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MAX5717/MAX5719
General Description
The MAX5717 and MAX5719 are serial-input, unbuffered
16 and 20-bit voltage-output unipolar digital-to-analog
converters (DACs) with integrated feedback resistors
that allow bipolar operation when used with an external
operational amplifier. These DACs provide low glitch
energy, low noise, tight bipolar resistor matching, and high
accuracy. The DACs feature 1LSB INL (max, MAX5717A)
over the temperature range of -40°C to +105°C. Integrated
precision setting resistors make the DACs easy to use.
The MAX5717 and MAX5719 feature a 50MHz, 3-wire
SPI™, QSPI™, MICROWIRE™, and DSP-compatible
serial interface.
On power-up, the output resets to zero-scale, providing
additional safety for applications which drive valves or
other transducers that need to be off on power-up. The
DAC output settles in 750ns and has a low offset and
gain drift of ±0.1 ppm/°C of FSR.
The MAX5717 is functionally similar to the MAX542,
but with significantly faster settling time. The MAX5719
provides a similar speed improvement as well as an
increase in resolution to 20 bits.
16 and 20-Bit Voltage DACs
Benefits and Features
●● 16 and 20-bit Resolution
●● 1LSB INL (Max, 16-bit)
●● ±0.5 LSB DNL (Max, MAX5717A)
●● 750ns Settling Time (Typ)
●● 0.05 nV-sec Glitch Energy
●● 6 nv/√Hz Output Noise Density
●● Integrated ±0.025% (max) Bipolar Setting Resistors
●● 4.5V to 5.5V Supply Range
●● 4.0V to VDD Reference Input Range
●● Safe Power-Up Reset-to-Zero-Scale DAC Output
(Unipolar)
●● 50MHz 3-Wire SPI Interface
●● -40°C to +105°C Operating Temperature Range.
●● SO-14 Package
Simplified Block Diagram
VDD
Applications
●●
●●
●●
●●
●●
●●
●●
●●
●●
Test and Measurement Equipment
Automatic Test Equipment
Gain and Offset Adjustment
Data-Acquisition Systems
Process Control and Servo Loops
Portable Instrumentation
Programmable Voltage and Current sources
Automatic Tuning
Communication Systems
MAX5717/
MAX5719
REFF
RFB
RINV
16-/20-BIT DAC
REFS
CS
LDAC
SCLK
DIN
16-/20-BIT DATA LATCH
CONTROL
LOGIC
SERIAL INPUT REGISTER
DGND
Ordering Information appears at end of data sheet.
19-8567; Rev 2; 7/19
RFB
INV
OUT
AGNDF
AGNDS
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Absolute Maximum Ratings
VDD to DGND...........................................................-0.3V to +6V
CS, SCLK, DIN, LDAC
to DGND........................ -0.3V to Lesser of VDD + 0.3 and 6V
REFF, REFS to AGND.........-0.3V to Lesser of VDD+0.3 and 6V
AGNDF, AGNDS to DGND....................................-0.3V to +0.3V
OUT, INV, to AGND,
DGND...............................-0.3V to Lesser of VDD+0.3 and 6V
RFB to AGND, DGND.................................................-6V to +6V
Maximum Current into Any Pin..................... -100mA to +100mA
Continuous Power Dissipation
(TA = +70°C, derate 8.33mW/°C above +70°C.)..........667mW
Operating Temperature Range.......................... -40°C to +105°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................... 300°C
Soldering Temperature (reflow)........................................ +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
Thermal Resistance, Single-Layer Board
Junction-to-Ambient (θJA)..........................................120°C/W
Junction-to-Case Thermal Resistance (θJC)................37°C/W
Thermal Resistance, Four-Layer Board
Junction-to-Ambient (θJA)............................................84°C/W
Junction-to-Case Thermal Resistance (θJC)................34°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermaltutorial.
Electrical Characteristics
(VDD = 4.5V to 5.5V, AGND, DGND, AGNDF, AGNDS = 0V, VREF = VREFF = VREFS = 4.096V, LDAC = 0V, CL=10pF, RL= No Load,
TA = -40°C to +105°C, unless otherwise noted. Typical values are at TA = 25°C and VDD = 5V.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE – ANALOG
Resolution
Integral Nonlinearity
Differential Nonlinearity
N
INL
MAX5717
16
MAX5719
20
MAX5717. Measured by a line passing
through DIN = 0 and (216 – 1).
