Please note that Cypress is an Infineon Technologies Company.
The document following this cover page is marked as “Cypress” document as this is the
company that originally developed the product. Please note that Infineon will continue
to offer the product to new and existing customers as part of the Infineon product
portfolio.
Continuity of document content
The fact that Infineon offers the following product as part of the Infineon product
portfolio does not lead to any changes to this document. Future revisions will occur
when appropriate, and any changes will be set out on the document history page.
Continuity of ordering part numbers
Infineon continues to support existing part numbers. Please continue to use the
ordering part numbers listed in the datasheet for ordering.
www.infineon.com
CYBLE-012011-00
EZ-BLE™ Creator Module
CYBLE-012011-00, EZ-BLE™ Creator Module
General Description
Functional Capabilities
The CYBLE-012011-00 is a Bluetooth Low Energy wireless
module solution. The CYBLE-012011-00 is a turnkey solution
and includes onboard crystal oscillators, trace antenna, passive
components, and the Cypress PSoC 4 Bluetooth LE. Refer to the
PSoC 4 Bluetooth LE datasheet for additional details on the
capabilities of the PSoC 4 Bluetooth LE device used on this
module.
■
Up to 22 capacitive sensors for buttons or sliders with
best-in-class signal-to-noise ratio (SNR) and liquid tolerance
■
12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
The CYBLE-012011-00 supports a number of peripheral
functions (ADC, timers, counters, PWM) and serial
communication protocols (I2C, UART, SPI) through its
programmable architecture. The CYBLE-012011-00 includes a
royalty-free Bluetooth LE stack compatible with Bluetooth 5.1
and provides up to 23 GPIOs in a 14.52 × 19.20 × 2.00 mm
package.
■
Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
■
LCD drive supported on all GPIOs (common or segment)
■
Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
■
I2S master interface
The CYBLE-012011-00 is fully certified and qualified and is an
ideal fit for cost sensitive applications.
■
Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
■
Switches between Central and Peripheral roles on-the-go
■
Standard Bluetooth Low Energy profiles and services for
interoperability
Custom profile and service for specific use cases
Module Description
■
Two serial communication blocks (SCBs) supporting I2C
(master/slave), SPI (master/slave), or UART
■
Module size: 14.52 mm ×19.20 mm × 2.00 mm (with shield)
■
Castellated solder pad connections for ease-of-use
■
128-KB flash memory, 16-KB SRAM memory
■
■
Up to 23 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output
Benefits
■
Bluetooth 5.1 qualified single-mode module
❐ QDID: U048529
❐ Declaration ID: 141257
The CYBLE-012011-00 module is provided as a turnkey solution,
including all necessary hardware required to use Bluetooth LE
communication standards.
■
Certified to FCC, ISED, MIC, KC, and CE regulations
■
Proven hardware design ready to use
■
Industrial temperature range: –40 °C to +85 °C
■
■
32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
Cost optimized for applications without space constraint,
Footprint
■
Reprogrammable architecture
■
Watchdog timer with dedicated internal low-speed oscillator
(ILO)
■
Fully certified module eliminates the time needed for design,
development and certification processes
■
Two-pin SWD for programming
■
Bluetooth SIG qualified with QDID and Declaration ID
■
Flexible communication protocol support
■
PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
Bluetooth LE application
Power Consumption
■
TX output power: –18 dbm to +3 dbm
■
Received signal strength indicator (RSSI) with 1-dB resolution
■
TX current consumption of 15.6 mA (radio only, 0 dbm)
■
RX current consumption of 16.4 mA (radio only)
■
Low power mode support
❐ Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
❐ Hibernate: 150 nA with SRAM retention
❐ Stop: 60 nA with GPIO (P2.2) or XRES wakeup
Cypress Semiconductor Corporation
Document Number: 002-02521 Rev. *I
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised December 23, 2020
CYBLE-012011-00
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to
quickly and effectively integrate the module into your design.
■
■
■
■
Overview: EZ-BLE Module Portfolio, Module Roadmap
PSoC 4 BLE Silicon Datasheet
Application notes: Cypress offers a number of Bluetooth LE
application notes covering a broad range of topics, from basic
to advanced level. Recommended application notes for getting
started with EZ-BLE modules are:
❐ AN96841 - Getting Started with EZ-BLE™ Creator Modules
®
❐ AN91267 - Getting Started with PSoC 4 BLE
®
❐ AN97060 - PSoC 4 BLE and PRoC™ BLE - Over-The-Air
(OTA) Device Firmware Upgrade (DFU) Guide
❐ AN91162 - Creating a BLE Custom Profile
❐ AN91184 - PSoC 4 BLE - Designing BLE Applications
❐ AN92584 - Designing for Low Power and Estimating Battery
Life for BLE Applications
®
®
❐ AN85951 - PSoC 4 CapSense Design Guide
®
❐ AN95089 - PSoC 4/PRoC™ BLE Crystal Oscillator Selection and Tuning Techniques
❐ AN91445 - Antenna Design and RF Layout Guidelines
Technical Reference Manual (TRM):
®
❐ PRoC BLE Technical Reference Manual
■
Knowledge Base Articles
❐ KBA09921 - Pin Mapping Differences Between the
EZ-BLE™ PRoC™ Creator Evaluation Board
(CYBLE-012011-EVAL) and the BLE Pioneer Kit
(CY8CKIT-042-BLE)
❐ KBA97095 - EZ-BLE™ Module Placement
❐ KBA210638 - RF Regulatory Certifications for
CYBLE-012011-00 and CYBLE-212019-00 EZ-BLE™
PRoC® Modules - KBA210638
❐ KBA213976 - FAQ for BLE and Regulatory Certifications with
EZ-BLE modules
❐ KBA210802 - Queries on BLE Qualification and Declaration
Processes
❐ KBA218122 - 3D Model Files for EZ-BLE/EZ-BT Modules
■
Development Kits:
❐ CYBLE-012011-EVAL - CYBLE-012011-EVAL EZ-BLE™
PRoC™ Evaluation Board
®
❐ CY8CKIT-042-BLE - Bluetooth Low Energy Pioneer Kit
®
❐ CY8CKIT-002 - PSoC MiniProg3 Program and Debug Kit
■
Test and Debug Tools:
®
❐ CYSmart - Bluetooth LE Test and Debug Tool (Windows)
®
❐ CYSmart Mobile - Bluetooth LE Test and Debug Tool
(Android/iOS Mobile App)
Two Design Environments to Get You Started Quickly
PSoC® Creator™ Integrated Design Environment (IDE)
PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and
debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 Bluetooth LE, and EZ-BLE module systems with no code size limitations. PSoC
peripherals are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified,
production-ready PSoC Components™.
PSoC Components are analog and digital “virtual chips,” represented by an icon that users can drag-and-drop into a design and
configure to suit a broad array of application requirements.
Bluetooth Low Energy Component
The Bluetooth Low Energy Component inside PSoC Creator provides a comprehensive GUI-based configuration window that lets you
quickly design Bluetooth LE applications. The Component incorporates a Bluetooth Core Specification v5.1 compliant Bluetooth LE
protocol stack and provides API functions to enable user applications to interface with the underlying Bluetooth Low Energy
Sub-System (BLESS) hardware via the stack.
EZ-Serial™ Bluetooth LE Firmware Platform
The EZ-Serial Firmware Platform provides a simple way to access the most common hardware and communication features needed
in Bluetooth LE applications. EZ-Serial implements an intuitive API protocol over the UART interface and exposes various status and
control signals through the module’s GPIOs, making it easy to add Bluetooth LE functionality quickly to existing designs.
Use a simple serial terminal and evaluation kit to begin development without requiring an IDE. Refer to the EZ-Serial webpage for
User Manuals and instructions for getting started as well as detailed reference materials.
EZ-BLE modules are pre-flashed with the EZ-Serial Firmware Platform. If you do not have EZ-Serial pre-loaded on your module, you
can download each EZ-BLE module’s firmware images on the EZ-Serial webpage.
Technical Support
■
■
■
Frequently Asked Questions (FAQs): Learn more about our Bluetooth LE ECO System.
Forum: See if your question is already answered by fellow developers on the PSoC 4 Bluetooth LE forum.
Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,
you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the prompt.
Document Number: 002-02521 Rev. *I
Page 2 of 39
CYBLE-012011-00
Contents
Overview ............................................................................ 4
Module Description ...................................................... 4
Pad Connection Interface ................................................ 6
Recommended Host PCB Layout ................................... 7
Digital and Analog Capabilities and Connections ......... 9
Power Supply Connections
and Recommended External Components .................. 10
Power Connections ................................................... 10
Connection Options ................................................... 10
External Component Recommendation .................... 10
Critical Components List ........................................... 13
Antenna Design ......................................................... 13
Electrical Specification .................................................. 14
GPIO ......................................................................... 16
XRES ......................................................................... 17
Digital Peripherals ..................................................... 20
Serial Communication ............................................... 22
Memory ..................................................................... 23
System Resources .................................................... 24
Environmental Specifications ....................................... 29
Environmental Compliance ....................................... 29
RF Certification .......................................................... 29
Safety Certification .................................................... 29
Document Number: 002-02521 Rev. *I
Environmental Conditions ......................................... 29
ESD and EMI Protection ........................................... 29
Regulatory Information .................................................. 30
FCC ........................................................................... 30
ISED .......................................................................... 31
European R&TTE Declaration of Conformity ............ 31
MIC Japan ................................................................. 32
KC Korea ................................................................... 32
Packaging ........................................................................ 33
Ordering Information ...................................................... 35
Part Numbering Convention ...................................... 35
Acronyms ........................................................................ 36
Document Conventions ................................................. 36
Units of Measure ....................................................... 36
Document History Page ................................................. 37
Sales, Solutions, and Legal Information ...................... 39
Worldwide Sales and Design Support ....................... 39
Products .................................................................... 39
PSoC® Solutions ....................................................... 39
Cypress Developer Community ................................. 39
Technical Support ..................................................... 39
Page 3 of 39
CYBLE-012011-00
Overview
Module Description
The CYBLE-012011-00 module is a complete module designed to be soldered to the applications main board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate Bluetooth LE device) from various vendors to achieve the
Bluetooth LE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained.
