ULN2003V12DR

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents ULN2003V12 SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 ULN2003V12 7-Channel Relay and Inductive Load Sink Driver 1 Features 3 Description • • • The ULN2003V12 device is a low-power upgrade of TI’s popular ULN2003 family of 7-channel Darlington transistor array. The ULN2003V12 sink driver features 7 low-output impedance drivers that minimize on-chip power dissipation. When driving a typical 12-V relay coil, a ULN2003V12 can dissipate up to 12 times lower power than an equivalent ULN2003A. The ULN2003V12 driver is pin-to-pin compatible with ULN2003 family of devices. 1 • • • • • • (1) 7-Channel High Current Sink Drivers Supports Up to 20-V Output Pullup Voltage Low Output VOL of 0.6 V (Typical) With: – 100-mA (Typical) Current Sink per Channel at 3.3-V Logic Input(1) – 140-mA (Typical) Current Sink per Channel at 5-V Logic Input(1) Compatible to 3.3-V and 5-V Microcontrollers and Logic Interface Internal Free-Wheeling Diodes for Inductive KickBack Protection Input Pulldown Resistors Allows Tri-Stating the Input Driver Input RC-Snubber to Eliminate Spurious Operation in Noisy Environment Low Input and Output Leakage Currents ESD Protection Exceeds JESD 22: – 2-kV HBM, 500-V CDM Total current sink may be limited by the internal junction temperature, absolute maximum current levels, and so forth (see Electrical Characteristics for details). The ULN2003V12 supports 3.3-V to 5-V CMOS logic input interface thus making it compatible to a wide range of microcontrollers and other logic interfaces. The ULN2003V12 also supports other logic input levels, like TTL or 1.8 V. Each output of the ULN2003V12 features an internal free-wheeling diode connected in a common-cathode configuration at the COM pin. The ULN2003V12 provides flexibility of increasing current sink capability through combining several adjacent channels in parallel. Under typical conditions the ULN2003V12 can support up to 1 A of load current when all 7-channels are connected in parallel. Device Information(1) PART NUMBER 2 Applications • • • • • Relay and Inductive Load Driver White Goods Factory and Home Automation Lamp and LED Displays Logic Level Shifter PACKAGE BODY SIZE (NOM) ULN2003V12D SOIC (16) 9.90 mm × 3.91 mm ULN2003V12PW TSSOP (16) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Diagram IN1 1 16 OUT1 IN2 2 15 OUT2 IN3 3 14 OUT3 IN4 4 13 OUT4 IN5 5 12 OUT5 IN6 6 11 OUT6 IN7 7 10 OUT7 GND 8 9 COM Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ULN2003V12 SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 5 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 6 7.1 7.2 7.3 7.4 Overview ................................................................... Functional Diagram ................................................... Feature Description .................................................. Device Functional Modes.......................................... 6 6 6 7 8 Applications and Implementation ........................ 8 8.1 Application Information.............................................. 8 8.2 Typical Applications .................................................. 8 9 Power Supply Recommendations...................... 13 10 Layout................................................................... 13 10.1 Layout Guidelines ................................................. 13 10.2 Layout Example .................................................... 13 10.3 Thermal Considerations ........................................ 13 11 Device and Documentation Support ................. 14 11.1 11.2 11.3 11.4 11.5 11.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 14 14 14 14 14 14 12 Mechanical, Packaging, and Orderable Information ........................................................... 14 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (November 2012) to Revision C Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 • Changed θJA values From: 75°C/W To: 104.8°C/W (D) and From: 95°C/W To: 130.6°C/W (PW) ........................................ 4 • Changed θJC values From: 46°C/W To: 63.7°C/W (D) and From: 49°C/W To: 62.7°C/W (PW) ............................................ 4 Changes from Revision A (July 2012) to Revision B • 2 Page Added Details to Switching Parameters ................................................................................................................................. 