FAN53501UCX

Features Description             The FAN53501 is a step-dow n sw itching voltage regulator that delivers a fixed 1.82 V from an input voltage supply of 2.7 V to 5.5 V. Using a proprietary architecture w ith synchronous rectification, the FAN53501 is capable of delivering 600 mA at over 90% efficiency, w hile maintaining a very high efficiency of over 80% at load currents as low as 1 mA. The regulator operates at a nominal fixed frequency of 3 MHz at full load, w hich reduces the value of the external components to 1 µH for the output inductor and 4.7 µF for the output capacitor. 3 MHz Fixed-Frequency Operation 16 µA Typical Quiescent Current 600 mA Output Current Capability 2.7 V to 5.5 V Input Voltage Range 1.82 V Fixed Output Voltage Synchronous Operation Pow er-Save Mode Soft-Start Capability Active Discharge During Shutdow n Input Under-Voltage Lockout (UVLO) Thermal Shutdow n and Overload Protection 5-Bump - 1.00 x 1.37 mm WLCSP The FAN53501 is available in a 5-bump Wafer-Level ChipScale Package (WLCSP). Applications      At moderate and light loads, pulse frequency modulation is used to operate the device in pow er-save mode w ith a typical quiescent current of 16µA. Even w ith such a low quiescent current, the part exhibits excellent transient response during large load sw ings. At higher loads, the system automatically sw itches to fixed-frequency control, operating at 3 MHz. In shutdow n mode, the supply current drops below 1 µA, reducing pow er consumption. Cell Phones, Smart-Phones Pocket PCs WLAN DC-DC Converter Modules PDA, DSC, PMP, and MP3 Players Portable Hard Disk Drives Ordering Information Part Number FAN53501UCX Operating Temperature Range -40°C to 85°C Package 5-Ball, Type-1, WL-CSP, 1x1.37mm, 0.5mm Pitch Packing Method Tape and Reel FAN53501AUCX © 2010 Semiconductor Components Industries, LLC. October-2017, Rev . 2 Publication Order Number: FAN53501/D FAN53501 — 3MHz, 600mA Step-Down DC-DC Converter in Wafer-Level Chip-Scale Packaging FAN53501 3MHz, 600mA Step-Down DC-DC Converter in Wafer-Level Chip-Scale Packaging 4.7µF VIN CIN VIN A1 A3 B2 EN C1 GND L1 SW 1µH C3 FB VOUT 4.7µF C OUT Figure 1. Typical Application, Show n w ith Bum ps Facing Dow n Block Diagram VIN Current Limit Bias EN + 1.8V Reference Modulator Logic SW Driver - FB 3MHz OSC Zero Crossing Figure 2. Block Diagram GND Pin Configuration VIN A1 A3 GND B2 EN C1 GND A3 SW SW FB C3 C3 FB Figure 3. Bum ps Facing Dow n A1 VIN B2 C1 EN Figure 4. Bum ps Facing Up Pin Definitions Pin # Name Description A1 V IN Pow er Supply Input. A3 GND Ground Pin. Signal and pow er ground for the part. C1 EN Enable Pin. The device is in shutdow n mode w hen voltage to this pin is 1.2V. Do not leave this pin floating. C3 FB Feedback Analog Input. Connect directly to the output capacitor. B2 SW Sw itching Node . Connection to the internal PFET sw itch and NFET synchronous rectifier. www.onsemi.com 2 FAN53501 — 3MHz, 600mA Step-Down DC-DC Converter in Wafer-Level Chip-Scale Packaging Typical Application Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Min. Max. Unit Input Voltage w ith Respect to GND -0.3 6.0 V Voltage on Any Other Pin w ith Respect to GND -0.3 V IN V TJ Junction Temperature -40 +150 °C TST G Storage Temperature -65 +150 °C +260 °C V IN TL Parameter Lead Temperature (Soldering, 10 Seconds) ESD Electrostatic Discharge Protection Level Human Body Model, JESD22-A114 4.5 Charged Device Model, JESD22-C101 1.5 Machine Model, JESD22-A115 200 kV V Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter V CC Supply Voltage Range IOUT Output Current L Min. Typ. Max. Unit 2.7 5.5 V 0 600 mA Inductor 0.7 1.0 3.0 µH Input Capacitor 3.3 4.7 12.0 µF Output Capacitor 3.3 4.7 12.0 µF TA Operating Ambient Temperature -40 +85 °C TJ Operating Junction Temperature -40 +125 °C Max. Units CIN COUT Thermal Properties Symbol ΘJA Parameter Min. Junction-to-Ambient Thermal Resistance (1) Typ. 180 °C/W Note: 1. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured w ith fourlayer 1s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA . www.onsemi.com 3 FAN53501 — 3MHz, 600mA Step-Down DC-DC Converter in Wafer-Level Chip-Scale Packaging Absolute Maximum Ratings Minimum and maximum values are at V IN = 2.7 V to 5.5 V, TA = -40°C to +85°C, CIN = COUT = 4.7 µF, L = 1 µH, unless otherw ise noted. Typical values are at TA = 25°C, V IN =3.6 V. Symbol Parameter Conditions Min. Typ. Max. Units Pow er Supplies IQ I(SD) Quiescent Current Shutdow n Supply Current V UVLO Under-Voltage Lockout Threshold V (ENH) Enable HIGH-Level Input Voltage V (ENL) Enable LOW-Level Input Voltage I(EN) Enable Input Leakage Current Device Not Sw itching, EN=V IN 16 Device Sw itching, EN=V IN 18 25 µA 0.05 1.00 µA V IN = 3.6 V, EN = GND µA Rising Edge 1.8 2.1 Falling Edge 1.75 1.95 1.2 V V 0.4 V 0.01 1.00 µA 2.5 3.0 3.5 MHz ILOAD = 0 to 600 mA 1.775 1.820 1.865 V CCM 1.784 1.820 1.856 V 300 µs EN = V IN or GND Oscillator f 0SC Oscillator Frequency Regulation VO Output Voltage Accuracy tSS Soft-Start EN = 0 -> 1 Output Driver RDS(on) PMOS On Resistance V IN = V GS = 3.6 V 180 m NMOS On Resistance V IN = V GS = 3.6 V 170 m (2) ILIM PMOS Peak Current Limit Open-Loop 650 800 900 mA RDIS Output Discharge Resistance EN = GND 700  TT SD Thermal Shutdow n CCM Only 150 °C THYS Thermal Shutdow n Hysteresis 20 °C Note: 2. The Electrical Characteristics table reflects open-loop data. Refer to Operation Description and Typical Characteristic for closed-loop data. www.onsemi.com 4 FAN53501 — 3MHz, 600mA Step-Down DC-DC Converter in Wafer-Level Chip-Scale Packaging Electrical Characteristics The FAN53501 is a step-dow n sw itching voltage regulator that delivers a fixed 1.82 V from an input voltage supply of 2.7 V to 5.5 V. Using a proprietary architecture w ith synchronous rectification, the FAN53501 is capable of delivering 600mA at over 90% efficiency, w hile maintaining a light load efficiency of over 80% at load currents as low as 1 mA. The regulator operates at a nominal frequency of 3 MHz at full load, w hich reduces the value of the external components to 1 µH for the output inductor and 4.7 µF for the output capacitor. Control Scheme The FAN53501 uses a proprietary non-linear, fixedfrequency PWM modulator to deliver a fast load transient response, w hile maintaining a constant sw itching frequency over a w ide range of operating conditions. The regulator performance is independent of the output capacitor ESR, allow ing for the use of ceramic output capacitors. Although this type of operation normally results in a sw itching frequency that varies w ith input voltage and load current, an internal frequency loop holds the sw itching frequency constant over a large range of input voltages and load currents. For very light loads, the FAN53501 operates in discontinuous current (DCM) single-pulse PFM mode, w hich produces low output ripple compared w ith other PFM architectures. Transition betw een PWM and PFM is seamless, w ith a glitch of less than 14 mV at V OUT during the transition betw een DCM and CCM modes. Combined w ith exceptional transient response characteristics, the very low quiescent current of the controller (