-4
±0.25
+4
LSB
(16-bit)
MAX5717A. Measured by a line passing
through DIN = 0 and (216 - 1).
-1
±0.25
+1
LSB
(16-bit)
-64.0
±1
+64.0
LSB
(20-bit)
MAX5719A. Measured by a line passing
through DIN = 0 and (220 - 1).
-20
±1
+20
LSB
(20-bit)
MAX5717
-0.5
±0.125
+0.5
LSB
(16-bit)
MAX5719
-2.0
±1
+2.0
LSB
(20-bit)
Code = 0, MAX5717
-2
±0.125
+2
LSB
(16-bit)
Code = 0, MAX5719
-32
±2
+32
LSB
(20-bit)
MAX5719. Measured by a line passing
through DIN = 0 and (220 – 1).
Bits
DNL
Zero-Code Offset Error
Zero-Code Temperature
Coefficient
Gain Error
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±0.2
Code = full scale
-0.003
µV/°C
+0.003
%
Maxim Integrated │ 2
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Electrical Characteristics (continued)
(VDD = 4.5V to 5.5V, AGND, DGND, AGNDF, AGNDS = 0V, VREF = VREFF = VREFS = 4.096V, LDAC = 0V, CL=10pF, RL= No Load,
TA = -40°C to +105°C, unless otherwise noted. Typical values are at TA = 25°C and VDD = 5V.)
PARAMETER
SYMBOL
CONDITIONS
MIN
Gain Error Temperature
Coefficient
MAX
±0.1
Output Voltage Range
Output Resistance
TYP
No load
AGND
ROUT
Bipolar Resistor Ratio
RFB/RINV
Bipolar Resistor Ratio Error
RFB/RINV - 1
UNITS
ppm/°C
VREF
V
2
kΩ
1
Ω/Ω
-0.025
+0.025
%
MAX5717
±5
LSB
(16-bit)
MAX5719
±80
LSB
(20-bit)
±4
µV/°C
Bipolar Zero Offset Error
Bipolar Zero Temperature
Coefficient
REFERENCE INPUT
Reference Input Voltage
Range
Reference Input Resistance
4
RREF
2
3.9
VDD
V
6
kΩ
Code = 0
75
Code = full scale
120
CL = 10pF
100
To ±1.0 LSB of FS step (16-bit), ±16 LSB
(20-bit) from CS low to high, CL = 10pF.
1.5
To ±1.0 LSB of FS step (16-bit), ±16 LSB
(20-bit) from LDAC high to low, CL = 10pF.
0.75
DAC Glitch Impulse
Worst-case transition
0.05
nV-s
Digital Feedthrough
Code = 0000h; CS = VDD, LDAC = 0;
SCLK, DIN = 0 to VDD levels.
1.0
nV-s
Output Voltage Spectral
Noise Density
fSW = 1kHz, code = midscale
6
nV/
(Hz)1/2
Output Voltage Noise LF
0.1Hz to 10Hz
1
µVp-p
Reference Input Capacitance
pF
DYNAMIC PERFORMANCE - ANALOG
Voltage Output Slew-Rate
Settling Time
SR
V/µs
µs
DYNAMIC PERFORMANCE - REFERENCE INPUT
Reference -3 dB Bandwidth
Code = 3FFFFh
1
MHz
Reference Feedthrough
Code = 0000h, Ref = 100mVp-p at 100kHz
1
mV p-p
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Maxim Integrated │ 3
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Electrical Characteristics (continued)
(VDD = 4.5V to 5.5V, AGND, DGND, AGNDF, AGNDS = 0V, VREF = VREFF = VREFS = 4.096V, LDAC = 0V, CL=10pF, RL= No Load,
TA = -40°C to +105°C, unless otherwise noted. Typical values are at TA = 25°C and VDD = 5V.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
5.5
V
1050
µA
POWER SUPPLY REQUIREMENTS
Positive Supply Voltage
VDD
Supply Current
IDD
4.5
750
DIN = SCLK = CS = LDAC = VDD
When updating DAC, fSCLK = 50MHz
7
mA
DIGITAL INPUTS
Input High Voltage
VIH
Input Low Voltage
VIL
0.7
VDD
0.3
Input Hysteresis
150
Input Current
IIN
Input Capacitance
CIN
-1
±0.1
VDD
mV
+1
10
µA
pF
TIMING CHARACTERISTICS
Serial Clock Frequency
0
fSCLK
SCLK Period
50
MHz
20
ns
SCLK Pulse-Width High
tCH
40% duty cycle.
8
ns
SCLK Pulse-Width Low
tCL
40% duty cycle.
8
ns
CS Fall to SCLK Rise Setup
Time
tCSSO
To first SCLK rising edge
8
ns
CS Fall to SCLK Rise Hold
Time
tCSH0
Applies to inactive RE preceding 1st RE
0
ns
CS Rise to SCLK Rise Hold
Time
tCSH1
Applies to 24th rising edge (MAX5719) or
16th rising edge (MAX5717).
8
ns
DIN to SCLK Rise Setup
Time
tDS
5
ns
DIN to SCLK Rise Hold Time
tDH
4.5
ns
CS Pulse-Width High
tCSPW
20
ns
LDAC Pulse Width
tLDPW
20
ns
tLDH
20
ns
CS High to LDAC Setup Time
Last Active Clock Edge to
Ready for DAC Output Update
1210
1500
ns
Note 1: Limits are 100% tested at TA = 25°C. Limits over the operating temperature range and relevant supply voltage range are
guaranteed by design and characterization.
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Maxim Integrated │ 4
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Typical Operating Characteristics
VDD = 5V, VREF = 4.096V, TA = 25°C unless otherwise noted.
SUPPLY CURRENT
vs. TEMPERATURE
SUPPLY CURRENT
vs. REFERENCE VOLTAGE
toc1
0.6
0.5
0.7
0.6
0.5
0.4
0.4
-60 -40 -20
0
20
40
60
80
4
100 120
4.2
TEMPERATURE (°C)
4.8
0
-0.05
-0.1
5
-60 -40 -20
80
100 120
toc4b
10.0
MIN INL (LSB)
MIN INL (LSB)
5.0
INL (LSB)
INL (LSB)
60
MAX INL (LSB)
0.5
0.6
40
15.0
MAX INL (LSB)
1.0
0.9
20
INL vs. TEMPERATURE
(MAX5719)
toc4a
2.0
1.5
0
TEMPERATURE (°C)
INL vs. TEMPERATURE
(MAX5717)
toc3b
1.2
0.0
-0.5
0.0
-5.0
-1.0
0.3
-10.0
-1.5
-2.0
0
-60 -40 -20
0
20
40
60
80
-15.0
-60
100 120
-40
-20
0
20
40
60
80
-60
100 120
DNL vs. TEMPERATURE
(MAX5717)
GAIN ERROR (LSB)
DNL (LSB)
-0.4
0.0
0
20
40
60
TEMPERATURE (oC)
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80
100 120
80
100 120
toc6a
0.05
0
-0.05
-1.0
-0.1
-1.5
-0.15
-2.0
-20
60
0.1
0.5
-0.5
-0.2
40
0.15
MIN DNL (LSB)
1.0
0.0
20
0.2
MAX DNL (LSB)
1.5
MIN DNL (LSB)
0.2
0
GAIN ERROR
vs. TEMPERATURE (MAX5717)
toc5b
2.0
MAX DNL (LSB)
-40
-20
TEMPERATURE (oC)
DNL vs. TEMPERATURE
(MAX5719)
toc5a
0.4
-60
-40
TEMPERATURE (oC)
TEMPERATURE (°C)
DNL (LSB)
4.6
0.05
REFERENCE VOLTAGE (V)
ZERO-CODE OFFSET ERROR
vs. TEMPERATURE (MAX5719)
ZERO-CODE OFFSET ERROR (LSB)
4.4
toc3a
0.1
ZERO-CODE OFFSET ERROR (LSB)
0.7
toc2
0.8
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
0.8
ZERO-CODE OFFSET ERROR
vs. TEMPERATURE (MAX5717)
-60
-40
-20
0
20
40
60
TEMPERATURE (oC)
80
100 120
-0.2
-60 -40 -20
0
20
40
60
80
100 120
TEMPERATURE (°C)
Maxim Integrated │ 5
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Typical Operating Characteristics (continued)
VDD = 5V, VREF = 4.096V, TA = 25°C unless otherwise noted.
