UC3611NG4


 SLUS338A – JUNE 1993 – REVISED MAY 2001 
      FEATURES D Matched, Four-Diode Monolithic Array D High Peak Current D Low-Cost MINIDIP Package D Low-Forward Voltage D Parallelable for Lower VF or Higher IF D Fast Recovery Time D Military Temperature Range Available DESCRIPTION This four-diode array is designed for general purpose use as individual diodes or as a high-speed, high-current bridge. It is particularly useful on the outputs of high-speed power MOSFET drivers where Schottky diodes are needed to clamp any negative excursions caused by ringing on the driven line.These diodes are also ideally suited for use as voltage clamps when driving inductive loads such as relays and solenoids, and to provide a path for current free-wheeling in motor drive applications.The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.This single monolithic chip is fabricated in both hermetic CERDIP and copper-eaded plastic packages. The UC1611 in ceramic is designed for –55°C to 125°C environments but with reduced peak current capability: while the UC3611 in plastic has higher current rating over a 0°C to 70°C ambient temperature range. AVAILABLE OPTIONS Packaged Devices TA = TJ SOIC Wide (DW) DIL (J) DIL (N) –55°C to 125°C UC1611DW UC1611J UC1611N 0°C to 70°C UC3611DW UC3611J UC3611N Copyright  2001, Texas Instruments Incorporated 
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 SLUS338A – JUNE 1993 – REVISED MAY 2001 DW PACKAGE (TOP VIEW) J OR N PACKAGE (TOP VIEW) absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Peak inverse voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V Diode-to-diode voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 V Peak forward current UC1611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A UC3611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 A Power dissipation at TA = 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ‡ Please consult packaging section of data book for thermal limitations and considerations of package. electrical characteristics, all specifications apply to each individual diode, TJ = 25°C, TA = TJ, (except as noted) PARAMETER TEST CONDITIONS MIN 0.3 TYP For ard voltage Forward oltage drop IF = 100 mA IF = 1 A Leakage current VR = 40 V VR = 40 V, Reverse recovery 0.5 A forward to 0.5 A reverse 20 Forward recovery 1 A forward to 1.1 V recovery 40 TJ = 100°C Junction capacitance MAX 0.7 V 0.9 1.2 V 0.01 0.1 mA 0.1 1.0 mA VR = 5V 100 NOTE: At forward currents of greater than 1.0 A, a parasitic current of approximately 10 mA may be collected by adjacent diodes. 2 www.ti.com UNITS 0.4 ns ns pF 

 SLUS338A – JUNE 1993 – REVISED MAY 2001 APPLICATION INFORMATION REVERSE CURRENT vs VOLTAGE FORWARD CURRENT vs VOLTAGE 1000 5.0 500 3.0 2.0 1.0 T J = 125 °C 100 Forward Current – A Leakage Current – µA 300 200 50 30 20 10 5 0.3 0.2 T J = –55 °C 0.1 0.05 0.03 0.02 T J = 25 °C 0.01 T J = 25 °C T J = 75 °C 0.5 0.005 3 2 T J = 125 °C 0.003 0.002 0.001 1 0 10 20 30 40 50 Reverse Voltage – V 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Forward Voltage – V Figure 1 Figure 2 Figure 3. Clamp Diodes – PWMs and Drivers www.ti.com 3 

 SLUS338A – JUNE 1993 – REVISED MAY 2001 APPLICATION INFORMATION Figure 4. Transformer Coupled Drive Circuits Figure 5. Linear Regulations 4 www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 1-Mar-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-90538012A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 596290538012A UC1611L/ 883B 5962-9053801PA ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 9053801PA UC1611 5962-9053801V2A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 59629053801V2A UC1611L QMLV 5962-9053801VPA ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 9053801VPA UC1611 Samples UC1611J ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 UC1611J Samples UC1611J883B ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 9053801PA UC1611 Samples UC1611L883B ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 596290538012A UC1611L/ 883B UC3611DW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3611DW Samples UC3611J ACTIVE CDIP JG 8 1 Non-RoHS & Green SNPB N / A for Pkg Type 0 to 70 UC3611J Samples UC3611N ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 UC3611N Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples Samples Samples Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Mar-2023 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of