Designs should be held within the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters
(mm).
Table 1. Module Design Dimensions
Dimension Item
Module dimensions
Antenna location dimensions
Specification
Length (X)
14.52 ± 0.15 mm
Width (Y)
19.20 ± 0.15 mm
Length (X)
11.00 ± 0.15 mm
Width (Y)
5.00 ± 0.15 mm
Height (H)
0.80 ± 0.10 mm
Shield height
Height (H)
1.20 ± 0.10 mm
Maximum component height
Height (H)
1.20 mm typical (shield)
Total module thickness (bottom of module to highest component)
Height (H)
2.00 mm typical
PCB thickness
See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-012011-00.
Document Number: 002-02521 Rev. *I
Page 4 of 39
CYBLE-012011-00
Figure 1. Module Mechanical Drawing
Top View
Side View
Bottom View
Note
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on
recommended host PCB layout, see Figure 3, Figure 4, Figure 5, and Figure 6 and Table 3.
Document Number: 002-02521 Rev. *I
Page 5 of 39
CYBLE-012011-00
Pad Connection Interface
As shown in the bottom view of Figure 1 on page 5, the CYBLE-012011-00 connects to the host board via solder pads on the backside
of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-012011-00 module.
Table 2. Solder Pad Connection Description
Name
SP
Connections Connection Type
31
Solder Pads
Pad Length Dimension
Pad Width Dimension
Pad Pitch
1.02 mm
0.71 mm
1.27 mm
Figure 2. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress Bluetooth LE module is in a corner of the host board with the trace antenna located at the far
corner. This placement minimizes the additional recommended keep out area stated in item 2. Refer to AN96841 for module
placement best practices.
2. To maximize RF performance, the area immediately around the Cypress Bluetooth LE module trace antenna should contain an
additional keep out area, where no grounding or signal trace are contained. The keep out area applies to all layers of the host
board. The recommended dimensions of the host PCB keep out area are shown in Figure 3 (dimensions are in mm).
Figure 3. Recommended Host PCB Keep Out Area Around the CYBLE-012011-00 Antenna
Host PCB Keep Out Area Around Trace Antenna
Document Number: 002-02521 Rev. *I
Page 6 of 39
CYBLE-012011-00
Recommended Host PCB Layout
Figure 4, Figure 5, Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the
CYBLE-012011-00. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad
on either side) shown in Figure 6 is the minimum recommended host pad length. The host PCB layout pattern can be completed using
either Figure 4, Figure 5, or Figure 6. It is not necessary to use all figures to complete the host PCB layout pattern.
Figure 4. Host Layout Pattern for CYBLE-012011-00
Figure 5. Module Pad Location from Origin
Top View (Seen on Host PCB)
Top View (Seen on Host PCB)
Document Number: 002-02521 Rev. *I
Page 7 of 39
CYBLE-012011-00
Table 3 provides the center location for each solder pad on the CYBLE-012011-00. All dimensions are referenced to the center of the
solder pad. Refer to Figure 6 for the location of each module solder pad.
Table 3. Module Solder Pad Location
Figure 6. Solder Pad Reference Location
Solder Pad
(Center of Pad)
Location (X,Y) from
Orign (mm)
Dimension from
Orign (mils)
1
(0.39, 4.88)
(15.35, 192.13)
2
(0.39, 6.15)
(15.35, 242.13)
3
(0.39, 7.42)
(15.35, 292.13)
4
(0.39, 8.69)
(15.35, 342.13)
5
(0.39, 9.96)
(15.35, 392.13)
6
(0.39, 11.23)
(15.35, 442.13)
7
(0.39, 12.50)
(15.35, 492.13)
8
(0.39, 13.77)
(15.35, 542.13)
9
(0.39, 15.04)
(15.35, 592.13)
10
(0.39, 16.31)
(15.35, 642.13)
11
(0.39, 17.58)
(15.35, 692.13)
12
(2.04, 18.82)
(80.31, 740.94)
13
(3.31, 18.82)
(130.31, 740.94)
14
(4.58, 18.82)
(180.31, 740.94)
15
(5.85, 18.82)
(230.31, 740.94)
16
(7.12, 18.82)
(280.31, 740.94)
17
(8.39, 18.82)
(330.31, 740.94)
18
(9.66, 18.82)
(380.31, 740.94)
19
(10.93, 18.82)
(430.31, 740.94)
20
(12.20, 18.82)
(480.31, 740.94)
21
(13.47, 18.82)
(530.31, 740.94)
22
(14.14, 16.31)
(556.69, 642.12)
23
(14.14, 15.04)
(556.69, 592.12)
24
(14.14, 13.77)
(556.69, 542.12)
25
(14.14, 12.50)
(556.69, 492.12)
26
(14.14, 11.23)
(556.69, 442.12)
27
(14.14, 9.96)
(556.69, 392.12)
28
(14.14, 8.69)
(556.69, 342.12)
29
(14.14, 7.42)
(556.69, 292.12)
30
(14.14, 6.15)
(556.69, 242.12)
31
(14.14, 4.88)
(556.69, 192.12)
Document Number: 002-02521 Rev. *I
Page 8 of 39
CYBLE-012011-00
Digital and Analog Capabilities and Connections
Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on
CYBLE-012011-00, the Bluetooth LE device port-pin, and denotes whether the function shown is available for each solder pad. Each
connection is configurable for a single option shown with a ✓.
Table 4. Solder Pad Connection Definitions
Solder Pad Device
Number Port Pin
1
XRES
2
[4]
P4.0
3
P3.7
4
P3.6
5
P3.5
6
P3.4
7
P3.3
8
P3.2
9
P2.6
10
VREF
11
P2.4
12
P2.3
13
P2.2
14
P2.0
15
VDD
16
P1.7
17
P1.6
18
P1.5
19
P1.4
20
P1.0
21
P0.4
22
P0.5
23
P0.7
UART
SPI
I2 C
TCPWM[2,3]
CapSense WCO ECO LCD
Out Out
External Reset Hardware Connection Input
✓(SCB1_RTS) ✓(SCB1_MOSI)
✓(SCB1_CTS)
✓(SCB1_RTS)
✓(SCB1_TX)
✓(SCB1_SCL)
✓(SCB1_RX)
✓(SCB1_SDA)
✓(SCB0_CTS)
✓(SCB0_RTS)
✓(TCPWM0_P)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(CMOD)
✓(Sensor) ✓
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
Reference Voltage Input (Optional)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(SCB0_SS3)
✓(SCB0_SS1)
✓(Sensor)
✓(Sensor) ✓
✓(Sensor)
✓(Sensor)
Digital Power Supply Input (1.8 to 5.5V)
✓(SCB0_CTS)
✓(SCB0_RTS)
✓(SCB0_TX)
✓(SCB0_RX)
✓(SCB0_SCLK)
✓(SCB0_SS0)
✓(SCB0_MISO) ✓(SCB0_SCL)
✓(SCB0_MOSI) ✓(SCB0_SDA)
✓(SCB0_RX)
✓(SCB0_TX)
✓(SCB0_CTS)
✓(SCB0_RTS)
✓(SCB0_MOSI) ✓(SCB0_SDA)
✓(SCB0_MISO) ✓(SCB0_SCL)
✓(SCB0_SCLK)
✓(SCB0_SS0)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
24
P0.6
25
GND[5]
Ground Connection
26
GND[5]
Ground Connection
27
GND
[5]
Ground Connection
28
GND[5]
Ground Connection
29
VDDR
Radio Power Supply (1.9V to 5.5V)
30
P5.0
31
P5.1
✓(SCB1_RX) ✓(SCB1_SS0) ✓(SCB1_SDA) ✓(TCPWM3_P) ✓(Sensor)
✓(SCB1_TX) ✓(SCB1_SCLK) ✓(SCB1_SCL) ✓(TCPWM3_N) ✓(Sensor)
✓
✓
SWD
GPIO
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓ ✓(SWDCLK)
✓ ✓(SWDIO)
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
Notes
2. TCPWM: Timer, Counter, and Pulse Width Modulator. If supported, the pad can be configured to any of these peripheral functions.
3. TCPWM connections on ports 0, 1, 2, and 3 can be routed through the Digital Signal Interconnect (DSI) to any of the TCPWM blocks and can be either positive
or negative polarity. TCPWM connections on ports 4 and 5 are direct and can only be used with the specified TCPWM block and polarity specified above.
4. When using the capacitive sensing functionality, Pad 2 (P4.0) must be connected to a CMOD capacitor (located off of Cypress Bluetooth LE Module). The value of
this capacitor is 2.2 nF and should be placed as close to the module as possible.
5. The main board needs to connect all GND connections (Pad 25/26/27/28) on the module to the common ground of the system.
6. If the I2S feature is used in the design, the I2S pins shall be dynamically routed to the appropriate available GPIO by PSoC Creator
Document Number: 002-02521 Rev. *I
Page 9 of 39
CYBLE-012011-00
Power Supply Connections and Recommended External Components
Power Connections
External Component Recommendation
The CYBLE-012011-00 contains two power supply connections,
VDD and VDDR. The VDD connection supplies power for both
digital and analog device operation. The VDDR connection
supplies power for the device radio.
In either connection scenario, it is recommended to place an
external ferrite bead between the supply and the module
connection. The ferrite bead should be positioned as close as
possible to the module pin connection.
VDD accepts a supply range of 1.71 V to 5.5 V. VDDR accepts
a supply range of 1.9 V to 5.5 V. These specifications can be
found in Table 9. The maximum power supply ripple for both
power connections on the module is 100 mV, as shown in
Table 7.
Figure 7 details the recommended host schematic options for a
single supply scenario. The use of one or two ferrite beads will
depend on the specific application and configuration of the
CYBLE-012011-00.
The power supply ramp rate of VDD must be equal to or greater
than that of VDDR.
Connection Options
Figure 8 details the recommended host schematic for an
independent supply scenario.
The recommended ferrite bead value is 330 , 100 MHz. (Murata
BLM21PG331SN1D).
Two connection options are available for any application:
1. Single supply: Connect VDD and VDDR to the same supply.
2. Independent supply: Power VDD and VDDR separately.
Figure 7. Recommended Host Schematic Options for a Single Supply Option
Single Ferrite Bead Option (Seen from Bottom)
Document Number: 002-02521 Rev. *I
Two Ferrite Bead Option (Seen from Bottom)
Page 10 of 39
CYBLE-012011-00
Figure 8. Recommended Host Schematic for an Independent Supply Option
Independent Power Supply Option (Seen from Bottom)
Document Number: 002-02521 Rev. *I
Page 11 of 39
CYBLE-012011-00
The CYBLE-012011-00 schematic is shown in Figure 9.
Figure 9. CYBLE-012011-00 Schematic Diagram
Document Number: 002-02521 Rev. *I
Page 12 of 39
CYBLE-012011-00
Critical Components List
Table 5 details the critical components used in the CYBLE-012011-00 module.
Table 5. Critical Component List
Component
Reference Designator
Description
Silicon
U1
56-pin QFN PSoC 4 Bluetooth LE
Crystal
Y1
24.000 MHz, 12PF
Crystal
Y2
32.768 kHz, 12.5PF
Antenna Design
Table 6 details trace antenna used in the CYBLE-012011-00 module. For more information, see Table 8.
Table 6. Trace Antenna Specifications
Item
Description
Frequency Range
2400–2500 MHz
Peak Gain
0.5-dBi typical
Average Gain
–0.5-dBi typical
Return Loss
10-dB minimum
Document Number: 002-02521 Rev. *I
Page 13 of 39
CYBLE-012011-00
Electrical Specification
Table 7 details the absolute maximum electrical characteristics for the Cypress Bluetooth LE module.
Table 7. CYBLE-012011-00 Absolute Maximum Ratings
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
VDDD_ABS
Analog, digital, or radio supply relative to VSS
(VSSD = VSSA)
–0.5
–
6
V
Absolute maximum
VCCD_ABS
Direct digital core voltage input relative to VSSD
–0.5
–
1.95
V
Absolute maximum
VDD_RIPPLE
Maximum power supply ripple for VDD and VDDR
input voltage
–
–
100
mV
VGPIO_ABS
GPIO voltage
–0.5
–
VDD +0.5
V
Absolute maximum
IGPIO_ABS
Maximum current per GPIO
–25
–
25
mA
Absolute maximum
IGPIO_injection
GPIO injection current: Maximum for VIH > VDD
and minimum for VIL < VSS
–0.5
–
0.5
mA
Absolute maximum current
injected per pin
LU
Pin current for latch up
–200
200
mA
–
3.0V supply
Ripple frequency of 100 kHz
to 750 kHz
Table 8 details the RF characteristics for the Cypress Bluetooth LE module.
Table 8. CYBLE-012011-00 RF Performance Characteristics
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
–18
0
3
dBm
Configurable via register
settings
–
–87
–
dBm
Guaranteed by design
simulation
RFO
RF output power on ANT
RXS
RF receive sensitivity on ANT
FR
Module frequency range
2400
–
2480
MHz
–
GP
Peak gain
–
0.5
–
dBi
–
GAvg
Average gain
–
–0.5
–
dBi
–
RL
Return loss
–
–10.5
–
dB
–
Table 9 through Table 48 list the module level electrical characteristics for the CYBLE-012011-00. All specifications are valid for –40
°C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted.
Table 9. CYBLE-012011-00 DC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
VDD1
Power supply input voltage
1.8
–
5.5
V
With regulator enabled
VDD2
Power supply input voltage unregulated
1.71
1.8
1.89
V
Internally unregulated
supply
VDDR1
Radio supply voltage (radio on)
1.9
–
5.5
V
–
VDDR2
Radio supply voltage (radio off)
1.71
–
5.5
V
–
Active Mode, VDD = 1.71 V to 5.5 V
T = 25 °C,
VDD = 3.3 V
IDD3
Execute from flash; CPU at 3 MHz
–
1.7
–
mA
IDD4
Execute from flash; CPU at 3 MHz
–
–
–
mA
T = –40 °C to 85 °C
IDD5
Execute from flash; CPU at 6 MHz
–
2.5
–
mA
T = 25 °C,
VDD = 3.3 V
IDD6
Execute from flash; CPU at 6 MHz
–
–
–
mA
T = –40 °C to 85 °C
IDD7
Execute from flash; CPU at 12 MHz
–
4
–
mA
T = 25 °C,
VDD = 3.3 V
Document Number: 002-02521 Rev. *I
Page 14 of 39
CYBLE-012011-00
Table 9. CYBLE-012011-00 DC Specifications (continued)
Parameter
IDD8
Description
Execute from flash; CPU at 12 MHz
Min
Typ
Max
Units
Details/Conditions
–
–
–
mA
T = –40 °C to 85 °C
IDD9
Execute from flash; CPU at 24 MHz
–
7.1
–
mA
T = 25 °C,
VDD = 3.3 V
IDD10
Execute from flash; CPU at 24 MHz
–
–
–
mA
T = –40 °C to 85 °C
IDD11
Execute from flash; CPU at 48 MHz
–
13.4
–
mA
T = 25 °C,
VDD = 3.3 V
IDD12
Execute from flash; CPU at 48 MHz
–
–
–
mA
T = –40 °C to 85 °C
–
–
–
mA
T = 25 °C, VDD = 3.3 V,
SYSCLK = 3 MHz
–
–
–
mA
T = 25 °C, VDD = 3.3 V,
SYSCLK = 3 MHz
Sleep Mode, VDD = 1.8 V to 5.5 V
IDD13
IMO on
Sleep Mode, VDD and VDDR = 1.9 V to 5.5 V
IDD14
ECO on
Deep-Sleep Mode, VDD = 1.8 V to 3.6 V
IDD15
WDT with WCO on
–
1.5
–
µA
T = 25 °C,
VDD = 3.3 V
IDD16
WDT with WCO on
–
–
–
µA
T = –40 °C to 85 °C
IDD17
WDT with WCO on
–
–
–
µA
T = 25 °C,
VDD = 5 V
IDD18
WDT with WCO on
–
–
–
µA
T = –40 °C to 85 °C
Deep-Sleep Mode, VDD = 1.71 V to 1.89 V (Regulator Bypassed)
IDD19
WDT with WCO on
–
–
–
µA
T = 25 °C
IDD20
WDT with WCO on
–
–
–
µA
T = –40 °C to 85 °C
Hibernate Mode, VDD = 1.8 V to 3.6 V
IDD27
GPIO and reset active
–
150
–
nA
T = 25 °C,
VDD = 3.3 V
IDD28
GPIO and reset active
–
–
–
nA
T = –40 °C to 85 °C
Hibernate Mode, VDD = 3.6 V to 5.5 V
IDD29
GPIO and reset active
–
–
–
nA
T = 25 °C,
VDD = 5 V
IDD30
GPIO and reset active
–
–
–
nA
T = –40 °C to 85 °C
Stop Mode, VDD = 1.8 V to 3.6 V
IDD33
Stop-mode current (VDD)
–
20
–
nA
T = 25 °C,
VDD = 3.3 V
IDD34
Stop-mode current (VDDR)
–
40
–-
nA
T = 25 °C,
VDDR = 3.3 V
IDD35
Stop-mode current (VDD)
–
–
–
nA
T = –40 °C to 85 °C
IDD36
Stop-mode current (VDDR)
–
–
–
nA
T = –40 °C to 85 °C,
VDDR = 1.9 V to 3.6 V
Stop Mode, VDD = 3.6 V to 5.5 V
IDD37
Stop-mode current (VDD)
–
–
–
nA
T = 25 °C,
VDD = 5 V
IDD38
Stop-mode current (VDDR)
–
–
–
nA
T = 25 °C,
VDDR = 5 V
IDD39
Stop-mode current (VDD)
–
–
–
nA
T = –40 °C to 85 °C
IDD40
Stop-mode current (VDDR)
–
–
–
nA
T = –40 °C to 85 °C
Document Number: 002-02521 Rev. *I
Page 15 of 39
CYBLE-012011-00
Table 10. AC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
1.71 V VDD 5.5 V
FCPU
CPU frequency
DC
–
48
MHz
TSLEEP
Wakeup from Sleep mode
–
0
–
µs
Guaranteed by characterization
TDEEPSLEEP
Wakeup from Deep-Sleep mode
–
–
25
µs
24-MHz IMO. Guaranteed by
characterization
THIBERNATE
Wakeup from Hibernate mode
–
–
2
ms
Guaranteed by characterization
TSTOP
Wakeup from Stop mode
–
–
2
ms
XRES wakeup
Min
Typ
Max
Units
GPIO
Table 11. GPIO DC Specifications
Parameter
VIH[7]
Description
Input voltage HIGH threshold
0.7 × VDD
–
–
V
LVTTL input, VDD < 2.7 V
0.7 × VDD
–
–
V
LVTTL input, VDD 2.7 V
2.0
–
–
V
–
–
0.3 × VDD
V
Input voltage LOW threshold
VIL
VOH
VOL
Details/Conditions
CMOS input
–
–
CMOS input
LVTTL input, VDD < 2.7 V
–
–
0.3× VDD
V
–
LVTTL input, VDD 2.7 V
–
–
0.8
V
–
Output voltage HIGH level
VDD –0.6
–
–
V
IOH = 4 mA at 3.3-V VDD
Output voltage HIGH level
VDD –0.5
–
–
V
IOH = 1 mA at 1.8-V VDD
Output voltage LOW level
–
–
0.6
V
IOL = 8 mA at 3.3-V VDD
Output voltage LOW level
–
–
0.6
V
IOL = 4 mA at 1.8-V VDD
IOL = 3 mA at 3.3-V VDD
–
–
0.4
V
RPULLUP
Output voltage LOW level
Pull-up resistor
3.5
5.6
8.5
k
RPULLDOWN
Pull-down resistor
3.5
5.6
8.5
k
IIL
Input leakage current (absolute value)
