BNX024H01B

Reference Only Spec.No. JENF243H-9101E-01 SMD Block Type EMIFIL BNX02□H01□ P 1/ 13 Murata Standard Reference Specification [AEC-Q200] 1.Scope This reference specification applies to Block Type EMIFIL BNX02□H01 Series for Automotive Electronics based on AEC-Q200. 2.Part Numbering BN Product ID X Type 024 H 01 L Serial No. Category Features Packaging Code （for Automotive Electronics）(L :Taping(178mm reel) / K :Taping(330mm reel) / B :Bulk) 3.Rating Customer’s Part Number Part Number Capacitance BNX024H01L BNX024H01K BNX024H01B BNX025H01L BNX025H01K BNX025H01B BNX026H01L BNX026H01K BNX026H01B BNX027H01L BNX027H01K BNX027H01B Rated Rated Withstanding DC Insulation Current Voltage Voltage Resistance Resistance  4.7μF ±15% 50V (DC) 125V (DC) 20A (DC) 0.43mΩ ±0.20mΩ 100MΩ min. 10μF ±15% 25V (DC) 62.5V (DC) 20A (DC) 0.43mΩ ±0.20mΩ 50MΩ min. 10μF 10 ±20% 50V (DC) 125V (DC) 20A (DC) 0.43mΩ ±0.20mΩ 10MΩ min. 22μF 20 ±40% 16V (DC) 40V (DC) 20A (DC) 0.43mΩ ±0.20mΩ 1MΩ min. Insertion Loss 35dB min. (100kHz to 1GHz) 35dB min. (50 kHz to 1GHz) 35dB min. (50KHz to 1GHz) 35dB min. (40KHz to 1GHz) ESD Voltage Rank Drop 2:2kV 45 mV max. 45mV max. 2 45mV max. 45mV max.  Rated current is derated according to operating temperature. Rated Current (A)  Operating Temperature : - 55 °C to + 125 °C  Storage Temperature : - 55 °C to + 125 °C 20 15 1 85 125 Operating Temperature (°C) 4.Standard Testing Condition Temperature : Ordinary Temp. 15 °C to 35 ºC Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Temperature : 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86kPa to 106kPa MURATA MFG.CO.,LTD. Reference Only Spec.No. JENF243H-9101E-01 5.Style and Dimensions ※Coplanarity 0.10mm max. ■Equivalent Circuit Ｌ１ Ｌ３ ① Ｃ２ ② Ｃ１ Ｌ２ ④ ③ ①B ：Bias ②CB ：Circuit + Bias ③PSG ：Power Supply Ground ④CG ：Circuit Ground ■ Unit Mass(Typical value) 0.86g 6.Marking Filter shall be marked as follows. (1) Murata Mark : (2) Part Number : BNX024H01：（ ＢＮＸ０２４ ） BNX025H01：（ ＢＮＸ０２５ ） BNX026H01：（ ＢＮＸ０２６ ） BNX027H01：（ ＢＮＸ０２７ ） (3) Polarity Marking : ○ MURATA MFG.CO.,LTD. P 2/ 13 Spec.No. JENF243H-9101E-01 Reference Only P 3/ 13 7.Electrical Performance No. 7.1 Item Insertion Loss Specification Meet item 3. Test Method 50 10dB Attenuator Balun (1) (2) Specimen (3) 50 50 10dB Attenuator (4) E 50 ～ SG  Method of measurement based on MIL-STD-220 7.2 Capacitance 7.3 DC Resistance Insulation Resistance 7.4 7.5 Withstanding Voltage Filter shall be no failure. 7.6 Voltage Drop Meet item 3. Insertion Loss = -20 log E1/E0 (dB) E0 : Level without FILTER (short) E1 : Level with FILTER Measuring Equipment : Agilent 8753C or the equivalent Measured by the following condition between Terminal ①② and ③④. (see item 5.) Frequency : 1 ± 0.1kHz (except BNX027) 120 ± 24Hz (BNX027) Voltage : 1 V(rms) max. (except BNX027) 0.5±0.1V(rms) (BNX027) Measuring Equipment : HP 4278A or the equivalent (except BNX027) HP 4284A or the equivalent (BNX027) Measured by the way of 4 terminal method between① and ② and between ③ and ④. (see item 5.) Measured at DC rated voltage between terminal ①② and ③④. (see item 5.) Time : 60 s max Charging current : 50 mA max. Measuring Equipment : R8340A or the equivalent Withstanding voltage shall be applied between terminal ① ② and ③④. (see item 5.) Test Voltage : BNX024 125V(DC) BNX025 62.5V(DC) BNX026 125V(DC) BNX027 40V(DC) Time : 5 ± 1 s Charging current : 50 mA max. After soldering the part on the test substrate, measure the voltage with passing the rated current as shown in the schematic below. A (1) V Specimen (2) Where the terminals of the part shall be connected as follows: Referring to the terminal No. shown in item 5, connect terminal No. ② and ④ by soldering copper wire with diameter more than 1mm / length less than 6mm. Then connect terminal No. ① as (1) and terminal No. ③ as (2) the measurement circuit as mentioned above. The probe for measuring the voltage shall be touched on the solder fillet of ①③. MURATA MFG.CO.,LTD. Spec.No. JENF243H-9101E-01 Reference Only 8. Q200 Requirement 8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 No. Stress 3 High Temperature Exposure (Storage) 4 Temperature Cycling 5 7 8 9 10 12 13 Destructive Physical Analysis Biased Humidity AEC-Q200 Test Method 1000hours at 125C Set for 24hours at room temperature, then measured. 