INL vs. CODE
(MAX5717)
GAIN ERROR
vs. TEMPERATURE (MAX5719)
toc6b
3
toc7a
0.40
2
0.30
0.20
0
INL (LSB)
GAIN ERROR (LSB)
1
-1
-2
0.10
0.00
-3
-0.10
-4
-0.20
-5
-60 -40 -20
0
20
40
60
80
0k
100 120
10k
20k
INL vs. CODE
(MAX5719)
40k
50k
60k
DNL vs. CODE
(MAX5717)
toc7b
5.00
toc8a
0.10
0.08
4.00
0.06
0.04
DNL (LSB)
3.00
INL (LSB)
30k
DAC CODE
TEMPERATURE (°C)
2.00
1.00
0.02
0.00
-0.02
-0.04
-0.06
0.00
-0.08
-1.00
0k
200k
400k
600k
800k
-0.10
1000k
0k
10k
DAC CODE
20k
30k
40k
50k
60k
DAC CODE
DNL vs. CODE
(MAX5719)
toc8b
2.00
1.50
DNL (LSB)
1.00
0.50
0.00
-0.50
-1.00
-1.50
-2.00
0k
200k
400k
600k
800k
1000k
DAC CODE
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Maxim Integrated │ 6
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Typical Operating Characteristics (continued)
VDD = 5V, VREF = 4.096V, TA = 25°C unless otherwise noted.
FULL-SCALE STEP RESPONSE
(MAX5719)
REFERENCE CURRENT vs. CODE
toc9
REFERENCE CURRENT (uA)
1200.0
toc10
MAX5717
MAX5719
CL = 10pF
RL = 10MΩ
1000.0
OUT
1V/div
800.0
600.0
400.0
200.0
0
1/4
1/2
3/4
1
200ns/div
DAC CODE (FS)
FULL-SCALE STEP RESPONSE
(MAX5717)
MAJOR CARRY OUTPUT GLITCH
(MAX5719)
toc11
toc12
CL = 10pF
RL = 10MΩ
LDACB
5V/div
OUT
(ACCOUPLED,
1mV/div)
OUT
1V/div
200ns/div
40ns/div
DIGITAL FEEDTHROUGH
(MAX5719)
toc13
SCLK
2V/div
OUT
ACCOUPLED,
1mV/div
100ns/div
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Maxim Integrated │ 7
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Pin Configuration
RFB
1
14
VDD
OUT
2
13
INV
AGNDF
3
12
DGND
AGNDS
4
11
LDAC
REFS
5
10
DIN
REFF
6
9
NC
CS
7
8
SCLK
MAX5717/
MAX5719
Pin Description
PIN
NAME
FUNCTION
TYPE
1
RFB
Feedback Resistor. Connect to external op amp’s output in bipolar mode.
Analog
2
OUT
DAC Voltage Output
Analog
3
AGNDF
Analog Ground (Force)
Analog
4
AGNDS
Analog Ground (Sense)
Analog
5
REFS
Reference Input (Sense). Connect to external 4.096V reference sense.
Analog
6
REFF
Reference Input (Force). Connect to external +4.096V reference force output.
Analog
7
CS
Active-Low Chip-Select Input
Digital
Serial Clock Input. Rising edge triggered. Duty cycle must between 40% and 60%.
Digital
8
SCLK
9
NC
Not Connected
10
DIN
SPI Bus Serial Data Input
Digital
11
LDAC
LDAC Input. A falling edge updates the internal DAC latch.
Digital
12
DGND
Digital Ground
Power
13
INV
Junction of Internal Resistors. Connect to the inverting input of the external op amp
in bipolar mode.
Analog
14
VDD
Power Supply Input. Connect to a 5V supply.
Power
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Maxim Integrated │ 8
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Detailed Description
The digital interface is based on a 3-wire standard that is
compatible with SPI, QSPI, and MICROWIRE interfaces.
The three digital inputs (CS, DIN, and SCLK) load the
digital input data serially into the DAC. LDAC updates
the DAC output asynchronously. All of the digital inputs
include Schmitt-trigger buffers to accept slow-transition
interfaces. This means that optocouplers can interface
directly to the DACs without additional external logic. The
digital inputs are compatible with CMOS-logic levels.
