FS05MR12A6MA1BBPSA1

AN-HPDPERF-ASSEMBLY Assembly Instructions for the HybridPACK™ Drive Performance About this document About this document This application note describes the recommended process for mounting the HybridPACK™ Drive Performance power modules which have silicon nitride ceramic (SIN) implemented for the internal isolation. The document is applicable to HybridPACK™ Drive Performance power module products, listed in the Chapter 1.1. Scope and purpose General information about the assembly process can be found under the application note AN-HPD-ASSEMBLY, which describe assembly processes of the HybridPACK™ Drive family. The HybridPACK™ Drive Performance power modules can be mounted with similar processes. This specific application (AN-HPDPERF-ASSEMBLY) describes one possible assembly process for the HybridPACK™ Drive Performance power modules, which showed during Infineon internal tests the best robustness performance. Intended audience Engineers and operators involved in the assembly of the HybridPACK™ Drive Performance power module into power electronics systems. Application note www.infineon.com Please read the sections "Important notice" and "Warnings" at the end of this document Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance Table of contents Table of contents About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1 1.1 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 HybridPACK™ Drive product list in scope of this application note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Recommended Mounting Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 3.1 3.2 3.3 3.4 3.4.1 3.4.2 3.5 PressFit Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Requirements for the PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 General hints for the PCB Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Press-In Tool with distance keeper for PCB external mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Press-In Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 PCB alignment before the press-in process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Press-in process description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PCB design for module external mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4 4.1 4.2 4.3 Power Module Cooling System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Reference Cooler Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Recommendation for the sealing ring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Cooling fluid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 5 5.1 5.1.1 5.2 5.3 5.4 Screw types and processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Baseplate Mounting Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Alternative: self-tapping screws for baseplate mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Fixation/clamping of the module during the baseplate screw process . . . . . . . . . . . . . . . . . . . . . . . 26 PCB mounting (module external) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Screw Orders (Baseplate and PCB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 6 6.1 6.1.1 6.2 Connecting to the Power Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Mounting Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Additional Information for Welding Processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Forces on Power Tabs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7 System Assembly Clearance & Creepage Distances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 8 Traceability, Data Matrix and Part Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 9 9.1 9.2 Technical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Basic Explanation Coordinate System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Pin Position and Pin Gauge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 10 Storage and Transport . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 11 11.1 11.2 Power Module Appearance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Pin Rotation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Module Lid to PCB Distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Application note 2 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance Table of contents 11.3 11.4 Power Tab Tin Plating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Baseplate Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 12 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Application note 3 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 1 General Information 1 General Information The HybridPACK™ Drive power module family is designed to meet the high volume production, high robustness, high power density, and low cost requirements of the automotive market. Different product derivatives with for example different power tab sizes and different baseplates are available within the HybridPACK™ Drive product family. General information about the assembly process can be found under the application note AN-HPD-ASSEMBLY. The HybridPACK™ Drive Performance power modules can be mounted with similar processes. After implementation of final design and assembly it is necessary to perform a system qualification, where system robustness is tested according to the specific application needs (see also for example system qualification tests in LV124). This specific application describes one possible assembly process for the HybridPACK™ Drive Performance power modules, which showed during Infineon internal tests the best robustness performance. The application note can be applied to HybridPACK™ Drive Modules listed in the Chapter 1.1. Figure 1 HybridPACK™ Drive Power Module (example shows FS950R08A6P2B typical appearance) 1.1 HybridPACK™ Drive product list in scope of this application note The scope of the application note is for the following products: Type Designation SP order number Status FS950R08A6P2B SP001720776 In production FS950R08A6P2LB SP002290988 In production FS380R12A6T4B SP001632438 In production FS380R12A6T4LB SP002516834 In production FS05MR12A6MA1B SP005247420 In production FS03MR12A6MA1B SP001720764 In production FS03MR12A6MA1LB SP002725554 In production Product not listed? Please ask your Infineon sales representative. Application note 4 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 2 Recommended Mounting Order 2 Recommended Mounting Order All datasheet drawings specify the power module at the state of delivery. Deformations on the product can occur when the power module is mounted to a cooling system (i.e. depending on cooler flatness and screw torque). As the pin position tolerance is important for PCB assembly, it is recommended to press the PCB on the power module first, and assemble the power module into the cooling system next. In order to avoid putting unnecessary mechanical stress on the PCB, it should be fixed by screws on the inverter housing subsequent to mounting the power module to the cooling system. As a summary, the following mounting order can be