–
–
2
nA
IIL_CTBM
Input leakage on CTBm input pins
–
–
4
nA
–
CIN
Input capacitance
–
–
7
pF
–
VHYSTTL
Input hysteresis LVTTL
25
40
–
mV
VHYSCMOS
Input hysteresis CMOS
0.05 × VDD
–
–
1
–
IDIODE
Current through protection diode to
VDD/VSS
–
–
100
µA
–
ITOT_GPIO
Maximum total source or sink chip
current
–
–
200
mA
–
–
–
25 °C, VDD = 3.3 V
VDD > 2.7 V
Note
7. VIH must not exceed VDD + 0.2 V.
Document Number: 002-02521 Rev. *I
Page 16 of 39
CYBLE-012011-00
Table 12. GPIO AC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
TRISEF
Rise time in Fast-Strong mode
2
–
12
ns
3.3-V VDDD, CLOAD = 25 pF
TFALLF
Fall time in Fast-Strong mode
2
–
12
ns
3.3-V VDDD, CLOAD = 25 pF
TRISES
Rise time in Slow-Strong mode
10
–
60
ns
3.3-V VDDD, CLOAD = 25 pF
TFALLS
Fall time in Slow-Strong mode
10
–
60
ns
3.3-V VDDD, CLOAD = 25 pF
FGPIOUT1
GPIO Fout; 3.3 V VDD 5.5 V
Fast-Strong mode
–
–
33
MHz
90/10%, 25 pF load, 60/40 duty
cycle
FGPIOUT2
GPIO Fout; 1.7 VVDD 3.3 V
Fast-Strong mode
–
–
16.7
MHz
90/10%, 25 pF load, 60/40 duty
cycle
FGPIOUT3
GPIO Fout; 3.3 V VDD 5.5 V
Slow-Strong mode
–
–
7
MHz
90/10%, 25 pF load, 60/40 duty
cycle
FGPIOUT4
GPIO Fout; 1.7 V VDD 3.3 V
Slow-Strong mode
–
–
3.5
MHz
90/10%, 25 pF load, 60/40 duty
cycle
FGPIOIN
GPIO input operating frequency
1.71 V VDD 5.5 V
–
–
48
MHz
90/10% VIO
Min
Typ
Max
Units
Table 13. OVT GPIO DC Specifications (P5_0 and P5_1 Only)
Parameter
Description
Details/Conditions
IIL
Input leakage (absolute value).
VIH > VDD
–
–
10
µA
25°C, VDD = 0 V, VIH = 3.0 V
VOL
Output voltage LOW level
–
–
0.4
V
IOL = 20 mA, VDD > 2.9 V
Table 14. OVT GPIO AC Specifications (P5_0 and P5_1 Only)
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
TRISE_OVFS
Output rise time in Fast-Strong mode
1.5
–
12
ns
25-pF load, 10%–90%, VDD=3.3 V
TFALL_OVFS
Output fall time in Fast-Strong mode
1.5
–
12
ns
25-pF load, 10%–90%, VDD=3.3 V
TRISESS
Output rise time in Slow-Strong mode
10
–
60
ns
25 pF load, 10%-90%,
VDD = 3.3 V
TFALLSS
Output fall time in Slow-Strong mode
10
–
60
ns
25 pF load, 10%-90%,
VDD = 3.3 V
FGPIOUT1
GPIO FOUT; 3.3 V VDD 5.5 V
Fast-Strong mode
–
–
24
MHz
90/10%, 25 pF load, 60/40 duty
cycle
FGPIOUT2
GPIO FOUT; 1.71 V VDD 3.3 V
Fast-Strong mode
–
–
16
MHz
90/10%, 25 pF load, 60/40 duty
cycle
XRES
Table 15. XRES DC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
VIH
Input voltage HIGH threshold
0.7 × VDDD
–
–
V
CMOS input
VIL
Input voltage LOW threshold
–
–
0.3 × VDDD
V
CMOS input
RPULLUP
Pull-up resistor
3.5
5.6
8.5
k
–
CIN
Input capacitance
–
3
–
pF
–
VHYSXRES
Input voltage hysteresis
–
100
–
mV
–
IDIODE
Current through protection diode to
VDD/VSS
–
–
100
µA
–
Document Number: 002-02521 Rev. *I
Page 17 of 39
CYBLE-012011-00
Table 16. XRES AC Specifications
Parameter
TRESETWIDTH
Description
Reset pulse width
Min
Typ
Max
Units
Details/Conditions
1
–
–
µs
–
Min
–5
Typ
±1
Temperature Sensor
Table 17. Temperature Sensor Specifications
Parameter
TSENSACC
Description
Temperature-sensor accuracy
Max
5
Units
Details/Conditions
°C
–40 to +85 °C
SAR ADC
Table 18. SAR ADC DC Specifications
Parameter
Description
Min
Typ
Max
Units
bits
Details/Conditions
A_RES
Resolution
–
–
12
A_CHNIS_S
Number of channels - single-ended
–
–
8
8 full-speed[8]
A-CHNKS_D
Number of channels - differential
–
–
4
Diff inputs use
neighboring I/O[8]
A-MONO
Monotonicity
–
–
–
A_GAINERR
Gain error
–
–
±0.1
%
With external
reference
A_OFFSET
Input offset voltage
–
–
2
mV
Measured with 1-V
VREF
A_ISAR
Current consumption
–
–
1
mA
Yes
A_VINS
Input voltage range - single-ended
VSS
–
VDDA
V
A_VIND
Input voltage range - differential
VSS
–
VDDA
V
A_INRES
Input resistance
–
–
2.2
k
A_INCAP
Input capacitance
–
–
10
pF
VREFSAR
Trimmed internal reference to SAR
–1
–
1
%
Percentage of Vbg
(1.024 V)
Table 19. SAR ADC AC Specifications
Parameter
Description
Min
Typ
Max
Units
A_PSRR
Power-supply rejection ratio
70
–
–
dB
A_CMRR
Common-mode rejection ratio
66
–
–
dB
Details/
Conditions
Measured at 1-V reference
A_SAMP
Sample rate
–
–
1
Msps
Fsarintref
SAR operating speed without external
ref. bypass
–
–
100
ksps
A_SNR
Signal-to-noise ratio (SNR)
65
–
–
dB
A_BW
Input bandwidth without aliasing
–
–
A_SAMP/2
kHz
A_INL
Integral nonlinearity. VDD = 1.71 V to
5.5 V, 1 Msps
–1.7
–
2
LSB
VREF = 1 V to VDD
A_INL
Integral nonlinearity. VDDD = 1.71 V to
3.6 V, 1 Msps
–1.5
–
1.7
LSB
VREF = 1.71 V to VDD
12-bit resolution
FIN = 10 kHz
Note
8. A maximum of eight single-ended ADC Channels can be accomplished only if the AMUX Buses are not being used for other funcitonality (e.g. CapSense). If
the AMUX Buses are being used for other functions, then the maximum number of single-ended ADC channels is six. Similarly, if the AMUX Buses are being
used for other functionality, then the maximum number of differential ADC channels is three.
