CPC1135NTR

CPC1135N 350V, 120mArms/mADC Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 120 35 Units VP mArms / mADC  Description The CPC1135N is a miniature, normally-closed, single-pole (1-Form-B) solid state relay that uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Its optically coupled output, which uses the patented OptoMOS architecture, is controlled by a highly efficient infrared LED. Features • 1500Vrms Input/Output Isolation • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Small 4-Pin SOP Package • Tape & Reel Version Available • Flammability Rating UL 94 V-0 IXYS Integrated Circuits' state of the art doublemolded vertical construction packaging enables the CPC1135N to be one of the world’s smallest 4-pin solid state relays. It offers board space savings over the competitor’s larger 4-pin SOP relay. Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1135N CPC1135NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally-Closed Devices Form-B IF ILOAD 10% toff DS-CPC1135N-R10 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION CPC1135N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Capacitance, Input to Output Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 3.33 mW / ºC Ratings 350 5 50 1 150 400 1 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW pF Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V t =10ms IL=120mA IF=2mA, VL=350VP IL ILPK RON ILEAK - - 120 ±350 35 5 mArms / mADC mAP  IF=2mA, VL=50V, f=1MHz ton toff COUT - 25 2 2 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.6 0.55 1.36 - 2 1.5 10 IF=5mA, VL=10V µA ms pF mA mA V µA Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60°C) a minimum LED drive current of 4mA is recomended. www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION CPC1135N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 10 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 0.50 0.55 0.60 0.65 0.70 20 15 10 5 30 30.5 31 5 0.45 0.50 20 15 10 5 0.75 20 15 10 5 0 0.21 31.5 0.55 0.60 0.65 0.70 LED Current (mA) Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) 25 0 0 29.5 10 0.75 Typical Turn-On Time (N=50, IF=5mA, IL=120mA) 25 Device Count (N) 25 29 15 LED Current (mA) Typical On-Resistance Distribution (N=50, IL=120mA) 28.5 20 0 0.45 30 Device Count (N) 15 0 0 35 20 Device Count (N) Device Count (N) 25 Typical IF for Switch Dropout (N=50, IL=120mA) 25 Device Count (N) 30 Typical IF for Switch Operation (N=50, IL=120mA) 0.22 0.23 0.24 0.25 0.26 0.27 0.50 0.60 Turn-On Time (ms) On-Resistance (:) 0.70 0.80 0.90 1.00 Turn-Off Time (ms) 1.10 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 365 395 Typical Load Current vs. Load Voltage (IF=0mA) 150 2.5 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 100 Load Current (mA) LED Current (mA) LED Forward Voltage Drop (V) 3.0 1.7 375 380 385 390 Blocking Voltage (VP) Typical IF for Switch Operation vs. Temperature (IL=50mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 370 2.0 1.5 1.0 0.5 1.1 -50 -25 0 25 50 Temperature (ºC) 75 100 0 -50 -100 0 1.0 50 -150 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -6 -4 -2 0 2 4 6 Load Voltage (V) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R10 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1135N PERFORMANCE DATA* Turn-Off Time (ms) Turn-On Time (ms) 0.6 0.5 0.4 0.3 0.2 0.1 0 5 10 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 15 20 25 30 35 40 45 5 10 15 10 20 25 30 35 40 45 50 -40 -20 0 20 40 60 Typical Turn-On Time vs. Temperature (IL=50mA) Typical Turn-Off Time vs. Temperature (IL=50mA) Maximum Load Current vs. Temperature (IF=0mA) 0 20 40 60 80 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 IF=5mA -20 0 395 0.014 390 0.012 375 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 100 0.010 0.008 0.006 0 -40 -20 0 20 40 60 80 100 80 60 40 -20 0 20 40 60 80 Temperature (ºC) Energy Rating Curve 0.002 365 120 120 -40 Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=2mA, VL=350V) 0.004 370 100 140 0 100 Load Current (A) 0.016 380 100 20 IF=10mA 400 385 180 80 160 -40 100 Leakage (µA) Blocking Voltage (VP) 20 Temperature (ºC) Typical Blocking Voltage vs. Temperature -20 30 LED Forward Current (mA) Temperature (ºC) -40 40 0 0 IF=5mA -20 60 50 50 IF=10mA -40 Typical On-Resistance vs. Temperature (IF=0mA, IL=120mA) LED Forward Current (mA) Turn-Off Time (ms) Turn-On Time (ms) 0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Load Current (mA) 0.7 Typical Turn-Off Time vs. LED Forward Current (IL=120mA) On-Resistance (:) Typical Turn-On Time vs. LED Forward Current (IL=120mA) 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms Temperature (ºC) 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION CPC1135N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1135N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1135N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R10 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1135N Mechanical Dimensions CPC1135N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 0.60 (0.024) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 2.030± 0.025 (0.080± 0.001) 0.481 (0.019) 0-0.1 (0-0.004) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) 0.381 ± 0.025 (0.015 ± 0.001) 3.85 (0.152) 1.54 (0.061) 2.54 (0.10) Dimensions mm (inches) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm CPC1135NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1135N-R10 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 8/5/2021