recommended: 1. Align PCB to the power module (the X-Pins will support this process) 2. Press-in PCB (recommended press-tool with distance keeper) 3. Prepare cooling system with the sealing ring 4. Attach power module with PCB to the prepared cooling system 5. Fix module baseplate on the cooler by screws 6. Fix the PCB at the inverter housing 7. Connect the module power tabs to busbar, capacitor, etc. When self-clinching nuts are chosen for the connecting type of the module power tabs it is recommended to press-in these nuts in the assembly line before the PCB mounting step 1 starts. Application note 5 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly 3 PressFit Assembly 3.1 Requirements for the PCB The pressfit technology used in the HybridPACK™ Drive is designed based on IEC 60352-5 for standard FR4 printed circuit boards with immersion tin plating. The PCB material must be compliant with IEC 60249-2-4 or IEC 60249-2-5 for double-sided printed circuit boards and IEC 60249-2-11 or IEC 60249-2-12 for multilayer printed circuit boards. The requirements for the PCB are in Table 1. In case the requirements are not met, there is risk of a not gas tight signal pin connection or of pin and/or PCB via damage. The recommendations for the PCB for the X-pin holes are in Table 2. Please note that the pressfit hole specifications are only valid for assembled PCBs. In case of unassembled PCBs, for example for testing purposes, it is recommended to perform a standard reflow solder process before starting the power module assembly process. Table 1 Requirements to the PCB No Description Unit Min. Typ. Max. Remarks and known common mistakes 1 Drill tool diameter mm 1.12 1.15   2 Copper thickness in hole μm Wrong drill tool applied. Specify clearly the pressfit hole positions and required drill tool size to the PCB manufacturer 25   50 In case the via metallization is lower than specification, the risk is a damaged/cracked via 3 End hole diameter mm 1.02   1.10 4 Copper thickness of conductors μm End hole diameters lower than spec may lead to increased press-in forces (typically > 115 N per pin) and may damage the pins. Larger holes than spec may lead to low press-in forces (typically < 40 N per pin) and can cause not gas tight connections 35 400 No results available for thinner or thicker copper layers 5 Hole to hole pattern tolerance μm 70 105     ± 100 6 Recommended PCB thickness mm   1.6   In typical PCB manufacturing hole to hole pattern is lower than ± 80 μm Target value with +/- 10% thickness tolerance 7 Recommended PCB fixing: On Inverter Housing (External, not on module)         Experiments have shown that HybridPACK™ Drive Performance modules show best robustness when PCB is mounted externally to the module. See also Chapter 3.3 (table continues...) Application note 6 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Table 1 (continued) Requirements to the PCB No Description Unit Min. 8 Metallization of circuit board   Immersion Tin (Sn chemically) 9 Metallization of pin   Ni/Sn (galvanic) Table 2 Typ. Max. Remarks and known common mistakes Immersion tin has Typ 1-5 μm metallization in the hole. Other metallization types should be avoided which can lead to strong deviation in press-in forces. For example HAL leadless show high variations in press-in forces and risk is a not gas tight pin connection, which can fail over application lifetime. PCB with ENIG plating can lead to increased press forces due to hard surface and this PCB type was not tested at Infineon module qualification tests The Sn plated pin with nickel under layer avoids potential whisker growth out of the upper galvanic tin layer Recommendations for the printed circuit board X-pin holes No Description Unit Min. Typ. Max. Remark 1 End hole diameter X-Pin1) mm 5.82 5.90   The hole should be drilled with 6.0 mm drill tool and not milled in order to avoid additional unnecessary hole position tolerances 2 End hole diameter Y-Pin1) mm 4.82 4.90   The hole should be drilled with 5.0 mm drill tool and not milled in order to avoid additional unnecessary hole position tolerances 3 Hole to hole pattern tolerance um     ± 100 Plated holes are preferred in order to achieve a minimum “X-pin hole” to “pressfit hole” pattern tolerance 1) Experience has shown that PCB hole diameter should be significantly larger than the module frame element for a seamless assembly process. The given relative large hole diameters in the PCB is the best compromise between Module and PCB alignment and the necessary play during this assembly step. The specified relative large hole sizes avoid an unnecessary rotation of the PCB with respect to the signal pin coordinate system. Please take note that the PCB pressfit holes should not be specified just by the finished end hole diameter. The risk is that wrong processes are applied by the PCB manufacturer. Please give your PCB manufacturer the information that all holes for the signal pins must be manufactured according to Table 1. As PCB design tools typically do not differentiate between “normal” and “pressfit holes” it is a well-known workaround to use a “unique hole size for example 1.06 mm” in the PCB design for all pressfit holes. Then the pressfit holes are separate in the NC drill files and so the PCB manufacturer knows exactly the positions where to apply the spec according to Table 1. An example for such a workaround is shown in Figure 2. Application note 7 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Experience has shown that it is best practice to place additionally a text on the drill drawing layer, where it is clearly specified that the 1.06 mm holes are the pressfit holes according to the specification of Table 1. This text is also visible in the gerber files which are the typical exchange format between the PCB designer and the manufacturer. Figure 2 Example NC Drill File (tool header only) of a PCB design where all pressfit holes are specified with 1.06 mm and a note to the manufacturer is added. The PCB manufacturer can now easily distinguish between a normal and a pressfit hole (see tool T2) A structure of a PCB according to the spec in Table 1 is illustrated in Figure 3. The hole in the PCB is drilled with a drill tool size of 1.15 mm. It is normal that PCB material shrinks after drilling. Therefore, this shown hole size with 1.15 mm should not be understood as a check gauge after drilling rather than an illustration for understanding the PCB stack. Later in the process, the holes will be plated. It is important to have minimum 25 μm copper in the hole otherwise the press forces may damage/crack the via. According to experience, larger annular rings are typically more robust to mechanical forces and so large annular rings (for example 0.5 mm) should be used wherever possible in the design. The metallization/plating in the holes has to be manufactured in an immersion tin (that is chemical tin) process. This process is known to generate very uniform layer thicknesses (typically about 1 μm) and ensures the correct press-in forces as well as an appropriate