Reference Only
Spec No. JENF243J-0010C
CHIP NOISE FILTER
P1/9
NFZ15SG□□□SN1□D REFERENCE SPECIFICATION
1. Scope
This reference specification applies to NFZ15SG Series, Chip Noise Filter.
2. Part Numbering
(ex)
NF
Z
15
Product ID Structure Dimension
(L×W)
101
SG
Characteristics
S
N
Typical Impedance Performance
at 900MHz
1
0
D
Category Numbers special Packaging
of
speci- D:Taping
Circuit
fication * B: BULK
1:LowRdc
0:HighImpedance
*B: Bulk packing also available
3. Rating
・Operating Temperature Range
・Storage Temperature Range
– 40°C to + 85°C
– 40°C to + 85°C
Impedance
Customer
Part Number
MURATA
Part Number
NFZ15SG101SN11D
NFZ15SG151SN11D
NFZ15SG331SN11D
NFZ15SG771SN10D
NFZ15SG152SN10D
NFZ15SG262SN10D
NFZ15SG462SN10D
at900MHz(Ω)
Typ.
Min.
100
70
150
100
330
230
770
530
1500
1000
2600
1800
4600
2800
DC Resistance (Ω)
at1.7GHz(Ω)
Typ.
160
250
540
900
1200
1450
1800
Typ.
Max.
0.07
0.09
0.20
0.35
0.55
0.80
1.25
0.10
0.12
0.30
0.50
0.80
1.00
1.65
Rated Current *1
(A)
1.10
1.00
0.65
0.50
0.40
0.35
0.27
*1: When applied Rated current to the Products, self temperature rise shall be limited to 40℃ max.
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Temperature : 20°C ± 2°C
: Ordinary Humidity
/ 25%(RH) to 85%(RH)
Humidity
: 60%(RH) to 70%(RH)
Humidity
Atmospheric Pressure : 86kPa to 106kPa
5. Appearance and Dimensions
■ Equivalent Circuit
(
■Unit Mass (Typical value)
0.001g
(in mm)
MURATA MFG.CO., LTD
)
Resistance element becomes
dominant at high frequencies.
Spec No. JENF243J-0010C
Reference Only
P2/9
6. Electrical Performance
No.
6.1
Item
Impedance
Specification
Impedance shall meet item 3.
6.2
DC Resistance
DC Resistance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT 4991A or equivalent (50mV)
Measuring Frequency: 900MHz / 1.7GHz
Measuring Equipment: Digital multi meter
Digital multi meter
(TR6846 or equivalent)
a
terminal1
terminal2
SW
b
DC resistance shall be measured after putting chip
noise filter between the terminal 2 under the condition
of opening between a and b.
Every measurement the terminal 1 shall be shorted
between a and b when changing noise filter.
*Except
resistance of the Substrate and Wire
7. Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip noise filter shall not be damaged
after tested as follows.
Test Method
Applied Direction
Coil
CHIP NOISE Chip
FILTER
F
Substrate
7.2
Bending Test
Force: 5N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
Substrate: Glass-epoxy substrate
(100mm×40mm×0.8mm)
Solder: Reflow
Pressure jig
R230
F
Deflection
45
7.3
Vibration
7.4
Drop
45
Product
(in mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 3.0 mm or Acceleration
amplitude 245m/s2 whichever is smaller.
Testing Time:
A period of 2h in each of 3 mutually
perpendicular directions. (Total 6h)
It shall be dropped on concrete or steel board.
Height : 1m
Total of 9 cycles
MURATA MFG.CO., LTD
Spec No. JENF243J-0010C
Reference Only
No.
7.5
Item
Solderability
Specification
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
7.6
Resistance to
Soldering Heat
Appearance: No damage
Impedance Change: within ±30%
Test Method
Flux: Ethanol solution of rosin 25(wt)%
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
Pre-Heating: 150°C±10°C / 60s to 90s
Solder: Sn-3.0Ag-0.5Cu
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 48h±4h.
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
8.1 Heat Resistance
Appearance: No damage
Impedance Change: within ±30%
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
P3/9
Test Method
Temperature: 85°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 48h±4h.
Temperature: -40°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 48h±4h.
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 48h±4h.
1 cycle:
1 step: -40°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: 85°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 100cycles
Then measured after exposure in the room
condition for 48h±4h.
MURATA MFG.CO., LTD
Spec No. JENF243J-0010C
Reference Only
P4/9
9. Specification of Packaging
1.15(Typ.)
0.65(Typ.)
Direction of Feed
8.0±0.3
+0.1
φ 1.5 -0
3.5±0.05
2.0±0.05
2.0±0.05 4.0±0.1
1.75±0.1
9.1 Appearance and Dimensions of plastic tape (8mm-wide)
0.8max.
(in mm)
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs / reel
(2) Packing Method
Products shall be packed in the cavity of base tape continuously and sealed by top tape
And bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The base tape and top tape has no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Top tape
Bottom tape
5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm / min
Plastic tape: 0.1N to 0.6N
(minimum value is typical)
MURATA MFG.CO., LTD
Spec No. JENF243J-0010C
Reference Only
P5/9
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (∗1), RoHS marking (∗2),
Quantity etc ・・・
□□ OOOO ×××
∗1)
(1)
(2)
(3)
(1) Factory Code
First digit
(2) Date
(3) Serial No.
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
∗2)
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2), Quantity, etc ・・・
9.8 Specification of Outer Case
Label
H
Outer Case Dimensions
(mm)
W
D
H
186
186
93
Standard Reel Quantity
in Outer Case (Reel)
5
D
W
∗ Above Outer Case size is typical. It depends on a quantity of an order
10. ! Caution
10.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(3) Undersea equipment
(4) Power plant control equipment (9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
(5) Medical equipment
requirements to the applications listed in the above
MURATA MFG.CO., LTD
Reference Only
Spec No. JENF243J-0010C
P6/9
10.2 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration
due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Chip
Noise Filter
Chip Ferrite Bead
c
a
Solder Resist
b
Pattern
Soldering
Reflow
a
0.4
b
1.2
c
0.5
(in mm)
11.2 Flux, Solder
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste: 100μm to 200μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
Soldering Profile for Lead Free solder
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
Limit Profile
150°C~180°C, 90s±30s
above 220°C, 30s~60s
above 230°C, 60s max.
245°C±3°C
260°C, 10s
2 times
2 times
MURATA MFG.CO., LTD
Reference Only
Spec No. JENF243J-0010C
P7/9
11.4 Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
11.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
t
1/3T≦t≦T
T: thickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
b
〈 Poor example 〉
Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
〈 Good example 〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Perforation
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG.CO., LTD
Stress Level
A > D *1
A > B
A > C
Spec No. JENF243J-0010C
Reference Only
P8/9
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
11.7 Cleaning
When cleaning this product, observe the following conditions.
Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product
before use.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall
be 40°C max.
(2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the
substrate vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always
perform a test cleaning beforehand using an actual cleaning device, and then check the quality of the products.
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner.
When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no
cleaner is left.
* For other cleaning, please consult our technical department.
11.8. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance
of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
11.9 Resin coating
The impedance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you
select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.10 Caution for use
There is possibility that the impedance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip noise filters are handled. (The tip of the tweezers should be molded with
resin or pottery.)
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD
Spec No. JENF243J-0010C
Reference Only
P9/9
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
: 15% to 85% relative humidity
Humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD