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FSUSB22_0506

FSUSB22_0506

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    FSUSB22_0506 - Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
FSUSB22_0506 数据手册
FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch January 2005 Revised June 2005 FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch General Description FSUSB22 is a low power high bandwidth switch specially designed for applications of the switching of high speed USB 2.0 signals in handset and consumer applications such as cell phone, digital camera, and notebook with hubs or controllers of limited USB I/O. The wide bandwidth (750MHz) of this switch allows signals to pass with minimum edge and phase distortion. Superior channel-to-channel crosstalk results in minimal interference. It is compatible with USB2.0 Hi-Speed standard. Features s 40dB OFF Isolation at 250MHz s 40dB non-adjacent channel crosstalk at 250MHz s 4.5: typical On Resistance (RON) s 3dB bandwidth: 750MHz s Low power consumption (1uA max) s Control input: TTL compatible s Bidirectional operation s USB Hi-Speed and Full Speed signaling capability Applications • Cell phone, PDA, digital camera, and notebook Ordering Code: Order Number FSUSB22BQX FSUSB22QSC FSUSB22QSCX_NL (Note 1) FSUSB22MTC FSUSB22MTCX_NL (Note 1) Package Number Package Description MLP016E 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm MQA16 MQA16 MTC16 MTC16 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide Pb-Free 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pb-Free 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only. © 2005 Fairchild Semiconductor Corporation DS500899 www.fairchildsemi.com FSUSB22 Analog Symbol Connection Diagrams Pin Assignments for QSOP and TSSOP Pin Descriptions Pin Name OE S A B1–B2 Description Bus Switch Enable Select Input Bus A Bus B Pad Assignments for DQFN Truth Table S X L H OE H L L Function Disconnect A A B1 B2 www.fairchildsemi.com 2 FSUSB22 Absolute Maximum Ratings(Note 2) Supply Voltage (VCC) DC Switch Voltage (VS) DC Input Voltage (VIN) (Note 3) DC Input Diode Current (lIK) VIN  0V DC Output (IOUT) Sink Current DC VCC/GND Current (ICC /IGND) Storage Temperature Range (TSTG) ESD Human Body Model 4kV 0.5V to 4.6V 0.5V to VCC 0.05V 0.5V to 4.6V 50 mA 128 mA Recommended Operating Conditions (Note 4) Power Supply Operating (VCC) Input Voltage (VIN) Output Voltage (VOUT) Input Rise and Fall Time (tr, tf) Switch Control Input Switch I/O Free Air Operating Temperature (TA) 0 ns/V to 5 ns/V 0 ns/V to DC 3.0V to 3.6V 0V to VCC 0V to VCC r100 mA 65qC to 150 qC 40 qC to 85 qC Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The Recommended Operating Conditions tables will define the conditions for actual device operation. Note 3: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Note 4: Unused control inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol VIK VIH VIL II IOFF RON Parameter Clamp Diode Voltage HIGH Level Input Voltage LOW Level Input Voltage Input Leakage Current OFF-STATE Leakage Current Switch On Resistance (Note 6) VCC (V) 3.0 3.0 - 3.6 3.0 - 3.6 3.6 3.6 3.0 3.0 5.0 4.5 0.3 1.0 1.0 2.0 0.8 TA Min 40 qC to 85 qC Typ (Note 5) Max Units V V V IIN Conditions 1.2 18 mA r1.0 r1.0 7.0 6.5 PA PA : : : : PA 0 d VIN d 3.6V 0 d A, B d VCC VIN ION VIN ION VIN IOUT VIN 0.8V 8 mA 3.0V 8 mA 0.8V, VIN 8 mA VCC or GND, IOUT 0 0V - 1.5V, ION 8 mA 'RON RFLAT(ON) ICC Delta RON On Resistance Flatness (Note 7) Quiescent Supply Current 3.0V and TA 3.0 3.0 3.6 25qC Note 5: Typical values are at VCC Note 6: M easured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (A or B) pins. Note 7: Flatness is defined as the difference between the maximum and minimum value On Resistance over the specified range of conditions. 3 www.fairchildsemi.com FSUSB22 AC Electrical Characteristics Symbol tON tOFF tPD OIRR XTALK BW Parameter Turn ON Time S-to-Bus B Turn OFF Time S-to-Bus B Propagation Delay Non-Adjacent OFF-Isolation Non-Adjacent Channel Crosstalk VCC (V) 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.3V and T A TA Min 40qC to 85qC Typ (Note 8) 4.5 2.5 0.25 Max 6.0 4.0 Units ns ns ns dB dB MHz CL f RL RL 10 pF 250MHz, RL 50 : 50 : Conditions Figure Number Figures 5, 6 Figures 5, 6 Figure 10 Figure 7 Figure 8 Figure 9 30.0 38.0 750 50:, f 250MHz 3dB Bandwidth Note 8: Typical values are at VCC 25qC USB Related AC Electrical Characteristics Symbol tSK(O) tSK(P) TJ Parameter Channel-to-Channel Skew Skew of Opposite Transition of the Same Output Total Jitter 3.3V and T A (Note 9) Units ns ns ns CL CL RL tR 10 pF 10 pF 50:, CL tF 10 pF Conditions Figure Number Figures 10, 11 Figures 10, 11 VCC (V) 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 25qC TA Min 40qC to 85qC Typ 0.051 0.020 0.210 Max 750ps at 480 Mbps Note 9: Typical values are at VCC Capacitance Symbol CIN CON COFF (Note 10) Parameter TA 40qC to 85qC Typ 2.5 12.0 4.5 Units pF pF pF VCC VCC 0V Conditions Control Pin Input Capacitance A/B ON Capacitance Port B OFF Capacitance 3.3V and TA 3.3V, OE 0V VCC and OE 3.3V Note 10: Typical values are at VCC 25qC FIGURE 1. Gain vs. Frequency www.fairchildsemi.com 4 FSUSB22 FIGURE 2. OFF Isolation FIGURE 3. Crosstalk FIGURE 4. RON 5 www.fairchildsemi.com FSUSB22 AC Loading and Waveforms Note: Input driven by 50: source terminated in 50 : Note: CL includes load and stray capacitance Note: Input PRR 1.0 MHz, t W 500 ns FIGURE 5. AC Test Circuit FIGURE 6. AC Waveforms FIGURE 7. OFF Isolation Test FIGURE 8. Crosstalk Test FIGURE 9. Bandwidth Test www.fairchildsemi.com 6 FSUSB22 AC Loading and Waveforms (Continued) FIGURE 10. Propagation Delay Pulse Skew tSK(P) Output Skew tSK(O) FIGURE 11. Skew Test 7 www.fairchildsemi.com FSUSB22 Tape and Reel Specification Tape Format for DQFN Package Designator BQX Tape Section Leader (Start End) Carrier Trailer (Hub End) TAPE DIMENSIONS inches (millimeters) Number Cavities 125 (typ) 2500/3000 75 (typ) Cavity Status Empty Filled Empty Cover Tape Status Sealed Sealed Sealed www.fairchildsemi.com 8 FSUSB22 Physical Dimensions inches (millimeters) unless otherwise noted 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Number MLP016E 9 www.fairchildsemi.com FSUSB22 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide Package Number MQA16 www.fairchildsemi.com 10 FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch Physical Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC16 Technology Description The Fairchild Switch family derives from and embodies Fairchild’s proven switch technology used for several years in its 74LVX3L384 (FST3384) bus switch product. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 11 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com www.fairchildsemi.com
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