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TPS62840DLCR

TPS62840DLCR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VSON-HR8_2X1.5MM

  • 描述:

    DC-DC电源芯片 1.8V~6.5V 750mA 降压 VSON-HR8_2X1.5MM

  • 数据手册
  • 价格&库存
TPS62840DLCR 数据手册
Order Now Product Folder Support & Community Tools & Software Technical Documents TPS62840 ZHCSJW0D – JUNE 2019 – REVISED MARCH 2020 TPS62840 1.8V 至 6.5V、 、750mA、 、60nA IQ 降压转换器 1 特性 • • • • • • • • • • • • 1 3 说明 TPS62840 是一款高效降压转换器,具有典型值为 60nA 的超低工作静态电流。此器件具有特殊电路,可 在 100% 模式下实现仅 120nA 的 IQ,因此可在放电末 期进一步延长电池寿命。 60nA 工作静态电流 100% 占空比模式下,IQ 为 120nA 输入电压范围 VIN:1.8V 至 6.5V 高达 750mA 的输出电流 射频友好型 DCS-Control™ 1µA IOUT(3.6VIN 至 1.8VOUT)时的效率为 80% 通过 VSET 引脚提供 16 种可选输出电压 自动转换 PFM/PWM 或强制 PWM 模式 可选的强制 PWM 和 STOP 模式 输出放电功能 25nA 关断电流 SON-8、WCSP-6 和热增强型 HVSSOP-8 此器件采用 DCS-Control 技术,可以为无线电提供干 净的电源,工作时具有 1.8MHz 的典型开关频率。在 省电模式下,此器件可将轻负载效率向下扩展至 1μA 负载电流及以下。 可以将一个电阻器连接到 VSET 引脚以选择 16 种预定 义的输出电压,因此这款器件可以灵活地用于各种 应 用 并最大限度地减少了外部组件的数量。 该器件的 STOP 引脚可立即消除所有的开关噪声,从 而在测试和测量系统中执行无噪声测量。 2 应用 • • • • • • • 智能仪表、智能恒温器 资产跟踪设备 可穿戴电子产品 医疗传感器贴片和患者监护仪 工业物联网(智能传感器)/窄带物联网 测试和测量 ATEX/本质安全 TPS62840 提供了高达 750mA 的输出电流。此器件的 输入电压为 1.8V 至 6.5V,支持多种电源,例如 2 节 至 4 节碱性电池或 1 节至 2 节锂二氧化锰 (Li-MnO2) 或 1 节锂离子/锂亚硫酰氯 (Li-SOCl2) 电池。 器件信息(1) 器件型号 TPS6284x 封装 封装尺寸(标称值) 8 引脚 DLC (SON) 1.5mm x 2mm 6 引脚 YBG (WCSP) 0.97mm x 1.47mm 8 引脚 DGR (HVSSOP) 3mm x 5mm (1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附 录。 典型应用 TPS62841DLC VIN CI 4.7 µF L 2.2 µH VOUT RUN /STOP VOS MODE STOP VSET ENABLE EN 90 CO 10µF GND MODE 95 SW 85 Efficiency (%) VIN 效率与负载电流间的关系 (VOUT = 1.8V) 100 RSET 80 75 70 65 VIN VIN VIN VIN VIN VIN VIN 60 55 50 45 40 100n 1P 10P 100P 1m 10m Output Current (A) = = = = = = = 100m 1.8V 2.5V 3.0V 3.6V 4.2V 5.0V 6.5V 1 D002 1 本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确 性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。 English Data Sheet: SLVSEC6 TPS62840 ZHCSJW0D – JUNE 2019 – REVISED MARCH 2020 www.ti.com.cn 目录 1 2 3 4 5 6 7 8 特性 .......................................................................... 应用 .......................................................................... 说明 .......................................................................... 修订历史记录 ........................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6 7.1 7.2 7.3 7.4 7.5 7.6 6 6 6 6 7 9 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 11 8.1 Overview ................................................................. 11 8.2 Functional Block Diagram ....................................... 11 8.3 Feature Description................................................. 12 8.4 Device Functional Modes........................................ 15 9 Application and Implementation ........................ 16 9.1 Application Information............................................ 16 9.2 Typical Application ................................................. 16 9.3 System Example ..................................................... 27 10 Power Supply Recommendations ..................... 28 11 Layout................................................................... 28 11.1 Layout Guidelines ................................................. 28 11.2 Layout Example .................................................... 28 12 器件和文档支持 ..................................................... 30 12.1 12.2 12.3 12.4 12.5 器件支持................................................................ 保障资源................................................................ 商标 ....................................................................... 静电放电警告......................................................... Glossary ................................................................ 30 30 30 30 30 13 机械、封装和可订购信息 ....................................... 30 4 修订历史记录 注:之前版本的页码可能与当前版本有所不同。 