contact surface for achieving gas tight pressfit connections. Application note 8 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Figure 3 Structure of a PCB according to the specification in Table 1 3.2 General hints for the PCB Footprint PCB footprint typically depend on PCB manufacturing processes and customer specific design rules. The following table can be understood as a best practice and starting point for system design. Table 3 Hint for PCB footpint holes. PCB bottom layer is defined on side of the power module No Type PCB Implementation Hint 1 X-Pin holes Hole at 0/0 Position1) End hole Diameter: 5.90 mm (see Table 2) Top Layer Copper Diameter: >= 6.40 mm Mid Layer Copper Diameter: >= 6.40 mm Bottom Layer Copper Diameter: >= 8.00 mm Hole at 87/82 Position1) End hole Diameter: 4.90 mm (see Table 2) Top Layer Copper Diameter: >= 5.40 mm Mid Layer Copper Diameter: >= 5.40 mm Bottom Layer Copper Diameter: >= 8.00 mm Signal pressfit pin holes 2 (table continues...) Application note See Table 1 9 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Table 3 (continued) Hint for PCB footpint holes. PCB bottom layer is defined on side of the power module No Type PCB Implementation Hint 3 Components Keepout around Uncritical packages like SO, TSSOP, QFP or not safety relevant SMD pressfit Pins resistors: >= 3 mm radius from the hole center Others: >= 4 mm radius from the hole center 4 1) OPTIONAL for external PCB mounting PCB fixing screw holes OPTIONAL for external PCB mounting End hole Diameter: 3.60 mm Top Layer Copper Diameter: >= 7.00 mm Mid Layer Copper Diameter: >= 6.50 mm Bottom Layer Copper Diameter: >= 6.60 mm The x-pin holes can be designed both as plated or un-plated holes. Plated holes with annular rings as noted in the table are the preferred solution. All plated holes are drilled at the PCB manufacturers within the same process and leads to best hole to hole pattern tolerances as a consequence 3.3 Press-In Tool with distance keeper for PCB external mounting This chapter describes a sample press-in tool, which can be adapted to project specific details like PCB assembly locations, maximum height of other PCB parts, etc. to avoid mechanical collisions during the press-in process. The press-in tool is made of two parts (see Figure 4). Figure 4 Application note Press-tool schematic top (A) and bottom (B). The top tool is designed with standoffs which provide a distance to the baseplate surface (C). The picture in (D) show a implementation example with adjustable distance keepers 10 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly The bottom tool supports the power module baseplate and has to avoid damage of the pin-fin cooling area. The material and/or plating of the bottom part of the tool has to be selected in order to avoid scratches and damage of the baseplate sealing area. The holes for the X-pins avoid, by the poka yoke concept, a wrong orientation of the power module in the press-tool. The top tool supports the PCB around the pressfit pins with cylindrical shapes and support the PCB during the press-in process. This part of the tool should be made of material, which can withstand the press-in forces. The top tool also has cylindrical shapes around the X-pins in order to avoid a press-in process with an incorrectly oriented tool or power module. Please note that the top tool height (height of the cylinders) must be adjusted according to the maximum PCB assembly height. Collision of PCB top side assembly must be avoided. A sample drawing of the sample press-in tools is given in Figure 5, Figure 6 and Figure 7 and can be adjusted to project specific needs. Figure 5 Application note Technical drawing of the sample press-in tool with distance keeper (Top Tool). The shown tool is for HybridPACK™ Drive modules with silicon IGBTs 750 V and 1200 V 11 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Figure 6 Technical drawing of the sample press-in tool with distance keeper (Top Tool). The shown tool is for HybridPACK™ Drive modules with SiC MOSFETs The 8 distance keeper can be designed with fixed standoff height but can be implemented as shown in the picture also as adjustable distance keeper (see Figure 4). Following items have to be considered. • Press-tool distance keeper (1) should be designed at the positions of the 8x module baseplate holes • Press-tool distance keeper (1) should have a minimum 8 mm diameter (9.4 mm diameter in the sample tool) • Maximum force press-in force of 3.5 kN should not be exceeded • Press-tool distance keeper height (see XX value in the sample tool): Gap between PCB and module housing domes should be at least 100 μm after the press-in process. For most projects with typical 1.6 mm thick PCB this value will be XX = 14.7 mm Application note 12 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Figure 7 Technical drawing of the sample press-in tool (Bottom Tool) The bottom tool can protect the underside of the power module (especially the PinFin and sealing area) against damage/scratching during the press-in process. The press-tool can be used in a simple toggle lever press for engineering purpose or in a controlled machine for serial production. 3.4 Press-In Process 3.4.1 PCB alignment before the press-in process The PCB can be assembled to the power module only in a correct orientation due to the poka-yoke mechanism of the X-pins. The PCB has to be positioned with a manual or automated handling tool to the X-pins without tilt. It is recommended to design a handling tool, which enables a significant play of the PCB in x-y direction. During the positioning of the PCB to the module the soft and round shaped X-pins will guide the PCB to the right position before the PCB will touch the pins. The signal pins itself will do kind of a “fine-alignment” while moving the PCB further down to the module. A low force in the range up to 10..20 N in z-axis is allowed on the PCB to support the final alignment process. In final position (before the press-in process) the signal pins will appear clearly at the PCB topside for 1.6 mm thick PCBs. The system is ready for the press-in process when all pins are correctly inserted. They also appear on the topside of PCB. This status can be checked for example manually, by automatic optical inspection (AOI) or PCB height level (see Figure 8 for typical appearance after correct PCB alignment process). Application note 13 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Figure 8 PCB at beginning of alignment process (A). After correct alignment, the pins are inserted in the PCB and are clearly visible at the PCB top side (B). The system is now ready for the press-in process 3.4.2 Press-in process description The press-in process is recommended with a controlled force-distance method for serial production. For testing under laboratory conditions, a manual toggle-press also typically gives good results. Application note 14 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Figure 9 Typical way-force press-in diagram from a HybridPACK™ Drive Performance module with 