DS80C390-QNR

DS80C390 Dual CAN High-Speed Microprocessor GENERAL DESCRIPTION FEATURES The DS80C390 is a fast 8051-compatible microprocessor with dual CAN 2.0B controllers. The redesigned processor core executes 8051 instructions up to 3X faster than the original for the same crystal speed. The DS80C390 supports a maximum crystal speed of 40MHz, resulting in apparent execution speeds of 100MHz (approximately 2.5X). An optional internal frequency multiplier allows the microprocessor to operate at full speed with a reduced crystal frequency, reducing EMI. A hardware math accelerator further increases the speed of 32-bit and 16-bit multiply and divide operations as well as high-speed shift, normalization, and accumulate functions.    See page 29 for a complete list of features. The High-Speed Microcontroller User’s Guide and High-Speed Microcontroller User’s Guide: DS80C390 Supplement must be used in conjunction with this data sheet. Download both at: www.maxim-ic.com/microcontrollers. ORDERING INFORMATION APPLICATIONS Industrial Controls Factory Automation Medical Equipment        80C52 Compatible High-Speed Architecture 4kB Internal SRAM Usable as Program/ Data/Stack Memory Enhanced Memory Architecture Two Full-Function CAN 2.0B Controllers Two Full-Duplex Hardware Serial Ports Programmable IrDA Clock High Integration Controller 16 Interrupt Sources with Six External Available in 64-Pin LQFP, 68-Pin PLCC Agricultural Equipment Gaming Equipment Heating, Ventilation, and Air Conditioning PART DS80C390-QCR DS80C390-QCR+ DS80C390-QNR DS80C390-QNR+ DS80C390-FCR DS80C390-FCR+ DS80C390-FNR DS80C390-FNR+ TEMP RANGE 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C PIN-PACKAGE 68 PLCC 68 PLCC 68 PLCC 68 PLCC 64 LQFP 64 LQFP 64 LQFP 64 LQFP +Denotes a lead(Pb)-free/RoHS-compliant device. PIN CONFIGURATIONS 9 1 48 61 33 TOP VIEW 10 60 49 32 Dallas Semiconductor Dallas Semiconductor DS80C390 DS80C390 26 44 27 43 17 64 1 PLCC 16 LQFP Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata. 1 of 52 REV: 050115 DS80C390 Dual CAN High-Speed Microprocessor ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground……………………………………………………….-0.3V to (VCC + 0.5V) Voltage Range on VCC Relative to Ground……………………………………………………………………-0.3V to +6.0V Operating Temperature Range………………………………………………………………………………..-40°C to +85°C Storage Temperature Range………………………………………………………………………………...-55°C to +125°C Soldering Temperature…..……………………………………………………………………..See IPC/JEDEC J-STD-020 Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Note 10) SYMBOL MIN TYP MAX UNITS Supply Voltage Power-Fail Warning Minimum Operating Voltage Supply Current, Active Mode (Note 1) Supply Current, Idle Mode (Note 2) Supply Current, Stop Mode (Note 3) Supply Current, Stop Mode, Bandgap Enabled (Note 3) Input Low Level Input High Level Input High Level for XTAL1, RST Output Low Voltage for Port 1, 3, 4, 5 at IOL = 1.6mA Output Low Voltage for Port 0, 1, 2, 4, 5, RD, WR, RSTOL, PSEN, and ALE at IOL = 3.2mA (Note 5) PARAMETER VCC VPFW VRST ICC IIDLE ISTOP ISPBG VIL VIH VIH2 VOL1 VRST 4.10 3.85 5.0 4.38 4.13 80 40 1 150 5.5 4.60 4.35 150 75 120 350 +0.8 VCC +0.5 VCC +0.5 0.45 V V V mA mA µA µA V V V V 0.45 V Output High Voltage for Port 1, 3, 4, 5 at IOH = -50µA (Note 4) Output High Voltage for Port 1, 3, 4, 5 at IOH = -1.5mA (Note 6) VOH1 VOH2 2.4 2.4 V V Output High Voltage for Port 0, 1, 2, 4, 5, RD, WR, RSTOL, PSEN, and ALE at IOH = -8mA (Note 5, 7) VOH3 2.4 V Input Low Current for Port 1, 3, 4, 5 at 0.45V (Note 8) Logic 1 to 0 Transition Current for Port 1, 3, 4, 5 (Note 9) Input Leakage Current for Port 0 (Input Mode Only) RST Pulldown Resistance IIL IT1 IL RRST Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: Note 7: Note 8: Note 9: Note 10: -0.5 2.0 0.7 x VCC VOL2 -300 50 -55 -650 +300 170 µA µA µA kΩ Active current measured with 40MHz clock source on XTAL1, VCC = RST = 5.5V, all other pins disconnected. Idle mode current measured with 40MHz clock source on XTAL1, VCC= 5.5V, RST = EA = VSS, all other pins disconnected. Stop mode current measured with XTAL1 = RST = EA = VSS, VCC = 5.5V, all other pins disconnected. RST = VCC. This condition mimics operation of pins in I/O mode. Applies to port pins when they are used to address external memory or as CAN interface signals. This measurement reflects the port during a 0-to-1 transition in I/O mode. During this period a one-shot circuit drives the ports hard for two clock cycles. If a port 4 or 5 pin is functioning in memory mode with pin state of 0 and the SFR bit contains a 1, changing the pin to an I/O mode (by writing to P4CNT) will not enable the 2-cycle strong pullup. During Stop or Idle mode the pins switch to I/O mode, and so port 2 and port 1 (in nonmultiplexed mode) will not exhibit the 2-cycle strong pullup when entering Stop or Idle mode. Port 3 pins 3.6 and 3.7 have a stronger than normal pullup drive for one oscillator period following the transition of either the RD or WR from a 0-to-1 transition. This is the current required from an external circuit to hold a logic low level on an I/O pin while the corresponding port latch bit is set to 1. This is only the current required to hold the low level; transitions from 1 to 0 on an I/O pin also have to overcome the transition current. Ports 1(in I/O mode), 3, 4, and 5 source transition current when being pulled down externally. It reaches its maximum at approximately 2V. Specifications to -40°C are guaranteed by design and not production tested. 2 of 52 DS80C390 Dual CAN High-Speed Microprocessor AC ELECTRICAL CHARACTERISTICS—(MULTIPLEXED ADDRESS/DATA BUS) (Note 10, Note 11) PARAMETER Oscillator Frequency SYMBOL CONDITIONS 1 / tCLCL External oscillator External crystal 40MHz MIN MAX 0 40 1 40 VARIABLE CLOCK MIN MAX 0 40 1 40 0.375 tMCS -5 UNITS MHz ALE Pulse Width tLHLL Port 0 Instruction Address or CE0---4 Valid to ALE Low tAVLL 0.125 tMCS - 5 ns Address Hold After ALE Low tLLAX1 0.125 tMCS - 5 ns ALE Low to Valid Instruction In tLLIV ALE Low to PSEN Low tLLPL 0.125 tMCS - 5 ns PSEN Pulse Width tPLPH 0.5 tMCS - 8 ns PSEN Low to Valid Instruction In tPLIV Input Instruction Hold After PSEN tPXIX Input Instruction Float After PSEN tPXIZ 0.25 tMCS - 5 ns Port 0 Address to Valid Instruction In tAVIV1 0.75 tMCS - 22 ns Port 2, 4 Address to Valid Instruction In tAVIV2 0.875 tMCS - 30 ns PSEN Low to Address Float tPLAZ 0 ns Note 11: 0.625 tMCS - 20 ns 0.5 tMCS - 20 0 0 0 ns ns ns All parameters apply to both commercial and industrial temperature operation unless otherwise noted. The value tMCS is a function of the machine cycle clock in terms of the processor’s input clock frequency. These relationships are described in the Stretch Value Timing table. All signals characterized with load capacitance of 80pF except Port 0, ALE, PSEN, RD, and WR with 100pF. Interfacing to memory devices with float times (turn off times) over 25ns can cause bus contention. This does not damage the parts, but causes an increase in operating current. Specifications assume a 50% duty cycle for the oscillator. Port 2 and ALE timing changes in relation to duty cycle variation. Some AC timing characteristic drawings contain references to the CLK signal. This waveform is provided to assist in determining the relative occurrence of events and cannot be used to determine the timing of signals relative to the external clock. AC timing is characterized and guaranteed by design but is not production tested. 3 of 52 DS80C390 Dual CAN High-Speed Microprocessor AC SYMBOLS The DS80C390 uses timing parameters and symbols similar to the original 8051 family. The following list of timing symbols is provided as an aid to understanding the timing diagrams. SYMBOL t A C CE D H L I P Q R V W X Z FUNCTION Time Address Clock Chip Enable Input Data Logic Level High Logic Level Low Instruction PSEN Output Data RD Signal Valid WR Signal No longer a valid logic level. Tri-State Figure 1. Multiplexed External Program Memory Read Cycle 4 of 52 DS80C390 Dual CAN High-Speed Microprocessor MOVX CHARACTERISTICS (MULTIPLEXED ADDRESS/DATA BUS) (Note 12) PARAMETER SYMBOL MIN MAX UNITS 0.5 tMCS - 20 CST x tMCS - 25 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 0.375 tMCS - 5 0.5 tMCS - 5 1.5 tMCS - 10 0.125 tMCS - 5 0.25tMCS - 5 1.25 tMCS - 10 0.25tMCS-5 0.125 tMCS - 5 1.25 tMCS - 5 0.5 tMCS - 6 CST x tMCS - 10 0.5 tMCS - 6 CST x tMCS - 10 STRETCH VALUES CST (MD2:0) CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 7 MOVX ALE Pulse Width tLHLL2 Port 0 MOVX Address, CE0---4, PCE0---4 Valid to ALE Low tAVLL2 Address Hold After MOVX Read/Write tLLAX2 tLLAX3 RD Pulse Width tRLRH WR Pulse Width tWLWH RD Low to Valid Data In tRLDV Data Hold After Read tRHDX Data Float After Read tRHDZ ALE Low to Valid Data In tLLDV Port 0 Address, Port 4 CE, Port 5 PCE to Valid Data In tAVDV1 Port 2, 4 Address to Valid Data In tAVDV2 ALE Low to RD or WR Low tLLWL Port 0 Address, Port 4 CE, Port 5 PCE to RD or WR Low tAVWL1 Port 2, 4 Address to or WR Low tAVWL2 Data Valid to WR Transition tQVWX -8 ns Data Hold After WR High tWHQX 0.25 tMCS - 8 0.5tMCS - 10 1.5 tMCS - 10 ns ns ns CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 RD Low to Address Float tRLAZ ns ns ns CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 RD or WR High to ALE, Port 4 CE or Port 5 PCE High Note 12: tWHLH 0 0.125 tMCS - 5 0.25tMCS - 5 1.25 tMCS - 5 0.25 tMCS - 11 0.5tMCS - 11 2.5 tMCS - 11 0.375 tMCS - 11 0.625tMCS - 11 2.625 tMCS - 11 ns 0.25 tMCS - 5 0.5tMCS - 5 1.5 tMCS - 5 0.625 tMCS - 20 (CST + 0.25) x tMCS - 20 (CST + 1.25) x tMCS - 20 0.75 tMCS - 26 (4CST + 0.5) x tMCS - 30 (4CST + 2.5) x tMCS - 30 0.75 tMCS - 30 (4CST + 0.5) x tMCS - 30 (4CST + 2.5) x tMCS - 30 0.125 tMCS + 10 0.25tMCS + 10 1.25 tMCS + 10 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST =0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 See Note 12 -5 0.25 tMCS - 7 1.25 tMCS - 7 +10 0.25 tMCS + 5 1.25 tMCS +10 All parameters apply to both commercial and industrial temperature operation. CST is the stretch cycle value determined by the MD2:0 bits. tMCS is a time period shown in the tMCS Time Periods table. All signals characterized with load capacitance of 80pF except Port 0, ALE, PSEN, RD, and WR with 100pF. Interfacing to memory devices with float times over 25ns can cause bus contention and an increase in operating current. Specifications assume a 50% duty cycle for the oscillator; port 2 and ALE timing changes in relation to duty cycle variation. Some AC timing characteristic drawings show the CLK signal, provided to determine the relative occurrence of events and not the timing of signals relative to the external clock. During the external addressing mode, weak latches maintain the previously driven value from the processor on Port 0 until Port 0 is overdriven by external memory; and on Port 1, 2 and 4 for one XTAL1 cycle prior to change in output address from Port 1, 2, and 4. 