The MAX5717 and MAX5719 are serial-input, unbuffered
voltage output unipolar/bipolar digital-to-analog converters
(DACs). These DACs provide low glitch energy, low noise,
tight bipolar resistor matching, and high accuracy. The
DACs feature 1LSB INL (max, MAX5717A) accuracy and
are guaranteed monotonic over the temperature range of
-40°C to +105°C. The offset and gai,n drift are low: ±0.1
ppm /°C of FSR. Integrated precision setting resistors
make the DACs easy to use in bipolar-output configurations.
SPI Interface
The low-resistance DAC resistor network provides two
important advantages over DACs that have higherresistance networks. First, the DAC's thermal noise,
which is proportional to the square root of resistance,
is lower than for higher-resistance DACs. Second, the
DAC's settling time, which is directly proportional to the
resistance, is lower than for other DACs. The DAC output
settles in 750nS.
16-Bit Interface (MAX5717)
The 16-Bit Serial Interface Timing Diagram shows the
operation of the SPI interface. SCLK rising edges clock
in the data on the DIN input. The CS low interval frames
the 16-cycle SPI instruction. Qualified operations will
be executed in response to the rising edge of CS.
Operations consisting of less than 16 SCLK cycles will
not be executed. Operations consisting of more than 16
SCLK cycles will be executed using the first two bytes of
data available. In order to abort a command sequence,
the rise of CS must precede the 16th rising edge of SCLK.
LDAC allows the DACD latch to update asynchronously,
by pulling LDAC low after CS goes high. Hold LDAC high
during the data loading sequence.
On power-up, the output resets to zero-scale (unipolar
mode) providing additional safety for applications which
drive valves or other transducers that need to be off
on power-up. The MAX5717 and MAX5719 feature a
50MHz 3-wire SPI™, QSPI™, MICROWIRE™, and DSPcompatible serial interface.
Digital Inputs and Interface Logic
Table 1. 16-Bit SPI Data Register
CLOCK EDGE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
DAC Register
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
DAC Data
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
LSB
MSB
X
DIN
LSB
D15
D14
D13
D12
tDH
SCLK
1
tCSH0
2
tCSS0
D11
D10
tDS
3
X
D0
tCP
4
tCL
5
6
16
tCH
tCSH1
CS
tCSPW
tLDH
LDAC
tLDPW
Figure 1. 16-Bit Serial Interface Timing Diagram
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Maxim Integrated │ 9
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
20-Bit Interface (MAX5719)
Throughput Rate
The 20-Bit Serial Interface Timing Diagram shows the
operation of the SPI interface. SCLK rising edges clock
in the data on the DIN input. The CS low interval frames
the 24-cycle SPI instruction. Qualified operations will be
executed in response to the rising edge of CS. Operations
consisting of less than 24 SCLK cycles will not be executed.
Operations consisting of more than 24 SCLK cycles will
be executed using the first 20 bits of data available. In
order to abort a command sequence, the rise of CS must
precede the 24th rising edge of SCLK. LDAC allows the
DACD latch to update asynchronously, by pulling LDAC
low after CS goes high. Hold LDAC high during the data
loading sequence.
The throughput rate is dominated by the time required
to load the DAC data and the time required for the internal calibration circuitry to operate (referred to as "digital
latency"). At a 50MHz serial clock frequency, clocking the
DAC data into the input register requires 20ns times the
number of bits of resolution. Therefore, for a 20-bit DAC,
the data is clocked into the register in 400ns. The digital
latency is nominally 1210ns, with a maximum value of
1500ns. An additional 20ns is required for the CS minimum
pulse width, for a total throughput period of 1.92µs, as
shown in the figure below.
Table 2. 20-Bit SPI DAC Register Table
CLOCK
EDGE
1
DAC
Register
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
D23 D22 D21 D20 D19 D18 D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DAC Data
D19
D0
D18 D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1
X
MSB
LSB
MSB
X
DIN
D19
D18
1
tCSH0
X
X
LSB
D16
D17
tDH
SCLK
X
2
D14
D15
tDS
3
tCSS0
X
D0
X
X
tCP
4
tCH
5
6
tCL
20
21
22
23
24
tCSH1
CS
tCSPW
tLDH
LDAC
tLDPW
Figure 2. 20-Bit Serial Interface Timing Diagram
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Maxim Integrated │ 10
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
When the falling-edge of LDAC occurs after the digital
latency period, the DAC output begins to change on the
falling-edge of LDAC. When the falling-edge of LDAC
occurs before the end of the digital latency period, the
DAC output begins to change at the end of the digital
latency period. Settling time is approximately 750ns,
which means that the DAC will settle to value (N - 1) at
some point during the digital latency period for data (N).