Document Number: 002-02521 Rev. *I
Page 18 of 39
CYBLE-012011-00
Table 19. SAR ADC AC Specifications (continued)
Parameter
Description
Details/
Conditions
Min
Typ
Max
Units
–1.5
–
1.7
LSB
VREF = 1 V to VDD
A_INL
Integral nonlinearity. VDD = 1.71 V to
5.5 V, 500 ksps
A_dnl
Differential nonlinearity. VDD = 1.71 V to
5.5 V, 1 Msps
–1
–
2.2
LSB
VREF = 1 V to VDD
A_DNL
Differential nonlinearity. VDD = 1.71 V to
3.6 V, 1 Msps
–1
–
2
LSB
VREF = 1.71 V to VDD
A_DNL
Differential nonlinearity. VDD = 1.71 V to
5.5 V, 500 ksps
–1
–
2.2
LSB
VREF = 1 V to VDD
A_THD
Total harmonic distortion
–
–
–65
dB
Min
Typ
Max
Units
1.71
–
5.5
V
FIN = 10 kHz
CSD
CSD Block Specifications
Parameter
Description
VCSD
Voltage range of operation
IDAC1
DNL for 8-bit resolution
–1
–
1
LSB
IDAC1
INL for 8-bit resolution
–3
–
3
LSB
IDAC2
DNL for 7-bit resolution
–1
–
1
LSB
IDAC2
INL for 7-bit resolution
–3
–
3
LSB
SNR
Ratio of counts of finger to noise
5
–
–
Ratio
IDAC1_CRT1
Output current of IDAC1 (8 bits) in
High range
–
612
–
µA
IDAC1_CRT2
Output current of IDAC1 (8 bits) in
Low range
–
306
–
µA
IDAC2_CRT1
Output current of IDAC2 (7 bits) in
High range
–
305
–
µA
IDAC2_CRT2
Output current of IDAC2 (7 bits) in
Low range
–
153
–
µA
Document Number: 002-02521 Rev. *I
Details/
Conditions
Capacitance range of 9 pF to
35 pF, 0.1-pF sensitivity. Radio is
not operating during the scan
Page 19 of 39
CYBLE-012011-00
Digital Peripherals
Timer
Table 20. Timer DC Specifications
Parameter
ITIM1
Description
Block current consumption at 3 MHz
Min
–
Typ
–
Max
42
Units
µA
Details/Conditions
16-bit timer
ITIM2
Block current consumption at 12 MHz
–
–
130
µA
16-bit timer
ITIM3
Block current consumption at 48 MHz
–
–
535
µA
16-bit timer
Table 21. Timer AC Specifications
Parameter
TTIMFREQ
Description
Operating frequency
Min
FCLK
Typ
–
Max
48
Units
MHz
Details/Conditions
TCAPWINT
Capture pulse width (internal)
2 × TCLK
–
–
ns
TCAPWEXT
Capture pulse width (external)
2 × TCLK
–
–
ns
TTIMRES
Timer resolution
TCLK
–
–
ns
TTENWIDINT
Enable pulse width (internal)
2 × TCLK
–
–
ns
TTENWIDEXT
Enable pulse width (external)
2 × TCLK
–
–
ns
TTIMRESWINT
Reset pulse width (internal)
2 × TCLK
–
–
ns
TTIMRESEXT
Reset pulse width (external)
2 × TCLK
–
–
ns
16-bit counter
16-bit counter
Counter
Table 22. Counter DC Specifications
Parameter
ICTR1
Description
Block current consumption at 3 MHz
Min
–
Typ
–
Max
42
ICTR2
Block current consumption at 12 MHz
–
–
130
Units
µA
µA
ICTR3
Block current consumption at 48 MHz
–
–
535
µA
Details/Conditions
16-bit counter
Table 23. Counter AC Specifications
Parameter
TCTRFREQ
Description
Operating frequency
Min
FCLK
Typ
–
Max
48
Units
MHz
TCTRPWINT
Capture pulse width (internal)
2 × TCLK
–
–
ns
TCTRPWEXT
Capture pulse width (external)
2 × TCLK
–
–
ns
TCTRES
Counter Resolution
TCLK
–
–
ns
TCENWIDINT
Enable pulse width (internal)
2 × TCLK
–
–
ns
TCENWIDEXT
Enable pulse width (external)
2 × TCLK
–
–
ns
TCTRRESWINT
Reset pulse width (internal)
2 × TCLK
–
–
ns
TCTRRESWEXT
Reset pulse width (external)
2 × TCLK
–
–
ns
Document Number: 002-02521 Rev. *I
Details/Conditions
Page 20 of 39
CYBLE-012011-00
Pulse Width Modulation (PWM)
Table 24. PWM DC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
IPWM1
Block current consumption at 3 MHz
–
–
42
µA
16-bit PWM
IPWM2
Block current consumption at 12 MHz
–
–
130
µA
16-bit PWM
IPWM3
Block current consumption at 48 MHz
–
–
535
µA
16-bit PWM
Min
Typ
Max
Units
Table 25. PWM AC Specifications
Parameter
Description
TPWMFREQ
Operating frequency
FCLK
–
48
MHz
TPWMPWINT
Pulse width (internal)
2 × TCLK
–
–
ns
TPWMEXT
Pulse width (external)
2 × TCLK
–
–
ns
TPWMKILLINT
Kill pulse width (internal)
2 × TCLK
–
–
ns
TPWMKILLEXT
Kill pulse width (external)
2 × TCLK
–
–
ns
TPWMEINT
Enable pulse width (internal)
2 × TCLK
–
–
ns
TPWMENEXT
Enable pulse width (external)
2 × TCLK
–
–
ns
TPWMRESWINT
Reset pulse width (internal)
2 × TCLK
–
–
ns
TPWMRESWEXT
Reset pulse width (external)
2 × TCLK
–
–
ns
Min
–
Typ
17.5
Max
–
Units
µA
Details/Conditions
LCD Direct Drive
Table 26. LCD Direct Drive DC Specifications
Parameter
ILCDLOW
Description
Operating current in low-power mode
CLCDCAP
LCD capacitance per segment/common driver
–
500
5000
pF
LCDOFFSET
Long-term segment offset
–
20
–
mV
ILCDOP1
LCD system operating current
VBIAS = 5 V
LCD system operating current
VBIAS = 3.3 V
–
2
–
mA
–
2
–
mA
Typ
50
Max
150
Units
Hz
ILCDOP2
Details/Conditions
16 × 4 small segment
display at 50 Hz
32 × 4 segments. 50 Hz
at 25 °C
32 × 4 segments
50 Hz at 25 °C
Table 27. LCD Direct Drive AC Specifications
Parameter
FLCD
Description
LCD frame rate
Document Number: 002-02521 Rev. *I
Min
10
Details/Conditions
Page 21 of 39
CYBLE-012011-00
Serial Communication
Table 28. Fixed I2C DC Specifications
Parameter
Description
II2C1
Block current consumption at 100 kHz
II2C2
Block current consumption at 400 kHz
II2C3
Block current consumption at 1 Mbps
II2C4
Min
Typ
Max
Units
Details/Conditions
–
–
50
µA
–
–
–
155
µA
–
–
–
390
µA
–
–
–
1.4
µA
–
Min
Typ
Max
Units
Details/Conditions
–
–
400
kHz
2
I C enabled in Deep-Sleep mode
Table 29. Fixed I2C AC Specifications
Parameter
FI2C1
Description
Bit rate
Table 30. Fixed UART DC Specifications
Description
Min
Typ
Max
Units
Details/Conditions
IUART1
Parameter
Block current consumption at 100 kbps
–
–
55
µA
–
IUART2
Block current consumption at 1000 kbps
–
–
312
µA
–
Min
Typ
Max
Units
Details/Conditions
–
–
1
Mbps
–
Table 31. Fixed UART AC Specifications
Parameter
FUART
Description
Bit rate
Table 32. Fixed SPI DC Specifications
Min
Typ
Max
Units
Details/Conditions
ISPI1
Parameter
Block current consumption at 1 Mbps
Description
–
–
360
µA
–
ISPI2
Block current consumption at 4 Mbps
–
–
560
µA
–
ISPI3
Block current consumption at 8 Mbps
–
–
600
µA
–
Min
Typ
Max
Units
Details/Conditions
–
–
8
MHz
–
Min
Typ
Max
Units
Details/Conditions
–
Table 33. Fixed SPI AC Specifications
Parameter
FSPI
Description
SPI operating frequency (master; 6x
over sampling)
Table 34. Fixed SPI Master Mode AC Specifications
Parameter
Description
TDMO
MOSI valid after SCLK driving edge
–
–
18
ns
TDSI
MISO valid before SCLK capturing edge
Full clock, late MISO sampling used
20
–
–
ns
Full clock, late MISO sampling
THMO
Previous MOSI data hold time
0
–
–
ns
Referred to Slave capturing edge
Table 35. Fixed SPI Slave Mode AC Specifications
Description
Min
Typ
Max
Units
TDMI
Parameter
MOSI valid before SCLK capturing edge
40
–
–
ns
TDSO
MISO valid after SCLK driving edge
–
–
42 + 3 ×
TCPU
ns
TDSO_ext
MISO Valid after SCLK driving edge in
external clock mode. VDD < 3.0 V
–
–
50
ns
Document Number: 002-02521 Rev. *I
Details/Conditions
Page 22 of 39
CYBLE-012011-00
Table 35. Fixed SPI Slave Mode AC Specifications (continued)
Parameter
Description
THSO
Previous MISO data hold time
TSSELSCK
SSEL valid to first SCK valid edge
Min
Typ
Max
Units
0
–
–
ns
100
–
–
ns
Details/Conditions
Memory
Table 36. Flash DC Specifications
Parameter
Description
Min
Typ
Max
Units
V
Details/Conditions
VPE
Erase and program voltage
1.71
–
5.5
TWS48
Number of Wait states at 32–48 MHz
2
–
–
CPU execution from flash
TWS32
Number of Wait states at 16–32 MHz
1
–
–
CPU execution from flash
TWS16
Number of Wait states for 0–16 MHz
0
–
–
CPU execution from flash
–
Table 37. Flash AC Specifications
Min
Typ
Max
Units
TROWWRITE[9]
Parameter
Row (block) write time (erase and program)
Description
–
–
20
ms
TROWERASE[9]
Row erase time
Details/Conditions
Row (block) = 128 bytes
–
–
13
ms
–
TROWPROGRAM[9] Row program time after erase
–
–
7
ms
–
TBULKERASE[9]
TDEVPROG[9]
Bulk erase time (128 KB)
–
–
35
ms
–
Total device program time
–
–
25
seconds
–
FEND
Flash endurance
100 K
–
–
cycles
–
FRET
Flash retention. TA 55 °C, 100 K P/E cycles
20
–
–
years
–
FRET2
Flash retention. TA 85 °C, 10 K P/E cycles
10
–
–
years
–
Note
9. It can take as much as 20 ms to write to flash. During this time, the device should not be reset, or flash operations will be interrupted and cannot be relied on to have
completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs. Make
certain that these are not inadvertently activated.