5 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 2. Multiplexed 9-Cycle Address/Data CE0-3 MOVX Read/Write Operation 6 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 3. Multiplexed 9-Cycle Address/Data PCE0-3 MOVX Read/Write Operation 7 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 4. Multiplexed 2-Cycle Data Memory PCE0-3 Read or Write Figure 5. Multiplexed 2-Cycle Data Memory CE0-3 Read 8 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 6. Multiplexed 2-Cycle Data Memory CE0-3 Write Figure 7. Multiplexed 3-Cycle Data Memory PCE0-3 Read or Write 9 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 8. Multiplexed 3-Cycle Data Memory CE0-3 Read Figure 9. Multiplexed 3-Cycle Data Memory CE0-3 Write 10 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 10. Multiplexed 9-Cycle Data Memory PEC0-3 Read or Write Figure 11. Multiplexed 9-Cycle Data Memory CE0-3 Read 11 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 12. Multiplexed 9-Cycle Data Memory CE0-3 Write 12 of 52 DS80C390 Dual CAN High-Speed Microprocessor ELECTRICAL CHARACTERISTICS—(NONMULTIPLEXED ADDRESS/DATA BUS) (Note 13) PARAMETER Oscillator Frequency SYMBOL 1 / tCLCL CONDITIONS External oscillator External crystal 40MHz MIN MAX 0 40 1 40 VARIABLE CLOCK MIN MAX 0 40 1 40 UNITS MHz PSEN Pulse Width tPLPH PSEN Low to Valid Instruction In tPLIV Input Instruction Hold After PSEN tPXIX Input Instruction Float After PSEN tPXIZ See MOVX Characteristics ns tAVIV1 0.75 tMCS - 22 ns tAVIV2 0.875 tMCS - 30 ns Port 1 Address, Port 4 CE to Valid Instruction In Port 2, 4 Address to Valid Instruction In Note 13: 0.5 tMCS - 8 ns 0.5 tMCS - 20 0 0 ns ns All parameters apply to both commercial and industrial temperature operation unless otherwise noted. The value tMCS is a function of the machine cycle clock in terms of the processor’s input clock frequency. These relationships are described in the Stretch Value Timing table. All signals characterized with load capacitance of 80pF except Port 0, ALE, PSEN, RD, and WR with 100pF. Interfacing to memory devices with float times (turn off times) over 25ns can cause bus contention. This does not damage the parts, but causes an increase in operating current. Specifications assume a 50% duty cycle for the oscillator. Port 2 and ALE timing changes in relation to duty cycle variation. Some AC timing characteristic drawings contain references to the CLK signal. This waveform is provided to assist in determining the relative occurrence of events and cannot be used to determine the timing of signals relative to the external clock. Figure 13. Nonmultiplexed External Program Memory Read Cycle 13 of 52 DS80C390 Dual CAN High-Speed Microprocessor MOVX CHARACTERISTICS (NONMULTIPLEXED ADDRESS/DATA BUS) PARAMETER SYMBOL RD Pulse Width tRLRH WR Pulse Width tWLWH RD Low to Valid Data In tRLDV Data Hold After Read tRHDX Data Float After Read tRHDZ Port 1 Address, Port 4 CE, Port 5 PCE to Valid Data In tAVDV1 Port 2, 4 Address to Valid Data In tAVDV2 Port 0 Address, Port 4 CE, Port 5 PCE to RD or WR Low tAVWL1 Port 2, 4 Address to RD or WR Low tAVWL2 Data Valid to WR Transition tQVWX Data Hold After WR High tWHQX RD or WR High to ALE, Port 4 CE or Port 5 PCE High tWHLH MIN MAX 0.5 tMCS - 6 CST x tMCS - 6 0.5 tMCS - 6 CST x tMCS - 6 ns ns 0.5 tMCS - 20 CST x tMCS - 25 0 0.25 tMCS - 11 0.5 tMCS - 11 2.5 tMCS - 11 0.375 tMCS - 11 0.625tMCS - 11 2.625 tMCS - 11 ns ns ns ns ns -8 14 of 52 ns STRETCH VALUES CST (MD2:0) CST = 0 1 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 7 ns 0.125 tMCS - 5 0.375tMCS - 5 1.375 tMCS - 5 0.75 tMCS - 26 (4CST + 0.5) x tMCS - 30 (4CST + 2.5) x tMCS - 30 0.75 tMCS - 30 (4CST + 0.625) x tMCS - 30 (4CST + 2.625) x tMCS - 30 0.25 tMCS - 8 0.5tMCS - 10 1.5 tMCS - 10 -5 0.25 tMCS - 7 1.25 tMCS - 7 UNITS CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 ns ns 10 0.25 tMCS + 10 1.25 tMCS + 10 ns CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 CST = 0 1 ≤ CST ≤ 3 4 ≤ CST ≤ 7 DS80C390 Dual CAN High-Speed Microprocessor Figure 14. Nonmultiplexed 9-Cycle Address/Data CE0-3 MOVX Read/Write Operation 15 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 15. Nonmultiplexed 9-Cycle Address/Data PCE0-3 MOVX Read/Write Operation 16 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 16. Nonmultiplexed 2-Cycle Data Memory PCE0 - 3 Read or Write Figure 17. Nonmultiplexed 2-Cycle Data Memory CE0-3 Read 17 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 18. Nonmultiplexed 2-Cycle Data Memory CE0-3 Write Figure 19. Nonmultiplexed 3-Cycle Data Memory PEC0-3 Read or Write 18 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 20. Nonmultiplexed 3-Cycle Data Memory CE0-3 Read Figure 21. Nonmultiplexed 3-Cycle Data Memory CE0-3 Write 19 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 22. Nonmultiplexed 9-Cycle Data Memory PCE0-3 Read or Write Figure 23. Nonmultiplexed 9-Cycle Data Memory CE0-3 Read 20 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 24. Nonmultiplexed 9-Cycle Data Memory CE0-3 Write tMCS TIME PERIODS SYSTEM CLOCK SELECTION 4X/2X CD1 CD0 1 0 X X 0 0 1 1 0 0 0 1 tMCS 1 tCLCL 2 tCLCL 4 tCLCL 1024 tCLCL EXTERNAL CLOCK CHARACTERISTICS PARAMETER Clock High Time Clock Low Time Clock Rise Time Clock Fall Time SYMBOL tCHCX tCLCX tCLCH tCHCL MIN 8 8 MAX 4 4 Figure 25. External Clock Drive 21 of 52 UNITS ns ns ns ns DS80C390 Dual CAN High-Speed Microprocessor SERIAL PORT MODE 0 TIMING CHARACTERISTICS PARAMETER SYMBOL Serial Port Clock Cycle Time tXLXL Output Data Setup to Clock Rising tQVXH Output Data Hold from Clock Rising tXHQX Input Data Hold After Clock Rising tXHDX Clock Rising Edge to Input Data Valid tXHDV CONDITIONS SM2 = 0:2 clocks per cycle SM2 = 1:4 clocks per cycle SM2 = 0:12 clocks per cycle SM2 = 1:4 clocks per cycle M2 = 0:12 clocks per cycle SM2 = 1:4 clocks per cycle SM2 = 0:12 clocks per cycle SM2 = 1:4 clocks per cycle SM2 = 0:12 clocks per cycle SM2 = 1:4 clocks per cycle 22 of 52 TYP 12 tCLCL 4 tCLCL 10 tCLCL 3 tCLCL 2 tCLCL tCLCL tCLCL 0 11 tCLCL 2 tCLCL UNITS ns ns ns ns ns DS80C390 Dual CAN High-Speed Microprocessor Figure 26. Serial Port 0 (Synchronous Mode) HIGH-SPEED OPERATION, TXD CLK = XTAL/4 (SM2 = 1) TRADITIONAL 8051 OPERATION, TXD CLOCK = XTAL/12 (SM2 = 0) 23 of 52 DS80C390 Dual CAN High-Speed Microprocessor POWER-CYCLE TIMING CHARACTERISTICS PARAMETER SYMBOL TYP Crystal Startup Time (Note 14) tCSU 1.8 Power-On Reset Delay (Note 15) tPOR MAX UNITS ms 65,536 tCLCL Note 14: Startup time for crystals varies with load capacitance and manufacturer. Time shown is for an 11.0592MHz crystal manufactured by Fox Electronics. Note 15: Reset delay is a synchronous counter of crystal oscillations during crystal startup. Counting begins when the level on the XTAL1 input meets the VIH2 criteria. At 40MHz, this time is approximately 1.64ms. Figure 27. Power-Cycle Timing 24 of 52 DS80C390 Dual CAN High-Speed Microprocessor PIN DESCRIPTION PIN LQFP 8, 22, 40, 56 9, 25, 41, 57 PLCC 17, 32, 51, 68 1, 18, 35, 52 NAME VCC GND 46 57 ALE 45 56 PSEN 47 58 EA 26 36 MUX 2 11 RST 3 12 RSTOL 23 33 XTAL2 24 34 XTAL1 55 54 53 52 51 50 49 48 67 66 65 64 63 62 61 59 AD0/D0 AD1/D1 AD2/D2 AD3/D3 AD4/D4 AD5/D5 AD6/D6 AD7/D7 FUNCTION +5V Digital Circuit Ground Address Latch Enable, Output. When the MUX pin is low, this pin outputs a clock to latch the external address LSB from the multiplexed address/data bus on Port 0. This signal is commonly connected to the latch enable of an external transparent latch. ALE has a pulse width of 1.5 XTAL1 cycles and a period of four XTAL1 cycles. When the MUX pin is high, the pin will toggle continuously if the ALEOFF bit is cleared. ALE is forced high when the device is in a reset condition or if the ALEOFF bit is set while the MUX pin is high. Program Store Enable, Output. This signal is the chip enable for external ROM memory. PSEN provides an active-low pulse and is driven high when external ROM is not being accessed. External Access Enable, Input. This pin must be wired to GND for proper operation. Multiplex/Demultiplex Select, Input. This pin selects if the address/data bus operates in multiplexed (MUX = 0) or demultiplexed (MUX = 1) mode. Reset, Input. The RST input pin contains a Schmitt voltage input to recognize external active-high reset inputs. The pin also employs an internal pulldown resistor to allow for a combination of wired-OR external reset sources. An RC circuit is not required for power-up, as the device provides this function internally. Reset Output Low, Output. This active-low signal is asserted: When the processor has entered reset through the RST pin, During crystal warmup period following power-on or stop mode, During a watchdog timer reset (2 cycles duration), During an oscillator failure (if OFDE = 1), Whenever VCC ≤ VRST. XTAL1, XTAL2. Crystal oscillator pins support fundamental mode, parallel resonant, and AT-cut crystals. XTAL1 is the input if an external clock source is used in place of a crystal. XTAL2 is the output of the crystal amplifier. AD0–7 (Port 0), I/O. When the MUX pin is wired low, Port 0 is the multiplexed address/data bus. While ALE is high, the LSB of a memory address is presented. While ALE falls, the port transitions to a bidirectional data bus. When the MUX pin is wired high, Port 0 functions as the bidirectional data bus. Port 0 cannot be modified by software. The reset condition of Port 0 pins is high. No pullup resistors are needed. 