BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Product description
The BFP420 is a low noise device based on a grounded emitter (SIEGET™) that is part of
Infineon’s established fourth generation RF bipolar transistor family. Its transition
frequency fT of 25 GHz, high gain and low current characteristics make the device
suitable for oscillators up to 10 GHz. It remains cost competitive without compromising
on ease of use.
Feature list
•
•
•
Minimum noise figure NFmin = 1.1 dB at 1.8 GHz, 2 V, 5 mA
High gain Gms = 21 dB at 1.8 GHz, 2 V, 20 mA
OIP3 = 22 dBm at 1.8 GHz, 2 V, 20 mA
Product validation
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.
Potential applications
•
•
•
Radio-frequency oscillators
Broadband low noise amplifiers (LNAs) for CATV, DVB-T, DAB/DMB and FM/AM radio
LNAs for sub-1 GHz ISM band applications
Device information
Product name / Ordering code
Package
Pin configuration
BFP420 / BFP420H6327XTSA1
SOT343
1=B
2=E
3=C
4=E
Marking
Pieces / Reel
AMs
3000
BFP420 / BFP420H6433XTMA1
10000
Attention: ESD (Electrostatic discharge) sensitive device, observe handling precautions
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
Revision 2.0
2019-01-25
BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Table of contents
Table of contents
Product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
3.1
3.2
3.3
3.4
3.5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
General AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Frequency dependent AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Characteristic DC diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Characteristic AC diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4
Package information SOT343 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Datasheet
2
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Absolute maximum ratings
1
Absolute maximum ratings
Table 1
Absolute maximum ratings at TA = 25 °C (unless otherwise specified)
Parameter
Symbol
Values
Min.
Collector emitter voltage
VCEO
–
Unit
Note or test condition
V
Open base
Max.
4.5
4.1
TA = -55 °C, open base
Collector emitter voltage
VCES
15
E-B short circuited
Collector base voltage
VCBO
15
Open emitter
Emitter base voltage
VEBO
1.5
Open collector
Base current
IB
9
Collector current
IC
60
Total power dissipation 1)
Ptot
Junction temperature
TJ
Storage temperature
TStg
mA
–
210
mW
TS ≤ 98 °C
150
°C
–
-55
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Exceeding only one of these values may cause irreversible damage to the integrated
circuit.
1
TS is the soldering point temperature. TS is measured on the emitter lead at the soldering point of the PCB.
Datasheet
3
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Thermal characteristics
2
Thermal characteristics
Table 2
Thermal resistance
Parameter
Symbol
Junction - soldering point
RthJS
Values
Min.
Typ.
Max.
–
250
–
Unit
Note or test condition
K/W
–
260
240
220
200
180
Ptot[mW]
160
140
120
100
80
60
40
20
0
Figure 1
Datasheet
0
25
50
75
TS[°C]
100
125
150
Total power dissipation Ptot = f(TS)
4
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Thermal characteristics
RthJS
10 3
K/W
10 2
10 110 -7
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D=0
10 -6
10 -5
10 -4
10 -3
10 -2
10 -1 s 10 0
tp
Figure 2
Permissible pulse load RthJS = f(tp)
Ptotmax/PtotDC
10 1
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-
10 010 -7
10 -6
10 -5
10 -4
10 -3
10 -2
10 -1 s 10 0
tp
Figure 3
Datasheet
Permissible pulse load Ptot,max / Ptot,DC = f(tp)
5
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
3
Electrical characteristics
3.1
DC characteristics
Table 3
DC characteristics at TA = 25 °C
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or test condition
Collector emitter breakdown voltage
V(BR)CEO
4.5
5
–
V
IC = 1 mA, IB = 0,
open base
Collector emitter leakage current
ICES
–
–
10 2)
μA
VCE = 15 V, VBE = 0,
E-B short circuited
Collector base leakage current
ICBO
100 2) nA
VCB = 5 V, IE = 0,
open emitter
Emitter base leakage current
IEBO
3 2)
VEB = 0.5 V, IC = 0,
open collector
DC current gain
hFE
60
3.2
General AC characteristics
Table 4
General AC characteristics at TA = 25 °C
Parameter
Symbol
95
μA
130
Values
Min.
Typ.
Max.