1000cycles(-55C to 125C) Measurement at 24±2 hours after test conclusion. Per EIA469 No electrical tests Not Applicable External Visual Physical Dimension Resistance to Solvents Mechanical Shock Measurement at 24+/-2 hours after test conclusion. Visual inspection No abnormalities Meet ITEM 4 No defects (Style and Dimensions) Per MIL-STD-202 Method 215 Not Applicable Vibration 15 17 Resistance to Soldering Heat ESD 18 Solderbility Per J-STD-002 19 Electrical Measured :Capacitance Characterization Flammability Per UL-94 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Terminal Per AEC-Q200-006 Strength A force of 17.7N for 60sec Electrical Per ISO-7637-2 Transient Conduction 30 Meet Table A after testing. Measurement at 24+/-2 hours after test conclusion. Operational Life 1000hours at 125C Meet Table A after testing. Apply Maximum rated Voltage. 14 22 Meet Table A after testing. 1000hours 85C/85%RH. Meet Table B after testing. Apply Maximum rated Voltage. Per MIL-STD-202 Method 213 Figure 1 of Method 213. Condition F(1500g's/0.5ms/Half sine) Three times each 6 direction. 5g's for 20 minutes, 12cycles each of 3 oritentations Osscillation Frequency : 10-2000Hz. No heating. 260C +/- degree C Immersion time 10s Per AEC-Q200-002 20 21 Murata Specification / Deviation Meet Table C after testing. Meet Table C after testing. Pre-heating: 150C+/-5C, 60s+/-5s Meet Table D after testing. Meet Table C after testing. ESD Rank: Refer to Item 3. Rating. Method b : Not Applicable 75% of the terminations is to be soldered. No defects Not Applicable Meet Table D after testing. 17.7N for 60sec No defects Not Applicable MURATA MFG.CO.,LTD. P 4/ 13 Spec.No. JENF243H-9101E-01 Reference Only P 5/ 13 Table A Appearance Capacitance Change I.R. No damaged Within +/-12.5% (BNX024/BNX025) Within +/-15% (BNX026/BNX027) 10MΩ min. (BNX024) 5M Ω min. (BNX025) 1MΩ min. (BNX026) 0.1M Ω min. (BNX027) Table B Appearance Capacitance Change I.R. No damaged Within +/-12.5% (BNX024/BNX025) Within +/-15% (BNX026/BNX027) 5MΩ min. (BNX024) 2.5M Ω min. (BNX025) 1MΩ min. (BNX026) 0.1M Ω min. (BNX027) Table C Appearance No damaged Capacitance Change Within +/-15% 100MΩ min. (BNX024) 50M Ω min. (BNX025) 10MΩ min. (BNX026) 1M Ω min. (BNX027) No damaged I.R. Withstanding Voltage Table D Appearance Capacitance Change I.R. Withstanding Voltage No damaged Within +/-7.5% (BNX024/BNX025) Within +/-15% (BNX026/BNX027) 100MΩ min. (BNX024) 50M Ω min. (BNX025) 10MΩ min. (BNX026) 1M Ω min. (BNX027) No damaged ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. MURATA MFG.CO.,LTD. Reference Only Spec.No. JENF243H-9101E-01 P 6/ 13 9.Insertion Loss Characteristics (I.L.) (Typ.) BNX024H01 BNX025H01／BNX026H01 BNX027H01 10. Specification of Packaging 10.1 Appearance and Dimensions (24mm-wide plastic tape) (1) plastic tape 4.0×10pitch=40.0±0.2 4.0×10pich=40.0±0.2 Cavity 2.0±0.1 0.5  1.5± 0 12.4 ±0.1 11.5±0.1 0.1  1.5± 0 9.4±0.1 0.3±0.1 24.0±0.2 4.0±0.1 1.75±0.1 Sprocket Hole 3.3±0.1 3.6±0.1 12.0±0.1 Direction of feed (in:mm) *Dimension of the Cavity is measured at the bottom side. MURATA logo mark MURATA MFG.CO.,LTD. 2 2 0 X N B BNX024 2 2 0 X N B BNX024 2 2 0 X N B BNX024 (2)Direction of the product Reference Only Spec.No. JENF243H-9101E-01 P 7/ 13 10.2 Specification of Taping (1) Packing quantity (standard quantity) 178mm reel : 400 pcs. / reel 330mm reel : 1500 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the plastic tape and sealed with cover tape. (3) Spliced point The cover tape have no spliced point. (4) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3 Pull Strength of Plastic Tape and Cover Tape Plastic tape Cover tape 10N min. 165 to 180 degree F Cover tape 10.4 Peeling off force of Cover tape Plastic tape 0.2N to 0.7N (minimum value is typical)  Speed of Peeling off : 300 mm / min 10.