24 signal pins using press-tool with distance keeper and maximum 3.5 kN press-in force The Figure 9 show an example of a HybridPACK™ Drive press-in process. The press-in process starts when the force increases. At this point the z-axis is set to 0 mm in this diagram. In case an initial high peak is detected it may indicate a failure in the process like PCB hole plugged with solder, not properly inserted PCB before the process starts, machine collision with other external parts, etc. The force curve will increase smoothly while pressing down the PCB (see diagram 0 to 1.2 mm). This force curve will have same appearance for different press-in speeds. Lower press-in speeds as noted in Table 4 are not allowed as the press-in forces can increase and damage the pin. Higher press-in speeds are uncritical for the module. The maximum speed is noted with respect to press-in equipment limitation. A higher speed was not tested and is therefore not recommended. The dF curve, which is the 1st derivate of the force-distance diagram is optional for press-in tools with distance keeper. But the dF curve give a useful indication for the effective press-in depth of the pins as well as the effective force at the pins. Please note it is important that the press-in equipment is designed for the expected high forces. During the press-in process the bottom and top press tool must be parallel to each other and should be mechanically fixed without tilt. Application note 15 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Table 4 Overview press-in process No Description Unit 1 Press-in speed 2 3 Typ. Max. Remarks mm/s 0.4 2-4 8 During the press-in process it is not allowed to come under the minimum speed (no multistep press-in process). The maximum press-in speed is typically limited due to non ideal press machine. See explanation “stop criteria” Recommended press-in stop Force using press-tool with distance keeper (external mounted PCB) kN     3.5 Stop criteria only to be applied for press-tool with distance keeper and external mounted PCB Recommended effective press-in length mm 0.9     The pin might be also gas tight at lower effective press-in length in case sufficient force was applied 3.5 Min. PCB design for module external mounting With the described press-tool and process the PCB is pressed with at certain distance to the power module (see also Figure 10A). After the press-in a gap between PCB bottom side and the power module housing domes remain (see indicated area (2) in the Figure 10). Inverter system designer can implement a PCB fixing point outside of the power module (see indicated area (3) in the Figure 10). This fixing point has to be designed with a slightly lower height in order to provide PCB push force on the power module after fixing the PCB by screws to the fixing point. It has to be clearly mentioned that no screws (i.e. the Ejot screws) are allowed at the module domes in case of module external fixation method. A small gap between module and PCB is intended and has to remain after the final assembly. Application note 16 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 3 PressFit Assembly Figure 10 Application note Example of distance press-in combined with module external mounted PCB. Distance keeper (1) ensure a certain distance of PCB to module dome (2). PCB can be fixed externally of the module (3) 17 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 4 Power Module Cooling System 4 Power Module Cooling System The power losses occurring in the module must be dissipated in order to not exceed the maximum permissible operating temperature specified in the datasheet. Therefore, the design of cooling system/heat sink is of great importance. HybridPACK™ Drive Performance has a pin-fin array on the base plate, which makes liquid cooling very effective in sense of the thermal performance. The base plate is made of copper (Cu) material with nickel (Ni) plating. The pin fin structure is suitable for cooling fluids like water/ethylene glycol mixture. Note: During the mounting process, damage to the nickel plating or mechanical deformation of the pin fin structure as well as contamination, scratches or other damage in the sealing region (see Figure 13) must be strictly avoided. 4.1 Reference Cooler Design The cooler design has a great impact on the overall cooling performance, which means the combination of thermal resistance/impedance, pressure drop, and cooling flow rate. So, for all of these thermal related product specifications a reference cooling system is needed, where the given specification values are valid. Figure 11 Reference cooler design for HybridPACK™ Drive Performance with its PinFin Cooling Structure The cooler can be designed differently if other tradeoffs of thermal resistance/impedance, pressure drop and flow rates must be achieved. Therefore, the reference cooler should be regarded as a design example, where the values from the corresponding product specification can be achieved. Application note 18 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 4 Power Module Cooling System The following requirements must be considered when either the reference design or other designs are used. • Roughness of the cooler: ≤ RZ25 (DIN EN ISO 1302) in area of the sealing • Cooler Flatness at the module area: ≤ 50 µm Exceeding the requirements above may lead to damage of the power module. The cooler material should be AlMgSi0.5 or other alternative which is compatible to copper baseplate with nickel plating and which can withstand the mechanical stress required from a specific customer application. The holes for the x-pins are designed in the reference cooler with a high margin (that is 8 mm depth holes). When necessary for the system design it is possible to reduce these holes to 6.0 mm depth. Application note 19 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 4 Power Module Cooling System Another cooling solution was developed in a joint venture between Quarder and Infineon. The plastic cooler is produced by Quarder and is validated for automotive use (see [6] and [7]). Figure 12 Thermoplastic reference cooler housing with mounted IGBT Modul for HybridPACK™ Drive 4.2 Recommendation for the sealing ring The power module baseplate is designed with a flat region of 6.5 mm surrounding the entire pin fin area (see Figure 13). Considering a 4 mm thick groove for the sealing ring and a positioning tolerance of the sealing area and the alignment to the cooling system of better than ± 1 mm, it is convenient to achieve a proper sealing. Application note 20 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 4 Power Module Cooling System Figure 13 The sealing region with 6.5 mm surrounding the pin fin area. For initial evaluation and power module qualification tests where an assembly was required, a sample sealing ring from Dichtomatik GmbH (company of Freudenberg Sealing Technologies) part number 192944/192945 was used. This sealing ring was of EDPM 70 material and had a specification shown in Figure 14. For easier assembly and even higher