nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
Low Loss DuoPack :
IGBT in 2nd generation TRENCHSTOP™
with soft, fast recovery anti-parallel Emitter Controlled Diode
C
Best in class TO247
Short circuit withstand time – 10s
Designed for :
- Frequency Converters
- Uninterrupted Power Supply
TRENCHSTOP™ 2nd generation for 1200 V applications offers :
- very tight parameter distribution
- high ruggedness, temperature stable behavior
Easy paralleling capability due to positive temperature coefficient in
VCE(sat)
Low EMI
Low Gate Charge
Very soft, fast recovery anti-parallel Emitter Controlled HE Diode
Qualified according to JEDEC1 for target applications
Pb-free lead plating; RoHS compliant
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/
Type
IKW40N120T2
G
E
PG-TO-247-3
VCE
IC
VCE(sat),Tj=25°C
Tj,max
Marking Code
Package
1200V
40A
1.75V
175C
K40T1202
PG-TO-247-3
Maximum Ratings
Parameter
Symbol
Value
Unit
Collector-emitter voltage
VCE
1200
V
DC collector current (Tj=150°C)
IC
A
2
TC = 25C
75
TC = 110C
40
Pulsed collector current, tp limited by Tjmax
ICpuls
160
Turn off safe operating area
-
160
VCE 1200V, Tj 175C
DC Diode forward current (Tj=150°C)
IF
TC = 25C
752
TC = 110C
40
Diode pulsed current, tp limited by Tjmax
IFpuls
160
Gate-emitter voltage
VGE
20
V
tSC
10
s
Ptot
480
W
C
Short circuit withstand time
3)
VGE = 15V, VCC 600V, Tj,start 175C
Power dissipation
TC = 25C
Operating junction temperature
Tj
-40...+175
Storage temperature
Tstg
-55...+150
Soldering temperature, 1.6mm (0.063 in.) from case for 10s
-
260
Wavesoldering only, temperature on leads only
1
2
3)
J-STD-020 and JESD-022
Limited by bond wire
Allowed number of short circuits: 1s.
IFAG IPC TD VLS
1
Rev. 2.4
23.09.2014
nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
Thermal Resistance
Parameter
Symbol
Conditions
Max. Value
Unit
RthJC
0.31
K/W
RthJCD
0.53
RthJA
40
Characteristic
IGBT thermal resistance,
junction – case
Diode thermal resistance,
junction – case
Thermal resistance,
junction – ambient
Electrical Characteristic, at Tj = 25 C, unless otherwise specified
Parameter
Symbol
Conditions
Value
min.
typ.
max.
1200
-
-
T j =2 5 C
-
1.75
2.2
T j =1 5 0 C
-
2.25
-
T j =1 7 5 C
-
2.3
-
T j =2 5 C
-
1.75
2.2
T j =1 5 0 C
-
1.80
-
T j =1 7 5 C
-
1.80
-
5.2
5.8
6.4
Unit
Static Characteristic
Collector-emitter breakdown voltage
V(BR)CES
V G E =0 V , I C = 5 0 0 µ A
Collector-emitter saturation voltage
VCE(sat)
VGE = 15V, IC=40A
Diode forward voltage
VF
V
V G E =0 V , I F =4 0 A
Gate-emitter threshold voltage
VGE(th)
I C = 1 . 5 m A , V C E =V G E
Zero gate voltage collector current
ICES
V C E =1 2 0 0 V ,
V G E =0 V
mA
T j =2 5 C
-
-
0.4
T j =1 5 0 C
-
-
4.0
T j =1 7 5 C
-
-
20
Gate-emitter leakage current
IGES
V C E =0 V , V G E = 2 0 V
-
-
200
nA
Transconductance
gfs
V C E =2 0 V , I C =4 0 A
-
21
-
S
Rev. 2.4
23.09.2014
IFAG IPC TD VLS
2
nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
Dynamic Characteristic
Input capacitance
Ciss
V C E =2 5 V ,
-
2360
-
pF
Output capacitance
Coss
V G E =0 V ,
-
230
-
Reverse transfer capacitance
Crss
f =1 M H z
-
125
-
Gate charge
QGate
V C C =9 6 0 V , I C =4 0 A
-
192
-
nC
-
13
-
nH
-
A
V G E =1 5 V
Internal emitter inductance
LE
measured 5mm (0.197 in.) from case
Short circuit collector current1)
IC(SC)
V G E =1 5 V , t S C 1 0 s
VCC = 600V,
Tj, start = 2 5C
Tj. start = 1 75C
220
156
Switching Characteristic, Inductive Load, at Tj=25 C
Parameter
Symbol
Conditions
Value
min.
typ.
max.
-
33
-
-
28
-
-
314
-
-
94
-
-
3.2
-
-
2.05
-
-
5.25
-
Unit
IGBT Characteristic
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
T j =2 5 C ,
V C C =6 0 0 V , I C =4 0 A ,
V G E =0 / 1 5 V ,
RG=12,
L 2 ) =8 0 n H,
C 2 ) =6 7 p F
Energy losses include
“tail” and diode reverse
recovery.
Diode reverse recovery time
trr
T j =2 5 C ,
-
285
Diode reverse recovery charge
Qrr
V R = 6 0 0 V , I F =4 0 A ,
-
3.3
µC
Diode peak reverse recovery current
Irrm
d i F / d t =9 5 0 A / s
-
23
A
Diode peak rate of fall of reverse
recovery current during t b
dirr/dt
-
350
ns
mJ
Anti-Parallel Diode Characteristic
1)
2)
-
ns
A/s
Allowed number of short circuits: 1s.
Leakage inductance L a n d Stray capacity C due to dynamic test circuit in Figure E.
IFAG IPC TD VLS
3
Rev. 2.4
23.09.2014
nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
Switching Characteristic, Inductive Load, at Tj=175 C
Parameter
Symbol
Conditions
Value
min.
typ.
max.
-
32
-
-
28
-
-
405
-
-
195
-
-
4.5
-
-
3.8
-
-
8.3
-
Unit
IGBT Characteristic
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
T j =1 7 5 C
V C C =6 0 0 V , I C =4 0 A ,
V G E =0 / 1 5 V ,
RG= 12,
L 1 ) =1 8 0 n H,
C 1 ) =6 7 p F
Energy losses include
“tail” and diode reverse
recovery.
Diode reverse recovery time
trr
T j =1 7 5 C
-
480
-
ns
Diode reverse recovery charge
Qrr
V R = 6 0 0 V , I F =4 0 A ,
-
6.6
-
µC
Diode peak reverse recovery current
Irrm
d i F / d t =9 5 0 A / s
-
31
-
A
Diode peak rate of fall of reverse
recovery current during t b
dirr/dt
-
200
ns
mJ
Anti-Parallel Diode Characteristic
1)
A/s
Leakage inductance L a n d Stray capacity C due to dynamic test circuit in Figure E.
IFAG IPC TD VLS
4
Rev. 2.4
23.09.2014
nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
140A
TC=80°C
10µs
IC, COLLECTOR CURRENT
IC, COLLECTOR CURRENT
tp=3µs
100A
160A
120A
100A
80A
TC=110°C
60A
Ic
50µs
10A
150µs
500µs
1A
20ms
40A
Ic
DC
20A
0A
10Hz
Figure 1.
0.1A
100Hz
1kHz
10kHz
1V
100kHz
f, SWITCHING FREQUENCY
Collector current as a function of
switching frequency
(Tj 175C, D = 0.5, VCE = 600V,
VGE = 0/+15V, RG = 12)
10V
100V
1000V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 2. Safe operating area
(D = 0, TC = 25C,
Tj 175C;VGE=15V)
70A
IC, COLLECTOR CURRENT
60A
300W
200W
Ptot,
POWER DISSIPATION
400W
50A
40A
30A
20A
100W
10A
0W
25°C
Figure 3.