The DAC will begin to settle to value (N) on either the next
falling-edge of LDAC (if LDAC goes low after the end of
the digital latency period) or at the end of the next digital
latency period (if LDAC goes low before the end of the
digital latency period).
Power-On Reset
The internal power-on reset circuit sets the DAC’s output
to 0V in unipolar mode and -VREF in bipolar mode when
VDD is first applied. This ensures that unexpected DAC
output voltages will not occur immediately following a
system power-up, such as after a loss of power.
LOAD DATA N
MSB
X
DIN
SCLK
D19
D18
1
D17
2
Reference And Analog Ground Inputs
Apply an external voltage reference between the 4.0V
and VDD to the reference inputs. The reference voltage
determines the DAC’s full-scale output voltage. Kelvin
connections are provided for optimum performance.
Since these converters are designed as inverted R-2R
voltage-mode DACs, the input resistance seen by the
voltage reference is code-dependent. The worst-case
input resistance variation is from 2KΩ to 15KΩ. The
maximum change in load current for a 4.096V reference
is approximately 2mA. Therefore, when using a voltage
reference with 10ppm/mA load regulation, the reference
voltage may change by around 20ppm across the full
range of input codes. Therefore, a buffer amplifier should
be used when the best INL performance is needed. In
addition, the impedance of the path must be kept low
because it contributes directly to the load regulation error.
If separate force and sense lines are not used, tie the
appropriate force and sense pins together, close to the
package.
LOAD DATA N+1
MSB
LSB
X
D0
3
Applications Information
20
420ns
X
X
21
D19
D18
1
24
2
DIGITAL LATENCY: 1500ns max
CS
20ns
20ns
LDAC
20ns
20ns
OUT
SETTLING TIME N-1
SETTLING TIME N
Figure 3. Throughput Timing (20-Bit Resolution Shown)
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Maxim Integrated │ 11
MAX5717/MAX5719
Use appropriate capacitor bypassing between the
reference inputs and ground. A 0.1µF ceramic capacitor
with short leads between REFF and AGNDF provides
high-frequency bypassing. A 10µF low-ESR tantalum,
film, or organic semiconductor capacitor works well for
low-frequency bypassing. The circuit can benefit from
even larger bypassing capacitors, depending on the
stability of the external reference with capacitive loading.
To maintain the excellent accuracy of these high-performance
DACs, the analog ground connection must be low impedance.
Connect AGNDF and AGNDS to a star ground very close
to the pins and with the lowest impedance possible. The
effect of ground trace resistance may be eliminated by
using a precision operational amplifier to drive AGNDF
and force AGNDS to ground. A voltage reference with
a ground sense pin can also be used to control the
DAC's reference voltage, provided that measurements
are referred to AGNDS.
As in all high-resolution, high-accuracy applications,
separate analog and digital ground planes yield the best
results. Tie DGND to AGND at the AGND pin to form the
“star” ground for the DAC system. Always refer remote
DAC loads to this system ground for the best possible
performance.
External Output Buffer Amplifier
The requirements on the external output buffer amplifier
change whether the DAC is used in the unipolar or bipolar
modes of operation. In unipolar mode, the output amplifier is
used in a voltage-follower configuration. In bipolar mode,
the amplifier operates with the internal scaling resistors
(see Typical Application Circuits). In each mode, the
DAC’s output impedance is constant and is independent
of input code; however, the output amplifier’s input impedance
should still be as high as possible to minimize gain errors.
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16 and 20-Bit Voltage DACs
The DAC’s output capacitance is also independent of
input code, thus simplifying stability requirements on the
external amplifier.
In bipolar mode, a precision amplifier operating with dual
power supplies (such as the MAX9632) provides the
±VREF output range. In single-supply applications, precision amplifiers with input common-mode ranges including
AGND are available. However, their output swings do
not normally include the negative rail (AGND) without
significant degradation of performance. A single-supply
amplifier may be suitable if the application does not use
codes near zero.