5 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 ULN2003V12 www.ti.com SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 5 Pin Configuration and Functions D and PW Packages 16-Pin SOIC and TSSOP Top View IN1 1 16 OUT1 IN2 2 15 OUT2 IN3 3 14 OUT3 IN4 4 13 OUT4 IN5 5 12 OUT5 IN6 6 11 OUT6 IN7 7 10 OUT7 GND 8 9 COM Not to scale Pin Functions PIN NO. NAME I/O (1) DESCRIPTION 1 IN1 I Channel 1 input 2 IN2 I Channel 2 input 3 IN3 I Channel 3 input 4 IN4 I Channel 4 input 5 IN5 I Channel 5 input 6 IN6 I Channel 6 input 7 IN7 I Channel 7 input 8 GND — Supply ground 9 COM — Common cathode node for flyback diodes (required for inductive loads) 10 OUT7 O Channel 7 output 11 OUT6 O Channel 6 output 12 OUT5 O Channel 5 output 13 OUT4 O Channel 4 output 14 OUT3 O Channel 3 output 15 OUT2 O Channel 2 output 16 OUT1 O Channel 1 output (1) I = Input and O = Output Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 3 ULN2003V12 SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Specified at TJ = –40°C to 125°C (unless otherwise noted) (1) MIN MAX UNIT –0.3 5.5 V Pins OUT1 – OUT7 to GND voltage, VOUT 20 V Pin COM to GND voltage, VCOM 20 V 700 mA Pins IN1 – IN7 to GND voltage, VIN 100ºC < TJ < 125°C Maximum GND-pin continuous current, IGND 1 A Operating virtual junction temperature, TJ –55 150 °C Storage temperature, Tstg –55 150 °C (1) TJ < 100°C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VOUT Channel off-state output pullup voltage 16 V VCOM COM pin voltage 16 V IOUT(ON) (1) Per channel continuous sink current TJ Operating junction temperature (1) (1) VINx = 3.3 V 100 VINx = 5 V 140 (1) –40 125 mA ºC See Absolute Maximum Ratings for TJ dependent absolute maximum GND-pin current. 6.4 Thermal Information ULN2003V12 THERMAL METRIC (1) D (SOIC) PW (TSSOP) 16 PINS 16 PINS UNIT RθJA Junction-to-ambient thermal resistance 104.8 130.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 63.7 62.7 °C/W RθJB Junction-to-board thermal resistance 62.3 76.1 °C/W ψJT Junction-to-top characterization parameter 27.1 15.9 °C/W ψJB Junction-to-board characterization parameter 62.1 75.5 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 ULN2003V12 www.ti.com SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 6.5 Electrical Characteristics Typical values are at TJ = 25°C, minimum and maximum values over the recommended junction temperature range TJ = –40°C to 125°C, and over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUTS IN1 THROUGH IN7 PARAMETERS VI(ON) IN1–IN7 logic high input voltage Vpullup = 3.3 V, Rpullup = 1 kΩ, IOUTX = 3.2 mA VI(OFF) IN1–IN7 logic low input voltage Vpullup = 3.3 V, Rpullup = 1 kΩ, IOUTX < 20 µA II(ON) IN1–IN7 ON state input current Vpullup = 12 V, VINx = 3.3 V II(OFF) IN1–IN7 OFF state input leakage Vpullup = 12 V, VINx = 0 V 1.65 V 0.6 12 25 µA 250 nA OUTPUTS OUT1 THROUGH OUT7 PARAMETERS VOL(VCE-SAT) OUT1–OUT7 low-level output voltage VINX = 3.3 V, IOUTX = 20 mA 0.12 0.15 VINX = 3.3 V, IOUTX = 100 mA 0.6 0.75 0.09 0.11 0.6 0.75 VINX = 5 V, IOUTX = 20 mA VINX = 5 V, IOUTX = 140 mA IOUT(ON) OUT1–OUT7 ON-state continuous current at VOUTX = 0.6 V (1) (2) VINX = 3.3 V, VOUTX = 0.6 V 80 100 VINX = 5 V, VOUTX = 0.6 V 95 140 IOUT(OFF)(ICEX) OUT1–OUT7 OFF-state leakage current VINX = 0 V, VOUTX = VCOM = 16 V 0.5 V mA µA SWITCHING PARAMETERS (3) (4) tPHL OUT1–OUT7 logic high propagation delay VINX = 3.3 V, Vpullup = 12 V, Rpullup = 1 kΩ 50 70 ns tPLH OUT1–OUT7 logic low propagation delay VINX = 3.3V, Vpullup = 12 V, Rpullup = 1 kΩ 121 140 ns t CHANNEL Channel-to-channel delay Over recommended operating conditions and with same test conditions on channels. 15 50 ns RPD IN1–IN7 input pulldown resistance 300 390 kΩ ζ IN1–IN7 input filter time constant COUT OUT1–OUT7 output capacitance 210 VINX = 3.3 V, VOUTX = 0.4 V 9 ns 15 pF FREE-WHEELING DIODE PARAMETERS (4) (5) VF Forward voltage drop IF-peak Diode peak forward current (1) (2) (3) (4) (5) IF-peak = 140 mA, VF = VOUTx – VCOM 1.2 V 140 mA The typical continuous current rating is limited by VOL= 0.6 V. Whereas, absolute maximum operating continuous current may be limited by the Thermal performance parameters listed in the Thermal Information and other reliability parameters listed in Recommended Operating Conditions. See Absolute Maximum Ratings for TJ dependent absolute maximum GND-pin current. Rise and fall propagation delays, tPHL and tPLH, are measured between 50% values of the input and the corresponding output signal amplitude transition. Specified by design only. Validated during qualification. Not measured in production testing. Not rated for continuous current operation. For higher reliability, use an external freewheeling diode for inductive loads resulting in more than specified maximum free-wheeling. Diode peak current across various temperature conditions. 