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FGL60N100BNTD

FGL60N100BNTD

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    TO-264-3

  • 描述:

    此款为旧型号与FGL60N100BNTDTU无区别

  • 数据手册
  • 价格&库存
FGL60N100BNTD 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FGL60N100BNTD 1000 V, 60 A NPT Trench IGBT Features General Description • High Speed Switching Using Fairchild's proprietary trench design and advanced NPT technology, the 1000V NPT IGBT offers superior conduction and switching performances, high avalanche ruggedness and easy parallel operation. This device offers the optimum performance for hard switching application such as UPS, welder applications. • Low Saturation Voltage: VCE(sat) = 2.5 V @ IC = 60 A • High Input Impedance • Built-in Fast Recovery Diode Applications • UPS, Welder C G TO-264 3L G C E E Absolute Maximum Ratings Symbol Description Ratings Unit VCES Collector to Emitter Voltage 1000 V VGES Gate to Emitter Voltage  25 V Collector Current @ TC = 25oC 60 A Collector Current @ TC = 100oC 42 A ICM (1) Pulsed Collector Current @ TC = 25oC 200 A IF Diode Continuous Forward Current @ TC = 100oC 15 A W IC PD o Maximum Power Dissipation @ TC = 25 C 180 Maximum Power Dissipation @ TC = 100oC 72 W TJ Operating Junction Temperature -55 to +150 o Tstg Storage Temperature Range -55 to +150 o C TL Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds 300 o C C Notes: 1: Repetitive rating: Pulse width limited by max. junction temperature Thermal Characteristics Symbol RJC(IGBT) Parameter Ratings Thermal Resistance, Junction to Case RJC(Diode) Thermal Resistance, Junction to Case RJA Thermal Resistance, Junction to Ambient ©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 o C/W 2.08 o C/W 25 1 Unit 0.69 oC/W www.fairchildsemi.com FGL60N100BNTD — 1000 V, 60 A NPT Trench IGBT March 2014 Part Number Top Mark FGL60N100BNTD FGL60N100BNTD Package Packing Method TO-264 Tape Width Quantity N/A N/A 30 Tube Electrical Characteristics of the IGBT Symbol Reel Size Parameter TC = 25°C unless otherwise noted Test Conditions Min. Typ. Max. Unit 1000 - - V Off Characteristics BVCES Collector to Emitter Breakdown Voltage VGE = 0 V, IC = 1 mA ICES Collector Cut-Off Current VCE = VCES, VGE = 0 V - - 1 mA IGES G-E Leakage Current VGE = VGES, VCE = 0 V - - ±500 nA IC = 60 mA, VCE = VGE On Characteristics VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage 4.0 5.0 7.0 V IC =10 A, VGE = 15 V - 1.5 1.8 V IC = 60 A, VGE = 15 V, - 2.5 2.9 V - 6000 - pF VCE = 10 V, VGE = 0 V, f = 1MHz - 260 - pF - 200 - pF - 140 - ns - 320 - ns Dynamic Characteristics Cies Input Capacitance Coes Output Capacitance Cres Reverse Transfer Capacitance Switching Characteristics td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qge Gate to Emitter Charge Qgc Gate to Collector Charge VCC = 600 V, IC = 60 A, RG = 51 , VGE = 15 V, Inductive Load, TC = 25oC VCE = 600 V, IC = 60 A, VGE = 15 V, TC = 25oC Electrical Characteristics of the Diode Symbol VFM Parameter Diode Forward Voltage Test