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. [ Packaging Code:L (178mm reel) ] Trailer 160 min. 2.0±0.5 Leader 210 min. 190 min. Label Empty tape Cover tape  13.0±0.2  62± 0.5  21.0±0.8 Direction of feed 2.2±0.1  178±0.5 24.8～26.5 (in:mm) [ Packaging Code:K (330mm reel) ] 2.0±0.5 Trailer 160 min. Leader 190 min. Label Empty tape 210 min. Cover tape  13.0±0.2  100± 1.0  21.0±0.8 Direction of feed 2±0.2 25.5±0.5  330±2.0 (in:mm) MURATA MFG.CO.,LTD. Reference Only Spec.No. JENF243H-9101E-01 P 8/ 13 10.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc 1) « Expression of Inspection No. » (1) Factory Code (2) Date □□ (1) OOOO  (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS discrimination(2) , Quantity , etc 10.8 Specification of Outer Case Label Reel H D W 178mm 330mm Outer Case Dimensions (mm) W D H 186 186 93 340 340 Standard Reel Quantity in Outer Case (Reel) 85 3 2 Above Outer Case size is typical. It depends on a quantity of an order. 11. ! Caution 11.1 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where dust rises. (4) in the atmosphere where rapidly thermal change occurs. 11.2.Direction of mounting Please make sure of the direction of mounting and connect to the circuit properly. As shown in the equivalent circuit shown in item 5, this product has a directionality. Wrong connection to the circuit may cause open/short circuit of the part, burnout and serious accidents. 11.3.Caution (Rating) < Self-heating > Though this product has a large rated current,following attention should be paid. (1) Do not use this product beyond the ratings such as rated voltage and rated current/derating condition. Then burnout may occurred by self-heating. (2)After installing this product in your product, please make sure of the self-heating with the rated current. 11.4. Attention regarding product's lay out < Attention regarding the heat generated by other products > Please provide special attention when mounting products in close proximity to other products that radiate heat. Failure to follow the above cautions may result, worst case, in a short circuit and cause fuming or firing when the product is used. 11.5. Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. MURATA MFG.CO.,LTD. Spec.No. JENF243H-9101E-01 Reference Only P 9/ 13 11.6.ESD ESD to this product, exceeding condition of IEC61000-4-2 with 30kV, may cause short circuit and fuming or firing. 11.7.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(trains,ships,etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 11.8 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 12.Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive.  12.1. Flux and Solder Flux Solder Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water soluble flux. Use Sn-3.0Ag-0.5Cu solder Other flux (except above) Please contact us for details, then use. 12.2. Note for Assembling When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs. Products can only be soldered with reflow. The use in flow soldering be reserved. < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 °C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. 12.3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. 〔Products direction〕 a b 〈 Poor example〉 Products shall be locatedin the sideways direction (Length:ab) to the mechanical stress. 