6.6 Typical Characteristics TA = 25ºC Figure 1. Load Current, 1-Channel at VOL = 0.6 V Figure 2. Load Current, 7-Channels in Parallel at VOL = 0.6 V Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 5 ULN2003V12 SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 www.ti.com 7 Detailed Description 7.1 Overview The ULN2003V12 device is a seven channel low-side NMOS driver capable of driving 100-mA Load with 3-V input drive voltage through each channel. This device can drive relays, LEDs, or resistive loads up to 16 V. The ULN2003V12 supports 3.3-V to 5-V CMOS logic input interface, thus making it compatible to a wide range of microcontrollers and other logic interfaces. The ULN2003V12 features an improved input interface that minimizes the input DC current drawn from the external drivers. The ULN2003V12 features an input RC snubber that greatly improves its performance in noisy operating conditions. The ULN2003V12 channel inputs feature an internal input pulldown resistor, thus allowing input logic to be tri-stated. The ULN2003V12 may also support other logic input levels (for example, TTL and 1.8 V). 7.2 Functional Diagram IN1 1 16 OUT1 IN2 2 15 OUT2 IN3 3 14 OUT3 IN4 4 13 OUT4 IN5 5 12 OUT5 IN6 6 11 OUT6 IN7 7 10 OUT7 GND 8 9 COM Copyright © 2016, Texas Instruments Incorporated 7.3 Feature Description As shown in Figure 3, each output of the ULN2003V12 features an internal free-wheeling diode connected in a common-cathode configuration at the COM pin. The ULN2003V12 provides flexibility of increasing current sink capability through combining several adjacent channels in parallel. Under typical conditions, the ULN2003V12 can support up to 1 A of load current when all 7-channels are connected in parallel. The ULN2003V12 can also be used in a variety of other applications requiring a sink driver. COM OUT RC Filter/Snubber RIN=3kQ IN NFET Pull-down 300kQ ESD CIN= 9pF ESD Figure 3. Channel Block Diagram 6 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 ULN2003V12 www.ti.com SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 Feature Description (continued) 7.3.1 TTL and Other Logic Inputs ULN2003V12 input interface is specified for standard 3-V and 5-V CMOS logic interface. However, ULN2003V12 input interface may support other logic input levels as well. See Figure 1 and Figure 2 to establish VOL and the corresponding typical load current levels for various input voltage ranges. See Applications and Implementation for an implementation to drive 1.8-V relays using ULN2003V12. 7.3.2 Input RC Snubber ULN2003V12 features an input RC snubber that helps prevent spurious switching in noisy environment. Connect an external 1-kΩ to 5-kΩ resistor in series with the input to further enhance ULN2003V12’s noise tolerance. 7.3.3 High-impedance Input Drivers ULN2003V12 features a 300-kΩ input pulldown resistor. The presence of this resistor allows the input drivers to be tri-stated. When a high-impedance driver is connected to a channel input the ULN2003V12 detects the channel input as a low level input and remains in the OFF position. The input RC snubber helps improve noise tolerance when input drivers are in the high-impedance state. 