Conditions IF = 15 A trr Diode Reverse Recovery Time IF = 60 A, di/dt = 20 A/us IR Instantaneous VRRM = 1000 V FGL60N100BNTD Rev. C2 630 - ns 130 - ns - 275 - nC - 45 - nC - 95 - nC TC = 25°C unless otherwise noted IF = 60 A ©2000 Fairchild Semiconductor Corporation - 2 Min. Typ. Max Unit - 1.2 1.7 V - 1.8 2.1 V - 1.2 1.5 us - 0.05 2.0 uA www.fairchildsemi.com FGL60N100BNTD — 1000 V, 60 A NPT Trench IGBT Package Marking and Ordering Information Figure 1. Typical Output Characteristics 80 Collector Current, I C [A] 90 20V 15V 10V 9V Common Emitter TC = 25℃ 8V 70 60 40 7V 20 1 2 3 4 TC = 25℃ 60 TC = 125℃ 50 40 30 20 10 VGE = 6V 0 0 Common Emitter VGE = 15V TC = 25℃ ━━ TC = 125℃ ------ 80 Collector Current, I C [A] 100 Figure 2. Typical Saturation Voltage Characteristics 0 5 0 Collector-Emitter Voltage, VCE [V] 1 2 3 4 Collector-Emitter Voltage, VCE [V] Figure 3. Saturation Voltage vs. Case Temperature at Variant Current Level Figure 4. Saturation Voltage vs. VGE 10 Common Emitter O T C= - 40 C 3 Collector-Emitter Voltage, VCE[V] Collector-Emitter Voltage, VCE [V] Common Emitter VGE=15V 80A 60A 2 30A IC=10A 1 -50 0 50 100 8 6 IC=10A 0 150 4 Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V] 10 8 6 30A 60A 80A 2 IC = 10A 0 8 12 16 FGL60N100BNTD Rev. C2 16 20 Common Emitter TC = 125℃ 8 30A 6 60A 80A 4 2 IC = 10A 0 20 4 Gate-Emitter Voltage, VGE [V] ©2000 Fairchild Semiconductor Corporation 12 Figure 6. Saturation Voltage vs. VGE Common Emitter TC = 25℃ 4 8 Gate-Emitter Voltage, V GE [V] Figure 5. Saturation Voltage vs. VGE 4 60A 80A 2 Case Temperature, TC [℃] 10 30A 4 8 12 16 20 Gate-Emitter Voltage, VGE [V] 3 www.fairchildsemi.com FGL60N100BNTD — 1000 V, 60 A NPT Trench IGBT Typical Performance Characteristics Figure 7. Capacitance Characteristics Figure 8. Switching Loss vs. Gate Resistance 10000 VCC=600V, IC=60A 10000 VGE=? 5V Cies o Switching Time [ns] Capacitance [pF] T C=25 C 1000 Coes 100 Cres Tdoff 1000 Tr Tdon Tf 100 Common Emitter VGE = 0V, f = 1MHz T C = 25℃ 0 5 10 15 20 25 10 30 0 Collector-Emitter Voltage, VCE [V] 50 Figure 9. Switching Characteristics vs. Collector Current 20 200 Common Emitter VCC=600V, RL=10 Ω TC=25 ℃ Gate-Emitter Voltage,VGE [V] V CC =600V, Rg=51Ω V GE =± 15V, TC =25 ℃ Switching Time [ns] 150 Figure 10. Gate Charge Characteristics 1000 Tdoff Tf Tr 100 100 Gate Resistance, RG [? ] Tdon 15 10 5 0 10 20 30 40 50 0 60 50 100 150 200 250 300 Gate Charge, Qg [nC] Collector Current, I C [A] Figure 11. SOA Characteristics Figure 12. Forward Characteristics 100 IC MAX. (Pulsed) IC MAX. (Continuous) 50us Forward Current, IF[A] Collector Current , I C [A] 100 100us 10 1ms DC Operation 1 Single Nonrepetitive Pulse T C = 25℃ Curve must be darated linearly with increase in temperature 10 100 FGL60N100BNTD Rev. C2 1 0.0 1000 Collector-Emitter Voltage, V CE [V] ©2000 Fairchild Semiconductor Corporation TC = 25 ℃ 0.1 0.1 1 TC = 100 ℃ 10 0.5 1.0 1.5 2.0 2.5 Forward Voltage, VFM [V] 4 www.fairchildsemi.com FGL60N100BNTD — 1000 V, 60 A NPT Trench IGBT Typical Performance