VCE = 4 V, IC = 20 mA,
pulse measured
Unit
Note or test condition
Transition frequency
fT
18
25
–
GHz
VCE = 3 V, IC = 30 mA,
f = 2 GHz
Collector base capacitance
CCB
–
0.15
0.3
pF
VCB = 2 V, VBE = 0,
f = 1 MHz,
emitter grounded
Collector emitter capacitance
CCE
0.37
–
Emitter base capacitance
CEB
0.55
2
VCE = 2 V, VBE = 0,
f = 1 MHz,
base grounded
VEB = 0.5 V, VCB = 0,
f = 1 MHz,
collector grounded
Maximum values not limited by the device but by the short cycle time of the 100% test.
Datasheet
6
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
3.3
Frequency dependent AC characteristics
Measurement setup is a test fixture with Bias-T’s in a 50 Ω system, TA = 25 °C.
VC
Top View
Bias-T
OUT
C
E
VB
B
Bias-T
E
(Pin 1)
IN
Figure 4
Testing circuit
Table 5
AC characteristics, VCE = 2 V, f = 1.8 GHz
Parameter
Symbol
Values
Min.
Power gain
•
Maximum power gain
•
Transducer gain
Noise figure
•
Minimum noise figure
Gms
|S21|2
NFmin
–
14
–
Linearity
OIP3
•
3rd order intercept point at output
•
1 dB gain compression point at output OP1dB
Note:
Datasheet
Typ.
21
17
Unit
Max.
–
dB
1.1
22
12
Note or test condition
IC = 20 mA
IC = 5 mA
dBm
IC = 20 mA, ZS = ZL = 50 Ω
Gms = IS21 / S12I for k < 1; Gma = IS21 / S12I(k-(k2-1)1/2) for k > 1. In order to get the NFmin values stated in
this chapter, the test fixture losses have been subtracted from all measured results. OIP3 value
depends on termination of all intermodulation frequency components. Termination used for this
measurement is 50 Ω from 0.1 MHz to 6 GHz.
7
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
3.4
Characteristic DC diagrams
65
I B= 725µA
I B= 675µA
I = 625µA
B
I = 575µA
B
I B= 525µA
I B= 475µA
I B= 425µA
I B= 375µA
I B= 325µA
I B= 275µA
I = 225µA
60
55
50
45
IC[mA]
40
35
30
25
B
20
I B= 175µA
15
I B= 125µA
10
I B= 75µA
5
0
Figure 5
I B= 25µA
0
1
2
3
VCE[V]
4
5
6
Collector current vs. collector emitter voltage IC = f(VCE), IB = parameter
2
hFE
10
1
10
−1
10
0
1
10
10
2
10
IC[mA]
Figure 6
DC current gain hFE = f(IC), VCE = 3 V
Datasheet
8
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
2
10
1
10
0
10
IC[mA]
−1
10
−2
10
−3
10
−4
10
−5
10
0.5
0.6
0.7
0.8
0.9
1
VBE[V]
Figure 7
Collector current vs. base emitter forward voltage IC = f(VBE), VCE = 3 V
0
10
−1
10
−2
10
IB[mA]
−3
10
−4
10
−5
10
−6
10
−7
10
0.5
0.6
0.7
0.8
0.9
1
VBE[V]
Figure 8
Datasheet
Base current vs. base emitter forward voltage IB = f(VBE), VCE = 3 V
9
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
−6
10
−7
10
−8
IB[A]
10
−9
10
−10
10
−11
10
Figure 9
0.3
0.5
0.7
0.9
VEB[V]
1.1
1.3
1.5
Base current vs. base emitter reverse voltage IB = f(VEB), VCE = 3 V
8
C
7.5
B
VCER [V]
7
RBE
E
6.5
6
5.5
5
4
10
5
6
10
10
7
10
RBE [ Ω]
Figure 10
Datasheet
Collector emitter breakdown voltage VCER = f(RBE), IC = 1 mA
10
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
3.5
Characteristic AC diagrams
30
GHz
2 to 4
1.5
24
fT
1
20
0.75
16
12
0.5
8
4
00
5
10
15
20
25
30
mA
40
IC
Figure 11
Transition frequency fT = f(IC), f = 2 GHz, VCE = parameter
0.3
Ccb
pF
0.2
0.15
0.1
0.05
00
1
2
V
4
VCB
Figure 12
Datasheet
Collector base capacitance CCB = f(VCB), f = 1 MHz
11
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
44
40
36
32
G
ms
G [dB]
28
24
20
G
ma
16
|S |2
21
12
8