Document Number: 002-02521 Rev. *I
Page 23 of 39
CYBLE-012011-00
System Resources
Power-on-Reset (POR)
Table 38. POR DC Specifications
Min
Typ
Max
Units
Details/Conditions
VRISEIPOR
Parameter
Rising trip voltage
Description
0.80
–
1.45
V
–
VFALLIPOR
Falling trip voltage
0.75
–
1.40
V
–
VIPORHYST
Hysteresis
15
–
200
mV
–
Min
Typ
Max
Units
Details/Conditions
–
–
1
µs
–
Description
Min
Typ
Max
Units
Details/Conditions
VFALLPPOR
BOD trip voltage in Active and Sleep modes
1.64
–
–
V
–
VFALLDPSLP
BOD trip voltage in Deep Sleep
1.4
–
–
V
–
Table 39. POR AC Specifications
Parameter
TPPOR_TR
Description
Precision power-on reset (PPOR) response
time in Active and Sleep modes
Table 40. Brown-Out Detect
Parameter
Table 41. Hibernate Reset
Parameter
VHBRTRIP
Description
BOD trip voltage in Hibernate
Min
Typ
Max
Units
Details/Conditions
1.1
–
–
V
–
Voltage Monitors (LVD)
Table 42. Voltage Monitor DC Specifications
Parameter
VLVI1
Description
LVI_A/D_SEL[3:0] = 0000b
Min
1.71
Typ
1.75
Max
1.79
Units
V
Details/Conditions
–
VLVI2
LVI_A/D_SEL[3:0] = 0001b
1.76
1.80
1.85
V
–
VLVI3
LVI_A/D_SEL[3:0] = 0010b
1.85
1.90
1.95
V
–
VLVI4
LVI_A/D_SEL[3:0] = 0011b
1.95
2.00
2.05
V
–
VLVI5
LVI_A/D_SEL[3:0] = 0100b
2.05
2.10
2.15
V
–
VLVI6
LVI_A/D_SEL[3:0] = 0101b
2.15
2.20
2.26
V
–
VLVI7
LVI_A/D_SEL[3:0] = 0110b
2.24
2.30
2.36
V
–
VLVI8
LVI_A/D_SEL[3:0] = 0111b
2.34
2.40
2.46
V
–
VLVI9
LVI_A/D_SEL[3:0] = 1000b
2.44
2.50
2.56
V
–
VLVI10
LVI_A/D_SEL[3:0] = 1001b
2.54
2.60
2.67
V
–
VLVI11
LVI_A/D_SEL[3:0] = 1010b
2.63
2.70
2.77
V
–
VLVI12
LVI_A/D_SEL[3:0] = 1011b
2.73
2.80
2.87
V
–
VLVI13
LVI_A/D_SEL[3:0] = 1100b
2.83
2.90
2.97
V
–
VLVI14
LVI_A/D_SEL[3:0] = 1101b
2.93
3.00
3.08
V
–
VLVI15
LVI_A/D_SEL[3:0] = 1110b
3.12
3.20
3.28
V
–
VLVI16
LVI_A/D_SEL[3:0] = 1111b
4.39
4.50
4.61
V
–
LVI_IDD
Block current
–
–
100
µA
–
Document Number: 002-02521 Rev. *I
Page 24 of 39
CYBLE-012011-00
Table 43. Voltage Monitor AC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
–
–
1
µs
–
Min
Typ
Max
Units
Details/Conditions
Voltage monitor trip time
TMONTRIP
SWD Interface
Table 44. SWD Interface Specifications
Parameter
Description
F_SWDCLK1
3.3 V VDD 5.5 V
–
–
14
MHz
SWDCLK 1/3 CPU clock frequency
F_SWDCLK2
1.71 V VDD 3.3 V
–
–
7
MHz
SWDCLK 1/3 CPU clock frequency
T_SWDI_SETUP T = 1/f SWDCLK
0.25 × T
–
–
ns
–
T_SWDI_HOLD
0.25 × T
–
–
ns
–
T_SWDO_VALID T = 1/f SWDCLK
–
–
0.5 × T
ns
–
T_SWDO_HOLD
1
–
–
ns
–
T = 1/f SWDCLK
T = 1/f SWDCLK
Internal Main Oscillator
Table 45. IMO DC Specifications
Parameter
Description
Min
Typ
Max
Units
Details/Conditions
IIMO1
IMO operating current at 48 MHz
–
–
1000
µA
–
IIMO2
IMO operating current at 24 MHz
–
–
325
µA
–
IIMO3
IMO operating current at 12 MHz
–
–
225
µA
–
IIMO4
IMO operating current at 6 MHz
–
–
180
µA
–
IIMO5
IMO operating current at 3 MHz
–
–
150
µA
–
Min
Typ
Max
Units
Details/Conditions
Table 46. IMO AC Specifications
Parameter
Description
FIMOTOL3
Frequency variation from 3 to 48 MHz
–
–
±2
%
FIMOTOL3
IMO startup time
–
12
–
µs
With API-called calibration
–
Min
Typ
Max
Units
Details/Conditions
–
0.3
1.05
µA
–
Min
Typ
Max
Units
Details/Conditions
Internal Low-Speed Oscillator
Table 47. ILO DC Specifications
Parameter
IILO2
Description
ILO operating current at 32 kHz
Table 48. ILO AC Specifications
Parameter
Description
TSTARTILO1
ILO startup time
–
–
2
ms
–
FILOTRIM1
32-kHz trimmed frequency
15
32
50
kHz
–
Table 49. Recommended ECO Trim Value
Parameter
ECOTRIM
Description
24-MHz trim value
(firmware configuration)
Document Number: 002-02521 Rev. *I
Value
Details/Conditions
0x0000BCBC
Recommended trim value that needs to be loaded to register
CY_SYS_XTAL_BLERD_BB_XO_CAPTRIM_REG
Page 25 of 39
CYBLE-012011-00
Bluetooth LE Subsystem
Table 50. Bluetooth LE Subsystem
Parameter
Description
Details/
Conditions
Min
Typ
Max
Units
RX sensitivity with idle transmitter
–
–89
–
dBm
RX sensitivity with idle transmitter
excluding Balun loss
–
–91
–
dBm
Guaranteed by design
simulation
RXS, DIRTY
RX sensitivity with dirty transmitter
–
–87
–70
dBm
RF-PHY Specification
(RCV-LE/CA/01/C)
RXS, HIGHGAIN
RX sensitivity in high-gain mode with idle
transmitter
–
–91
–
dBm
PRXMAX
Maximum input power
–10
–1
–
dBm
RF-PHY Specification
(RCV-LE/CA/06/C)
CI1
Cochannel interference,
Wanted signal at –67 dBm and Interferer
at FRX
–
9
21
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
CI2
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±1 MHz
–
3
15
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
CI3
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±2 MHz
–
–29
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
CI4
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±3 MHz
–
–39
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
CI5
Adjacent channel interference
Wanted Signal at –67 dBm and Interferer
at Image frequency (FIMAGE)
–
–20
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
CI3
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at Image frequency (FIMAGE ± 1 MHz)
–
–30
–
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
OBB1
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 30–2000 MHz
–30
–27
–
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
OBB2
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 2003–2399 MHz
–35
–27
–
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
OBB3
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 2484–2997 MHz
–35
–27
–
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
OBB4
Out-of-band blocking,
Wanted signal a –67 dBm and Interferer
at F = 3000–12750 MHz
–30
–27
–
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
IMD
Intermodulation performance
Wanted signal at –64 dBm and 1-Mbps
Bluetooth LE, third, fourth, and fifth offset
channel
–50
–
–
dBm
RF-PHY Specification
(RCV-LE/CA/05/C)
RXSE1
Receiver spurious emission
30 MHz to 1.0 GHz
–
–
–57
dBm
100-kHz measurement
bandwidth
ETSI EN300 328 V1.8.1
RF Receiver Specification
RXS, IDLE
Document Number: 002-02521 Rev. *I
Page 26 of 39
CYBLE-012011-00
Table 50. Bluetooth LE Subsystem (continued)
Parameter
RXSE2
Description
Receiver spurious emission
1.0 GHz to 12.75 GHz
Min
Typ
Max
Units
–
–
–47
dBm
Details/
Conditions
1-MHz measurement
bandwidth
ETSI EN300 328 V1.8.1
RF Transmitter Specifications
TXP, ACC
RF power accuracy
–
±1
–
dB
TXP, RANGE
RF power control range
–
20
–
dB
TXP, 0dBm
Output power, 0-dB Gain setting (PA7)
–
0
–
dBm
TXP, MAX
Output power, maximum power setting
(PA10)
–
3
–
dBm
TXP, MIN
Output power, minimum power setting
(PA1)
–
–18
–
dBm
F2AVG
Average frequency deviation for
10101010 pattern
185
–
–
kHz
RF-PHY Specification
(TRM-LE/CA/05/C)
F1AVG
Average frequency deviation for
11110000 pattern
225
250
275
kHz
RF-PHY Specification
(TRM-LE/CA/05/C)
EO
Eye opening = F2AVG/F1AVG
0.8
–
–
FTX, ACC
Frequency accuracy
–150
–
150
kHz
RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, MAXDR
Maximum frequency drift
–50
–
50
kHz
RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, INITDR
Initial frequency drift
–20
–
20
kHz
RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, DR
Maximum drift rate
–20
–
20
kHz/
50 µs
RF-PHY Specification
(TRM-LE/CA/06/C)
IBSE1
In-band spurious emission at 2-MHz
offset
–
–
–20
dBm
RF-PHY Specification
(TRM-LE/CA/03/C)
IBSE2
In-band spurious emission at 3-MHz
offset
–
–
-30
dBm
RF-PHY Specification
(TRM-LE/CA/03/C)
TXSE1
Transmitter spurious emissions
(average), 1.0 GHz
–
–
-41.5
dBm
FCC-15.247
RF-PHY Specification
(TRM-LE/CA/05/C)
RF Current Specifications
IRX
Receive current in normal mode
–
18.7
–
mA
IRX_RF
Radio receive current in normal mode
–
16.4
–
mA
IRX, HIGHGAIN
Receive current in high-gain mode
–
21.5
–
mA
ITX, 3dBm
TX current at 3-dBm setting (PA10)
–
20
–
mA
ITX, 0dBm
TX current at 0-dBm setting (PA7)
–
16.5
–
mA
ITX_RF, 0dBm
Radio TX current at 0 dBm setting (PA7)
–
15.6
–
mA
Measured at VDDR
ITX_RF, 0dBm
Radio TX current at 0 dBm excluding
Balun loss
–
14.2
–
mA
Guaranteed by design
simulation
ITX,-3dBm
TX current at –3-dBm setting (PA4)
–
15.5
–
mA
Document Number: 002-02521 Rev. *I
Measured at VDDR
Page 27 of 39
CYBLE-012011-00
Table 50. Bluetooth LE Subsystem (continued)
Parameter
Description
Min
Typ
Max
Units
Details/
Conditions
ITX,-6dBm
TX current at –6-dBm setting (PA3)
–
14.5
–
mA
ITX,-12dBm
TX current at –12-dBm setting (PA2)
–
13.2
–
mA
ITX,-18dBm
TX current at –18-dBm setting (PA1)
–
12.5
–
mA
Iavg_1sec, 0dBm
Average current at 1-second Bluetooth
LE connection interval
–
17.1
–
µA
TXP: 0 dBm; ±20-ppm
master and slave clock
accuracy.