7.4 Device Functional Modes Table 1 lists the functional modes for this device. Table 1. ULN2003V12 Function Table (1) (1) INPUT (IN1 TO IN7) OUTPUT (OUT1 TO OUT7) L Z H L Z Z L = Low-level (GND), H= High-level, Z= High-impedance Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 7 ULN2003V12 SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 www.ti.com 8 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information Peripheral drivers such as the ULN2003V12 are primarily used in the following applications: • Stepper Motor Driving • Relay and Solenoid Driving • LED Driving • Logic Level Shifting Peripheral Drivers are not limited to one specific application at a time, but can be used for all of these applications simultaneously. For example, one device could enable driving one stepper motor, driving one relay, driving an LED, and shifting a 3.3-V logic signal to a 12-V logic signal at the same time. 8.2 Typical Applications 8.2.1 Unipolar Stepper Motor Driver The Figure 4 shows an implementation of ULN2003V12 for driving a unipolar stepper motor. Maximum Recommended VCC = 16 V Phase A VCC Stepper Motor Phase B IN1 OUT1 IN2 OUT2 IN3 OUT3 VCC Phase B Phase A Logic Inputs 3 V to 5 V OUT4 IN4 ULN2003V12 IN5 OUT5 IN6 OUT6 IN7 OUT7 GND COM VCC Stepper Motor Driving Applications Require Supply on COM pin Copyright © 2016, Texas Instruments Incorporated Figure 4. ULN2003V12 as a Stepper Motor Driver 8 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 ULN2003V12 www.ti.com SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 Typical Applications (continued) 8.2.1.1 Design Requirements The unconnected input channels can be used for other functions. When an input pin is left open, the internal 300kΩ pulldown resistor pulls the respective input pin to GND potential. For higher noise immunity use an external short across an unconnected input and GND pins. See Stepper Motor Driving with Peripheral Drivers (SLVA767) for additional information regarding stepper motor driving. 8.2.1.2 Application Curves Figure 5. Freewheeling Diode VF vs IF 8.2.2 Inverting Logic Level Shifter To use ULN2003V12 as an open-drain inverting logic level shifter, configure the device as shown in Figure 6. The device input and output logic levels can also be set independently. When using different channel input and output logic voltages, connect the ULN2003V12 COM pin to the maximum voltage. Maximum Recommended VCC = 16 V VCC1 VCC2 VCC3 Rpullup Logic Inputs 1.8 V to 5 V IN1 OUT1 IN2 OUT2 IN3 OUT3 OUT4 IN4 ULN2003V12 IN5 OUT5 IN6 OUT6 IN7 OUT7 GND COM Level Shifted Outputs Typically can be left floating for Level-Shifting applications If a supply is connected, it must be the most positive supply Copyright © 2016, Texas Instruments Incorporated Figure 6. ULN2003V12 as Inverting Logic Level Shifter Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 9 ULN2003V12 SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 www.ti.com Typical Applications (continued) 8.2.2.1 Design Requirements ULN2003V12 can be used in digital applications requiring logic level shifting up to 16 V at the output side. Because the device pulls the output transistor low when input is high, this configuration is useful for applications requiring inverting logic with the level shifting operation. 8.2.2.2 Detailed Design Procedure To operate in level shifting operation, timing and propagation delay must be kept in mind. Depending on the pullup resistors at the output ULN2003V12 exhibits different propagation delays. The choice of pullup resistor is dependent on the drive required at the output. The device can pull output to ground with the output transistor, but to transition from low to high output resistor plays a critical role. If high drive at output is required, use Equation 1 to calculate a lower resistance. RPullup = OUT1_VSUP / IDrive (1) For example, a drive of 5 mA is required at the output for 1.8-V to 5-V translation application. RPullup = OUT1_VSUP / IDrive = 5 / 0.005 =1k (2) 8.2.3 Maximum Supply Selector The Figure 7 implements a maximum supply selector along with a 4-channel logic level shifter using a single ULN20003V12. Maximum Recommended VMAX = 16 V VMAX from COM Logic Inputs 1.8 V to 5 V IN1 OUT1 IN2 OUT2 IN3 OUT3 OUT4 IN4 ULN2003V12 IN5 OUT5 IN6 OUT6 IN7 OUT7 GND COM V1 V2 V3 VMAX VMAX = MAX(V1,V2,V3) ± VF VF = Diode forward drop Copyright © 2016, Texas Instruments Incorporated Figure 7. ULN2003V12 as a Maximum Supply Selector 8.2.3.1 Design Requirements This setup configures ULN2003V12’s channel clamp diodes OUT5 to OUT7 in a diode-OR configuration and thus the maximum supply among V1, V2, and V3 becomes available at the COM pin. The maximum supply is then used as a pullup voltage for level shifters. Limit the net GND pin current to less than 100-mA DC to ensure reliability of the conducting diode. The unconnected inputs IN5 to IN7 are pulled to GND potential through 300-kΩ internal pulldown resistor. 