4
0
0
1
2
3
4
5
6
f [GHz]
Figure 13
Gain Gma, Gms, IS21I2 = f(f), VCE = 2 V, IC = 20 mA
30
dB
0.9
24
1.8
20
G
2.4
16
3
12
4
5
6
8
4
00
4
8
12
16
20
24
28
32
mA
40
IC
Figure 14
Datasheet
Maximum power gain Gmax = f(IC), VCE = 2 V, f = parameter in GHz
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
30
dB
0.9
G
24
1.8
20
2.4
16
3
4
12
5
6
8
4
00
0.5
1.0
1.5
2.0
2.5
3.0
3.5
V
4.5
VCE
Figure 15
Maximum power gain Gmax = f(VCE), IC = 20 mA, f = parameter in GHz
+j50
+j25
+j100
+j10
2.4GHz
1.8GHz
0.9GHz
3GHz
0
10
25
50
4GHz
5GHz
100
0.45GHz
5 mA
20 mA
-j10
6GHz
-j25
-j100
-j50
Figure 16
Datasheet
Source impedance for minimum noise figure ZS,opt = f(f), VCE = 2 V, IC = 5 / 20 mA
13
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
3
dB
F
2
1.5
1
IC = 20 mA
IC = 5 mA
0.5
0
0
1
2
3
GHz
4
6
f
Figure 17
Noise figure NFmin = f(f), VCE = 2 V, ZS = ZS,opt, IC = 5 / 20 mA
4.0
dB
F
3.0
2.0
f = 6 GHz
f = 5 GHz
f = 4 GHz
f = 3 GHz
f = 2.4 GHz
f = 1.8 GHz
f = 0.9 GHz
1.0
00
4
8
12
16
20
24
28
32
mA 38
IC
Figure 18
Datasheet
Noise figure NFmin = f(IC), VCE = 2 V, ZS = ZS,opt, f = parameter in GHz
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Electrical characteristics
3.0
F
dB
2.0
1.5
ZS = 50 Ohm
ZS = ZSopt
1.0
0.5
00
4
8
12
16
20
24
28
32 mA 36
IC
Figure 19
Note:
Datasheet
Noise figure NFmin = f(IC), ZS = ZS,opt, NF50 = f(IC), ZS = 50 Ω, VCE = 2 V, f = 1.8 GHz
The curves shown in this chapter have been generated using typical devices but shall not be
considered as a guarantee that all devices have identical characteristic curves. TA = 25 °C.
15
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Package information SOT343
0.9 ±0.1
Package information SOT343
1.25 ±0.1
0.15 -0.05
+0.10
A
0.1
0.1 MIN.
0.1
2.1 ±0.1
A
2
1
3x
+0.10
0.3 -0.05
0.6 -0.05
+0.10
1.3
2 ±0.2
0.1
3
4
0.15
0.2
0.1 MAX.
4
MOLD FLAS H, P ROTRUS ION OR GATE BURRS OF 0.2 MM MAXIMUM P ER S IDE ARE NOT INCLUDED
ALL DIMENS IONS ARE IN UNITS MM
THE DRAWING IS IN COMP LIANCE WITH IS O 128 & P ROJ ECTION METHOD 1 [
]
Figure 20
Package outline
Figure 21
Foot print
TYP E CODE
NOTE OF MANUFACTURER
MONTH
YEAR
Figure 22
Marking layout example
4
0.2
2.3
8
2
P IN 1
INDEX MARKING
2.15
ALL DIMENS IONS ARE IN UNITS MM
THE DRAWING IS IN COMP LIANCE WITH IS O 128 & P ROJ ECTION METHOD 1 [
Figure 23
Datasheet
1.1
]
Tape dimensions
16
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BFP420
Surface mount wideband silicon NPN RF bipolar transistor
Revision history
Revision history
Document
version
Date of
release
Description of changes
Revision 2.0
2019-01-25
New datasheet layout, typical DC curves added.
Datasheet
17
Revision 2.0
2019-01-25
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2019-01-25
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2019 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-ikw1524056005786
IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”) .
With respect to any examples, hints or any typical values
stated herein and/or any information regarding the
application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities of
any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
WARNINGS
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
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