For empty PDU exchange
Iavg_4sec, 0dBm
Average current at 4-second Bluetooth
LE connection interval
–
6.1
–
µA
TXP: 0 dBm; ±20-ppm
master and slave clock
accuracy.
For empty PDU exchange
2400
–
2482
MHz
General RF Specifications
FREQ
RF operating frequency
CHBW
Channel spacing
–
2
–
MHz
DR
On-air data rate
–
1000
–
kbps
IDLE2TX
Bluetooth LE.IDLE to Bluetooth LE. TX
transition time
–
120
140
µs
IDLE2RX
Bluetooth LE.IDLE to Bluetooth LE. RX
transition time
–
75
120
µs
RSSI, ACC
RSSI accuracy
–
±5
–
dB
RSSI, RES
RSSI resolution
–
1
–
dB
RSSI, PER
RSSI sample period
–
6
–
µs
RSSI Specifications
Document Number: 002-02521 Rev. *I
Page 28 of 39
CYBLE-012011-00
Environmental Specifications
Environmental Compliance
This Cypress Bluetooth LE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free
(HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
RF Certification
The CYBLE-012011-00 module will be certified under the following RF certification standards at production release.
■
FCC: WAP2011
■
CE
■
IC: 7922A-2011
■
MIC: 203-JN0509
■
KC: MSIP-CRM-Cyp-2011
Safety Certification
The CYBLE-012011-00 module complies with the following regulations:
■
Underwriters Laboratories, Inc. (UL) - Filing E331901
■
CSA
■
TUV
Environmental Conditions
Table 51 describes the operating and storage conditions for the Cypress Bluetooth LE module.
Table 51. Environmental Conditions for CYBLE-012011-00
Description
Operating temperature
Operating humidity (relative, non-condensation)
Thermal ramp rate
Minimum Specification
Maximum Specification
-40 °C
85 °C
5%
85%
–
3 °C/minute
–40 °C
85 °C
Storage temperature and humidity
–
85 ° C at 85%
ESD: Module integrated into system
Components[10]
–
15 kV Air
2.2 kV Contact
Storage temperature
ESD and EMI Protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure
near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground.
Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Note
10. This does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for 500-V HBM.
Document Number: 002-02521 Rev. *I
Page 29 of 39
CYBLE-012011-00
Regulatory Information
FCC
FCC NOTICE:
The device CYBLE-012011-00 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter
approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause
undesired operation.
CAUTION:
The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by
Cypress Semiconductor may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
■
Reorient or relocate the receiving antenna.
■
Increase the separation between the equipment and receiver.
■
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
■
Consult the dealer or an experienced radio/TV technician for help
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible
label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well
as the FCC Notice above. The FCC identifier is FCC ID: WAP2011.
In any case, the end product must be labeled exterior with “Contains FCC ID: WAP2011”
ANTENNA WARNING:
This device is tested with a standard SMA connector and with the antennas listed below. When integrated in the OEMs product, these
fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the
following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions.
RF EXPOSURE:
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved
antenna in the previous.
The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antennas
in Table 6 on page 13, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal
instructions about the integrated radio module is not allowed.
The radiated output power of CYBLE-012011-00 with the trace antenna is far below the FCC radio frequency exposure limits. Nevertheless, use CYBLE-012011-00 in such a manner that minimizes the potential for human contact during normal operation.
End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with
transmitter operating conditions for satisfying RF exposure compliance.
Document Number: 002-02521 Rev. *I
Page 30 of 39
CYBLE-012011-00
ISED
Innovation, Science and Economic Development Canada (ISED) Certification
CYBLE-012011-00 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development Canada
(ISED).
License: IC: 7922A-2011
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure
compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from
www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Table 6 on page 13, having a maximum gain of 0.5 dBi. Antennas
not included in this list or having a gain greater than 0.5 dBi are strictly prohibited for use with this device. The required antenna
impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter.
ISED NOTICE:
The device CYBLE-012011-00 including the built-in trace antenna complies with Canada RSS-GEN Rules. The device meets the
requirements for modular transmitter approval as detailed in RSS-GEN. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) This device must accept any interference received, including interference that
may cause undesired operation.
ISED RADIATION EXPOSURE STATEMENT FOR CANADA
This device complies with Innovation, Science and Economic Development (ISED) Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Cet appareil est conforme à la norme sur l'innovation, la science et le développement économique (ISED) norme RSS exempte de
licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur
de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible
label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as
the ISED Notice above. The IC identifier is 7922A-2011. In any case, the end product must be labeled in its exterior with “Contains
IC: 7922A-2011”
European R&TTE Declaration of Conformity
Hereby, Cypress Semiconductor declares that the Bluetooth module CYBLE-012011-00 complies with the essential requirements and
other relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of the
Directive 1999/5/EC, the end-customer equipment should be labeled as follows:
All versions of the CYBLE-012011-00 in the specified reference design can be used in the following countries: Austria, Belgium,
Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway.
Document Number: 002-02521 Rev. *I
Page 31 of 39
CYBLE-012011-00
MIC Japan
CYBLE-012011-00 is certified as a module with type certification number 203-JN0509. End products that integrate CYBLE-012011-00
do not need additional MIC Japan certification for the end product.
End product can display the certification label of the embedded module.
KC Korea
CYBLE-012011-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2011.
Document Number: 002-02521 Rev. *I
Page 32 of 39
CYBLE-012011-00
Packaging
Table 52. Solder Reflow Peak Temperature
Module Part Number
Package
Maximum Peak Temperature
Maximum Time at Peak
Temperature
No. of Cycles
CYBLE-012011-00
31-pad SMT
260 °C
30 seconds
2
Table 53. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number
Package
MSL
CYBLE-012011-00
31-pad SMT
MSL 3
The CYBLE-012011-00 is offered in tape and reel packaging. Figure 10 details the tape dimensions used for the CYBLE-012011-00.
Figure 10. CYBLE-012011-00 Tape Dimensions
Figure 11 details the orientation of the CYBLE-012011-00 in the tape as well as the direction for unreeling.
Figure 11. Component Orientation in Tape and Unreeling Direction
Document Number: 002-02521 Rev. *I
Page 33 of 39
CYBLE-012011-00
Figure 12 details reel dimensions used for the CYBLE-012011-00.
Figure 12. Reel Dimensions
The CYBLE-012011-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The
center-of-mass for the CYBLE-012011-00 is detailed in Figure 13.
Figure 13. CYBLE-012011-00 Center of Mass (Seen from Top)
Document Number: 002-02521 Rev. *I
Page 34 of 39
CYBLE-012011-00
Ordering Information
Table 54 lists the CYBLE-012011-00 part numbers and features.The CYBLE-012011-00 is available in certified and uncertified
options.Table 55 lists the CYBLE-012011-00 reel shipment quantities.
Table 54. Ordering Information
Part Number
CPU
Speed
(MHz)
Flash
Size
(KB)
CYBLE-012011-00
48
128
CapSense SCB TCPWM
Yes
2
4
12-Bit
SAR
ADC
I2S
LCD
Package
Packing
Certified
1 Msps
Yes
Yes
31-SMT
Tape and Reel
Yes
Table 55. Tape and Reel Package Quantity and Minimum Order Amount
Description
Minimum Reel Quantity
Maximum Reel Quantity
Comments
Reel quantity ships in either 500 unit or
1,000 unit reel quantities.