Since the LSBs for high-resolution DACs are extremely
small, pay close attention to the external amplifier’s input
specifications. The input offset voltage can degrade the
zero scale error and might require an output offset trim to
maintain full accuracy if the offset voltage is greater than
½ LSB. Similarly, the input bias current, multiplied by the
DAC output resistance (2KΩ, typ), contributes to the zeroscale error. Temperature drift of offset voltage and input
bias current must also be taken into account.
The settling time is affected by the buffer input capacitance,
the DAC’s output capacitance, and the PC board capacitance.
The typical DAC output voltage settling time to ±1ppm is
750ns for a full-scale step. Settling time can be significantly less for smaller step changes. Assuming a single
time constant exponential settling response, a full scale
step takes about 13.8 time constants to settle to within
±1ppm of the final output voltage. The time constant is
equal to the DAC output resistance multiplied by the total
output capacitance. Any additional output capacitance,
such as the buffer's input capacitance, will increase the
settling time.
Maxim Integrated │ 12
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
The external buffer amplifier’s gain-bandwidth product is
important because it increases the settling time by adding
another time constant to the output response. The
effective time constant of two cascaded systems, each
with a single time constant response, is approximately
the square root of the sum of the two time constants. The
DAC output’s time constant (due to internal resistance
and capacitance) is about 50ns, ignoring the effect of
additional capacitance. If the time constant of an external
amplifier with 10MHz bandwidth is
This suggests that the settling time to within ±1ppm of the
final output voltage, including the external buffer amplifier,
will be approximately
13.8 x 52.5ns = 724ns.
Unipolar Configuration
Figure 4 shows the MAX5717/MAX5719 configured for
unipolar operation with an external op amp. The op amp is
set for unity gain, and the tables below list the codes and
corresponding output voltages for this circuit when using
the 16-bit MAX5717 or the 20-bit MAX5719. At power-up,
the default output in unipolar mode is zero-scale.
1/(2π x 10MHz) = 15.9ns,
then the effective time constant of the combined system is:
[50ns2 + 15.9ns2 ] ½ ≈ 52.5ns
+5V
100nF
VDD
RFB
RFB
REFS
4.096V
INV
RINV
DAC
REFF
+5V
OUT
100nF
VOUT
AGNDF
-5V
AGNDS
CS
LDAC
SCLK
DIN
EXTERNAL OP-AMP
DATA LATCH
CONTROL
LOGIC
SERIAL INPUT REGISTER
DGND
Figure 4. MAX5717/MAX5719 in Unipolar Mode. The Internal Bipolar Setting Resistors are Not Used in Unipolar Mode. The Force
and Sense Pins for AGND and Reference Input May Be Used in This Mode, But Are Shown Connected Together in The Figure.
Table 3. MAX5717 Unipolar VOUT vs. DAC
Code
DAC LATCH CONTENTS
MSB
LSB
ANALOG OUTPUT, V OUT
Table 4. MAX5719 Unipolar VOUT vs. DAC
Code
DAC LATCH CONTENTS
MSB
LSB
ANALOG OUTPUT, V OUT
1111 1111 1111 1111
VREF x (65,535/65,536)
1111 1111 1111 1111 1111 xxxx VREF x (1,048,575/1,048,576)
1000 0000 0000 0000
VREF x (32,768/65,536) = ½ VREF
1000 0000 0000 0000 0000 xxxx VREF x (524,288/262,144) = ½ VREF
0000 0000 0000 0001
VREF x (1/65,536)
0000 0000 0000 0000
0V
0000 0000 0000 0000 0001 xxxx VREF x (1/1,048,576)
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0000 0000 0000 0000 0000 xxxx 0V
Maxim Integrated │ 13
MAX5717/MAX5719
Bipolar Configuration
The Typical Application Circuits show the DAC configured
for bipolar operation with an external op amp. Table 5 and
Table 6 list the offset binary codes for this circuit when
using the 16-bit MAX5717 and the 20-bit MAX5719. Ideal
values (ignoring offset and gain errors) are shown in the
tables. At power-up, the default output in bipolar mode is
negative full-scale (-VREF).
Power-Supply Bypassing and Ground
Management
16 and 20-Bit Voltage DACs
The best ground connection can be achieved by
connecting the DAC’s DGND and AGND pins together
and connecting that point to the system analog ground
plane. If the DAC’s DGND is connected to the system
digital ground, digital noise may get through to the DAC’s
analog portion.
