Reference Only
Spec. No. JEWE243B-0004E-01
EMIGUARD
VFR3V Series
P 1/ 7
Reference Specification
1. Scope
This reference specification applies to EMIGUARD applicable to automatic insertion,which is used electronic equipment.
2. Part Numbering
VF
Product ID
R
Structure
3
V
Style Features
Customer Part Number
D3
1E
131
Temperature
Rated
Capacitance
Characteristics Voltage
Part Number
VFR3VD31E131T51B
VFR3VD31E131U31A
T51
Lead Type
B
Packaging
Code
[A : Ammo Pack / B : Bulk]
Packaging Code
Bulk type
Taping type
3. Rating
Item
Rated Voltage
Capacitance
Insulation Resistance
Varistor Voltage
DC Resistance
Rated Current
Operating Temperature
Storage Temperature
Specification
25 V(DC)
130 pF ± 20 %
10 MΩ min.
50 V(DC) ± 20 %
150 Ω ± 35 %
20 mA(DC)
- 25 °C to + 85 °C
- 25 °C to + 85 °C
4. Standard Testing Condition
< Unless otherwise >
Temperature : Ordinary Temp. 15 °C to 35 °C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH)
< In case of doubt >
Temperature : 20 °C ± 2 °C
Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86 kPa to 106 kPa
5. Style and Dimensions
Meet Item 11.
6. Marking
The following items shall be marked.
Mark of T1 Terminal : Marked as
Symbol
: Marked as
●.
AY.
No.
7.1
Item
Capacitance
7.2
Insulation
Resistance (I.R.)
Varistor
Voltage
7.3
7.4
DC Resistance
7.5
Temperature
Characteristics
(Capacitance)
Specification
Meet Item 3.
Test Method
Measured between T1 and T2 terminal.
Frequency : 1 ± 0.1 kHz
Voltage : 1 ± 0.2 V(rms)
Measured between T1 and T2 terminal.
Time : 30 ± 5 seconds
Measuring DC Current : 1 mA
S
A
Regulated
Power
V 1mA
Supply
within ±
20
30
%
T1
T2
T3
S pecim en
7. Electrical Performance
Measured between T1 and T3 terminal.
Measuring Current : less than rated current.
Capacitance shall be measured at each step specified in
Table 1 after reaching thermal equilibrium.
The capacitance change against the capacitance at step 3
shall be calculated.
Table 1
Step
Temperature
(°C)
1
2
+20±2 -25±
MURATA MFG CO.,LTD.
3
0
3
4
+20±2 +85±
5
3
0
+20±2
Reference Only
Spec. No. JEWE243B-0004E-01
No.
7.6
Item
Temperature
Characteristics
(DC Resistance)
7.7
Withstanding
Surge Current
Specification
within ± 30 %
Meet Table 2.
Table 2
Appearance
Varistor Voltage
Change
No damage
within ± 10%
Test Method
DC Resistance shall be measured at each step
specified in Table 1 after reaching thermal
equilibrium.
The DC Resistance change against the
DC Resistance at step 3 shall be calculated.
Waveform : 80/20 µ s (rectangular pulse)
Peak current : 30A
The Number of Times : 2 times (5 minutes interval)
Then measured after exposure in the room
condition for 1 to 2 hours.
Measuring varistor voltage : as same as the
above surge current.
Equipment
of Surge
test
7.8
P 2/ 7
T3
T1
Specimen
T2
Waveform : 150pF,330Ω ESD contact
discharge. (IEC1000-4-2)
Peak Voltage : 15 kV
The Number of Times : 100 times (10 times/s)
Then measured after exposure in the room
condition for 1 to 2 hours.
Measuring varistor voltage : as same as the
above surge current.
Pulse Life
Electrostatic
Discharge
Simulator
T1
T3
Specimen
T2
Output
Shall be shorted
8. Mechanical Performance
No.
8.1
8.2
8.3
8.4
Item
Appearance and
Dimensions
Marking
Solderability
Resistance to
Soldering Heat
Specification
Meet Item 5.
Marking shall be legible
Along the circumference of terminal
shall be covered with new solder at
least 90%.
Meet Table 3.
Table 3
Appearance
Cap.Change
Varistor Voltage
Change
I.R.
8.5
Terminal Pull
Test
8.6
Terminal Bent
Test
No damage
within ± 20%
within ± 10%
10 MΩ min.
Products shall be damaged.
Test Method
Visual inspection and measured with slide
calipers.
It is inspection Visually.
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 seconds
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245 ± 5 °C
Immersion Time : 2 ± 0.5 seconds
Immersion Depth : 1.5 to 2.0 mm from the
bottom of the body
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 seconds
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5 °C
Immersion Time : 3 ± 0.5 seconds
Immersion Depth : 1.5 to 2.0 mm from the
bottom of the body
Then measured after exposure in the room
condition for 1 to 12 hours.
It shall be fixed and the load shall be applied to three
terminals gradually in the direction of the terminals.
Applying Force : 10N
Keeping Time : 10 seconds
∗ Products should be used by being mounted
through P.C.B. hole.
It shall be fixed and the load of 5N shall be suspended
Then the body shall be bent through 90 ° and
returned to its normal position. And the body shall be
ben through 90 ° in the opposite direction, and
returned to its normal position.
∗ Products should be used by being mounted
through P.C.B. hole.
MURATA MFG CO.,LTD.
Reference Only
Spec. No. JEWE243B-0004E-01
9. Environment Performance
No.
9.1
9.2
9.3
Item
Temperature
Cycling
Specification
Test Method
Meet Table 3.
1 Cycle
°C / 30 minutes
1 step : -25 ± 0
3
2 step : Room Temperature / 5 min within.
3 step : +85 ± 3
0 °C / 30 minutes
4 step : Room Temperature / 5 min within.
Total of 10 cycles
Then measured after exposure in the room
condition for 1 to 12 hours.
Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Humidity
Humidity Load
Time : 500 ±24
hours
0
Then measured after exposure in the room
condition for 4 to 24 hours.
Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Test Voltage : 35 V(DC)
Meet Table 4.
Table 4
9.4
P 3/ 7
Heat Life
Appearance
Cap.Change
Varistor Voltage
Change
I.R.
No damage
within ± 20%
within ± 10%
1 MΩ min.
Time : 500 ±24
hours
0
Then measured after exposure in the room
condition for 4 to 24 hours.
Temperature : 85 ± 3 °C
Test Voltage : 35 V(DC)
hours
Time : 500 ±24
0
Then measured after exposure in the room
condition for 4 to 24 hours.
The voltage shall be applied between T1 and T2
terminal.
Measuring direction of varistor voltage : as same
as that of applied voltage.
10. Insertion Loss (Typ.)
Insertion Loss measuring circuit
Sample
Impedance
Transducer
(3k Ω - 50Ω )
50 Ω
RF
Voltmeter
~
50 Ω
SG
MURATA MFG CO.,LTD.
Reference Only
Spec. No. JEWE243B-0004E-01
P 4/ 7
11. Style and Dimensions
11.1. Bulk (VFR3VD31E131T51B Type)
8.0 max.
φ 0.8 to 1.0 × 3
5.0 max.
1
AY
Mark of
(T1) Terminal
Mounting Hole
2.3 max.
2
2.5±0.2
2.5±0.2
25.0 min.
F1 F1
3
φ 0.45±0.1
5.0±0.5
T1
T2
No.
1
2
ITEM
Over Coating
Armor
3
Lead Wire
■ Unit Mass (Typical value)
0.23g
T3
F = 2.5 ± 0.5
∗ Lower side of ceramic dielectric may be expo
11.2. Taping (VFR3VD31E131U31A Type)
P
AY
AY
AY
H
Δ h2
φd
W0
L
P0
φ 1.0 × 3
φ D0
l
T1 T2 T3
Mounting Hole
t1
t2
W1
W2
F
F1
W
Δ h1
ΔS
D
P1
2.3 max.
5.0
max.
P2
MATERIAL
Epoxy Resin
Phenol Resin
Annealed Copper Wire
Solder Coating
2.5±0.2
∗ Lower side of ceramic dielectric may be exposed.
Code
P
P0
P1
P2
Description
D
ΔS
W
Pitch of Component
Pitch of Sprocket Hole
Length from Hole Center to Lead
Length from Hole Center
to Component Center
Width of Body
Deviation along tape, Left or Right
Carrier Tape Width
W1
Position of Sprocket Hole
l
D0
d
t1
t2
Δh1
Δh2
L
W0
W2
H
Protrusion Length
Diameter of Sprocket Hole
Lead Diameter
Total Tape Thickness
Total Thickness, Tape and Lead Wire
Deviation across Tape , front
Deviation across Tape , rear
Portion to Cut in Case of Defect
Hold Down Tape Width
Hold Down Tape Position
Lead length between sprocket hole
and forming position
F
F1
Lead Spacing
2.5±0.2
(in mm)
Dimensions
Remarks
12.7
12.7 ± 0.2
3.85 ± 0.7
Product Inclination ΔS Determines Crossing
6.35 ± 1.3
Shift In Tape In Direction of Feed
8.0 max.
0 ± 1.0
18.0 ± 0.5
9.0 ±
0
0.5
+ 0.5 to + 1.0
φ 4.0 ± 0.1
φ 0.45 ± 0.1
0.7 ± 0.2
1.5 max.
1.0 max.
1.0 max.
11.0 ±
12.0 ± 0.5
1.5 ± 1.5
Tape Widthwise Shift
Includes Thickness of Bonding Tape
18.5 ± 1.0
5.0 ±
0.8
2.5 ±
0.4
0.2
0.2
MURATA MFG CO.,LTD.
Reference Only
Spec. No. JEWE243B-0004E-01
12. Taping
P 5/ 7
12.1. A maximum of 0.3 % of the components quantity per Ammo pack may be missing without consecutive
missing components.
12.2. The adhesive power of the tape shall have over 2.94N at the following condition.
F
2.94 N
Hold down tape
Carrier tape
12.3. Splicing method of tape
Overall thickness Hold down tape
Direction of feed
(1) Carrier tape
Carrier tape
Cellophane tape
30 to 50
Carrier tape shall be spliced by cellophane tape.
Overall thickness shall be less than 1.05 mm.
(2) Hold down tape
Direction of feed
20 to 30
(in mm)
Hold down tape
Hold down tape
Carrier tape
Overall thickness
· Hold down tape shall be spliced with overlapping.
· Overall thickness shall be less than 1.05 mm.
(in mm)
(3) Both carrier tape and hold down tape
Both tapes shall be cut zigzag and spliced with splicing tape.
13. Packing Quantity and Packing Form
The standard packing is as follows.
(The packing quantity may be changed due to a fraction of order)
Minimum Packing From and Quantity
Terminal Configuration
A Unit Quantity
Bulk : in a plastic bag
Taping : in an Ammo pack
∗ Standard Quantity in a container
(corrugated cardboard box)
250 pcs.
2000 pcs.
5000 pcs.
20000 pcs.
VFR3VD31E131T51B (Bulk)
VFR3VD31E131U31A (Taping)
∗ A quantity in a container is depending on a quantity of an order.
13.1. Bulk
· A plastic bag pack
(1) Products are packed into a plastic bag.
a plastic bag
(2) The plastic bags are put into a container
(corrugated cardboard box) depending on a
quantity of an order.
the plastic bag with products
a container
13.2. Taping
container label
· An ammo pack
(1) Folding the tape per 25 pitches, products are packed into an ammo package so that each product of each
layer wound zigzag is put on top of one another.
(2) The dimensions of the ammo package are as follows.
(3) The ammo packages are put into a container (corrugated cardboard box) depending on a quantity of an order.
(4) Not less than 3 consecutive of component shall be missing on both edge of tape.
MURATA MFG CO.,LTD.
Reference Only
Spec. No. JEWE243B-0004E-01
zig zag
P 6/ 7
240 max.
340 max.
label
25 pitches
51 max.
The unloading direction : Right
The hold down tape : Upper
The product body : Left along the unloading direction
(in mm)
14. Marking on package
14.1. Unit package
· Bulk
: Marked on plastic bag
· Taping : Marked on a label stuck on an ammo package.
Necessary things are printed on a unit package as follows.
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking (∗2), Quantity, etc
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
14.2. Container
Stick a label on which necessary things are printed as follows.
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (∗2), Quantity , etc
15. ! Caution
15.1. Mounting holes
Mounting holes should be designed as specfied in this specifications.
Or different design from this specifications may cause cracks in ceramics which may lead to smoking / firing.
15.2. Caution for the product angle adjust work
Take care not to apply any mechanical stress to product body at the lead terminal bending process for product angle
adjustment after insertion.
15.3. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life,body or property.
(1)Aircraft equipment
(2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (10)Applications of similar complexity or with reliability
requirements comparable to the applications listed in the above
16. Notice
16.1. Usage Condition
Terminal (Marked with ●) should be connected to the line of incoming electrostatic surge. (There is directional
characteristics.)
· Example on output terminal
· Example on input terminal
Incoming
Electrostatic Surages
Incoming
Elctrostatic Surges
MURATA MFG CO.,LTD.
Reference Only
Spec. No. JEWE243B-0004E-01
P 7/ 7
16.2. Products should be used at rated voltage or less and rated current or less.
16.3. Products should not be applied for the absorption of surge which have large energy (ex. induced lighting
surges, switching surges) because it is designed for the absorption of electrostatic surges.
16.4. Electrostatic test
Electrostatic test should be done on the following conditions.
n : Times applies
n • [ C / R • V2 ]2 < 8.0 × 105
C : Charging Capacitance (pF)
16.5. Soldering
V : Testing Voltage (kV)
R : Charging Resistance (Ω)
T e m p e ra tu re (° C )
(1) Flux, Solder
· Rosin-based flux should be used.
Do not use strong acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value.)
· Use Sn-3.0Ag-0.5Cu solder.
(2) Standard flow soldering profile.
300
Pre- heating(in air)
150
Gradual Cooling
(in air)
Solder Temperature
250
200
Soldering
150°C
Solder Temperature
250 ~ 260 °C
100
50
Soldering Time
4~6s
1 minutes min. Soldering Time
(3) Resistance to soldering iron goes in the following condition that tip temperature is 350 °C max. and
soldering time is 5 s max.
(4) Products and the leads should not be subjected to any mechanical stress during soldering process.
(and also while subjected to the equivalent high temperature.)
16.6. Cleaning
Avoid cleaning products.
16.7. Operating Environment
(1) Do not use products in corrosive gased such as chlorine gas, acid or sulfide gas.
(2) Do not use products in the environment where water, oil or organic solvents may adhere to products.
(3) Do not adhere any resin to products, coat nor mold products with any resin (including adhesive) to
prevent mechanical and chemical stress on products.
16.8. Storage condition
(1) Storage period
Products which inspected in MURATA over 12 months ago should be examined and used, which
can be confirmed with inspection No. marked on the container.
(2) Storage environment condition
· Products should be storage in the warehouse on the following conditions.
Temperature : - 10 °C to + 40 °C
Humidity
: 15% to 85% relative humidity No rapid change on temperature and humidity
· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may
cause oxidization of electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from
humidity, dust and so on.
· Products s should be stored in the warehouse without heat shock, vibration, direct
sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
17.
! Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO.,LTD.