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IM241S6S1BAUMA1

IM241S6S1BAUMA1

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    PowerSMD23 模块

  • 描述:

    功率驱动器模块 IGBT 三相反相器 600 V 2 A 23-PowerSMD 模块

  • 数据手册
  • 价格&库存
IM241S6S1BAUMA1 数据手册
Confidential IM241 Series CIPOS™ Micro IPM 600 V, 2 A IM241 Series Description IM241-S6 is a 3-phase Intelligent Power Module (IPM) designed for high-efficiency appliance motor drives such as fans and pumps. This IPM is available in both fast and slow speeds for low loss and low EMI operation respectively. Features • • • • • • • • • • 600V 3-phase inverter including gate drivers & bootstrap function Reverse Conducting IGBT Gen 2 (RCD2) optimized for motor drives Temperature monitor Accurate overcurrent shutdown (±5%) Fault reporting and programmable fault clear Advanced input filter with shoot-through protection Optimized dV/dt for loss and EMI trade offs Open-emitter for single and leg-shunt current sensing 3.3V logic compatible Isolation 2000VRMS, 1min SOP 29x12 DIP 29x12 Potential Applications Fans • Pumps • Product validation Qualified for industrial applications according to the relevant tests of JEDEC47/20/22. Table 1 Product Information Base Part Number Package Type IM241-S6T2y IM241-S6S1y Standard Pack Form Quantity DIP 29x12 Tube 240 SOP 29x12 Tube 240 Tape & Reel 500 y = B (fast speed for low losses; for x = S, M, L) or J (slow speed for low EMI; for x = S, M) Final Datasheet www.infineon.com Please read the Important Notice and Warnings at the end of this document Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Table of contents Table of contents Description 1 Features 1 Potential Applications ..................................................................................................................... 1 Product validation .......................................................................................................................... 1 Table of contents ............................................................................................................................ 2 1 Internal Electrical Schematic .......................................................................................... 3 2 2.1 2.2 Pin Configuration........................................................................................................... 4 Pin Assignment ........................................................................................................................................ 4 Pin Descriptions....................................................................................................................................... 5 3 3.1 3.2 3.3 Absolute Maximum Rating .............................................................................................. 7 Module ..................................................................................................................................................... 7 Inverter .................................................................................................................................................... 7 Control ............................................................................................................................................................ 7 4 Thermal Characteristics ................................................................................................. 8 5 Recommended Operating Conditions ............................................................................... 9 6 6.1 6.2 Static Parameters ......................................................................................................... 10 Inverter .................................................................................................................................................. 10 Control ................................................................................................................................................... 10 7 7.1 7.2 Dynamic Parameters ..................................................................................................... 12 Inverter .................................................................................................................................................. 12 Control ................................................................................................................................................... 13 8 Thermistor Characteristics ............................................................................................ 14 9 Mechanical Characteristics and Ratings........................................................................... 15 10 Qualification Information .............................................................................................. 16 11 11.1 11.2 11.3 11.4 Diagrams & Tables ........................................................................................................ 17 TC Measurement Point ........................................................................................................................... 17 Backside Curvature Measurement Points ............................................................................................ 17 Input-Output Logic Table ...................................................................................................................... 18 Switching Time Definitions ................................................................................................................... 19 12 12.1 12.2 12.3 Application Guide ......................................................................................................... 20 Typical Application Schematic ............................................................................................................. 20 TJ vs TTH .................................................................................................................................................. 21 –VS Immunity ......................................................................................................................................... 22 13 13.1 13.2 Package Outline ........................................................................................................... 23 DIP 29x12 ............................................................................................................................................... 23 SOP 29x12 .............................................................................................................................................. 24 14 Revision History ........................................................................................................... 25 Final Datasheet www.infineon.com 2 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Internal Electrical Schematic 1 Internal Electrical Schematic 1 VSS 17 P 2 VB(U) 3 VDD1 4 HIN (U) 5 LIN (U) Half-Bridge HVIC 18 U/V S(U) 19 NU 6 RFE 7 VB(V) 20 NV 8 VDD2 9 HIN (V) 10 L IN (V) Half-Bridge HVIC 21 V/VS(V) 11 VTH 12 V B(W) 22 NW 13 V DD3 14 H IN (W) 15 L IN (W) Half-Bridge HVIC 23 W/VS(W) 16 I TRIP Figure 1 Internal electrical schematic. Final Datasheet www.infineon.com 3 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Pin Configuration 2 Pin Configuration 2.1 Pin Assignment 16 14 12 10 8 6 4 2 15 13 11 9 7 5 3 1 e 23 22 21 Pin Assignment 20 Table 2 19 Module pinout 18 17 Figure 2 Pin Name Description 1 VSS Logic ground 2 VB(U) U-phase high-side floating IC supply voltage 3 VDD1 Low-side control supply 1 4 HIN(U) U-phase high-side gate driver input 5 LIN(U) U-phase low-side gate driver input 6 RFE RCIN / Fault / Enable 7 VB(V) V-phase high-side floating IC supply voltage 8 VDD2 Low-side control supply 2 9 HIN(V) V-phase high-side gate driver input 10 LIN(V) V-phase low-side gate driver input 11 VTH Thermistor output 12 VB(W) W-phase high-side floating IC supply voltage 13 VDD3 Low-side control supply 3 14 HIN(W) W-phase high-side gate driver input 15 LIN(W) W-phase low-side gate driver input 16 ITRIP Over-current protection input 17 P DC bus voltage positive 18 U/VS(U) Motor U-phase output, U-phase high-side floating IC supply offset voltage 19 NU U-phase low-side emitter 20 NV U-phase low-side emitter -phase low-side emitter 21 V/VS(V) Motor V-phase output, V-phase high-side floating IC supply offset voltage 22 NW W-phase low-side emitter 23 W/VS(W) Motor W-phase output, W-phase high-side floating IC supply offset voltage Final Datasheet www.infineon.com 4 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Pin Configuration 2.2 Pin Descriptions HIN(U,V,W) and LIN(U,V,W) (Low side and high side control pins) The IC shuts down all the gate drivers power outputs, when the VDD supply voltage is below VDDUV- = 10.9V. This prevents the external power switches from critically low gate voltage levels during on-state and therefore from excessive power dissipation. These pins are positive logic and they are responsible for the control of the integrated IGBT. The Schmitt-trigger input thresholds of them are such to guarantee LSTTL and CMOS compatibility down to 3.3V controller outputs. Pull-down resistor of about 800k is internally provided to pre-bias inputs during supply start-up and an ESD diode is provided for pin protection purposes. Input Schmitt-trigger and noise filter provide beneficial noise rejection to short input pulses. VB (U,V,W) and VS (U,V,W) (High side supplies) VB to VS is the high side supply voltage. The high side circuit can float with respect to VSS following the external high side power device source voltage. Due to the low power consumption, the floating driver stage is supplied by integrated bootstrap circuit. The noise filter suppresses control pulses which are below the filter time TFILIN. The filter acts according to Figure 4. The under-voltage detection operates with a rising supply threshold of typical VBSUV+ = 11.1V and a