robustness margin, a double sealing ring can be applied (see Figure 14). In the meanwhile Freudenberg Sealing Technologies has developed an optimized sealing ring design under the part number OR-SF19023 and is available for open market. Figure 14 Drawing of a EPDM 70 sample o-ring (A) and corresponding groove size in the cooler (B) The company Shanghai Transtech Sealing Technology designed a derivate of this initial design with the article number: YA-15070-E7061. This sample design was also applied in monitoring qualification and release of new products in the HybridPACK™ Drive modules, where mounting on cooler system was required for the test. This design has “assembly knobs” supporting an easier assembly process. These knobs can fix the sealing ring after it is attached to the cooler groove and will avoid the risk of displacements during the module assembly process. Application note 21 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 4 Power Module Cooling System Figure 15 Drawing of sample sealing ring designed by Transtech with knobs supporting the assembly process (A). Corresponding groove size in the cooler (B) The sealing ring is held in a groove, which must be designed in the cooling system. It should be noted that the sample sealing rings shown above lead to positive results in power module qualification tests. Nevertheless, it is necessary to perform system qualification test (e.g. according to LV124) if final system design and assembly meets the project specific application needs. Additional design/supplier of the sealing ring: Sealing ring suppliers further optimized sealing rings for the HybridPACK™ Drive power modules. Two designs are shown below, which were used successfully in latest monitoring tests. Figure 16 Application note Drawing of sealing ring from Freudenberg Sealing Technologies OR-SF-19023 22 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 4 Power Module Cooling System Figure 17 Note: Drawing of sealing ring with assembly knobs from Freudenberg Sealing Technologies OR-SF-21004 Infineon does not recommend the usage of a silicon gasket or other sealing methods. The usage of sealing methods different than sealing ring can cause damage on HybridPACK™ Drive module. 4.3 Cooling fluid A general recommendation for a specific cooling fluid cannot be provided, as the power module is only one single part in the entire cooling system. Following items have to be considered at the system supplier to find appropriate coolant fluid: • Coolant fluid with its corrosion protection has to be compatible with the aluminium of the cooler material and the nickel overplated Cu module baseplate • Also other parts in the coolant system has to be compatible to the fluid type (for example Zn screws and chrome parts are typically not allowed in the cooling system) • The fluid mixture has to provide enough anti-freeze for the application conditions. Freezing events of the fluid has to be strictly avoided. Freezing fluid will lead to plastic deformation of the power module baseplate and may lead to fluid leakage and/or isolation failure consequently For power module tests at Infineon where cooling is required (for example thermal characterization, power cycling tests) typically BASF Glysantin™ G30™ with an organic-acid-technologie (OAT) silicate-free corrosion protection is applied. Application note 23 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 5 Screw types and processes 5 Screw types and processes 5.1 Baseplate Mounting Screws The power module baseplate is designed to be fixed on the cooling system by means of M4 screws. A standard screw M4x10 ISO 4762 (DIN 912 A2) with washer M4 ISO 7090 (DIN 125 A2) may be possible, depending on mechanical application constraints (for example vibration, maximum pressure test,…). Considering production complexity and highest mechanical robustness, we recommend the following screw type to fix the baseplate to the AlMgSi0.5 cooler: Table 5 Recommended baseplate fixing screw M4x10 ISO 7380-2 A2 (TX) No Description Min. Typ. Max. Remarks 1 Mounting torque 1.8 Nm 2.0 Nm 2.2 Nm   2 Max mounting speed     400 rpm   3 Effective length of screw in cooler 6 mm     AlMgSi0.5 cooler material. Typical M4x10 screws are used Figure 18 Picture of recommended screw type M4x10 ISO 7380-2 A2 (typical appearance). The correct type has -2 suffix to the ISO norm and is a screw with flattened round head (German: Linsen-Flanschkopfschraube). The recommended screw type is also available with a TX20 screw head: ISO 7380-2-A2-TX Table 6 List of suitable baseplate fixing screw types for HybridPACK™ Drive Type Description Remarks M4x10 ISO 4762 screw M4 ISO 7090 washer Standard M4 screw and washer Due to production complexity/cost only for lab testing recommended M4x10 ISO 7380-2 A2 M4 screw with integrated washer   M4x10 ISO 7380-2 A2 TX M4 screw with integrated washer and TX20 screw head Recommended for low to high volume production EJOT ALtracs Plus WN5152 AP 40x12/10 Self-tapping screw (see Chapter 5.1.1 for requirements) Recommended for high volume production 5.1.1 Alternative: self-tapping screws for baseplate mounting Self-tapping screws are well known for use in plastic materials but are also available and established since several years for metal materials. The main advantages are the elimination of drilling and thread cutting as well Application note 24 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 5 Screw types and processes as the corresponding cleaning processes. This can lead to significant cost reduction and process time reduction for cooler manufacturing at high production volumes. Furthermore, such self-tapping screws are known to be extremely rugged during vibration stress. The following rules and recommendations are given for the screw type: • EJOT ALtracs Plus WN5152 AP 40x12/10 The baseplate fixing points in the cooler has to be adjusted as shown in the drawing of Figure 19. The self-tapping screw should not be used in standard M4 threads. Figure 19 Picture of the self-tapping EJOT ALtracs Plus WN5152 AP 40x12/10. A typical torque and mounting force diagram as well as drawing of the required fixing holes in the cooler. The holes can be also drilled with a standard drill tool (3.7 mm 0°) Table 7 Alternative baseplate fixing screw EJOT ALtracs Plus WN5152 AP 40x12/10 No Description Min. Typ. Max. Remarks 1 Mounting torque Meff 1.6 Nm 1.8 Nm 2.0 Nm Approx. Mw = 2 Nm torque is required for the self-tapping. This torque is not effective for the mounting force Ft. Self-tapping force strongly depends on cooler material 2 Recommended mounting speed 400 rpm   600 rpm Lower than 200 rpm is not recommended 3 Module Clamping/Fixation during mounting   2 kN   Self-tapping screws require single step mounting and appropriate module clamping. See Chapter 5.2 Further important notes to avoid burrs and flakes in the final system: • The fixing holes in the cooler must be blind holes (no clearance holes) • Only one time mounting is feasible The geometry of the EJOT screw is designed such that the burrs and flakes are only generated at the bottom of the screw thread. The screw self-tapping moment depends on the cooler (housing) material. Infineon recommends to perform mounting experiments with final cooler material. In these experiments the screw torque should be recorded. The cooler material specific self-tapping torque can be observed from the recorded data as shown in the example with the reference cooler made of AlMgSi0.5 material. Application note 25 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 5 Screw types and processes Figure 20 Recorded screw torque in CNC machined cooler from AlMgSi0.5 material. The self tapping torque was at several experiments was in average 2.0 Nm. For this part a total screw torque of 3.8 Nm would lead to an effective screw torque of the required Meff = 1.8 Nm 5.2 Fixation/clamping of the module during the baseplate screw process It is required to fix properly the power module to the cooler during the screwing process in order to avoid tilting of the module with a possible damage (for example plastic deformation of the baseplate). Following methods are preferred for module fixation. Screw orders are listed in Chapter 5.4: 1. Multi-Step Screw Mounting: Place screw number 1 & 2 and fix with lowest torque (this avoids only module tilting and will not to provide a high clamping force). Fix screw 3 to 8 with low torque (for example. 0.4-0.6 Nm). Fix screws with final torque as specified 2. Module Clamping: After the power module (with PCB) is placed onto the cooling system the module should be clamped in z axis of the module with a total force of Fc = 2 kN to ensure that the sealing ring is fully compressed during the screwing process. The clamping can be performed in the area where the PCB mounting domes are located. Eight 2.3 mm (-0.1) diameter stamps can be used to apply the force in the corresponding module housing blind holes. It is important that the PCB is not further pushed down during the clamping especially in the mounting methods where the PCB is pressed with a certain distance to the module domes. A schematic 3D drawing with a sample clamping tool as described in shown in the Figure 21 Note: The described 1st fixing method with multi step screw mounting is not suitable for self-tapping screws. For self-tapping screws it is mandatory to use proper clamping which enables a single step screw mounting. Attention: It is important for external mounted PCBs, which have a gap between PCB and module housing that the PCB is not pushed down to the module! Application note 26 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 5 Screw types and processes Figure 21 Module clamping with force Fc during the baseplate screw process. The shown clamping tool uses 2.3 mm (-0.1) stamps in blind holes of the frame dome to apply the force directly to the module. The clamping tool does not apply a force to the PCB 5.3 PCB mounting (module external) For the described assembly method in this application note the PCB is fixed externally to the module directly at the inverter housing. Please align with the responsible engineer of the inverter housing for the appropriate fixation type and process. Attention: It has to be clearly mentioned that no screws (that is the Ejot screws) are allowed at the module domes in case of the described module external fixation method. 5.4 Screw Orders (Baseplate and PCB) The screw order as shown in Figure 22 is very important in order to avoid damage on the part. Please see Chapter 5.1 and Chapter 5.3 for specification of screw type and torque as well as required processes like module fixation/clamping during the baseplate screw process. Application note 27 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 5 Screw types and processes Figure 22 Application note Screw order for baseplate and PCB screws 28 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 6 Connecting to the Power Terminals 6 Connecting to the Power Terminals 6.1 Mounting Options The copper power tabs are tin-plated and are so well suited for screw type connections including clinch processes as well as welding processes. Several mounting options are suitable and some examples are illustrated in Figure 23 where the HybridPACK™ Drive is connected to a DC-link capacitor. It is possible to have the mounting order: screw – power tab – busbar – nut (Figure 23 Opt. 1), nut – power tab – busbar – screw (Figure 23 Opt. 2), In the examples the busbar is always a single part/sheet, but also two or three busbar sheets are possible to be mounted in the stack and so it is also possible to have instead of the screw head/nut only busbars as a direct interface to the power tabs: For example screw – busbar - power tab – busbar – nut. Further beneficial mounting options are given by the use of self clinching nuts. Standard M4 self clinching nuts can be used in mounting holes designed for M5 screws. So, a M4 self clinching nut can be pressed into the power tab hole and busbars can be connected with a M4 screw (preferred the same screw type as used for mounting the baseplate to the cooling system). In case the mounting order is reversed it is possible to use a M5 self clinching nut in a busbar and to use a M5 screw on the power tab side as counterpart (that is mounting Option 4 in Figure 23 and Table 8). Figure 23 Examples of power tab connection options Table 8 Power tab mounting options and recommended screw torque Mounting Option Screw/Nut type 1,2 M5 ISO 4762 screw (M5 ISO 7090 washer) M5 ISO4032 nut M5 ISO 7380-2-A2(TX) screw M5 ISO6923 nut (table continues...) 1,2 Application note Mounting torque Min. Remarks Typ. Max. 3.6 Nm 4.0 Nm 4.4 Nm Low volume production & lab testing 3.6 Nm 4.0 Nm 4.4 Nm Low volume production & lab testing 29 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 6 Connecting to the Power Terminals Table 8 (continued) Power tab mounting options and recommended screw torque Mounting Option Screw/Nut type 3 M4 ISO 7380-2-A2(TX) M4 self-clinching nut For example “TR-SM4-1” PEM “S-M4-0ZI” 4 M5 or M4 ISO 7380-2A2-(TX) screw M5 or M4 selfclinching nut in busbar/capacitor (depending on busbar/capacitor design) 5 welding Mounting torque Min. Remarks Typ. Max. 1.8 Nm 2.0 Nm 2.2 Nm Low to high volume production & lab testing 3.6 Nm 4.0 Nm 4.4 Nm Low to high volume production & lab testing - - high volume production - The screw types in table give only a rough overview. Different types may be possible with same mounting torque in case the base of head or the spot face are comparable to the given types and the busbar material is suitable for such mounting. 6.1.1 Additional Information for Welding Processes The HybridPACK™ Drive power modules without an ‘B’ in the ending of the type designation (for example FS820R08A6P2B) indicates a module frame, which has no mounting hole in the power tab. Examples of these module types can be seen in Figure 24 . These plain power tabs of these products can be connected by means of welding processes. The welding process with its specific parameters have to be evaluated by the customer. A general recommendation to the process type or parameters is not possible as it is also depending on the companion material of the busbar and the available welding equipment at the customer. Studies of institutes give a comprehensive guide for the pre-selection of applicable welding process types and can be found for example at [1] Table 3.3 or [3]. Material property of the power tabs for selecting the welding process: Copper Type: oxygen free copper type Plating: galvanic tin Please note that the power module frame has to be limited to 150°C during the welding process. A laser welding machine supplier, which has already successfully performed pre-tests on the HybridPACK™ Drive power tabs can be found under [4]. Application note 30 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 6 Connecting to the Power Terminals Figure 24 HybridPACK™ Drive Modules suitable for welding 6.2 Forces on Power Tabs The system mounting should be designed in a way that minimal force is applied on the power tabs of the power module. The tested and allowed forces on the power tabs are given in Figure 25. The specified force shown on one single tab is allowed simultaneously at all power tabs. Figure 25 Application note Allowed forces on the power tabs 31 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 7 System Assembly Clearance & Creepage Distances 7 System Assembly Clearance & Creepage Distances The datasheet of the HybridPACK™ Drive specifies clearance & creepage distances of the product itself. It is obvious that external parts can modify these distances in the system and so it is mandatory to check clearance and creepage distances of the entire final system assembly. Figure 26 shows an example where the power terminals are connected with screws by means of a standard hexagonal nut. Figure 26 HybridPACK™ Drive with a hex nut (ISO 4032) for the power tab connection. The clearance shown in the drawing is uncritical as it is higher than the minimum product clearance itself of 4.5 mm Even considering a fixing tolerance of ±0.25 mm the clearance distance shown above is higher than the minimum clearance in the module product itself, which is 4.5 mm according to the product datasheet. Note: The distance to the cooler, housing, (all external parts), must also be checked. For example, the distance from the hex nut to the cooler. This can be done only on system level. Appropriate keep out or covering with isolating parts (plastic) can typically increase critical distances in the system design. Application note 32 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 8 Traceability, Data Matrix and Part Markings 8 Traceability, Data Matrix and Part Markings Traceability of materials, equipment and processes is a must for key automotive components. Therefore, the HybridPACK™ Drive is produced at Infineon in a seamless traceability environment. Nevertheless, traceability must not be aborted after the modules are shipped to the customer and assembled into the inverters. In order to reap the full benefit of a traceability chain, the unique module number (module ID) should be linked to the inverter ID at customer side. Figure 27 shows the module labels and where to find the DMX-code necessary for tracing the module-ID. Figure 27 Picture of module labels (typical appearance). For a seamless traceability the DMX code which is the module ID (or alternative the type designation + date code + serial number) should be recorded and linked to the inverter ID The DMX code is readable with all professional data matrix code scanners compatible to the IEC24720 and IEC16022 standard. Engineers in the lab can also use free DMX code reader apps on their smartphones. Android: QR Extreme, QR Droid, and many others supporting data matrix codes. iOS: i-nigma QR, and many others supporting data matrix codes. Application note 33 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 9 Technical Drawing 9 Technical Drawing 9.1 Basic Explanation Coordinate System Figure 28 Technical drawing with global and local coordinate systems as utilized by the HybridPACK™ Drive The drawing of the HybridPACK™ Drive utilizes a global coordinate system, which is defined by the X-Pins and is mainly used for pre-alignment. The position of all elements like signal pins, mounting domes, etc. are given in this global system and makes it simple for designing companion parts like the PCB, busbar and housing. Furthermore, important interfaces like mounting domes, signal pins are also defined in local coordinate systems, where position tolerances can be defined more precise. With such a drawing, the companion parts will be typically designed with respect to the relative tolerances from the corresponding local systems and the positioning of the companion part to the power module can be best designed/checked in the common global coordinate systems. Figure 28 show the basics of technical drawings with global and local coordinate systems. A coordinate system is here defined by three elements. The 1st element defines a surface (see Figure 28a). The position where the line of the 2nd element vertical crosses the surface of the 1st element defines the origin (see Figure 28b). A further line from the 3rd element to the origin defines the rotation of the final 3D Cartesian coordinate system (see Figure 28c). An additional local coordinate system can be defined when one or more elements are shifted. In the example of Figure 28d, the 2nd element (B) is replaced by element (E). The result is a local coordinate system, which is Application note 34 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 9 Technical Drawing linear transformed to the global system. These local systems enables a comprehensive way to define relative tolerances of for example pin positions, mounting domes, etc. 9.2 Pin Position and Pin Gauge For power modules which have in product specification a note as shown in Figure 29A, a pin gauge test is implemented in the production line at Infineon. The specification of this pin gauge is shown in Figure 29B for pinning as implemented in FS950R08A6P2B. For other signal pin pattern like for the SiC MOSFET modules the positions of the signal holes are different but hole size spec will remain same. At power module production the parts are tested if pin gauge can be applied to the module. A low force in module z-direction on the gauge are allowed (typical up to 10..20 N, which is uncritical for the module and its pins). When the pin gauge can be smoothly attached to the module the test is rated as PASS and can be seen as a test if customer can later smoothly assembly their PCBs on the power module. The basic description of the test and pin gauge specification is placed only for information how these modules are tested at Infineon production. It is not needed at customer side to test power modules at incoming inspection again. Application note 35 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 9 Technical Drawing Figure 29 Application note Extract of datasheet regarding pin positions on example of FS950R08A6P2B (A). Specification of