25 of 52 DS80C390 Dual CAN High-Speed Microprocessor PIN DESCRIPTION (continued) PIN LQFP 58–64, 1 PLCC 2–8, 10 NAME FUNCTION P1.0–P1.7 Port 1, I/O. Port 1 can function as an 8-bit bidirectional I/O port, the nonmultiplexed A0–A7 signals (when the MUX pin = 1), and as an alternate interface for internal resources. Setting the SP1EC bit relocates RXD1 and TXD1 to Port 5. The reset condition of Port 1 is all bits at logic 1 through a weak pullup. The logic 1 state also serves as an input mode, since external circuits writing to the port can overdrive the weak pullup. When software clears any port pin to 0, a strong pulldown is activated that remains on until either a 1 is written to the port pin or a reset occurs. Writing a 1 after the port has been at 0 activates a strong transition driver, followed by a weaker sustaining pullup. Once the momentary strong driver turns off, the port once again becomes the output (and input) high state. Port Alternate Function 58 2 A0 P1.0 T2 External I/O for Timer/Counter 2 59 3 A1 P1.1 T2EX Timer/Counter 2 Capture/Reload Trigger 60 4 A2 P1.2 RXD1 Serial Port 1 Input 61 5 A3 P1.3 TXD1 Serial Port 1 Output 62 6 A4 P1.4 INT2 External Interrupt 2 (Positive Edge Detect) 63 7 A5 P1.5 64 8 A6 P1.6 INT3 External Interrupt 3 (Negative Edge Detect) INT4 External Interrupt 4 (Positive Edge Detect) 1 35 36 37 38 39 42 43 44 10 46 47 48 49 50 53 54 55 A7 A8 (P2.0) A9 (P2.1) A10 (P2.2) A11 (P2.3) A12 (P2.4) A13 (P2.5) A14 (P2.6) A15 (P2.7) P1.7 INT5 External Interrupt 5 (Negative Edge Detect) 4–7, 10–13 13–16, 19–22 4 5 6 7 10 11 12 13 13 14 15 16 19 20 21 22 P3.0–P3.7 A15–A8 (Port 2), Output. Port 2 serves as the MSB for external addressing. The port automatically asserts the address MSB during external ROM and RAM access. Although the Port 2 SFR exists, the SFR value never appears on the pins (due to memory access). Therefore, accessing the Port 2 SFR is only useful for MOVX A, @Ri or MOVX @Ri, A instructions, which use the Port 2 SFR as the external address MSB. Port 3, I/O. Port 3 functions as an 8-bit bidirectional I/O port and as an alternate interface for several resources found on the traditional 8051. The reset condition of Port 1 is all bits at logic 1 through a weak pullup. The logic 1 state also serves as an input mode, since external circuits writing to the port can overdrive the weak pullup. When software clears any port pin to 0, the device activates a strong pulldown that remains on until either a 1 is written to the port pin or a reset occurs. Writing a 1 after the port has been at 0 activates a strong transition driver, followed by a weaker sustaining pullup. Once the momentary strong driver turns off, the port once again becomes the output (and input) high state. Port P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 Alternate Function RXD0 Serial Port 0 Input TXD0 Serial Port 0 Output INT0 External Interrupt 0 INT1 External Interrupt 1 T0 Timer 0 External Input T1/XCLK Timer 1 External Input/External Clock Output WR External Data Memory Write Strobe RD External Data Memory Read Strobe 26 of 52 DS80C390 Dual CAN High-Speed Microprocessor PIN DESCRIPTION (continued) PIN LQFP PLCC 34–27 45, 44, 42–37 34 33 32 31 30 29 28 27 45 44 42 41 40 39 38 37 21–14 31–27, 25–23 21 20 19 18 17 16 15 14 31 30 29 28 27 25 24 23 9, 26, 43, 60 NAME FUNCTION P4.0–P4.7 Port 4, I/O. Port 4 can function as an 8-bit, bidirectional I/O port, and as the source for external address and chip enable signals for program and data memory. Port pins are configured as I/O or memory signals via the P4CNT register. The reset condition of Port 1 is all bits at logic 1 via a weak pullup. The logic 1 state also serves as an input mode, since external circuits writing to the port can overdrive the weak pullup. When software clears any port pin to 0, the device activates a strong pulldown that remains on until either a 1 is written to the port pin or a reset occurs. Writing a 1 after the port has been at 0 will activate a strong transition driver, followed by a weaker sustaining pullup. Once the momentary strong driver turns off, the port once again becomes the output (and input) high state. P5.0–P5.7 N.C. Port Alternate Function P4.0 CE0 Program Memory Chip Enable 0 P4.1 CE1 Program Memory Chip Enable 1 P4.2 CE2 Program Memory Chip Enable 2 P4.3 CE3 Program Memory Chip Enable 3 P4.4 A16 Program/Data Memory Address 16 P4.5 A17 Program/Data Memory Address 17 P4.6 A18 Program/Data Memory Address 18 P4.7 A19 Program/Data Memory Address 19 Port 5, I/O. Port 5 can function as an 8-bit, bidirectional I/O port, the CAN interface, or as peripheral enable signals. Setting the SP1EC bit will relocate the RXD1 and TXD1 functions to P5.3-P5.2 as described in the High-Speed Microcontroller User’s Guide: DS80C390 Supplement. The reset condition of Port 1 is all bits at logic 1 via a weak pullup. The logic 1 state also serves as an input mode, since external circuits writing to the port can overdrive the weak pullup. When software clears any port pin to 0, the device activates a strong pulldown that remains on until either a 1 is written to the port pin or a reset occurs. Writing a 1 after the port has been at 0 will activate a strong transition driver, followed by a weaker sustaining pullup. Once the momentary strong driver turns off, the port once again becomes the output (and input) high state. Port Alternate Function P5.0 C0TX CAN0 Transmit Output P5.1 C0RX CAN0 Receive Input P5.2 C1RX CAN1 Receive Input (optional RXD1) P5.3 C1TX CAN1 Transmit Output (optional TXD1) P5.4 PCE0 Peripheral Chip Enable 0 P5.5 PCE1 Peripheral Chip Enable 1 P5.6 PCE2 Peripheral Chip Enable 2 P5.7 PCE3 Peripheral Chip Enable 3 Not Connected. Reserved. These pins are reserved for use with future devices in this family and should not be connected. 27 of 52 DS80C390 Dual CAN High-Speed Microprocessor Figure 28. Block Diagram DS80C390 28 of 52 DS80C390 Dual CAN High-Speed Microprocessor FEATURES      80C52 Compatible 8051-Instruction-Set Compatible Four 8-Bit I/O Ports Three 16-Bit Timer/Counters 256 Bytes Scratchpad RAM High-Speed Architecture 4 Clocks/Machine Cycle (8051 = 12) Runs DC to 40MHz Clock Rates Frequency Multiplier Reduces Electromagnetic Interference (EMI) Single-Cycle Instruction in 100ns 16/32-Bit Math Coprocessor 4kB Internal SRAM Usable as Program/Data/Stack Memory Enhanced Memory Architecture Addresses Up to 4MB External Defaults to True 8051-Memory Compatibility User-Enabled 22-Bit Program/Data Counter 16-Bit/22-Bit Paged/22-Bit Contiguous Modes User-Selectable Multiplexed/Nonmultiplexed Memory Interface Optional 10-Bit Stack Pointer      Two Full-Function CAN 2.0B Controllers 15 Message Centers Per Controller Standard 11-Bit or Extended 29-Bit Identification Modes Supports DeviceNet™, SDS, and Higher Layer CAN Protocols Disables Transmitter During Autobaud SIESTA Low-Power Mode Two Full-Duplex Hardware Serial Ports Programmable IrDA Clock High-Integration Controller Includes: Power-Fail Reset Early-Warning Power-Fail Interrupt Programmable Watchdog Timer Oscillator-Fail Detection 16 Interrupt Sources with Six External Available in 64-Pin LQFP and 68-Pin PLCC DETAILED DESCRIPTION The DS80C390 features two full-function controller area network (CAN) 2.0B controllers. Status and control registers are distributed between SFRs and 512 bytes of internal MOVX memory for maximum flexibility. In addition to standard 11-bit or 29-extended message identifiers, the device supports two separate 8-bit media masks and media arbitration fields to support the use of higher-level CAN protocols such as DeviceNet and SDS. All of the standard 8051 resources such as three timer/counters, serial port, and four 8-bit I/O ports (plus two 8-bit ports dedicated to memory interfacing) are included in the DS80C390. In addition it includes a second hardware serial port, seven additional interrupts, programmable watchdog timer, brownout monitor, power-fail reset, and a programmable output clock that supports an IrDA interface. The device provides dual data pointers with increment/decrement features to speed block data memory moves. It also can adjust the speed of MOVX data memory access from 2 to 12 machine cycles for flexibility in addressing external memory and peripherals. The device incorporates a 4kB SRAM, which can be configured as various combinations of MOVX memory, program memory, and optional stack memory. A 22-bit program counter supports access to a maximum of 4MB of external program memory and 4MB of external data memory. A 10-bit stack pointer addresses up to 1kB of MOVX memory for increased code efficiency. A new power-management mode (PMM) is useful for portable or power-conscious applications. This feature allows software to switch from the standard machine cycle rate of 4 clocks per cycle to 1024 clocks per cycle. For example, at 12MHz standard operation has a machine cycle rate of 3MHz. In PMM at the same external clock speed, software can select 11.7kHz machine cycle rate. There is a corresponding reduction in power consumption when the processor runs slower. The EMI reduction feature allows software to select a reduced electromagnetic interference (EMI) mode by disabling the ALE signal when it is unneeded. The device also incorporates active current control on the address and data buses, reducing EMI by minimizing transients when interfacing to external circuitry. 