Characteristics Figure 13. Reverse Recovery Characteristics vs. di/dt 119 IF =60A 85 0.85 t rr 0.68 68 0.51 51 0.34 34 Irr 0.17 17 Reverse Recovery Time, trr [us] 102 1 .0 10 t rr 0 .8 8 I rr 0 .6 6 0 .4 4 0 0.00 0 40 80 120 160 200 240 10 20 di/dt [A/us] 30 40 50 Figure 16. Junction Capacitance 1000 250 100 TC = 150℃ Capacitance, Cj [pF] 1 0.1 T C= 25℃ 150 100 50 1E-3 0 T C = 25 ℃ 200 10 0.01 60 F o rw a rd C urre nt, IF [A ] Figure 15. Reverse Current vs. Reverse Voltage Reverse Current, IR [uA] 12 Reverse Recovery Current Irr [A] 1.02 d i/d t= -2 0 A /u s T C=25 ? 1 .2 T C =25? Reverse Recovery Current Irr [A] Reverse Recovery Time, trr [us] 1.19 Figure 14. Reverse Recovery Characteristics vs. Forward Current 300 600 0 900 0.1 1 10 100 Reverse Voltage, V R [V] Reverse Voltage, VR [V] Figure 17.Transient Thermal Impedance of IGBT 1 Thermal Response, Z THJC [℃/W] 1 0 0 .5 0 .2 0 .1 0 .1 0 .0 5 PDM 0 .0 2 t1 0 .0 1 0 .0 1 1 E -3 s in g le p u ls e 1 0 -4 1 0 -3 1 0 -2 R e c ta n g u la r P u ls e ©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 t2 5 1 0 -1 D u r a t io n 1 0 0 1 0 1 [s e c ] www.fairchildsemi.com FGL60N100BNTD — 1000 V, 60 A NPT Trench IGBT Typical Performance Characteristics FGL60N100BNTD — 1000 V, 60 A NPT Trench IGBT Mechanical Dimensions Figure 18. TO-264 3L - 3LD; TO264; MOLDED; JEDEC VARIATION AA Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO264-003 ©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 6 www.fairchildsemi.com *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used here in: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I66 ©2000 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. C2 7 www.fairchildsemi.com FGL60N100BNTD — 1000 V, 60 A NPT Trench IGBT TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Sync-Lock™ F-PFS™ AccuPower™ ® FRFET® AX-CAP®* ®* ® Global Power ResourceSM PowerTrench BitSiC™ GreenBridge™ PowerXS™ Build it Now™ TinyBoost® Green FPS™ Programmable Active Droop™ CorePLUS™ TinyBuck® ® Green FPS™ e-Series™ QFET CorePOWER™ TinyCalc™ CROSSVOLT™ QS™ Gmax™ TinyLogic® CTL™ GTO™ Quiet Series™ TINYOPTO™ Current Transfer Logic™ IntelliMAX™ RapidConfigure™ TinyPower™ DEUXPEED® ISOPLANAR™ ™ TinyPWM™ Dual Cool™ Marking Small Speakers Sound Louder TinyWire™ EcoSPARK® Saving our world, 1mW/W/kW at a time™ and Better™ TranSiC™ EfficentMax™ SignalWise™ MegaBuck™ TriFault Detect™ ESBC™ SmartMax™ MICROCOUPLER™ TRUECURRENT®* SMART START™ MicroFET™ ® SerDes™ Solutions for Your Success™ MicroPak™ ® ® SPM MicroPak2™ Fairchild STEALTH™ MillerDrive™ Fairchild Semiconductor® UHC® SuperFET® MotionMax™ FACT Quiet Series™ ® Ultra FRFET™ ® SuperSOT™-3 mWSaver FACT UniFET™ OptoHiT™ SuperSOT™-6 FAST® ® VCX™ OPTOLOGIC SuperSOT™-8 FastvCore™ ® ® VisualMax™ OPTOPLANAR SupreMOS FETBench™ VoltagePlus™ SyncFET™ FPS™ XS™ ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com © Semiconductor Components Industries, LLC N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com
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