Infineon pin gauge for power module production test (B). Hole pattern can be adjusted for other signal pinning with same hole size spec (for example SiC MOSFET Module) 36 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 10 Storage and Transport 10 Storage and Transport During transport and storage of the modules, extreme forces through shock or vibration have to be avoided as well as extreme environmental influences. Storage of the modules at the limits of the temperature specified in the datasheet is possible, but not recommended. The recommended storage conditions according to IEC60721-3-1, class 1K2 should be assured for the recommended storage time of maximum 2 years. Max. air temperature: Tmaxair = + 40°C Min. air temperature: Tminair = +5°C Max. relative humidity: 85% Min. relative humidity: 5% Condensation: not permissible Precipitation: not permissible Icing: not permissible Pre-drying of the power module prior to the press-in process (as is recommended for molded discrete components, such as microcontrollers, TO-cases etc.) is not required for the HybridPACK™ Drive power modules. Application note 37 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 11 Power Module Appearance 11 Power Module Appearance This chapter explains frequent questions about the typical power module appearance. 11.1 Pin Rotation The position tolerance is an important value and ensures that a PCB designed according to the recommendations fits to the power module. The positions of the pins are clearly specified in the product datasheet. The pin rotation is not fixed as the interface (PCB via) is totally symmetric. A pin rotation is clearly visible due to the asymmetric pin geometry (that is three contact pressfit pin). An example is shown in Figure 30, where the rotation is indicated. Typically about 45° pin rotations can be seen. Nevertheless, different angles may occur in the final product and it is no reason for an objection and has no influence on the final contact quality. Figure 30 Pins are not symmetrical (three contact pressfit pins) and so a rotation angle is visible. Different angles may occur in final product but are uncritical for the contact quality and is no reason for an objection 11.2 Module Lid to PCB Distance The power module lid is also guided with the module x-pins. In the area of the x-pins the module lid is in contact to the PCB even before it is pressed down. After final assembly this ensures that the lid has contact to the PCB and so avoids noise during typical application vibration profiles. The force of the lid to the PCB is low and uncritical for the PCB. Figure 31 Application note The module lid has contact to the PCB before it is pressed onto the power module. This ensures a contact after the PCB is assembled and avoids noise during vibration profiles 38 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 11 Power Module Appearance 11.3 Power Tab Tin Plating The power tabs are made of copper with a tin plating. The plating has the role to avoid visual discoloration and oxidation of the copper between power module production and the mounting processes. After assembly, the tin plating has no function and the contact resistance is the same as an un-plated pure copper power tab. In order to provide the maximum possible compatibility to various connecting techniques like screw type connections, clinching and welding, it is mandatory to make the plating as soft as possible. Due to the desired compatibility and the required softness, visible scratches (see Figure 32a) and/or not completely over-plated edges due to the stamping process (see Figure 32b) are of logical consequence and is no reason for an objection as it does not influence the product performance or quality. Figure 32 Typical appearance of the copper power tabs, which have a very soft tin plating and provides maximum compatibility to different mounting processes 11.4 Baseplate Surface A typical appearance of the baseplate surface is a so called “marbling” or “white spots” structure. This structure can be observed after the galvanic nickel and its cleaning process of the baseplates. The roughness of the baseplate, the chemical structure as well as the thickness of the Ni layer is not different to baseplates where this structure is not visible by naked eye. Such an appearance as shown in the Figure 33 is a normal appearance and is no reason for an objection as it does not influence the product performance or quality. Figure 33 Application note Typical appearance of power module baseplate surface with a “marbling” or “white spots” structure 39 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance 12 References 12 References The referenced application notes can be found at http://www.infineon.com [1] Copper Development Association, “Welding copper and copper alloys“, http://www.copper.org/ publications/pub_list/pdf/a1050.pdf [2] Harting Technology Group, http://www.harting.com [3] Deutsches Kupferinstitute, “Schweißen von Kupfer und Kupferlegierungen” http://copperalliance.de/ docs/librariesprovider3/i012-mit-info-deutsches-kupferinstitut-pdf [4] Trumpf Laser- und Systemtechnik GmbH, https://www.trumpf.com [5] Alpitronic GmbH, http://www.alpitronic.it [6] Infineon Technologies AG, "HybridPack-Drive Cooler EQ V08" [7] Erwin Quarder Gruppe, https://www.quarder.de/thermomanagement-fuer-batterietechnik/hybridpackdrive-kuehler/ Application note 40 Rev. 1.5 2024-04-23 Assembly Instructions for the HybridPACK™ Drive Performance Revision history Revision history Document version Date of release Description of changes 1 2019-09 Initial Version for HybridPACK™ Drive Performance power modules 1.1 2021-02 Added SiC MOSFET modules in scope. Presstool drawing for SiC Modules added. Added section and pictures for typical appearance of module baseplate. Gauge drawing corrected to match calibration specification of gauge. Corrected typers 1.2 2021-08 Presstool drawing for SiC Modules updated 1.3 2022-08 Revisions: Added additional design/supplier of the sealing ring 1.4 2023-12-07 Template update; no content update 1.5 2024-04-23 Added information about Quarder cooler Application note 41 Rev. 1.5 2024-04-23 Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2024-04-23 Published by Infineon Technologies AG 81726 Munich, Germany   © 2024 Infineon Technologies AG All Rights Reserved.   Do you have a question about any aspect of this document? Email: erratum@infineon.com   Document reference IFX-ycr1699970845178 Important notice The information contained in this application note is given as a hint for the implementation of the product only and shall in no event be regarded as a description or warranty of a certain functionality, condition or quality of the product. Before implementation of the product, the recipient of this application note must verify any function and other technical information given herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this application note. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. Warnings Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.