Changes from Revision C (November 2019) to Revision D Page • Updated the Device Comparison Table ................................................................................................................................ 3 • Added efficiency graphs to the Application Curves .............................................................................................................. 20 Changes from Revision B (August 2019) to Revision C Page • 将 SON-8、WCSP-6 和热增强型 HVSSOP-8 添加至特性 ..................................................................................................... 1 • 将“ATEX/本质安全”添加到应用 .............................................................................................................................................. 1 • 更新了典型应用图像以显示 TPS62842DGR 器件 .................................................................................................................. 1 • Added orderable part number TPS62841DGR to Device Comparison Table ....................................................................... 3 • Added orderable part number TPS62842DGR to Device Comparison Table ....................................................................... 3 • Updated Thermal Information values to support TPS62842DGR .......................................................................................... 6 • Added low-side MOSFET switch current limit to Electrical Characteristics ........................................................................... 8 • Added TPS62841DGR to Output Voltage Selection ........................................................................................................... 13 • Updated Efficiency Power Save graphs in Application Curves ............................................................................................ 20 • Updated Load Transient waveform in Application Curves ................................................................................................... 24 • Added PCB layout for DGR package ................................................................................................................................... 29 Changes from Revision A (July 2019) to Revision B Page • 将销售状态从“预告信息”更改为“生产数据” .............................................................................................................................. 1 2 Copyright © 2019–2020, Texas Instruments Incorporated TPS62840 www.ti.com.cn ZHCSJW0D – JUNE 2019 – REVISED MARCH 2020 5 Device Comparison Table ORDERABLE PART NUMBER TPS62840DLC TPS62840YBG OUTPUT VOLTAGE 1.8 V to 3.3 V in 100-mV steps OUTPUT CURRENT 750 mA OUTPUT DISCHARGE 0.8 V to 1.55 V in 50-mV steps 750 mA yes TPS62841DGR TPS62842DGR TPS62849DLC 1.8 V, 2.0 V, 2.2 V, 2.4 V to 3.6 V in 100-mV steps 3.4-V fixed output voltage Copyright © 2019–2020, Texas Instruments Incorporated 750 mA STOP PIN PACKAGE PACKAGE MARKING yes yes SON-8 (DLC) E5 no no WCSP-6 (YBG) 62840 yes yes SON-8 (DLC) E9 no no WCSP-6 (YBG) 62841 yes no HVSSOP-8 (DGR) 62841 no HVSSOP-8 (DGR) 62842 yes SON-8 (DLC) FF yes TPS62841DLC TPS62841YBG MODE PIN yes yes 3 TPS62840 ZHCSJW0D – JUNE 2019 – REVISED MARCH 2020 www.ti.com.cn 6 Pin Configuration and Functions DLC SON-8 Bottom view Top view GND VIN MODE EN VOS SW STOP VSET 8 1 2 7 3 6 4 5 VOS SW STOP VSET GND VIN MODE EN 1 8 7 2 6 3 5 4 DGR HVSSOP-8 Bottom view Top view VOS SW MODE VSET 1 8 2 7 EP 3 6 4 5 GND NC VIN EN GND NC VIN EN 8 1 7 2 EP 6 3 5 4 VOS SW MODE VSET YBG WCSP-6 Top view 4 1 2 A GND VOS B VIN C EN Bottom view 2 1 A VOS GND SW B SW VIN VSET C VSET EN Copyright © 2019–2020, Texas Instruments Incorporated TPS62840 www.ti.com.cn ZHCSJW0D – JUNE 2019 – REVISED MARCH 2020 Pin Functions PIN DLC (SON-8) DGR (HVSSOP-8) YBG (WCSP-6) I/O VIN 2 6 B1 PWR VIN power supply pin. Connect the input