80C32 COMPATIBILITY The DS80C390 is a CMOS 80C32-compatible microcontroller designed for high performance. Every effort has been made to keep the core device familiar to 80C32 users while adding many new features. DeviceNet is a trademark of Open DeviceNet Vendor Association, Inc. 29 of 52 DS80C390 Dual CAN High-Speed Microprocessor Because the device runs the standard 8051 instruction set, in general, software written for existing 80C32-based systems will work on the DS80C390. The primary exceptions are related to timing-critical issues, since the highperformance core of the microcontroller executes instructions much faster than the original. Memory interfacing is performed identically to the standard 80C32. The high-speed nature of the DS80C390 core slightly changes the interface timing, and designers are advised to consult the timing diagrams in this data sheet for more information. The DS80C390 provides the same timer/counter resources, full duplex serial port, 256 bytes of scratchpad RAM and I/O ports as the standard 80C32. Timers default to a 12 clocks-per-machine cycle operation to keep timing compatible with original 8051 systems, but can be programmed to run at the faster four clocks-per-machine cycle if desired. New hardware functions are accessed using special function registers that do not overlap with standard 80C32 locations. This data sheet provides only a summary and overview of the DS80C390. Detailed descriptions are available in the High-Speed Microcontroller User’s Guide: DS80C390 Supplement. This data sheet assumes a familiarity with the architecture of the standard 80C32. In addition to the basic features of that device, the DS80C390 incorporates many new features. PERFORMANCE OVERVIEW The DS80C390’s higher performance comes not just from increasing the clock frequency but also from a more efficient design. This updated core removes the dummy memory cycles that are present in a standard, 12 clocksper-machine cycle 8051. In the DS80C390, the same machine cycle takes 4 clocks. Thus the fastest instruction, one machine cycle, executes three times faster for the same crystal frequency. The majority of instructions on the DS80C390 see the full 3-to-1 speed improvement, while a few execute between 1.5 and 2.4 times faster. Regardless of specific performance improvements, all instructions are faster than the original 8051. Improvement of individual programs depends on the actual mix of instructions used. Speed-sensitive applications should make the most use of instructions that are three times faster. However, the large number of 3-to-1 improved op codes makes dramatic speed improvements likely for any arbitrary combination of instructions. These architecture improvements and the submicron CMOS design produce a peak instruction cycle in 100ns (10 MIPS). The dual data pointer feature also allows the user to eliminate wasted instructions when moving blocks of memory. INSTRUCTION SET SUMMARY All instructions perform exactly the same functions as their 8051 counterparts. Their effect on bits, flags, and other status functions is identical. However, the timing of instructions is different, both in absolute and relative number of clocks. The absolute timing of software loops can be calculated using a table in the High-Speed Microcontroller User’s Guide: DS80C390 Supplement. However, counter/timers default to run at the traditional 12 clocks per increment. In this way, timer-based events occur at the standard intervals with software executing at higher speed. Timers optionally can run at the faster four clocks per increment to take advantage of faster processor operation. The relative time of two DS80C390 instructions might differ from the traditional 8051. For example, in the original architecture the “MOVX A, @DPTR” instruction and the “MOV direct, direct” instruction required the same amount of time: two machine cycles or 24 oscillator cycles. In the DS80C390, the MOVX instruction takes as little as two machine cycles, or eight oscillator cycles, but the “MOV direct, direct” uses three machine cycles, or 12 oscillator cycles. While both are faster than their original counterparts, they now have different execution times. This is because the device usually uses one instruction cycle for each instruction byte. Examine the timing of each instruction for familiarity with the changes. Note that a machine cycle now requires just four clocks, and provides one ALE pulse per cycle. Many instructions require only one cycle, but some require five. Refer to the High-Speed Microcontroller User’s Guide: DS80C390 Supplement for details and individual instruction timing. SPECIAL FUNCTION REGISTERS (SFRs) Special function registers (SFRs) control most special features of the microcontroller, allowing the device to have many new features but use the same instruction set as the 8051. When writing software to use a new feature, an equate statement defines the SFR to an assembler or compiler. This is the only change needed to access the new function. The DS80C390 duplicates the SFRs contained in the standard 80C52. Table 1 shows the register addresses and bit locations. Many are standard 80C52 registers. The High-Speed Microcontroller User’s Guide: DS80C390 Supplement contains a full description of all SFRs. 30 of 52 DS80C390 Dual CAN High-Speed Microprocessor Table 1. SFR Locations REGISTER BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 ADDRESS P4 SP DPL DPH DPL1 DPH1 DPS PCON TCON TMOD TL0 TL1 TH0 TH1 CKCON P1 EXIF P4CNT DPX DPX1 C0RMS0 C0RMS1 SCON0 SBUF0 ESP AP ACON C0TMA0 C0TMA1 P2 P5 P5CNT C0C C0S C0IR C0TE C0RE IE SADDR0 SADDR1 C0M1C C0M2C C0M3C C0M4C C0M5C P3 C0M6C C0M7C C0M8C C0M9C C0M10C IP SADEN0 SADEN1 C0M11C C0M12C C0M13C P4.7 P4.6 P4.5 P4.4 P4.3 P4.2 P4.1 P4.0 ID1 SMOD_0 TF1 GATE ID0 SMOD0 TR1 C/T TSL OFDF TF0 M1 — OFDE TR0 M0 — GF1 IE1 GATE — GF0 IT1 C/T — STOP IE0 M1 SEL IDLE IT0 M0 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 90h 91h 92h 93h 95h 96h 97h 98h 99h 9Bh 9Ch 9Dh 9Eh 9Fh A0h A1h A2h A3h A4h A5h A6h A7h A8h A9h AAh ABh ACh ADh AEh AFh B0h B3h B4h B5h B6h B7h B8h B9h BAh BBh BCh BDh WD1 WD0 INT5/P1.7 INT4/P1.6 IE5 IE4 — SBCAN T2M T1M T0M MD2 MD1 INT3/P1.5 INT2/P1.4 TXD1/P1.3 RXD1/P1.2 T2EX/P1.1 IE3 IE2 CKRY RGMD RGSL P4CNT.5 P4CNT.4 P4CNT.3 P4CNT.2 P4CNT.1 MD0 T2/P1.0 BGS P4CNT.0 SM0/FE_0 SM1_0 SM2_0 REN_0 TB8_0 RB8_0 TI_0 RI_0 — — — — — — ESP.1 ESP.0 — — — — — SA AM1 AM0 P2.7 P5.7 CAN1BA ERIE BSS INTIN7 P2.6 P5.6 CAN0BA STIE EC96/128 INTIN6 P2.5 P5.5 SP1EC PDE WKS INTIN5 P2.4 P5.4 C1_I/O SIESTA RXS INTIN4 P2.3 P5.3 C0_I/O CRST TXS INTIN3 P2.2 P5.2 P5CNT.2 AUTOB ER2 INTIN2 P2.1 P5.1 P5CNT.1 ERCS ER1 INTIN1 P2.0 P5.0 P5CNT.0 SWINT ER0 INTIN0 EA ES1 ET2 ES0 ET1 EX1 ET0 EX0 MSRDY MSRDY MSRDY MSRDY MSRDY P3.7 MSRDY MSRDY MSRDY MSRDY MSRDY — ETI ETI ETI ETI ETI P3.6 ETI ETI ETI ETI ETI PS1 ERI ERI ERI ERI ERI T1 ERI ERI ERI ERI ERI PT2 INTRQ INTRQ INTRQ INTRQ INTRQ T0 INTRQ INTRQ INTRQ INTRQ INTRQ PS0 EXTRQ EXTRQ EXTRQ EXTRQ EXTRQ INT1 EXTRQ EXTRQ EXTRQ EXTRQ EXTRQ PT1 MTRQ MTRQ MTRQ MTRQ MTRQ INT0 MTRQ MTRQ MTRQ MTRQ MTRQ PX1 ROW/TIH ROW/TIH ROW/TIH ROW/TIH ROW/TIH TXD0 ROW/TIH ROW/TIH ROW/TIH ROW/TIH ROW/TIH PT0 DTUP DTUP DTUP DTUP DTUP RXD0 DTUP DTUP DTUP DTUP DTUP PX0 MSRDY MSRDY MSRDY ETI ETI ETI ERI ERI ERI INTRQ INTRQ INTRQ EXTRQ EXTRQ EXTRQ MTRQ MTRQ MTRQ ROW/TIH ROW/TIH ROW/TIH DTUP DTUP DTUP 31 of 52 DS80C390 Dual CAN High-Speed Microprocessor Table 1. SFR Locations (continued) REGISTER BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 ADDRESS C0M14C C0M15C SCON1 SBUF1 PMR STATUS MCON TA T2CON T2MOD RCAP2L RCAP2H TL2 TH2 COR PSW MCNT0 MCNT1 MA MB MC C1RMS0 C1RMS1 WDCON C1TMA0 C1TMA1 ACC C1C C1S C1IR C1TE C1RE EIE MXAX C1M1C C1M2C C1M3C C1M4C C1M5C B C1M6C C1M7C C1M8C C1M9C C1M10C EIP C1M11C C1M12C C1M13C C1M14C C1M15C MSRDY MSRDY SM0/FE_1 ETI ETI SM1_1 ERI ERI SM2_1 INTRQ INTRQ REN_1 EXTRQ EXTRQ TB8_1 MTRQ MTRQ RB8_1 ROW/TIH ROW/TIH TI_1 DTUP DTUP RI_1 CD1 PIP IDM1 CD0 HIP IDM0 SWB LIP CMA CTM — — 4X/2X SPTA1 PDCE3 ALEOFF SPRA1 PDCE2 — SPTA0 PDCE1 — SPRA0 PDCE0 TF2 — EXF2 — RCLK — TCLK D13T1 EXEN2 D13T2 TR2 —- C/T2 T2OE CP/RL2 DCEN IRDACK CY LSHIFT MST C1BPR7 AC CSE MOF C1BPR6 F0 SCB — C0BPR7 RS1 MAS4 CLM C0BPR6 RS0 MAS3 — COD1 OV MAS2 — COD0 F1 MAS1 — CLKOE P MAS0 — SMOD_1 POR EPFI PFI WDIF WTRF EWT RWT ERIE BSS INTIN7 STIE CECE INTIN6 PDE WKS INTIN5 SIESTA RXS INTIN4 CRST TXS INTIN3 AUTOB ER2 INTIN2 ERCS ER1 INTIN1 SWINT ER0 INTIN0 CANBIE C0IE C1IE EWDI EX5 EX4 EX3 EX2 MSRDY MSRDY MSRDY MSRDY MSRDY ETI ETI ETI ETI ETI ERI ERI ERI ERI ERI INTRQ INTRQ INTRQ INTRQ INTRQ EXTRQ EXTRQ EXTRQ EXTRQ EXTRQ MTRQ MTRQ MTRQ MTRQ MTRQ ROW/TIH ROW/TIH ROW/TIH ROW/TIH ROW/TIH DTUP DTUP DTUP DTUP DTUP MSRDY MSRDY MSRDY MSRDY MSRDY CANBIP MSRDY MSRDY MSRDY MSRDY MSRDY ETI ETI ETI ETI ETI C0IP ETI ETI ETI ETI ETI ERI ERI ERI ERI ERI C1IP ERI ERI ERI ERI ERI INTRQ INTRQ INTRQ INTRQ INTRQ PWDI INTRQ INTRQ INTRQ INTRQ INTRQ EXTRQ EXTRQ EXTRQ EXTRQ EXTRQ PX5 EXTRQ EXTRQ EXTRQ EXTRQ EXTRQ MTRQ MTRQ MTRQ MTRQ MTRQ PX4 MTRQ MTRQ MTRQ MTRQ MTRQ ROW/TIH ROW/TIH ROW/TIH ROW/TIH ROW/TIH PX3 ROW/TIH ROW/TIH ROW/TIH ROW/TIH ROW/TIH DTUP DTUP DTUP DTUP DTUP PX2 DTUP DTUP DTUP DTUP DTUP BEh BFh C0h C1h C4h C5h C6h C7h C8h C9h CAh CBh CCh CDh CEh D0h D1h D2h D3h D4h D5h D6h D7h D8h DEh DFh E0h E3h E4h E5h E6h E7h E8h EAh EBh ECh EDh EEh EFh F0h F3h F4h F5h F6h F7h F8h FBh FCh FDh FEh FFh Note: Shaded bits are timed-access protected. 