50°C
75°C
100°C
125°C
0A
25°C
150°C
TC, CASE TEMPERATURE
Maximum power dissipation as a
function of case temperature
(Tj 175C)
IFAG IPC TD VLS
Figure 4.
5
75°C
125°C
TC, CASE TEMPERATURE
Maximum collector current as a
function of case temperature
(VGE 15V, Tj 175C)
Rev. 2.4
23.09.2014
IKW40N120T2
nd
TRENCHSTOP™ 2 Generation Series
150A
150A
20V
20V
125A
VGE=17V
IC, COLLECTOR CURRENT
IC, COLLECTOR CURRENT
125A
15V
100A
13V
11V
75A
9V
7V
50A
11V
7V
0A
2V
3V
4V
0V
5V
VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE
120A
100A
80A
60A
40A
TJ=175°C
25°C
0A
0V
Figure 7.
2V
4V
6V
8V
10V
12V
VGE, GATE-EMITTER VOLTAGE
Typical transfer characteristic
(VCE=20V)
IFAG IPC TD VLS
1V
2V
3V
4V
5V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 6. Typical output characteristic
(Tj = 175°C)
140A
20A
9V
50A
0A
1V
13V
75A
25A
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 5. Typical output characteristic
(Tj = 25°C)
IC, COLLECTOR CURRENT
15V
100A
25A
0V
VGE=17V
3.5V
2.5V
2.0V
IC=40A
1.5V
IC=20A
1.0V
IC=8A
0.5V
0.0V
-50°C
Figure 8.
6
IC=80A
3.0V
0°C
50°C
100°C
150°C
TJ, JUNCTION TEMPERATURE
Typical collector-emitter saturation
voltage as a function of junction
temperature
(VGE = 15V)
Rev. 2.4
23.09.2014
nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
1000ns
td(off)
1000 ns
100ns
t, SWITCHING TIMES
t, SWITCHING TIMES
td(off)
tf
td(on)
10ns
tr
tf
100 ns
td(on)
10 ns
tr
1ns
20A
60A
IC, COLLECTOR CURRENT
Typical switching times as a
function of collector current
(inductive load, TJ=175°C, VCE=600V,
VGE=0/15V, RG=12Ω,
Dynamic test circuit in Figure E)
RG, GATE RESISTOR
Figure 10. Typical switching times as a
function of gate resistor
(inductive load, TJ=175°C, VCE=600V,
VGE=0/15V, IC=40A,
Dynamic test circuit in Figure E)
t, SWITCHING TIMES
VGE(th), GATE-EMITTER THRESHOLD VOLTAGE
Figure 9.
40A
TJ, JUNCTION TEMPERATURE
Figure 11. Typical switching times as a
function of junction temperature
(inductive load, VCE=600V, VGE=0/15V,
IC=40A, RG=12Ω,
Dynamic test circuit in Figure E)
IFAG IPC TD VLS
7
TJ, JUNCTION TEMPERATURE
Figure 12. Gate-emitter threshold voltage as a
function of junction temperature
(IC = 1.5mA)
Rev. 2.4
23.09.2014
IKW40N120T2
nd
TRENCHSTOP™ 2 Generation Series
*) Eon and Ets include losses
due to diode recovery
*) Eon and Etsinclude losses
due to diode recovery
Ets*
15.0mJ
10.0mJ
Eon*
5.0mJ
Eoff
E, SWITCHING ENERGY LOSSES
E, SWITCHING ENERGY LOSSES
20.0mJ
10.0 mJ
7.5 mJ
Eon*
20A
40A
2.5 mJ
60A
IC, COLLECTOR CURRENT
Figure 13. Typical switching energy losses as
a function of collector current
(inductive load, TJ=175°C, VCE=600V,
VGE=0/15V, RG=12Ω,
Dynamic test circuit in Figure E)
Eoff
5.0 mJ
0.0 mJ
0.0mJ
E, SWITCHING ENERGY LOSSES
E, SWITCHING ENERGY LOSSES
Eoff
Eon*
2.5mJ
0.0mJ
100°C
Eon*
7.5mJ
Ets*
5.0mJ
Eoff
2.5mJ
0.0mJ
400V
150°C
TJ, JUNCTION TEMPERATURE
Figure 15. Typical switching energy losses as
a function of junction temperature
(inductive load, VCE=600V, VGE=0/15V,
IC=40A, RG=12Ω,
Dynamic test circuit in Figure E)
IFAG IPC TD VLS
10.0mJ
5.0mJ
50°C
*) Eon and Ets include losses
due to diode recovery
Ets*
0°C
RG, GATE RESISTOR
Figure 14. Typical switching energy losses as a
function of gate resistor
(inductive load, TJ=175°C, VCE=600V,
VGE=0/15V, IC=40A,
Dynamic test circuit in Figure E)
*) Eon and Ets include losses
due to diode recovery
7.5mJ
Ets*
8
500V
600V
700V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 16. Typical switching energy losses as
a function of collector emitter
voltage
(inductive load, TJ=175°C, VGE=0/15V,
IC=40A, RG=12Ω,
Dynamic test circuit in Figure E)
Rev. 2.4
23.09.2014
IKW40N120T2
nd
TRENCHSTOP™ 2 Generation Series
Ciss
240V
960V
10V
c, CAPACITANCE
VGE, GATE-EMITTER VOLTAGE
15V
1nF
Coss
5V
100pF
0V
0nC
50nC
100nC
0V
150nC
IC(sc), SHORT CIRCUIT COLLECTOR CURRENT
15µs
10µs
5µs
12V
14V
16V
20V
300A
200A
100A
0A
18V
VGE, GATE-EMITTER VOLTAGE
Figure 19. Short circuit withstand time as a
function of gate-emitter voltage
(VCE=600V, start at TJ 175°C)
IFAG IPC TD VLS
10V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 18. Typical capacitance as a function of
collector-emitter voltage
(VGE=0V, f = 1 MHz)
tSC,
SHORT CIRCUIT WITHSTAND TIME
QGE, GATE CHARGE
Figure 17. Typical gate charge
(IC=40 A)
0µs
Crss
12V
14V
16V
18V
VGE, GATE-EMITTER VOLTAGE
Figure 20. Typical short circuit collector
current as a function of gate-emitter
voltage
(VCE 600V, Tj,start = 175C)
9
Rev. 2.4
23.09.2014
IKW40N120T2
nd
VCE
600V
60A
400V
40A
200V
20A
IC, COLLECTOR CURRENT
VCE, COLLECTOR-EMITTER VOLTAGE
TRENCHSTOP™ 2 Generation Series
40A
IC
400V
200V
20A
VCE
IC
0V
0.4us
0us
0.8us
0A
1.2us
0A
0us
D=0.5
-1
10 K/W
0.2
0.1
R,(K/W)
0.064
0.074
0.162
0.010
0.05
-2
10 K/W
, (s)
3.67*10-4
3.92*10-3
1.92*10-2
3.40*10-1
0.02
0.01
R1
R2
single pulse
C 1 = 1 /R 1
1.2us
0.8us
R,(K/W)
0.112
0.163
0.234
0.015
R1
R2
C 1 = 1 /R 1
100µs
1ms
10ms
C 2 = 2 /R 2
100ms
tP, PULSE WIDTH
Figure 23. IGBT transient thermal impedance
(D = tp / T)
IFAG IPC TD VLS
, (s)
2.80*10-4
3.27*10-3
1.71*10-2
2.68*10-1
C 2 = 2 /R 2
-3
10 K/W
10µs
0V
0.4us
t, TIME
Figure 22. Typical turn off behavior
(VGE=15/0V, RG=12Ω, Tj = 175C,
Dynamic test circuit in Figure E)
ZthJC, TRANSIENT THERMAL IMPEDANCE
t, TIME
Figure 21. Typical turn on behavior
(VGE=0/15V, RG=12Ω, Tj = 175C,
Dynamic test circuit in Figure E)
ZthJC, TRANSIENT THERMAL IMPEDANCE
600V
60A
10
tP, PULSE WIDTH
Figure 24. Diode transient thermal impedance
as a function of pulse width
(D=tP/T)
Rev. 2.4
23.09.2014
nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
8µC
500ns
TJ=175°C
400ns
300ns
200ns
TJ=25°C
TJ=175°C
Qrr, REVERSE RECOVERY CHARGE
trr, REVERSE RECOVERY TIME
600ns
6µC
4µC
TJ=25°C
2µC
100ns
0ns
400A/µs
800A/µs
1200A/µs
0µC
400A/µs
1600A/µs
diF/dt, DIODE CURRENT SLOPE
Figure 23. Typical reverse recovery time as a
function of diode current slope
(VR=600V, IF=40A,
Dynamic test circuit in Figure E)
800A/µs
1200A/µs
1600A/µs
diF/dt, DIODE CURRENT SLOPE
Figure 24. Typical reverse recovery charge as
a function of diode current slope
(VR=600V, IF=40A,
Dynamic test circuit in Figure E)
-1000A/µs
TJ=25°C
TJ=175°C
35A
dirr/dt, DIODE PEAK RATE OF FALL
OF REVERSE RECOVERY CURRENT
Irr,
REVERSE RECOVERY CURRENT
40A
30A
TJ=25°C
25A
20A
15A
10A
5A
-800A/µs
TJ=175°C
-600A/µs
-400A/µs
-200A/µs
0A
400A/µs
800A/µs
1200A/µs
1600A/µs
-0A/µs
400A/µs
diF/dt, DIODE CURRENT SLOPE
Figure 25. Typical reverse recovery current as
a function of diode current slope
(VR=600V, IF=40A,
Dynamic test circuit in Figure E)
IFAG IPC TD VLS
11
800A/µs
1200A/µs
1600A/µs
diF/dt, DIODE CURRENT SLOPE
Figure 26. Typical diode peak rate of fall of
reverse recovery current as a
function of diode current slope
(VR=600V, IF=40A,
Dynamic test circuit in Figure E)
Rev. 2.4
23.09.2014
IKW40N120T2
nd
TRENCHSTOP™ 2 Generation Series
150A
2.5V
TJ = 25°C
IF=80A
175°C
VF, FORWARD VOLTAGE
IF, FORWARD CURRENT
125A
100A
75A
50A
2.0V
40A
1.5V
1.0V
20A
8A
0.5V
25A
0A
0V
1V
2V
0.0V
3V
VF, FORWARD VOLTAGE
Figure 27. Typical diode forward current as a
function of forward voltage
IFAG IPC TD VLS
12
0°C
50°C
100°C
150°C
TJ, JUNCTION TEMPERATURE
Figure 28. Typical diode forward voltage as a
function of junction temperature
Rev. 2.4
23.09.2014
nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
IFAG IPC TD VLS
13
Rev. 2.4
23.09.2014
IKW40N120T2
nd
TRENCHSTOP™ 2 Generation Series
i,v
tr r =tS +tF
diF /dt
Qr r =QS +QF
tr r
IF
tS
QS
Ir r m
tF
QF
10% Ir r m
dir r /dt
90% Ir r m
t
VR
Figure C. Definition of diodes
switching characteristics
1
2
r1
n
r2
rn
Tj (t)
p(t)
r1
r2
rn
Figure A. Definition of switching times
TC
Figure D. Thermal equivalent
circuit
Figure E. Dynamic test circuit
.
Figure B. Definition of switching losses
IFAG IPC TD VLS
14
Rev. 2.4
23.09.2014
nd
IKW40N120T2
TRENCHSTOP™ 2 Generation Series
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the
types in question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or
systems and/or automotive, aviation and aerospace applications or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable
to assume that the health of the user or other persons may be endangered.
IFAG IPC TD VLS
15
Rev. 2.4
23.09.2014