BLM31PG601SN1L

Spec. No. JENF243A-0006V-01 Reference Only Chip Ferrite Bead BLM31□□□□□SN1□ P.1/9 Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM31_SN Series. 2. Part Numbering (ex.) BL M 31 PG 601 (1) (2) (3) (4) (5) (1)Product ID (2)Type (3)Dimension (L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz S N 1 L (6) (7) (8) (9) (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging (L:Taping / B:Bulk) 3. Rating MURATA Part Number BLM31PG330SN1L BLM31PG330SN1B BLM31PG500SN1L BLM31PG500SN1B BLM31PG121SN1L BLM31PG121SN1B BLM31PG391SN1L BLM31PG391SN1B BLM31PG601SN1L BLM31PG601SN1B BLM31SN500SN1L BLM31SN500SN1B BLM31KN121SN1L BLM31KN121SN1B BLM31KN271SN1L BLM31KN271SN1B BLM31KN471SN1L BLM31KN471SN1B BLM31KN601SN1L BLM31KN601SN1B BLM31KN801SN1L BLM31KN801SN1B BLM31KN102SN1L BLM31KN102SN1B 33±25% 33±25% 35 min. 35 min. 120±25% 120±25% 390±25% 390±25% 600±25% 600±25% 50±12.5Ω 50±12.5Ω 120±25% 120±25% 270±25% 270±25% 470±25% 470±25% 600±25% 600±25% 800±25% 800±25% 1000±25% 1000±25%  Operating Temperature: -55°C to +125°C Rated Current at 85℃ (mA) (Note1) 6000 6000 3500 3500 3500 3500 2000 2000 1500 1500 12000 12000 6000 6000 4500 4500 4000 4000 2900 2900 2500 2500 2000 2000 Rated Current at 125℃ (mA) (Note1) 3500 3500 2300 2300 2000 2000 1250 1250 1000 1000 10000 10000 4000 4000 3000 3000 2700 2700 2000 2000 1700 1700 1400 1400 DC DC Resistance Resistance Initial After Remark Values Testing () max. () max. For DC power line 0.009 0.018 0.009 0.018 For DC power line 0.015 0.03 For DC power line 0.015 0.03 For DC power line 0.02 0.04 For DC power line 0.02 0.04 For DC power line 0.05 0.10 For DC power line 0.05 0.10 For DC power line 0.08 0.16 For DC power line 0.08 0.16 For DC power line 0.0016 0.0021 For DC power line 0.0016 0.0021 For DC power line 0.009 0.011 For DC power line 0.009 0.011 For DC power line 0.016 0.019 For DC power line 0.016 0.019 For DC power line 0.02 0.024 For DC power line 0.02 0.024 For DC power line 0.038 0.045 For DC power line 0.038 0.045 For DC power line 0.05 0.06 For DC power line 0.05 0.06 For DC power line 0.075 0.09 For DC power line 0.075 0.09 For DC power line  Storage Temperature: -55°C to +125°C （Note1）Rated Current is derated as right figure depending on the operating temperature. R a te d C u r re n t ( A ) Customer Part Number Impedance () (at 100MHz) 85℃x Describe the Rated current as x[A] in case of more than 1A. 1 125℃ 0 85 125 Operating Temperature (°C) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0006V-01 P.2/9 4. Style and Dimensions 1.6±0 .2 3.2 ±0.2 ■ Equivalent Circuit T 0.7 ±0.3 ( : Electrode Item BLM31PG***SN1* BLM31SN***SN1* BLM31KN***SN1* Dimension “T” 1.1±0.2 1.1±0.2 1.6±0.2 ) Resistance element becomes dominant at high frequencies. ■ Unit Mass (Typical value) BLM31PG***SN1* : 0.025 g BLM31SN***SN1* : 0.025 g BLM31KN***SN1* : 0.041 g (in mm) 5.Marking No marking. 6. Standard Testing Conditions  Unless otherwise specified  Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH))  In case of doubt  Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7. Specifications 7-1. Electrical Performance No. Item 7-1-1 Impedance Specification Meet item 3. 7-1-2 DC Resistance Meet item 3. Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 7-2. Mechanical Performance No. Item 7-2-1 Appearance and Dimensions 7-2-2 Bonding Strength Specification Meet item 4. Test Method Visual Inspection and measured with Slide Calipers. Meet Table 1. It shall be soldered on the substrate. Applying Force(F) : 9.8N Applying Time : 5s±1s Applied direction:Parallel to substrate Table 1 Appearance Impedance Change (at 100MHz) DC Resistance No damage Ｆ Within ±30% Side view Ｆ R0.5 Meet item 3. Substrate 7-2-3 Bending Strength It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm40mm1.6mm Deflection: 1.0mm Speed of Applying Force : 0.5mm/s Pressure jig Keeping Time : 30s R340 F Deflection 45mm MURATA MFG.CO., LTD. 45mm Product Spec. No. JENF243A-0006V-01 No. Item 7-2-4 Vibration 7-2-5 Resistance to Soldering Heat Reference Only Specification P.3/9 Test Method Meet Table 1. It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Meet Table 2. Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Table 2 Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Appearance No damage Immersion and emersion rates : 25mm/s Impedance Within ±30% Change (for BLM31SN,KN Then measured after exposure in the room condition for 48h±4h. (at 100MHz) within ±50%) DC Meet item 3. Resistance 7-2-6 Drop Products shall be no failure after tested. 7-2-7 Solderability The electrodes shall be at least 95% covered with new solder coating. It shall be dropped on concrete or steel board. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction (Total 9 times) Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 4s±1s Immersion and emersion rates : 25mm/s 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Temperature Meet Table 2. Cycle 7-3-2 Humidity 7-3-3 Heat Life 7-3-4 Cold Resistance Test Method 1 cycle: 1 step: -55 °C(+0 °C,-3 °C) / 30min±3min 2 step: Ordinary temp. / 10min to 15min 3 step: +125 °C(+3 °C,-0 °C) / 30min±3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : 85°C±3°C Applying Current : Rated Current Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : -55±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. MURATA MFG.CO., LTD. Reference Only 2.0±0.05 4.0±0.1 4.0±0.1 1.75±0.1 8. Specification of Packaging 8-1. Appearance and Dimensions (8mm-wide plastic tape)  1.5+0.1 3.5±0.1 3.5±0.05 -0 +0.3 1.9±0.1 Item BLM31PG***SN1* BLM31SN***SN1* BLM31KN***SN1* Direction of feed  1.0- 0 P.4/9 1.3±0.1 T 0.2±0.1 8.0±0.3 Spec. No. JENF243A-0006V-01 Dimension “T” 1.3±0.1 1.3±0.1 1.75±0.1 (in mm) *Dimension of the Cavity is measured at the bottom side. (1) Taping Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch and plastic tape continuously and sealed by cover tape. (2) Sprocket hole : The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point : The cover tape has no spliced point. (4) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2. Tape Strength (1)Pull Strength Plastic tape Cover tape 5N min. 10N min. 165 to 180 degree (2) Peeling off force of Cover tape 0.2N to 0.7N (Minimum value is typical.) *Speed of Peeling off:300mm/min F Cover tape Plastic tape 8-3. Taping Condition (1) Standard quantity per reel Type BLM31PG/BLM31SN BLM31KN Quantity per 180mm reel 3000 pcs. / reel 2500 pcs. / reel (2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows. (3) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number (1), RoHS marking (2) , Quantity, etc) 1) « Expression of Inspection No. » □□ OOOO  (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day 2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) (4) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2), Quantity, etc) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0006V-01 P.5/9 (5) Dimensions of reel and taping (leader-tape, trailer-tape) Trailer 160 min. 2.0±0.5 Leader Label 190 min. 210 min. Empty tape Cover tape  13.0±0.2 +1  60 -0  21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 (in mm) +0  180 -3 8-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. 9. ！ Caution 9-1. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (vehicles,trains,ships,etc.) (4)Power plant control equipment (9)Applications of similar complexity and /or reliability requirements (5)Medical equipment to the applications listed in the above MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0006V-01 P.6/9 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing Standard land dimensions (Flow and Reflow soldering) Chip Ferrite Bead Type a 1.2 BLM31PG BLM31KN 2.0 4.2 to 5.2 Rated Current (A) 1.5/2 3.5 6 10～12 Land pad thickness and dimension a 18µm 1.2 2.4 6.4 - 35µm 1.2 1.2 3.3 9.8 70µm 1.2 1.2 1.65 4.9 Solder Resist BLM31SN Pattern (in mm) *The excessive heat by land pads may cause deterioration at joint of products with substrate. Land dimensions on Flow soldering for 2.5mm pitch mounting Chip Ferrite Bead *Taking land pad thickness and rated current into account. 2 .5 m m p itc h a 2.0 e b 4.2 to 5.2 c 1.2 d 1.3 e 1.35 (in mm) e a *The pattern shall be designed to above drawing to prevent causing the solder bridge when products are mounted by 2.5mm pitch flow soldering. c b d c e a b Solder Resist e d Pattern 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 m (2) Soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0006V-01 (3) soldering profile □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile 150℃、60s min. 250℃、4～6s 2 times Limit Profile 265℃±3℃、5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times 10-3. Reworking with soldering iron Pre-heating: 150°C, 1 min Tip temperature: 350°C max. Soldering time : 3(+1,-0) seconds. Soldering iron output: 80W max.  Tip diameter:φ3mm max.  Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG.CO., LTD. P.7/9 Reference Only Spec. No. JENF243A-0006V-01 P.8/9 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a Products shall be located in the sideways direction (Length:ab) to the mechanical stress. b 〈 Poor example 〉 〈 Good example 〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Stress Level A > D *1 A > B A > C C Perforation B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. MURATA MFG.CO., LTD. Spec. No. JENF243A-0006V-01 Reference Only P.9/9 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3) Cleaner 1.Alternative cleaner Isopropyl alcohol (IPA) 2.Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11. Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions Products should be stored the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.  Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11 . ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.