32 of 52 DS80C390 Dual CAN High-Speed Microprocessor ON-CHIP ARITHMETIC ACCELERATOR An on-chip math accelerator allows the microcontroller to perform 32-bit and 16-bit multiplication, division, shifting, and normalization using dedicated hardware. Math operations are performed by sequentially loading three special registers. The mathematical operation is determined by the sequence in which three dedicated SFRs (MA, MB, and MC) are accessed, eliminating the need for a special step to choose the operation. The normalize function facilitates the conversion of 4-byte unsigned binary integers into floating point format. Table 2 shows the operations supported by the math accelerator and their time of execution. Table 2. Arithmetic Accelerator Execution Times OPERATION RESULT 32-Bit/16-Bit Divide 16-Bit/16-Bit Divide 16-Bit/16-Bit Multiply 32-Bit Shift Left/Right 32-Bit Normalize 32-Bit Quotient, 16-Bit Remainder 16-Bit Quotient, 16-Bit Remainder 32-Bit Product 32-Bit Result 32-Bit Mantissa, 5-Bit Exponent EXECUTION TIME (tCLCL) 36 24 24 36 36 Table 3 demonstrates the procedure to perform mathematical operations using the hardware math accelerator. The MA and MB registers must be loaded and read in the order shown for proper operation, although accesses to any other registers can be performed between access to the MA or MB registers. An access to the MA, MB, or MC registers out of sequence corrupts the operation, requiring the software to clear the MST bit to restart the math accelerator state machine. Consult the description of the MCNT0 SFR for details of how the shift and normalize functions operate. Software must ensure that the input value for the normalize operation is not zero or the function will not complete. Compilers such as the one from Keil Software have updated their libraries and compensate for this condition. Table 3. Arithmetic Accelerator Sequencing DIVIDE (32/16 OR 16/16) Load MA with dividend LSB. Load MA with dividend LSB + 1.* Load MA with dividend LSB + 2.* Load MA with dividend MSB. Load MB with divisor LSB. Load MB with divisor MSB. Poll the MST bit until cleared. (9 machine cycles). Read MA to retrieve the quotient MSB. Read MA to retrieve the quotient LSB + 2.** Read MA to retrieve the quotient LSB + 1.** Read MA to retrieve the quotient LSB. Read MB to retrieve the remainder MSB. Read MB to retrieve the remainder LSB. MULTIPLY (16 X 16) Load MB with multiplier LSB. Load MB with multiplier MSB. Load MA with multiplicand LSB. Load MA with multiplicand MSB. Poll the MST bit until cleared. (6 machine cycles). Read MA for product MSB. Read MA for product LSB + 2. Read MA for product LSB + 1. Read MA for product LSB. SHIFT RIGHT/LEFT Load MA with data LSB. Load MA with data LSB + 1. Load MA with data LSB + 2. Load MA with data MSB. Configure MCNT0 register as required Poll the MST bit until cleared. (9 machine cycles) Read MA for result MSB. Read MA for result LSB + 2. Read MA for result LSB + 1. Read MA for result LSB. NORMALIZE Load MA with data LSB. Load MA with data LSB + 1. Load MA with data LSB + 2. Load MA with data MSB.*** Load MCNT0 with 00h. Poll the MST bit until cleared. (9 machine cycles) Read MA for mantissa MSB. Read MA for mantissa LSB + 2. Read MA for mantissa LSB + 1. Read MA for mantissa LSB. Read MCNT0.4–MCNT0.0 for exponent. *Not performed for 16-bit numerator. **Not performed for 16/16 divide. ***Value to be normalized must be nonzero. 33 of 52 DS80C390 Dual CAN High-Speed Microprocessor 40-BIT ACCUMULATOR The accelerator also incorporates an automatic accumulator function, permitting the implementation of multiplyand-accumulate and divide-and-accumulate functions without any additional delay. Each time the accelerator is used for a multiply or divide operation, the result is transparently added to a 40-bit accumulator. This can greatly increase speed of DSP and other high-level math operations. The accumulator can be accessed anytime the multiply/accumulate status flag (MCNT1;D2h) is cleared. The accumulator is initialized by performing five writes to the multiplier C register (MC;D5h), LSB first. The 40-bit accumulator can be read by performing five reads of the multiplier C register, MSB first. MEMORY ADDRESSING The DS80C390 incorporates three internal memory areas:  256 bytes of scratchpad (or direct) RAM  4kB of SRAM configurable as various combinations of MOVX data memory, stack memory, and MOVC program memory  512 bytes of RAM reserved for the CAN message centers. Up to 4MB of external memory is addressed via a multiplexed or demultiplexed 20-bit address bus/8-bit data bus and four chip-enable (active during program memory access) or four peripheral-enable (active during data memory access) signals. Three different addressing modes are supported, as selected by the AM1, AM0 bits in the ACON SFR. 16-Bit Address Mode Memory is accessed by 16-bit address mode similarly to the traditional 8051. It is op-code compatible with the 8051 microprocessor and identical to the byte and cycle count of the Dallas Semiconductor High-Speed Microcontroller family. A device operating in this mode can access up to 64kB of program and data memory. The device defaults to this mode following any reset. 22-Bit Paged-Address Mode The 22-bit paged-address mode retains binary-code compatibility with the 8051 instruction set, but adds one machine cycle to the ACALL, LCALL, RET, and RETI instructions with respect to Dallas Semiconductor’s HighSpeed Microcontroller family timing. This is transparent to standard 8051 compilers. Interrupt latency is also increased by one machine cycle. In this mode, interrupt vectors are fetched from 0000xxh. 22-Bit Contiguous Address Mode The 22-bit contiguous addressing mode uses a full 22-bit program counter, and all modified branching instructions automatically save and restore the entire program counter. The 22-bit branching instructions such as ACALL, AJMP, LCALL, LJMP, MOV DPTR, RET, and RETI instructions require an assembler, compiler, and linker that specifically supports these features. The INC DPTR is lengthened by one cycle but remains byte-count-compatible with the standard 8051 instruction set. Internally, the device uses a 22-bit program counter. The lowest order 22 bits are used for memory addressing, with a special 23rd bit used to map the 4kB SRAM above the 4MB memory space in bootstrap loader applications. Address bits 16–23 for the 22-bit addressing modes are generated through additional SFRs dependent on the type of instruction as shown in Table 4. Table 4. Extended Address Generation INSTRUCTION MOVX instructions using DPTR MOVX instructions using DPTR1 MOVX instructions using @Ri Addressing program memory in 22-bit paged mode 10-bit stack pointer mode ADDRESS BITS 23–16 DPX;93h DPX1;95h MXAX;EAh ADDRESS BITS 15–8 DPH;83h DPH1;85h P2;A0h ADDRESS BITS 7–0 DPL;82h DPL1;84h Ri AP;9Ch — — — ESP;9Bh SP;81h 34 of 52 DS80C390 Dual CAN High-Speed Microprocessor INTERNAL MOVX SRAM The DS80C390 contains 4kB of SRAM that can be configured as user accessible MOVX memory, program memory, or optional stack memory. The specific configuration and locations are governed by the internal data memory configuration bits (IDM1, IDM0) in the memory control register (MCON;C6h). Note that when the SA bit (ACON.2) is set, the first 1kB of the MOVX data memory is reserved for use by the 10-bit expanded stack. Internal memory accesses will not generate WR, RD, or PSEN strobes. The DS80C390 can configure its 4kB of internal SRAM as combined program and data memory. This allows the application software to execute self-modifiable code. The technique loads the 4kB SRAM with bootstrap loader software, and then modifies the IDM1 and IDM0 bits to map the 4kB starting at memory location 40000h. This allows the system to run the bootstrap loader without disturbing the 4MB external memory bus, making the device in-system reprogrammable for flash or NV RAM. Table 5. Internal MOVX SRAM Configuration MEMORY IDM1 0 0 0 0 1 1 1 1 IDM0 0 0 1 1 0 0 1 1 CMA 0 1 0 1 0 1 0 1 MOVX DATA CAN MESSAGE SHARED PROGRAM/DATA 00F000h–00FFFFh 00F000h–00FFFFh 000000h–000FFFh 000000h–000FFFh 400000h–400FFFh 400000h–400FFFh — — 00EE00h–00EFFFh 401000h–4011FFh 00EE00h–00EFFFh 401000h–4011FFh 00EE00h–00EFFFh 401000h–4011FFh 00EE00h–00EFFFh 401000h–4011FFh — — — — — — 400000h–400FFFh* 400000h–400FFFh* *10-bit expanded stack is not available in shared program/data memory mode. EXTERNAL MEMORY ADDRESSING The enabling and mapping of the chip-enable signals is done through the Port 4 control register (P4CNT;92h) and memory control register (MCON; 96h). Table 7 shows which chip-enable and address line signals are active on Port 4. Following reset, the device will be configured with P4.7–P4.4 as address lines and P4.3–P4.0 configured as CE3-0, with the first program fetch being performed from 00000h with CE0 active. The following tables illustrate which memory ranges are controlled by each chip enable as a function of which address lines are enabled. Table 6. External Memory Addressing Pin Assignments ADDRESS/DATA BUS CE3---CE0 PCE3---PCE0 ADDR 19–16 ADDR 15–8 ADDR 7–0 DATA BUS Multiplexed P4.3–P4.0 P5.7–P5.4 P4.7–P4.4 P2 P0 P0 Demultiplexed P4.3–P4.0 P5.7–P5.4 P4.7–P4.4 P2 P1 P0 Table 7. Extended Address and Chip-Enable Generation P4CNT.5–3 000 100 101 110 111(default) P4.7 I/O I/O I/O I/O A19 PORT 4 PIN FUNCTION P4.6 P4.5 I/O I/O I/O I/O I/O A17 A18 A17 A18 A17 P4.4 I/O A16 A16 A16 A16 P4CNT.2–0 000 100 101 110 111(default) 35 of 52 P4.3 I/O I/O I/O I/O CE3 PORT 4 PIN FUNCTION P4.2 P4.1 I/O I/O I/O I/O I/O CE1 CE2 CE1 CE2 CE1 P4.0 I/O CE0 CE0 CE0 CE0 DS80C390 Dual CAN High-Speed Microprocessor Table 8. Program Memory Chip-Enable Boundaries P4CNT.5–3 CE0 CE1 CE2 CE3 000 100 101 110 111(default) 0h–7FFFh 0h–1FFFFh 0h–3FFFFh 0h–7FFFFh 0–FFFFFh 8000h–FFFFh 20000h–3FFFFh 40000h–7FFFFh 80000h–FFFFFh 100000h–1FFFFFh 10000h–17FFFh 40000h–5FFFFh 80000h–BFFFFh 100000h–17FFFFh 200000h–2FFFFFh 18000h–1FFFFh 60000h–7FFFFh C0000h–FFFFFh 180000h–1FFFFFh 300000h–3FFFFFh The DS80C390 incorporates a feature allowing PCE and CE signals to be combined. This is useful when incorporating modifiable code memory as part of a bootstrap loader or for in-system reprogrammability. Setting the PDCE3---0 (MCON.3–0) bits causes the corresponding chip-enable signal to function for both MOVC and MOVX operations. Write access to combined program and data memory blocks is controlled by the WR signal, and read access is controlled by the PSEN signal. This feature is especially useful if the design achieves in-system reprogrammability via external flash memory, in which a single device is accessed through both MOVC instructions (program fetch) and MOVX write operations (updates to code memory). In this case, the internal SRAM is placed in the program/data configuration and loaded with a small bootstrap loader program stored in the external flash memory. The device then executes the internal bootstrap loader routine to modify/update the program memory located in the external flash memory. STRETCH MEMORY CYCLES The DS80C390 allows user-application software to select the number of machine cycles it takes to execute a MOVX instruction, allowing access to both fast and slow off-chip data memory and/or peripherals without glue logic. High-speed systems often include memory-mapped peripherals such as LCDs or UARTs with slow access times, so it may not be necessary or desirable to access external devices at full speed. The microprocessor can perform a MOVX instruction in as little as two machine cycles or as many as twelve machine cycles. Accesses to internal MOVX SRAM always use two cycles. Note that stretch cycle settings affect external MOVX memory operations only and that there is no way to slow the accesses to program memory other than to use a slower crystal (or external clock). External MOVX timing is governed by the selection of 0 to 7 stretch cycles, controlled by the MD2–MD0 SFR bits in the clock-control register (CKCON.2–0). A stretch of zero results in a 2-machine cycle MOVX instruction. A stretch of seven results in a MOVX of 12 machine cycles. Software can dynamically change the stretch value depending on the particular memory or peripheral being accessed. The default of one stretch cycle allows the use of commonly available SRAMs without dramatically lengthening the memory access times. Stretch cycle settings affect external MOVX timing in three gradations. Changing the stretch value from 0 to 1 adds an additional clock cycle each to the data setup and hold times. When a stretch value of 4 or above is selected, the interface timing changes dramatically to allow for very slow peripherals. First, the ALE signal is lengthened by 1 machine cycle. This increases the address setup time into the peripheral by this amount. Next, the address is held on the bus for one additional machine cycle increasing the address hold time by this amount. The WR and RD signals are then lengthened by a machine cycle. Finally, during a MOVX write the data is held on the bus for one additional machine cycle, thereby increasing the data hold time by this amount. For every stretch value greater than 4, the setup and hold times remain constant, and only the width of the read or write signal is increased. These three gradations are reflected in the AC Electrical Characteristics, where the eight MOVX timing specifications are represented by only three timing diagrams. The reset default of one stretch cycle results in a three-cycle MOVX for any external access. Therefore, the default off-chip RAM access is not at full speed. This is a convenience to existing designs that use slower RAM. When maximum speed is desired, software should select a stretch value of zero. When using very slow RAM or peripherals, the application software can select a larger stretch value. The specific timing of MOVX instructions as a function of stretch settings is provided in the Electrical Specifications section of this data sheet. As an example, Table 9 shows the read and write strobe widths corresponding to each stretch value. 36 of 52 DS80C390 Dual CAN High-Speed Microprocessor Table 9. Data Memory Cycle Stretch Values MD2 MD1 MD0 STRETCH CYCLE COUNT 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0* 1** 2 3 4 5 6 7 MOVX MACHINE CYCLES 2 3 4 5 9 10 11 12 RD, WR PULSE WIDTH (IN OSCILLATOR CLOCKS) tMCS (4X/2X = 1 CD1:0 = 00) 0.5 tCLCL tCLCL 2 tCLCL 3 tCLCL 4 tCLCL 5 tCLCL 6 tCLCL 7 tCLCL tMCS (4X/2X = 0 CD1:0 = 00) 1 tCLCL 2 tCLCL 4 tCLCL 6 tCLCL 8 tCLCL 10 tCLCL 12 tCLCL 14 tCLCL tMCS (4X/2X = X CD1:0 = 10) 2 tCLCL 4 tCLCL 8 tCLCL 12 tCLCL 16 tCLCL 20 tCLCL 24 tCLCL 28 tCLCL tMCS (4X/2X = X CD1:0 = 11) 2048 tCLCL 4096 tCLCL 8192 tCLCL 12,288 tCLCL 16,384 tCLCL 20,480 tCLCL 24,576 tCLCL 28,672 tCLCL *All internal MOVX operations execute at the 0 Stretch setting. **Default stretch setting for external MOVX operations following reset. EXTENDED STACK POINTER The DS80C390 supports both the traditional 8-bit and an extended 10-bit stack pointer that improves the performance of large programs written in high-level languages such as C. Enable the 10-bit stack pointer feature by setting the stack address mode bit, SA (ACON.2). The bit is cleared following a reset, forcing the device to use an 8-bit stack located in the scratchpad RAM area. When the SA bit is set, the device will address up to 1kB of stack memory in the first 1kB of the internal MOVX memory. The 10-bit stack pointer address is generated by concatenating the lower two bits of the extended stack pointer (ESP;9Bh) and the traditional 8051 stack pointer (SP;81h). The 10-bit stack pointer cannot be enabled when the 4kB of SRAM is mapped as both program and data memory. ENHANCED DUAL DATA POINTERS The DS80C390 contains two data pointers, DPTR0 and DPTR1, designed to improve performance in applications that require high data throughput. Incorporating a second data pointer allows the software to greatly speed up block data (MOVX) moves by using one data pointer as a source register and the other as the destination register. DPTR0 is located at the same address as the original 8051 data pointer, allowing the DS80C390 to execute standard 8051 code with no modifications. The second data pointer, DPTR1, is split between the DPH1 and DPL1 SFRs, similar to the DPTR0 configuration. The active data pointer is selected with the data pointer select bit SEL (DPS.0). Any instructions that reference the DPTR (i.e., MOVX A, @DPTR), will select DPTR0 if SEL = 0, and DPTR1 if SEL = 1. Because the bits adjacent to SEL are not implemented, the state of SEL (and thus the active data pointer) can be quickly toggled by the INC DPS instruction without disturbing other bits in the DPS register. Unlike the standard 8051, the DS80C390 has the ability to decrement as well as increment the data pointers without additional instructions. When the INC DPTR instruction is executed, the active DPTR increments or decrements according to the ID1, ID0 (DPS.7-6), and SEL (DPS.0) bits as shown. The inactive DPTR is not affected. Table 10. Data Pointer Auto Increment/ Decrement Configuration ID1 X X 0 1 ID0 0 1 X X SEL 0 0 1 1 INC DPTR RESULT Increment DPTR0 Decrement DPTR0 Increment DPTR1 Decrement DPTR1 Another useful feature of the device is its ability to automatically switch the active data pointer after a DPTR-based instruction is executed. This feature can greatly reduce the software overhead associated with data memory block moves, which toggle between the source and destination registers. When the toggle-select bit (TSL;DPS.5) is set to 1, the SEL bit (DPS.0) is automatically toggled every time one of the following DPTR-related instructions is executed. 37 of 52 DS80C390 Dual CAN High-Speed Microprocessor INC DPTR MOV DPTR, #data16 MOVC A, @A+DPTR MOVX A, @DPTR MOVX @DPTR, A As a brief example, if TSL is set to 1, then both data pointers can be updated with two INC DPTR instructions. Assume that SEL = 0, making DPTR the active data pointer. The first INC DPTR increments DPTR and toggles SEL to 1. The second instruction increments DPTR1 and toggles SEL back to 0. INC DPTR INC DPTR CLOCK CONTROL AND POWER MANAGEMENT The DS80C390 includes a number of unique features that allow flexibility in selecting system clock sources and operating frequencies. To support the use of inexpensive crystals while allowing full speed operation, a clock multiplier is included in the processor’s clock circuit. Also, in addition to the standard 80C32 idle and power-down (Stop) modes, the DS80C390 provides a new power management mode. This mode allows the processor to continue instruction execution, yet at a very low speed to significantly reduce power consumption (below even idle mode). The DS80C390 also features several enhancements to stop mode that make this extremely low-power mode more useful. Each of these features is discussed in detail below. System Clock Control As mentioned previously, the microcontroller contains special clock-control circuitry that simultaneously provides maximum timing flexibility and maximum availability and economy in crystal selection. The logical operation of the system clock-divide control function is shown in Figure 29. A 3:1 multiplexer, controlled by CD1, CD0 (PMR.7-6), selects one of three sources for the internal system clock:    Crystal oscillator or external clock source (Crystal oscillator or external clock source) divided by 256 (Crystal oscillator or external clock source) frequency multiplied by 2 or 4 times Figure 29. System Clock Control Diagram The system clock-control circuitry generates two clock signals that are used by the microcontroller. The internal system clock provides the time base for timers and internal peripherals. The system clock is run through a divideby-4 circuit to generate the machine cycle clock that provides the time base for CPU operations. All instructions execute in one to five machine cycles. It is important to note the distinction between these two clock signals, as they are sometimes confused, creating errors in timing calculations. Setting CD1, CD0 to 0 enables the frequency multiplier, either doubling or quadrupling the frequency of the crystal oscillator or external clock source. The 4X/2X bit controls the multiplying factor, selecting twice or four times the frequency when set to 0 or 1, respectively. Enabling the frequency multiplier results in apparent instruction 38 of 52 DS80C390 Dual CAN High-Speed Microprocessor execution speeds of 2 or 1 clocks. Regardless of the configuration of the frequency multiplier, the system clock of the microcontroller can never be operated faster than 40MHz. This means that the maximum crystal oscillator or external clock source is 10MHz when using the 4X setting, and 20MHz when using the 2X setting. The primary advantage of the clock multiplier is that it allows the microcontroller to use slower crystals to achieve the same performance level. This reduces EMI and cost, as slower crystals are generally more available and thus less expensive. Table 11. System Clock Configuration CD1 CD0 4X/2X FUNCTION CLOCKS PER MACHINE CYCLE 0 0 0 1 1 0 0 1 0 1 0 1 N/A N/A N/A Frequency Multiplier (2X) Frequency Multiplier (4X) Reserved Divide-by-4 (Default) Power Management Mode 2 1 — 4 1024 MAX EXTERNAL FREQUENCY (MHz) 20 10 — 40 40 The system clock and machine cycle rate changes one machine cycle after the instruction changing the control bits. Note that the change affects all aspects of system operation, including timers and baud rates. The use of the switchback feature, described later, can eliminate many of the problems associated with the PMM. Changing the System Clock/Machine Cycle Clock Frequency The microcontroller incorporates a special locking sequence to ensure “glitch-free” switching of the internal clock signals. All changes to the CD1, CD0 bits must pass through the 10 (divide-by-4) state. For example, to change from 00 (frequency multiplier) to 11 (PMM), the software must change the bits in the following sequence: 00 ≥ 10 ≥ 11. Attempts to switch between invalid states will fail, leaving the CD1, CD0 bits unchanged. The following sequence must be followed when switching to the frequency multiplier as the internal time source. This sequence can only be performed when the device is in divide-by-4 operation. The steps must be followed in this order, although it is possible to have other instructions between them. Any deviation from this order will cause the CD1, CD0 bits to remain unchanged. Switching from frequency multiplier to non-multiplier mode requires no steps other than the changing of the CD1, CD0 bits. 1) 2) 3) 4) 5) Ensure that the CD1, CD0 bits are set to 10, and the RGMD (EXIF.2) bit = 0. Clear the CTM (Crystal Multiplier Enable) bit. Set the 4X/2X bit to the appropriate state. Set the CTM (crystal multiplier enable) bit. Poll the CKRDY bit (EXIF.4), waiting until it is set to 1. This will take approximately 65,536 cycles of the external crystal or clock source. 6) Set CD1, CD0 to 00. The frequency multiplier is engaged on the machine cycle following the write to these bits. OSCILLATOR-FAIL DETECT The microprocessor contains a safety mechanism called an on-chip oscillator-fail-detect circuit. When enabled, this circuit causes the processor to be held in reset if the oscillator frequency falls below 40kHz. In operation, this circuit complements the watchdog timer. Normally, the watchdog timer is initialized so that it times out and causes a processor reset in the event that the processor loses control. In the event of a crystal or external oscillator failure, however, the watchdog timer does not function and there is the potential for the processor to fail in an uncontrolled state. The use of the oscillator-fail-detect circuit forces the processor to a known state (i.e., reset) even if the oscillator stops. The oscillator-fail-detect circuitry is enabled when software sets the enable bit OFDE (PCON.4) to 1. Please note that software must use a timed-access procedure (described later) to write this bit. The OFDF (PCON.5) bit also sets to 1 when the circuitry detects an oscillator failure, and the processor is forced into a reset state. This bit can only be cleared to 0 by a power-fail reset or by software. The oscillator-fail-detect circuitry is not activated when the oscillator is stopped due to the processor entering stop mode. 39 of 52 DS80C390 Dual CAN High-Speed Microprocessor POWER MANAGEMENT MODE (PMM) AND SWITCHBACK Power consumption in PMM is less than in idle mode, and approximately one quarter of that consumed in divideby-four mode. While PMM and Idle modes leave the power-hungry internal timers running, PMM runs all clocked functions such as timers at the rate of crystal divided by 1024, rather than crystal divided by 4. Even though instruction execution continues in PMM (albeit at a reduced speed), it still consumes less power than idle mode. As a result there is little reason to use idle mode in new designs. When enabled, the switchback feature allows serial ports and interrupts to automatically switch back from divide by 1024 (PMM) to divide-by-4 (standard speed) operation. This feature makes it very convenient to use the PMM in real-time applications. Software can simply set the CD1 and CD0 clock control bits to the 4 clocks-per-cycle mode to exit PMM. However, the microcontroller provides hardware alternatives for automatic Switchback to standard speed (divide-by-4) operation. Setting the SFR bit SWB (PMR.5) to 1 enables the switchback feature. Once it is enabled, and when PMM is selected, two possible events can cause an automatic switchback to divide-by-4 mode. First, if an interrupt occurs and is acknowledged, the system clock reverts from PMM to divide-by-4 mode. For example, if INT0 is enabled and the CPU is not servicing a higher priority interrupt, then switchback occurs on INT0. However, if INT0 is not enabled or the CPU is servicing a higher priority interrupt, then activity on INT0 does not cause switchback to occur. A switchback can also occur when an enabled UART detects the start bit indicating the beginning of an incoming serial character or when the SBUF register is loaded initiating a serial transmission. Note that a serial character’s start bit does not generate an interrupt. The interrupt occurs only on reception of a complete serial word. The automatic switchback on detection of a start bit allows timer hardware to return to divide-by-4 operation (and the correct baud rate) in time for a proper serial reception or transmission. So with switchback enabled and a serial port enabled, the automatic switch to divide-by-4 operation occurs in time to receive or transmit a complete serial character as if nothing special had happened. STATUS The status register (STATUS;C5h) provides information about interrupt and serial port activity to assist in determining if it is possible to enter PMM. The microprocessor supports three levels of interrupt priority: power-fail, high, and low. The PIP (power-fail priority interrupt status; STATUS.7), HIP (high-priority interrupt status; STATUS.6), and LIP (low-priority interrupt status; STATUS.5) status bits, when set to logic 1, indicate the corresponding level is in service. Software should not rely on a lower-priority level interrupt source to remove PMM (switchback) when a higher level is in service. Check the current priority service level before entering PMM. If the current service level locks out a desired switchback source, then it would be advisable to wait until this condition clears before entering PMM. Alternately, software can prevent an undesired exit from PMM by intentionally entering a low priority interrupt service level before entering PMM. This will prevent other low priority interrupts from causing a switchback. Entering PMM during an ongoing serial port transmission or reception can corrupt the serial port activity. To prevent this, a hardware lockout feature ignores changes to the clock divisor bits while the serial ports are active. Serial port activity can be monitored via the serial port activity bits located in the status register. IDLE MODE Setting the IDLE bit (PCON.0) invokes the idle mode. Idle leaves internal clocks, serial ports, and timers running. Power consumption drops because memory is not being accessed and instructions are not being executed. Since clocks are running, the idle power consumption is a function of crystal frequency. It should be approximately onehalf of the operational power at a given frequency. The CPU can exit idle mode with any interrupt or a reset. Because PMM consumes less power than idle mode, as well as leaving timers and CPU operating, idle mode is no longer recommended for new designs, and is included for backward software compatibility only. 40 of 52 DS80C390 Dual CAN High-Speed Microprocessor STOP MODE Setting the STOP bit of the power control register (PCON.1) invokes stop mode. Stop mode is the lowest power state (besides power off) since it turns off all internal clocking. All processor operation ceases at the end of the instruction that sets the STOP bit. The CPU can exit stop mode via an external interrupt, if enabled, or a reset condition. Internally generated interrupts (timer, serial port, watchdog) cannot cause an exit from stop mode because internal clocks are not active in stop mode. BANDGAP SELECT The DS80C390 provides two enhancements to stop mode. As described below, the device provides a band-gap reference to determine power-fail interrupt and reset thresholds. The bandgap select bit, BGS (RCON.0), controls the bandgap reference. Setting BGS to 1 keeps the bandgap reference enabled during stop mode. The default or reset condition of the bit is logic 0, which disables the bandgap during stop mode. This bit has no control of the reference during full power, PMM, or idle modes. With the bandgap reference enabled, the power-fail reset and interrupt are valid means for leaving stop mode. This allows software to detect and compensate for a power-supply sag or brownout, even when in stop mode. In stop mode with the bandgap enabled, ICC is higher compared to with the bandgap disabled. If a user does not require a power-fail reset or interrupt while in stop mode, the bandgap can remain disabled. Only the most power-sensitive applications should disable the bandgap reference in stop mode, as this results in an uncontrolled power-down condition. RING OSCILLATOR The second enhancement to Stop mode reduces power consumption and allows the device to restart instantly when exiting stop mode. The ring oscillator is an internal clock that can optionally provide the clock source to the microcontroller when exiting stop mode in response to an interrupt. During stop mode the crystal oscillator is halted to maximize power savings. Typically, 4ms to 10ms is required for an external crystal to begin oscillating again once the device receives the exit stimulus. The ring oscillator, by contrast, is a free-running digital oscillator that has no startup delay. Setting the ring oscillator select bit, RGSL (EXIF.1), enables the ring oscillator feature. If enabled, the microcontroller uses the ring oscillator as the clock source to exit stop mode, resuming operation in less than 100ns. After 65,536 oscillations of the external clock source (not the ring oscillator), the device clears the ring-oscillator-mode bit, RGMD (EXIF.2), to indicate that the device has switched from the ring oscillator to the external clock source. The ring oscillator runs at approximately 10MHz but varies over temperature and voltage. As a result, no serial communication or precision timing should be attempted while running from the ring oscillator since the operating frequency is not precise. The default state exits stop mode without using the ring oscillator. 41 of 52 DS80C390 Dual CAN High-Speed Microprocessor TIMED-ACCESS PROTECTION Selected SFR bits are critical to operation, making it desirable to protect them against an accidental write operation. The timed-access procedure prevents an errant processor from accidentally altering bits that would seriously affect processor operation. The timed-access procedure requires that the write of a protected bit be immediately preceded by the following two instructions: MOV MOV 0C7h, #0AAh 0C7h, #55h Writing an AAh followed by a 55h to the timed-access register (location C7h) opens a three-cycle window that allows software to modify one of the protected bits. If the instruction that seeks to modify the protected bit is not immediately preceded by these instructions, the write is ignored. The protected bits are: WDCON.6 WDCON.3 WDCON.1 WDCON.0 RCON.0 ACON.2 ACON.1–0 MCON.7–6 MCON.5 MCON.3–0 C0C.3 C1C.3 P4CNT.6 P4CNT.5–0 P5CNT.2–0 COR.7 COR.6–5 COR.4–3 COR.2–1 COR.0 POR WDIF EWT RWT BGS SA AM1–AM0 IDM1–IDM0 CMA PDCE3–PDCE.0 CRST CRST SBCAN P5.7–P5.5 IRDACK C1BPR7–C1BPR6 C0BPR7–C0BPR6 COD1–COD0 CLKOE Power-On Reset Flag Watchdog Interrupt Flag Watchdog Reset Enable Reset Watchdog Timer Bandgap Select Stack Address Mode Address Mode Select bits Internal Memory Configuration and Location bits CAN Data Memory Assignment Program/Data Chip Enables CAN 0 Reset CAN 1 Reset Single Bus CAN Port 4 Pin Configuration Control Bits Configuration Control Bits IRDA Clock Output Enable CAN 1 Baud Rate Prescale Bits CAN 0 Baud Rate Prescale Bits CAN Clock Output Divide Bit 1 and Bit 0 CAN Clock Output Enable EMI REDUCTION One of the major contributors to radiated noise in an 8051-based system is the toggling of ALE. The microcontroller allows software to disable ALE when not used by setting the ALEOFF (PMR.2) bit to 1. When ALEOFF = 1, ALE automatically toggles during an off-chip MOVX. However, ALE remains static when performing on-chip memory access. The default state of ALEOFF is 0 so ALE normally toggles at a frequency of XTAL/4. PERIPHERAL OVERVIEW The DS80C390 provides several of the most commonly needed peripheral functions in microcomputer-based systems. New functions include a second serial port, power-fail reset, power-fail interrupt flag, and a programmable watchdog timer. In addition, the microcontroller contains two CAN modules for industrial communication applications. Each of these peripherals is described in the following paragraphs. More details are available in the High-Speed Microcontroller User’s Guide and the DS80C390 Supplement. SERIAL PORTS The microcontroller provides a serial port (UART) that is identical to the 80C52. In addition it includes a second hardware serial port that is a full duplicate of the standard one. This second port optionally uses pins P1.2 (RXD1) and P1.3 (TXD1). It has duplicate control functions included in new SFR locations. The second serial port can alternately be mapped to P5.2 and P5.3 to allow use of both serial ports in nonmultiplexed mode. Both ports can operate simultaneously but can be at different baud rates or even in different modes. The second serial port has similar control registers (SCON1, SBUF1) to the original. The new serial port can only use Timer 1 for baud-rate generation. 42 of 52 DS80C390 Dual CAN High-Speed Microprocessor The SCON0 register provides control for serial port 0 while its I/O buffer is SBUF0. The registers SCON1 and SBUF1 provide the same functions for the second serial port. A full description of the use and operation of both serial ports can be found in the High-Speed Microcontroller User’s Guide: DS80C390 Supplement. WATCHDOG TIMER The watchdog is a free-running, programmable timer that can set a flag, cause an interrupt, and/or reset the microcontroller if allowed to reach a preselected timeout. It can be restarted by software. A typical application uses the watchdog timer as a reset source to prevent software from losing control. The watchdog timer is initialized, selecting the timeout period and enabling the reset and/or interrupt functions. After enabling the reset function, software must then restart the timer before its expiration or the hardware will reset the CPU. In this way, if the code execution goes awry and software does not reset the watchdog as scheduled, the processor is put in a known good state: reset. Software can select one of four timeout values as controlled by the WD1 and WD0 bits. Timeout values are precise since they are a function of the crystal frequency. When the watchdog times out, it sets the watchdog timer-reset flag (WTRF = WDCON.2), which generates a reset if enabled by the enable watchdog-timer reset (EWT = WDCON.1) bit. Both the enable watchdog-timer reset and the reset watchdog timer control bits are protected by timed-access circuitry. This prevents errant software from accidentally clearing or disabling the watchdog. The watchdog interrupt is useful for systems that do not require a reset circuit. It set the WDIF (watchdog interrupt) flag 512 clocks before setting the reset flag. Software can optionally enable this interrupt source, which is independent of the watchdog-reset function. The interrupt is commonly used during the debug process to determine where watchdog-reset commands must be located in the application software. The interrupt also can serve as a convenient time base generator or can wake up the processor from power-saving modes. The clock control (CKCON) and the watchdog control (WDCON) SFRs control the watchdog timer. CKCON.7 and CKCON.6 (WD1 and WD0, respectively) select the watchdog timeout period. Of course, the 4X/2X (PMR.3) and CD1:0 (PMR.7:6) system clock-control bits also affect the timeout period. Table 12 shows the timeout selection. Table 12. Watchdog Timeout Values WATCHDOG INTERRUPT TIMEOUT 4X/2X WATCHDOG RESET TIMEOUT CD1:0 WD1:0 = 00 WD1:0 = 01 WD1:0 = 10 WD1:0 = 11 WD1:0 = 00 WD1:0 = 01 WD1:0 = 10 WD1:0 = 11 1 0 x x x 00 00 01 10 11 15 2 16 2 17 2 17 2 25 2 18 2 19 2 20 2 20 2 28 2 21 2 22 2 23 2 23 2 31 2 24 2 25 2 26 2 26 2 34 2 15 2 +512 16 2 +512 17 2 +512 17 2 +512 25 2 +512 18 2 +512 19 2 +512 20 2 +512 20 2 +512 28 2 +512 21 2 +512 22 2 +512 23 2 +512 23 2 +512 31 2 +512 24 2 +512 25 2 +512 26 2 +512 26 2 +512 34 2 +512 Table 12 demonstrates that for a 33MHz crystal frequency, the watchdog timer can produce timeout periods from 17 26 3.97ms (2 x 1/33MHz) to over 2 seconds (2.034 = 2 x 1/33MHz) with the default setting of CD1:0 (=10). This wide variation in timeout periods allows very flexible system implementation. In a typical initialization, the user selects one of the possible counter values to determine the timeout. Once the counter chain has completed a full count, hardware sets the interrupt flag (WDIF = WDCON.3). Regardless of whether the software makes use of this flag, there are then 512 clocks left until the reset flag (WTRF = WDCON.2) is set. Software can enable (1) or disable (0) the reset using the enable watchdog-timer-reset (EWT = WDCON.1) bit. 43 of 52 DS80C390 Dual CAN High-Speed Microprocessor POWER-FAIL RESET The microcontroller incorporates an internal precision bandgap voltage reference and comparator circuit that provide a power-on and power-fail reset function. This circuit monitors the processor’s incoming power supply voltage (VCC), and holds the processor in reset while VCC is below the minimum voltage level. When power exceeds the reset threshold, a full power-on reset is performed. In this way, this internal voltage monitoring circuitry handles both power-up and power-down conditions without the need for additional external components. Once VCC has risen above VRST, the device automatically restarts the oscillator for the external crystal and counts 65,536 clock cycles before program execution begins at location 0000h. This helps the system maintain reliable operation by only permitting processor operation when the supply voltage is in a known good state. Software can determine that a power-on reset has occurred by checking the power-on reset flag (POR;WDCON.6). Software should clear the POR bit after reading it. POWER-FAIL INTERRUPT The bandgap voltage reference that sets a precise reset threshold also generates an optional early warning powerfail interrupt (PFI). When enabled by software, the processor vectors to ROM address 0033h if VCC drops below VPFW . PFI has the highest priority. The PFI enable is in the watchdog control SFR (EPFI;WDCON.5). Setting this bit to logic 1 enables the PFI. Application software can also read the PFI flag at WDCON.4. A PFI condition sets this bit to 1. The flag is independent of the interrupt enable and must be cleared by software. EXTERNAL RESET PINS The DS80C390 has reset input (RST) and reset output (RSTOL) pins. The RSTOL pin supplies an active-low reset when the microprocessor is issued a reset from either a high on the RST pin, a timeout of the watchdog timer, a crystal oscillator fail, or an internally detected power fail. The timing of the RSTOL pin is dependent on the source of the reset. RSTOL DURATION RESET TYPE/SOURCE Power-On Reset External Reset Power Fail Watchdog Timer Reset Oscillator-Fail Detect 65,536 tCLCL (as described in Power Cycle Timing Characteristics)