capacitor close to this pin for best noise and voltage spike suppression. A 4.7-µF ceramic capacitor is required. SW 7 2 B2 PWR The switch pin is connected to the internal MOSFET switches. Connect the inductor to this terminal. GND 1 8 A1 PWR GND supply pin. Connect this pin close to the GND terminal of the input and output capacitors. VSET 5 4 C2 IN Connecting a resistor to GND sets the output voltage when the converter is enabled. For the TPS62849, connect this pin to GND. VOS 8 1 A2 IN Output voltage sense pin for the internal feedback divider network and regulation loop. When the converter is disabled, this pin discharges VOUT by an internal MOSFET. Connect this pin directly to the output capacitor with a short trace. EN 4 5 C1 IN Enable pin. A high level enables the device and a low level turns the device off. The pin features an internal pulldown resistor, which is disabled once the device has started up and the output voltage is regulated. The pulldown resistor is activated again, once a low level has been detected. STOP 6 n/a n/a IN STOP Switching pin. When this pin is logic high, the converter stops switching in order to provide a quiet supply rail. The output is powered from the charge available in the output capacitor. When this pin is logic low, the device immediately resumes operation. The pin features an internal pulldown resistor, which is disabled once a high level is detected at the input. The pulldown resistor is activated again, once a low level has been detected. MODE 3 3 n/a IN MODE pin. A low level enables Power-Save Mode operation with an automatic transition between PFM and PWM modes. A high level forces the converter to operated in PWM mode. This pin can be toggled during operation. It must be terminated. NC n/a 7 n/a EP n/a 9 n/a NAME (1) DESCRIPTION This pin is not connected internally. Do not connect this pin. PWR Exposed thermal pad (1). The PowerPAD must be connected to GND. For more information about the PowerPAD, see the PowerPAD™ Thermally Enhanced Package application report. Copyright © 2019–2020, Texas Instruments Incorporated 5 TPS62840 ZHCSJW0D – JUNE 2019 – REVISED MARCH 2020 www.ti.com.cn 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX VIN –0.3 7 V SW (DC) –0.3 VIN + 0.3 V SW (AC), less than 10ns (3) –2.0 8.5 V EN, MODE, STOP –0.3 6.5 V VSET –0.3 VIN + 0.3 < 3.6 V VOS –0.3 3.7 V Operating junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C Pin voltage (2) (1) (2) (3) UNIT Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal GND. While switching. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN VIN Supply voltage VIN L Effective inductance COUT Effective output capacitance CIN Effective input capacitance CVSET External parasitic capacitance at VSET pin UNIT V 2.2 2.9 µH 3 10 40 µF 1 4.7 0.909 External voltage selection resistor tolerance µF 100 pF 267 kΩ 1% External voltage selection resistor temperature coefficient TJ MAX 6.5 1.51 Nominal resistance range for external voltage selection resistor (E96 resistor series) RSET NOM 1.8 ±200 ppm/°C Operating junction temperature range -40 125 °C 7.4 Thermal Information THERMAL METRIC (1) 8 Pins DLC Package 6 Pins YBG Package JEDEC PCB 51-7 RθJA DGR EVM JEDEC PCB 51-5 TPS62841-2EVM123 UNIT 105.6 133.4 54.4 46.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 75.7 0.4 58.1 N/A °C/W RθJB Junction-to-board thermal resistance 31.9 39.4 25.9 N/A °C/W ψJT Junction-to-top characterization parameter 2.3 0.1 1.2 0.9 °C/W ψJB Junction-to-board characterization parameter 31.5 39.4 25.9 17.