MMPQ6502

M MPQ6502 MMPQ6502 E2 B2 E3 B E4 4 B3 E1 B1 SOIC-16 C1 Pin #1 C2 C1 C C2 3 C C4 4 C3 TRANSISTOR TRANSISTOR C1 B1 C3 B3 E1 & E3 & C 2 B2 E 2 C4 B4 E4 TYPE NPN PNP Quad NPN & PNP General Purpose Amplifier These complimentary devices can be used in medium power amplifiers, drivers and switches with collector currents to 500 mA. These devices are best used when space is the primary consideration. Sourced from Process 19 & 63. See PN2222A (NPN) & PN2907A (PNP) for characteristics. Absolute Maximum Ratings* Symbol VCEO VCBO VEBO IC TJ, Tstg Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous TA = 25°C unless otherwise noted Parameter Collector-Emitter Voltage Value 30 60 5.0 1.0 -55 to +150 Units V V V A °C Operating and Storage Junction Temperature Range *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Thermal Characteristics Symbol PD RθJA TA = 25°C unless otherwise noted Characteristic Total Device Dissipation Derate above 25°C Thermal Resistance, Junction to Ambient Effective 4 Die Each Die Max MMPQ6502 1000 8.0 125 240 Units mW mW/°C °C/W °C/W  1 997 Fairchild Semiconductor Corporation MMPQ6502, Rev B M MPQ6502 Quad NPN & PNP General Purpose Amplifier (continued) Electrical Characteristics Symbol Parameter TA = 25°C unless otherwise noted Test Conditions Min Max Units OFF CHARACTERISTICS V(BR)CEO V(BR)CBO V(BR)EBO ICBO IEBO Collector-Emitter Breakdown Voltage* Collector-Base Breakdown Voltage Emitter-Base Breakdown Voltage Collector-Cutoff Current Emitter-Cutoff Current IC = 10 mA, IB = 0 IC = 10 µA, IE = 0 IE = 10 µA, IC = 0 VCB = 50 V, IE = 0 VEB = 3.0 V, IC = 0 30 60 5.0 30 30 V V V nA nA ON CHARACTERISTICS* hFE DC Current Gain VCE = 10 V, IC = 1.0 mA VCE = 10 V, IC = 10 mA VCE = 10 V, IC = 150 mA VCE = 10 V, IC = 300 mA IC = 150 mA, IB = 15 mA IC = 300 mA, IB = 30 mA IC = 150 mA, IB = 15 mA IC = 300 mA, IB = 30 mA 50 75 100 30 0.4 1.4 1.3 2.0 V V V V VCE(sat) VBE(sat) Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS Cob Cib fT Output Capacitance Input Capacitance Current-Gain Bandwidth Product VCB = 10 V, f = 1.0 MHz VBE = 2.0 V, f = 1.0 MHz IC = 50 mA, VCE = 20 V, f = 100 MHz 200 8.0 30 pF pF MHz *Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0% SOIC-16 Tape and Reel Data and Package Dimensions SOIC(16lds) Packaging Configuration: Figure 1.0 Packaging Description: EL ECT ROST AT IC SEN SIT IVE DEVICES DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S TNR D ATE PT NUMB ER PEEL STREN GTH MIN ___ __ ____ __ ___gms MAX ___ ___ ___ ___ _ gms Antistatic Cover Tape ESD Label SOIC-16 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). This and some other options are further described in the Packaging Information table. These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. Static Dissipative Embossed Carrier Tape F63TNR Label Customized Label SOIC (16lds) Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code) TNR 2,500 13" Dia 343x64x343 5,000 0.1437 0.7735 L86Z Rail/Tube 45 530x130x83 13,500 0.1437 - FD85AB NDM3001 FD85AB NDM3001 FD85AB NDM3001 FD85AB NDM3001 SOIC-16 Unit Orientation FD85AB NDM3001 Pin 1 343mm x 342mm x 64mm Standard Intermediate box ESD Label F63TNR Label sample LOT: CBVK741B019 FSID: NDM3000 QTY: 2500 SPEC: F63TNR Label F63TNR Label ESD Label D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F (F63TNR)3 SOIC(16lds) Tape Leader and Trailer Configuration: Figure 2.0 Carrier Tape Cover Tape Components Trailer Tape 640mm minimum or 80 empty pockets Leader Tape 1680mm minimum or 210 empty pockets October 1999, Rev. B SOIC-16 Tape and Reel Data and Package Dimensions, continued SOIC(16lds) Embossed Carrier Tape Configuration: Figure 3.0 T E1 P0 D0 F K0 Wc B0 E2 W Tc A0 P1 D1 User Direction of Feed Dimensions are in millimeter Pkg type SOIC(16lds) (16mm) A0 6.60 +/-0.30 B0 10.35 +/-0.25 W 16.0 +/-0.3 D0 1.55 +/-0.05 D1 1.60 +/-0.10 E1 1.75 +/-0.10 E2 14.25 min F 7.50 +/-0.05 P1 8.0 +/-0.1 P0 4.0 +/-0.1 K0 2.40 +/-0.40 T 0.450 +/-0.150 Wc 13.0 +/-0.3 Tc 0.06 +/-0.02 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 10 deg maximum Typical component cavity center line 0.9mm maximum B0 10 deg maximum component rotation 0.9mm maximum Sketch A (Side or Front Sectional View) Component Rotation A0 Sketch B (Top View) Typical component center line Sketch C (Top View) Component lateral movement SOIC(16lds) Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max B Min Dim C Dim A max Dim D min Dim N DETAIL AA See detail AA W3 13" Diameter Option W2 max Measured at Hub Dimensions are in inches and millimeters Tape Size 16mm Reel Option 13" Dia Dim A 13.00 330 Dim B 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 Dim N 4.00 100 Dim W1 0.646 +0.078/-0.000 16.4 +2/0 Dim W2 0.882 22.4 Dim W3 (LSL-USL) 0.626 – 0.764 15.9 – 19.4 July 1999, Rev. B SOIC-16 Tape and Reel Data and Package Dimensions, continued SOIC-16 (FS PKG Code S3) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.1437 October 1999, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ CoolFET™ CROSSVOLT™ E2CMOSTM FACT™ FACT Quiet Series™ FAST® FASTr™ GTO™ HiSeC™ DISCLAIMER ISOPLANAR™ MICROWIRE™ POP™ PowerTrench  QFET™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 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PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. D