Reel Quantity
500
1,000
Minimum Order Quantity (MOQ)
500
–
–
Order Increment (OI)
500
–
–
The CYBLE-012011-00 is offered in tape and reel packaging. The CYBLE-012011-00 ships with a maximum of 1,000 units/reel. If a
500 unit reel is desired, an order should be placed with a single line item of 500 units. Order line items larger than 500 units will be
shipped in reel quantities of 1,000 units based on the order line item quantity.
Part Numbering Convention
The part numbers are of the form CYBLE-FATT##-SB where the fields are defined as follows.
For additional information and a complete list of Cypress Semiconductor Bluetooth LE products, contact your local Cypress sales
representative. To locate the nearest Cypress office, visit our website.
U.S. Cypress Headquarters Address
U.S. Cypress Headquarter Contact Info
Cypress website address
Document Number: 002-02521 Rev. *I
198 Champion Court, San Jose, CA 95134
(408) 943-2600
http://www.cypress.com
Page 35 of 39
CYBLE-012011-00
Acronyms
Acronym
Description
BLE
Bluetooth Low Energy
Bluetooth SIG
Bluetooth Special Interest Group
CE
European Conformity
CSA
Canadian Standards Association
EMI
electromagnetic interference
ESD
electrostatic discharge
FCC
Federal Communications Commission
GPIO
general-purpose input/output
IC
Industry Canada
IDE
integrated design environment
KC
Korea Certification
MIC
Ministry of Internal Affairs and Communications (Japan)
PCB
printed circuit board
RX
receive
QDID
qualification design ID
SMT
surface-mount technology; a method for producing electronic circuitry in which the components are placed
directly onto the surface of PCBs
TCPWM
timer, counter, pulse width modulator (PWM)
TUV
Germany: Technischer Überwachungs-Verein (Technical Inspection Association)
TX
transmit
Document Conventions
Units of Measure
Symbol
Unit of Measure
°C
degree Celsius
kV
kilovolt
mA
milliamperes
mm
millimeters
mV
millivolt
µA
microamperes
µm
micrometers
MHz
megahertz
GHz
gigahertz
V
volt
Document Number: 002-02521 Rev. *I
Page 36 of 39
CYBLE-012011-00
Document History Page
Document Title: CYBLE-012011-00, EZ-BLE™ Creator Module
Document Number: 002-02521
Revision
ECN
Submission
Date
Description of Change
**
4998892
10/22/2015
Preliminary datasheet for CYBLE-012011-00 module.
*A
5060713
01/07/2016
Updated General Description to add reference and link to PSoC 4 BLE silicon datasheet.
Added More Information section to the datasheet.
Updated Figure 1, Figure 2, Figure 3, and Figure 4 to improve clarity and viewing.
Added Figure 5 in Recommended Host PCB Layout section to show solder pad location
from module origin.
Updated Table 3 and Figure 6 in Recommended Host PCB Layout section to provide the
location to the center of each solder pad from the origin (in mm and mils).
Added Bluetooth LE Subsystem section.
Added French translation for IC Radiation Exposure Statement For Canada in ISED section
on page 31 in accordance with IC requirements.
Updated MIC Japan section on page 32 to specify final MIC certification number.
Updated KC Korea section on page 32 to specify final KC certification number.
Added Packaging section.
Added Table 52 and Table 53 on page 33.
*B
5148398
02/23/2016
Remove Preliminary from datasheet header and release as final.
Update More Information section to add KBA210638 (Certification Test Reports) to
reference list.
Updated orientation of module drawings in Figure 1, Figure 2, Figure 3, Figure 4, Figure 5,
Figure 6, Figure 7, Figure 8, Figure 9, and Figure 13 to match orientation in PSoC Creator.
Update Table 4 to add additional information with respect to the functional capabilities for
each solder pad.
*C
5418690
08/30/2016
Updated General Description:
Updated Power Consumption:
Replaced “Stop: 60 nA with XRES wakeup” with “Stop: 60 nA with GPIO (P2.2) or XRES
wakeup” under “Low power mode support”.
Updated More Information:
Added Knowledge Base Article references.
Updated Electrical Specification:
Updated System Resources:
Updated Internal Low-Speed Oscillator:
Updated Table 49 (Updated details in “Value” column corresponding to ECOTRIM
parameter).
Updated Ordering Information:
No change in part numbers.
Added Table 55 (To specify minimum and maximum reel quantities that ship for orders of
the CYBLE-012011-00 module).
Updated to new template.
Completing Sunset Review.
*D
5528433
11/21/2016
Updated More Information:
Added EZ-Serial™ Bluetooth LE Firmware Platform section.
Updated Overview:
Updated Figure 1 to specify that Bottom View is “Seen from Bottom”.
Updated Recommended Host PCB Layout:
Updated Figure 4, Figure 5, and Figure 6 captions to specify that these as “Seen on Host
PCB”.
Updated Power Supply Connections and Recommended External Components:
Updated Figure 7 and Figure 8 to specify that these are “Seen from Bottom”.
Updated Digital and Analog Capabilities and Connections:
Updated Table 4:
Updated TCPWM column to add TCPWM capability on Port 2 pins.
Added Footnote 3.
Document Number: 002-02521 Rev. *I
Page 37 of 39
CYBLE-012011-00
Document Title: CYBLE-012011-00, EZ-BLE™ Creator Module
Document Number: 002-02521
Revision
ECN
Submission
Date
Description of Change
*E
5553544
12/14/2016
Updated Electrical Specification:
Updated SAR ADC:
Updated Table 18 to add Note 8 to specify under what conditions the maximum number of
ADC channels can be achieved.
Completing Sunset Review.
*F
5709491
04/25/2017
Updated Cypress Logo and Copyright.
*G
5996958
03/08/2018
Updated document title.
Updated “PRoC™” references to “Creator”.
Updated “PRoC BLE” references to “PSoC 4 BLE”.
Updated Module Description, More Information, Environmental Specifications, Regulatory
Information, and Part Numbering Convention.
Updated Figure 6.
Removed CYBLE-012012-10 part number.
Updated to new template.
*H
6953980
08/31/2020
Updated Bluetooth 4.1 to 5.1.
Updated QDID and Declaration ID in Module Description.
Updated Regulatory Information:
Added “Anatel Brazil”.
*I
7052686
12/23/2020
Updated General Description:
Updated Module Description:
Updated description.
Replaced “Bluetooth Low Energy (BLE)” with “Bluetooth Low Energy” in all instances across
the document.
Replaced “BLE” with “Bluetooth LE” in all instances across the document.
Updated Regulatory Information:
Removed “Anatel Brazil”.
Completing Sunset Review.
Document Number: 002-02521 Rev. *I
Page 38 of 39
CYBLE-012011-00
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
PSoC® Solutions
Products
Arm® Cortex® Microcontrollers
Automotive
cypress.com/arm
cypress.com/automotive
Clocks & Buffers
Interface
Internet of Things
Memory
cypress.com/clocks
cypress.com/interface
cypress.com/iot
cypress.com/memory
Microcontrollers
cypress.com/mcu
PSoC
cypress.com/psoc
Power Management ICs
Touch Sensing
USB Controllers
Wireless Connectivity
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU
Cypress Developer Community
Community | Code Examples | Projects | Video | Blogs |
Training | Components
Technical Support
cypress.com/support
cypress.com/pmic
cypress.com/touch
cypress.com/usb
cypress.com/wireless
© Cypress Semiconductor Corporation, 2015–2020. This document is the property of Cypress Semiconductor Corporation and its subsidiaries (“Cypress”). This document, including any software or
firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves
all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If
the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal,
non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software
solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through
resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as provided by Cypress, unmodified)
to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. No computing
device can be absolutely secure. Therefore, despite security measures implemented in Cypress hardware or software products, Cypress shall have no liability arising out of any security breach, such
as unauthorized access to or use of a Cypress product. CYPRESS DOES NOT REPRESENT, WARRANT, OR GUARANTEE THAT CYPRESS PRODUCTS, OR SYSTEMS CREATED USING
CYPRESS PRODUCTS, WILL BE FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE, HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (collectively, “Security
Breach”). Cypress disclaims any liability relating to any Security Breach, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any Security Breach. In
addition, the products described in these materials may contain design defects or errors known as errata which may cause the product to deviate from published specifications. To the extent permitted
by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or
circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility
of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. “High-Risk Device” means any
device or system whose failure could cause personal injury, death, or property damage. Examples of High-Risk Devices are weapons, nuclear installations, surgical implants, and other medical devices.
“Critical Component” means any component of a High-Risk Device whose failure to perform can be reasonably expected to cause, directly or indirectly, the failure of the High-Risk Device, or to affect
its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any use of a Cypress product
as a Critical Component in a High-Risk Device. You shall indemnify and hold Cypress, its directors, officers, employees, agents, affiliates, distributors, and assigns harmless from and against all claims,
costs, damages, and expenses, arising out of any claim, including claims for product liability, personal injury or death, or property damage arising from any use of a Cypress product as a Critical
Component in a High-Risk Device. Cypress products are not intended or authorized for use as a Critical Component in any High-Risk Device except to the limited extent that (i) Cypress's published
data sheet for the product explicitly states Cypress has qualified the product for use in a specific High-Risk Device, or (ii) Cypress has given you advance written authorization to use the product as a
Critical Component in the specific High-Risk Device and you have signed a separate indemnification agreement.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 002-02521 Rev. *I
Revised December 23, 2020
Page 39 of 39
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