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 11.7 N/A °C/W (1) 6 Junction-to-ambient thermal resistance 8 Pins DGR Package For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2019–2020, Texas Instruments Incorporated TPS62840 www.ti.com.cn ZHCSJW0D – JUNE 2019 – REVISED MARCH 2020 7.5 Electrical Characteristics VIN = 3.6 V, TJ = –40°C to 125°C, STOP = GND, MODE = GND, typical values are at TJ = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY IQ_NO_LOAD No load operating input current EN = VIN, IOUT = 0µA, VOUT = 1.8V device switching 60 nA IQ_NO_LOAD No load operating input current EN = VIN, IOUT = 0µA, VOUT = 1.2V device switching 80 nA IQ_NO_LOAD No load operating input current (PWM Mode) EN = VIN, IOUT = 0µA, VOUT = 1.8V, MODE = VIN device switching 3 mA IQ_VIN Operating quiescent current into pin VIN EN = VIN, IOUT = 0µA, VOUT = 1.55V or VOUT = 1.8V device not switching, TJ = 25°C (DLC package option) 36 100 nA IQ_VOS Operating quiescent current into pin VOS EN = VIN, IOUT = 0µA, VOUT = 1.55V or VOUT = 1.8V device not switching, TJ = 25°C (DLC package option) 56 120 nA IQ_VIN Operating quiescent current into pin VIN EN = VIN, IOUT = 0µA, VOUT = 1.55V or VOUT = 1.8V device not switching, TJ = -40°C to 85°C 36 360 nA IQ_VOS Operating quiescent current into pin VOS EN = VIN, IOUT = 0µA, VOUT = 1.55V or VOUT = 1.8V device not switching, TJ = -40°C to 85°C 56 170 nA EN = VIN, VOUT = 3.3V device not switching 70 nA EN = VIN, VOUT < 1.5 V device not switching 5 nA EN, STOP = VIN, 3V < VOUT < 3.3V TJ = -40°C to 85°C 5 IQ_VOS Operating quiescent current into VOS pin 100 nA IQ_100%_MODE Operating quiescent current 100% Mode VIN = VOUT = 3.3V, TJ = -40°C to 85°C IQ_VIN_STOP Operating quiescent current into pin VIN STOP = High, VOUT = 1.8V, TJ = -40°C to 85°C 70 175 µA ISD Shutdown current EN = GND, shutdown current into VIN VSET = GND, TJ = -40°C to 85°C 25 300 nA VTH_UVLO+ VTH_UVLO– Undervoltage lockout threshold 120 nA Rising VIN 1.72 1.8 V Falling VIN 1.45 1.75 V EN, MODE, STOP INPUTS VIH_TH High level input voltage VIL_TH Low level input voltage IIN Input bias current MODE input, TJ = -40°C to 85°C RPD Internal pull-down resistance EN, STOP inputs Copyright © 2019–2020, Texas Instruments Incorporated 1.1 V 1 200 450 0.4 V 25 nA kΩ 7 TPS62840 ZHCSJW0D – JUNE 2019 – REVISED MARCH 2020 www.ti.com.cn Electrical Characteristics (continued) VIN = 3.6 V, TJ = –40°C to 125°C, STOP = GND, MODE = GND, typical values are at TJ = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SWITCHES RDS(ON) ILIMF_SS High-side MOSFET on-resistance (DLC, YBG package) VIN = 3.6V, I = 200mA, TJ = -40°C to 85°C 430 600 VIN = 5V, I = 200mA, TJ = -40°C to 85°C 340 465 Low-side MOSFET on-resistance (DLC, YBG package) VIN = 3.6V, I = 200mA, TJ = -40°C to 85°C 170 240 VIN = 5V, I = 200mA, TJ = -40°C to 85°C 135 180 High-side MOSFET on-resistance (DGR package) VIN = 3.6V, I = 200mA, TJ = -40°C to 85°C 460 630 VIN = 5V, I = 200mA, TJ = -40°C to 85°C 370 495 Low-side MOSFET on-resistance (DGR package) VIN = 3.6V, I = 200mA, TJ = -40°C to 85°C 200 270 VIN = 5V, I = 200mA, TJ = -40°C to 85°C 165 210 0.15 0.225 0.3 A 1.0 1.2 1.4 A Soft-start switch current limit (1) High-side MOSFET switch current limit (1) ILIMF mΩ mΩ mΩ mΩ Low-side MOSFET switch current limit 1.0 A ILIMN Negative current limit 533 mA tI_LIM_DELAY Current limit propagation delay 50 ns ILKG_SW Leakage current into SW pin 10 nA VSW = 1.8V, TJ = -40°C to 85°C OUTPUT VOLTAGE DISCHARGE IDISCHARGE_VOS Output discharge current EN = GND, sink current into VOS pin, over VIN range VOUT = 1.8V, TJ = -40°C to 85°C 16 35 44 mA THERMAL PROTECTION Thermal shutdown temperature TSD Rising junction temperature, PWM Mode Thermal shutdown hysteresis 160 °C 5 °C OUTPUT VOUT Output voltage accuracy PWM Mode, IOUT = 0 mA, VOUT >= 1.8 V PWM Mode, IOUT = 0 mA, VOUT
TPS62840DLCR 价格&库存

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TPS62840DLCR
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  • 1+8.54280

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