Bypass VDD with a 0.1μF ceramic capacitor connected
between VDD and AGND. Mount it with short leads close
to the device. Ferrite beads can also be used to further
isolate the analog and digital power supplies.
For optimum system performance, use PC boards with
separate analog and digital ground planes. Wire-wrap
boards are not recommended. Connect the two ground
planes together at the low-impedance power-supply
source. Connect DGND and AGND together at the IC.
Table 6. MAX5719 Bipolar VOUT vs. DAC Code
Table 5. MAX5717 Bipolar VOUT vs. DAC Code
1000 0000 0000 0000 0001 xxxx +VREF x (1/524,288)
DAC LATCH CONTENTS
MSB
LSB
ANALOG OUTPUT, V OUT
1111 1111 1111 1111
+VREF x (32,767/32,768 )
1000 0000 0000 0001
+VREF x (1/32,768 )
1000 0000 0000 0000
0V
0111 1111 1111 1111
-VREF x ( 1/32,768 )
0000 0000 0000 0000
-VREF x ( 32,768/32,768 ) = -VREF
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DAC LATCH CONTENTS
MSB
LSB
ANALOG OUTPUT, V OUT
1111 1111 1111 1111 1111 xxxx +VREF x (524,287/524,288)
1000 0000 0000 0000 0000 xxxx 0V
0111 1111 1111 1111 1111 xxxx -VREF x (1/524,288)
0000 0000 0000 0000 0000 xxxx -VREF x (524,288/524,288) = -VREF
Maxim Integrated │ 14
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Typical Application Circuits
Simple Bipolar Output (Force and Sense Pins Connected Together Close to IC)
+5V
100nF
VDD
RFB
RFB
REFS
4.096V
RINV
DAC
REFF
OUT
100nF
CS
LDAC
SCLK
DIN
CONTROL
LOGIC
+5V
INV
-5V
AGNDF
AGNDS
DATA LATCH
VOUT
EXTERNAL OP-AMP
SERIAL INPUT REGISTER
DGND
Bipolar Output with Force and Sense Reference and Ground Connections Using Operational
Amplifiers
+5V
100nF
VDD
IN
+5V
MAX6133
OUT
-5V
1/2 MAX4163
GND
RFB
REFS
4.096V
REFF
+5V
INV
RINV
DAC
100nF
CS
LDAC
SCLK
DIN
RFB
OUT
AGNDF
DATA LATCH
CONTROL
LOGIC
SERIAL INPUT REGISTER
AGNDS
-5V
VOUT
EXTERNAL OP-AMP
+5V
-5V
1/2 MAX4163
DGND
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Maxim Integrated │ 15
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Typical Application Circuits (continued)
Bipolar Output Using Voltage Reference with Force and Sense on Output and Ground
+5V
100nF
VDD
IN
OUTS
OUTF
MAX6126
GND
4.096V
REFF
RFB
RFB
REFS
RINV
DAC
OUT
AGNDF
100nF
GNDS
CS
LDAC
SCLK
DIN
+5V
INV
-5V
VOUT
EXTERNAL OP-AMP
AGNDS
DATA LATCH
CONTROL
LOGIC
SERIAL INPUT REGISTER
DGND
Ordering Information
PART NUMBER
Package Information
TEMP RANGE
PIN-PACKAGE
MAX5717GSD+
-40°C to +105°C
14 SO
MAX5717GSD+T
-40°C to +105°C
14 SO
MAX5717AGSD+
-40°C to +105°C
14 SO
MAX5717AGSD+T
-40°C to +105°C
14 SO
MAX5719GSD+
-40°C to +105°C
14 SO
MAX5719GSD+T
-40°C to +105°C
14 SO
MAX5719AGSD+
-40°C to +105°C
14 SO
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE PACKAGE
TYPE
CODE
SOIC (N)
S14+4
OUTLINE
NUMBER
LAND
PATTERN NUMBER
21-0041
90-0112
MAX5719AGSD+T
-40°C to +105°C
14 SO
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape-and-reel.
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Maxim Integrated │ 16
MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Revision History
REVISION
NUMBER
REVISION
DATE
0
6/16
Initial release
1
1/17
Added MAX5717A and MAX5719A versions to data sheet
2
7/19
Updated Typical Application Circuit
DESCRIPTION
PAGES
CHANGED
—
1, 2, 9, 16
15
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Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
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