10 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 ULN2003V12 www.ti.com SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 Typical Applications (continued) 8.2.4 Constant Current LED Driver When configured as per Figure 8, the ULN2003V12 outputs OUT1 to OUT6 act as independent constant current sources. Maximum Recommended VSUP = 16 V VSUP VIN (up to 5.5 V) R1 IREF R1 = (VIN-VOUT7)/IREF OUT7 IN1 OUT1 IN2 OUT2 IN3 OUT3 OUT4 IN4 ULN2003V12 IN5 OUT5 IN6 OUT6 OUT7 IN7 OUT7 GND COM VSUP Copyright © 2016, Texas Instruments Incorporated Figure 8. ULN2003V12 as a Constant Current Driver 8.2.4.1 Design Requirements The current flowing through the resistor R1 is mirrored on all other channels. To increase the current sourcing connect several output channels in parallel. To ensure best current mirroring, set voltage drop across connected load such that VOUTx matches VOUT7. Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 11 ULN2003V12 SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 www.ti.com Typical Applications (continued) 8.2.5 NOR Logic Driver Figure 9 shows a NOR Logic driver implementation using the ULN2003V12 device. Maximum Recommended VSUP = 16 V VSUP Logic Inputs 1.8 V to 5 V A IN1 OUT1 IN2 OUT2 IN3 OUT3 B OUT4 IN4 ULN2003V12 IN5 OUT5 IN6 OUT6 IN7 OUT7 GND COM C VSUP Copyright © 2016, Texas Instruments Incorporated Figure 9. ULN2003V12 as a NOR driver 8.2.5.1 Design Requirements The output channels sharing a common pullup resistor implement a logic NOR of the respective channel inputs. Node A is controlled by inputs IN1 and IN2 as described in Table 2 (Positive Logic Function: A = IN1+IN2). Node B is controlled by inputs IN3 and IN4 as described in Table 3 (Positive Logic Function: B = IN3+IN4). Node C is controlled by inputs IN5, IN6, and IN7 as described in Table 4 (Positive Logic Function C = IN5+IN6+IN7). Table 2. Output A Function Table IN1 IN2 A L L H X H L H X L Table 3. Output B Function Table IN3 IN4 B L L H X H L H X L Table 4. Output C Function Table 12 IN5 IN6 IN7 C LED L L L H OFF X X H L ON X H X L ON H X X L ON Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 ULN2003V12 www.ti.com SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 9 Power Supply Recommendations The COM pin is the power supply pin of this device to power the gate drive circuitry. Although not required, TI recommends putting a bypass capacitor of 0.1 µF across the COM pin and GND pin. 10 Layout 10.1 Layout Guidelines Thin traces can be used on the input due to the low current logic that is typically used to drive ULN2003V12. Take care to separate the input channels as much as possible, as to eliminate cross-talk. TI recommends thick traces for the output to drive high currents that may be required. Wire thickness can be determined by the trace material's current density and desired drive current. Because all of the channels currents return to a common ground, it is best to size that trace width to be very wide. Some applications require up to 1 A. 10.2 Layout Example IN1 OUT1 IN2 OUT2 IN3 OUT3 IN4 OUT4 IN5 OUT5 IN6 OUT6 IN7 OUT7 GND COM 0.1 F 10.3 Thermal Considerations 10.3.1 On-chip Power Dissipation Use Equation 3 to calculate ULN2003V12 on-chip power dissipation PD. N PD = å VOLi ´ ILi i=1 where • • N is the number of channels active together VOLi is the OUTi pin voltage for the load current ILi (3) 10.3.2 Thermal Reliability TI recommends limiting the ULN2003V12 IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation. Use Equation 4 to calculate the maximum allowable on-chip power dissipation for a target IC junction temperature. PD(MAX) = (T J(MAX) - TA ) qJA where • • • TJ(MAX) is the target maximum junction temperature TA is the operating ambient temperature θJA is the package junction to ambient thermal resistance (4) Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 13 ULN2003V12 SLRS060C – MAY 2012 – REVISED NOVEMBER 2016 www.ti.com 11 Device and Documentation Support 11.1 Documentation Support For related documentation see the following: Stepper Motor Driving with Peripheral Drivers (SLVA767) 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: ULN2003V12 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) ULN2003V12DR ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 U2003V12 ULN2003V12PWR ACTIVE TSSOP PW 16 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 U2003V12 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of