falling threshold of VBSUV- = 10.9V. CIPOSTM VS(U,V,W) provide a high robustness against negative voltage in respect of VSS. This ensures very stable designs even under rough conditions. Schmitt-Trigger HINx LINx INPUT NOISE FILTER  0.8M SWITCH LEVEL VIH; VIL COM Figure 3 NU, NV, NW (Low side emitters) Input pin structure a) tFILIN b) The low side emitters are available for current measurements of each phase leg. It is recommended to keep the connection to pin VSS as short as possible in order to avoid unnecessary inductive voltage drops. tFILIN HIN LIN HIN LIN HO LO HO LO high Figure 4 low VTH (Thermistor output) Input filter timing diagram A UL certified NTC resistor is integrated in the module with one terminal of the chip connected to VSS and the other to VTH. When pulled up to a rail voltage such as VDD or 3.3V by a resistor, the VTH pin provides an analog voltage signal corresponding to the temperature of the thermistor. The integrated gate drive provides additionally a shoot through prevention capability which avoids the simultaneous on-state of the high-side and lowside switch of the same inverter phase. A minimum deadtime insertion of typically 300ns is also provided by driver IC, in order to reduce crossconduction of the external power switches. RFE (RCIN / Fault / Enable) The RFE pin combines 3 functions in one pin: RCIN or RC-network based programmable fault clear timer, fault output and enable input. VDDX, VSS (Low side control supply and reference) VDD is the control supply and it provides power both to input logic and to the output power stage. Input logic is referenced to VSS ground. The RFE pin is normally connected to an RC network on the PCB per the schematic in Figure 5. Under normal operating conditions, RRCIN pulls the RFE pin to 3.3V, thus enabling all the functions in the IPM. The microcontroller can pull this pin low to disable the IPM functionality. This is is the Enable function. The under-voltage circuit enables the device to operate at power on when a supply voltage of at least a typical voltage of VDDUV+ = 11.1V is present. Final Datasheet www.infineon.com 5 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Pin Configuration VRFE(t) = 3.3V * e-t/RC < VRFECRCIN < 350ns / ( - ln (VRFE- / 3.3V) * RRFE_ON) +3.3V To Microcontroller 6 RFE Consider VRFE- of 0.8V and RRFE_ON of 50ohm, CRCIN should be less than 5nF. It is also suggested to use a RRCIN of between 0.5MΩ and 2MΩ. IM231-L6 RRCIN CRCIN HIN Figure 5 Input Noise filter Deadtime & Shoot-Through Prevention Typical PCB circuit connected to the RFE pin LIN Input Noise filter VDD Undervoltage detection COM The Fault function allows the IPM to report a Fault condition to the microncontroller by pulling the RFE pin low in one of two situations. The first is an undervoltage condition on VDD and the second is when the ITRIP pin sees a voltage rising above VIT,TH+. ITRIP The programmable fault clear timer function provides a means of automatically re-enabling the module operation a preset amount of time (TFLT-CLR) after the fault condition has disappeared. Figure 6 shows the RFE-related circuit block diagram inside the IPM. RFE ITRIP Noise filter Noise filter The length of TFLT-CLR can be determined by using the formula below. VRFE(t) = 3.3V * (1 – e-t/RC) Figure 6 TFLT-CLR = -RRCIN * CRCIN * ln(1-VRFE +/3.3V) U/VS(U) , V/VS(V), W/VS(W) (High side emitter and low side collector) For example, if RRCIN is 1.2MΩ and CRCIN is 1nF, the TFLTCLR is about 1.7ms with VRFE + of 2.2V. It is also important to note that CRCIN needs to be minimized in order to make sure it is fully discharged in case of over current event. These pins are connected to motor U, V, W input pins. P (Positive bus input voltage) Since the ITRIP pin has a 500ns input filter, it is appropriate to ensure that CRCIN will be discharged below VRFE- by the open-drain MOSFET, after 350ns. Therefore, the max CRCIN can be calculated as: Final Datasheet www.infineon.com RFE internal circuit structure The high side IGBTs are connected to the bus voltage. It is noted that the bus voltage should not exceed 450V. 6 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Absolute Maximum Rating 3 Absolute Maximum Rating 3.1 Module Table 3 Parameter Symbol Storage temperature Condition Units TSTG -40 ~ 150 °C Operating case temperature TC -40 ~ 125 °C Operating junction temperature TJ -40 ~ 150 °C Isolation test voltage VISO 2000 V 3.2 Inverter Table 4 IM241-S6 Parameter Max. blocking voltage Symbol 1min, RMS, f = 60Hz Condition VCES/VRRM Units 600 V Output current IO TC = 25°C 2 A Peak output current IOP TC = 25°C, tp < 1ms 3 A Peak power dissipation per IGBT Ptot TC = 25°C 9 W Short circuit withstand time TSC VDD=15V, VDC ≤400V, TJ=150°C Allowed number of short circuits: 500ns - - 50 ns Internal dead time Matching propagation delay time (on and off) for same phase high-side and low-side Final Datasheet www.infineon.com DTIC MT 13 