〈 Good example〉 MURATA MFG.CO.,LTD. Reference Only Spec.No. JENF243H-9101E-01 P 10/ 13 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation A C B D Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended Portion of Perforation 12.4. Attention Regarding P.C.B. Design < The Arrangement of Products > P.C.B. shall be designed so that products are far from the portion of perforation. The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation.   Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) × P.C.B. ○ ○ Portion of Perforation ○ P.C.B. < Products Placing > Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. Product × × Product Hole Pick up nozzle P.C.B. Support pin < P.C.B. Separation > P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. MURATA MFG.CO.,LTD. Spec.No. JENF243H-9101E-01 Reference Only P 11/ 13 12.5. Standard Land Dimensions 12.5 CG 10.2 9.9 9.6 B CB PSG CG 7.1 6.2 5.3 2.8 2.3 Copper foil pattern Copper foil pattern+Resist CG 0 Etchedarea Through hole 0 3.8 5.8 10.3 13.2 13.7 17.5 （in ： mm） (1)Design the land pads for this part as shown above on both side printed circuit board ( or a multiple layered substrate ). (2) This product is designed to meet large current. Please design PCB pattern which is connected to this product not to become too hot by applied large current. (3)Ground area of CG should be connected to ground layer on the other side (or ground layer of multiple layered substrate) with through holes as shown above. It is recommended to take the ground area as wide as possible. (4)It is recommended to use the connection to the ground layer with through holes and the ground layer to be circuit board wide. (5)Even in case that it isn't possible to use a both side printed circuit board ( or a multiple layered substrate ), the land pads for CG should be designed as wide as possible. 12.6. Reflow Soldering 1) Solder paste printing for reflow soldering ꞏ Standard thickness of solder paste should be 150 to 200 µm. Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up the terminal, being possible to lead to not enough connection between terminals and lands on the circuit board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual use condition. ꞏ For the solder paste printing pattern, use standard land dimensions. ꞏ For the resist and copper foil pattern, use standard land dimensions. ꞏ Use Sn-3.0Ag-0.5Cu solder MURATA MFG.CO.,LTD. Reference Only Spec.No. JENF243H-9101E-01 P 12/ 13 2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (°C) 260°C 245°C±3°C 220°C 230°C Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time.(s) Standard Profile Limit Profile 150°C ~ 180°C , 90s ± 30s above 220°C , 30s ~ 60s above 230°C , 60s max. 250°C ± 3°C 260°C , 10s 2 times 2 times 12.7. Reworking with Soldering iron ꞏ The following conditions shall be strictly followed when using a soldering iron. Soldering iron : 100W max. Tip temperature/ Soldering time : 450°C ± 5°C, 5s Note : Do not touch the products directly with the tip of the soldering iron. 12.8. Cleaning Conditions Don’t cleaning product due to non-waterproof construction. 12.9．Moisture-proof coat material Moisture–proof coating is made on inner parts of this product. The Moisture–proof coat material might appear on the surface of product,which doesn’t affect on the product performance. 12.10. Resin coating The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 1211. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO.,LTD. Spec.No. JENF243H-9101E-01 Reference Only P 13/ 13 12.12 Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition ꞏ Products should be stored in the warehouse on the following conditions. Temperature : - 10 °C to + 40 °C Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity ꞏ Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ꞏProducts should be stored on the palette for the prevention of the influence from humidity, dust and so on. ꞏProducts should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ꞏAvoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 13. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD.