin low. JP3 – VID1 VID1 pin input jumper. Place the supplied jumper across HIGH and VID1 to set the VID1 pin high. Place the jumper across LOW and VID1 to set the VID1 pin low. JP4 – LPM LPM pin input jumper. Place the supplied jumper across HIGH and LPM to disable the low power mode. Place the jumper across LOW and LPM to enable the low power mode. JP5 – PG Pullup Voltage PG pin pullup voltage jumper. Place the supplied jumper on JP5 to connect the PG pin pullup resistor to Vdd. Alternatively, the jumper can be removed and a different voltage can be supplied on pin 1 to pull up the PG pin to a different level. This externally applied voltage must remain below 7 V. 2.2 Setup To operate the EVM, set jumpers JP1 through JP5 to the desired positions per Section 2.1. Connect the input supply to J1 and J3 and connect the load to J4 and J6. Connect a second input supply to J9. 4 TPS62134x Buck Converter Evaluation Module User's Guide SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com TPS62134xEVM-595 Test Results 3 TPS62134xEVM-595 Test Results The TPS62134xEVM-595 was used to take the data in the TPS62134x data sheet. See the device data sheet (SLVSC20) for the performance of this EVM. 60 180 50 150 40 120 30 90 20 60 10 30 0 0 -10 -30 -20 -60 -30 -90 -40 Phase (deg) Gain (dB) Figure 3-1. Thermal Performance (VIN = 17 V, VOUT = 1.05 V, Load = 3.2 A) -120 Gain -50 -150 Phase -60 100 1000 10000 100000 -180 1000000 Frequency (Hz) C001 Figure 3-2. Loop Measurement (VIN = 12 V, VOUT = 1 V, Load = 3 A) SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 TPS62134x Buck Converter Evaluation Module User's Guide Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated 5 Board Layout www.ti.com 4 Board Layout This section provides the TPS62134xEVM-595 board layout and illustrations. Figure 4-1. Assembly Layer Figure 4-2. Top Silk Layer 6 TPS62134x Buck Converter Evaluation Module User's Guide SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com Board Layout Figure 4-3. Top Layer Figure 4-4. Internal Layer 1 SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 TPS62134x Buck Converter Evaluation Module User's Guide Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated 7 Board Layout www.ti.com Figure 4-5. Internal Layer 2 Figure 4-6. Bottom Layer 8 TPS62134x Buck Converter Evaluation Module User's Guide SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com Schematic and Bill of Materials 5 Schematic and Bill of Materials This section provides the TPS62134xEVM-595 schematic and bill of materials. 5.1 Schematic Figure 5-1 illustrates the TPS62134xEVM-595 schematic. VIN U1 J1 2 1 VIN 3V to 17V 11 12 10 13 J2 2 1 S+ S- C10 100µF C9 Open C1 22uF 9 8 C4 Open 14 J3 PVIN PVIN AVIN EN VID0 VID1 LPM 2 1 GND 7 SS FBS VOS 5 R2 Open 1 TP1 SW SW PG PGND PGND AGND PAD TPS62134xRGT 2 3 4 15 16 6 1 2 L1 J4 C2 47uF 1µH XFL4020-102MEB C5 Open C6 Open C7 Open VOUT 0.7V - 1.05V 3A C8 Open 1 2 S+ SJ5 Vdd 2 JP5 1 2 GND J6 1 VIN 1 2 3 ON EN OFF R1 499k JP1 Vdd 1 2 1 2 3 HIGH VID0 LOW PG GND J7 JP2 Vdd 1 2 3 HIGH VID1 LOW JP3 Vdd 1 2 3 HIGH /LPM LOW JP4 2 1 SS GND J8 C3 470pF Vdd 0.8V to 6V 2 1 Vdd GND J9 Figure 5-1. TPS62134xEVM-595 Schematic SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 Submit Document Feedback TPS62134x Buck Converter Evaluation Module User's Guide Copyright © 2021 Texas Instruments Incorporated 9 Schematic and Bill of Materials www.ti.com 5.2 Bill of Materials Table 5-1 lists the BOM for this EVM. Table 5-1. TPS62134xEVM-595 Bill of Materials Count PWR595-00 1 PWR595-00 2 PWR595-00 3 PWR595-0 04 Ref Des Value Description Size Part Number MFR 1 1 1 1 C1 22uF Capacitor, Ceramic, 25V, X5R, 20% 0805 GRM21BR61E226ME44 Murata 1 1 1 1 C2 47uF Capacitor, Ceramic, 6.3V, X5R, 20% 0805 GRM21BR60J476ME15 Murata 1 1 1 1 C3 470pF Capacitor, Ceramic, 50V, X7R, 10% 0603 GRM188R71H471KA01 D Murata 1 1 1 1 C10 100uF Capacitor, Tantalum, 25V, ±10%, 100 mOhm 7361 TPSV107K025R0100 AVX 1 1 1 1 L1 1uH Inductor, Power, 5.4 A, 10.8 mOhm 4 mm x 4 mm XFL4020-102MEB Coilcraft 1 1 1 1 R1 499k Resistor, Chip, 1/16W, 1% 0603 STD STD 1 0 0 0 U1 TPS62134A IC, 17-V Input, Step-down Converter with Low Power Mode Input for Intel Skylake Platform 3 mm x 3 mm TPS62134ARGT TI 0 1 0 0 U1 TPS62134B IC, 17-V Input, Step-down Converter with Low Power Mode Input for Intel Skylake Platform 3 mm x 3 mm TPS62134BRGT TI 0 0 1 0 U1 TPS62134C IC, 17-V Input, Step-down Converter with Low Power Mode Input for Intel Skylake Platform 3 mm x 3 mm TPS62134CRGT TI 0 0 0 1 U1 TPS62134D IC, 17-V Input, Step-down Converter with Low Power Mode Input for Intel Skylake Platform 3 mm x 3 mm TPS62134DRGT TI The TPS62134xEVM-595 may be populated with TPS62134x (U1) devices that do not contain the correct top side markings on the top of the device itself. These devices are still fully tested TPS62134x devices and meet the specified electrical characteristics of the data sheet. 10 TPS62134x Buck Converter Evaluation Module User's Guide SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com Revision History 6 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (March 2015) to Revision B (June 2021) Page • Updated the numbering format for tables, figures, and cross-references throughout the document. ................2 • Updated user's guide title................................................................................................................................... 2 SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 TPS62134x Buck Converter Evaluation Module User's Guide Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated 11 Revision History www.ti.com Changes from Revision * (November 2014) to Revision A (March 2015) Page • Added "TPS62134DEVM-595 (PWR595-004)." to Section 1 ............................................................................ 2 • Added "TPS62134DEVM-595," to Table 1-1 ..................................................................................................... 3 • Added column "PWR595-004" to Table 5-1 .....................................................................................................10 12 TPS62134x Buck Converter Evaluation Module User's Guide SLVUA82B – NOVEMBER 2014 – REVISED JUNE 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2022, Texas Instruments Incorporated