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Thermistor Characteristics 8 Thermistor Characteristics Table 13 Parameter Symbol Conditions Min. Typ. Max. Units Resistance R25 TC = 25°C, ±5% tolerance 44.65 47 49.35 kΩ Resistance R125 TC = 125°C 1.27 1.39 1.51 kΩ B-constant (25/100) B - 4006 - K -20 - 150 °C ±1% tolerance Temperature Range +3.3V 4.0 Thermistor Pin Readout Voltage VTH (V) REX T VTH 3.5 R 3.0 2.5 max typ min 2.0 1.5 1.0 0.5 0.0 0 Figure 7 TTH [℃] Rmin [kΩ] Rtyp [kΩ] Rmax [kΩ] 50 15.448 16.432 17.436 60 10.483 11.194 11.924 70 7.245 7.765 8.302 80 5.092 5.477 5.876 90 3.648 3.937 4.237 100 2.653 2.872 3.101 110 1.957 2.125 2.301 120 1.462 1.592 1.729 125 1.269 1.384 1.505 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Thermistor Temperature TTH (°C) Thermistor resistance – temperature curve, for REXT=9.76kΩ, and thermistor resistance variation with temperature. Final Datasheet www.infineon.com 14 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Mechanical Characteristics and Ratings 9 Mechanical Characteristics and Ratings Table 14 Parameter Symbol Comparative Tracking Index CTI Curvature of module backside BC Mounting Torque τ Weight Final Datasheet www.infineon.com Conditions Min. Typ. Max. Units 550 - - V See Figure 9 -50 - 50 µm M3 screw & washer, thermal grease 0.4 0.8 1.2 Nm M3 screw & washer, SIL-PAD 1500ST - 0.6 1.0 Nm - 3 - g W 15 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Qualification Information 10 Qualification Information Table 15 UL Certification UL-US-L252584-15-22508102-2 Moisture sensitivity level (SOP 29 x 12 only) MSL3 RoHS Compliant Yes ESD Human body model 1C Charge discharge model C3 Final Datasheet www.infineon.com 16 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Diagrams & Tables 11 Diagrams & Tables 11.1 TC Measurement Point 10.15 mm 4.05 mm Figure 8 TC measurement point 11.2 Backside Curvature Measurement Points Figure 9 Curvature measurement points Final Datasheet www.infineon.com 17 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Diagrams & Tables 11.3 Input-Output Logic Table V+ HIN U,V,W HO (4,9,14) LIN U,V,W U,V,W (5,10,15) IC Driver (18,21,23) ITRIP (16) LO RFE (6) Figure 10 Module block diagram Table 16 RFE ITRIP HIN U,V,W LIN U,V,W U,V,W 1 0 1 0 V+ 1 0 0 1 0 1 0 0 0 ‡ 1 0 1 1 ‡ 1 1 x x ‡ 0 x x x ‡ ‡ Voltage depends on direction of phase current Final Datasheet www.infineon.com 18 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Diagrams & Tables 11.4 Switching Time Definitions HINx LINx 2.1V 0.9V trr toff ton 10% iCx 90% 90% tf tr 10% 10% 10% 10% vCEx tc(on) tc(off) Figure 11 Switching times definition HIN(U, V, W) LIN(U, V, W) ITRIP 50% 50% TFLT 50% RFE U, V, W 50% 50% TITRIP Figure 12 TFL T-CLR ITRIP time waveform RFE 50% TEN U, V, W Figure 13 50% Output disable timing diagram Final Datasheet www.infineon.com 19 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Application Guide 12 Application Guide 12.1 Typical Application Schematic #10 P (26) (1) VS(U) (2) VB(U) RC -IGBT VB1 HO1 U (25) VS(U) (3) VS(V) RC -IGBT #4 (4) VB(V) VB2 V (24) VS(V) (5) VS(W) (6) VB(W) HO2 3-ph AC Motor RC -IGBT VB3 HO3 #3 W (23) VS(W) 5 or 3.3V 15V #8 VDD VDD VT H #5 (9) VSS RC -IGBT VSS #9 5 or 3.3V Micro Controller LO1 #2 (11) ITRIP (12) RFE (13) HIN(U) (14) HIN(V) (14) HIN(W) (15) LIN(U) (16) LIN(V) RC -IGBT HIN(U) LO2 #6 HIN(V) Power GND line RC -IGBT LIN(U) LIN(V) #7 NV (21) HIN(W) LO3 LIN(W) NW (20) #1 Figure 14 NU (22) RFE Control GND line (17) LIN(W) ITRIP Application schematic Final Datasheet www.infineon.com 20 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Application Guide 12.2 TJ vs TTH Figure 15 Typical TJ vs TTH correlation without heatsink (AN-2021-08 for reference) Figure 16 Typical TJ vs TTH correlation with heatsink and Rthc-amb = 7 K/W (AN-2021-08 for reference) Final Datasheet www.infineon.com 21 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Application Guide 12.3 –VS Immunity 0 -10 VS (V) -20 -30 -40 -50 -60 0 Figure 17 100 200 300 Time (ns) 400 500 Negative transient Vs SOA for integrated gate driver Final Datasheet www.infineon.com 22 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Package Outline 13 Package Outline 13.1 DIP 29x12 Dimensions in mm Final Datasheet www.infineon.com 23 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Package Outline 13.2 SOP 29x12 Dimensions in mm Final Datasheet www.infineon.com 24 Revision 1.6 2022-06-26 CIPOS™ Micro IM241 Series Revision History 14 Revision History Major changes since the last revision Page or Reference Final Datasheet www.infineon.com Description of change 25 Revision 1.6 2022-06-26 Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2022-06-26 Published by Infineon Technologies AG 81726 München, Germany © 2022 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Email: erratum@infineon.com Document reference IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application.
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