VFR3VD31E131U31A

Reference Only Spec. No. JEWE243B-0004E-01 EMIGUARD VFR3V Series P 1/ 7 Reference Specification 1. Scope This reference specification applies to EMIGUARD applicable to automatic insertion,which is used electronic equipment. 2. Part Numbering VF Product ID R Structure 3 V Style Features Customer Part Number D3 1E 131 Temperature Rated Capacitance Characteristics Voltage Part Number VFR3VD31E131T51B VFR3VD31E131U31A T51 Lead Type B Packaging Code [A : Ammo Pack / B : Bulk] Packaging Code Bulk type Taping type 3. Rating Item Rated Voltage Capacitance Insulation Resistance Varistor Voltage DC Resistance Rated Current Operating Temperature Storage Temperature Specification 25 V(DC) 130 pF ± 20 % 10 MΩ min. 50 V(DC) ± 20 % 150 Ω ± 35 % 20 mA(DC) - 25 °C to + 85 °C - 25 °C to + 85 °C 4. Standard Testing Condition < Unless otherwise > Temperature : Ordinary Temp. 15 °C to 35 °C Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) < In case of doubt > Temperature : 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86 kPa to 106 kPa 5. Style and Dimensions Meet Item 11. 6. Marking The following items shall be marked. Mark of T1 Terminal : Marked as Symbol : Marked as ●. AY. No. 7.1 Item Capacitance 7.2 Insulation Resistance (I.R.) Varistor Voltage 7.3 7.4 DC Resistance 7.5 Temperature Characteristics (Capacitance) Specification Meet Item 3. Test Method Measured between T1 and T2 terminal. Frequency : 1 ± 0.1 kHz Voltage : 1 ± 0.2 V(rms) Measured between T1 and T2 terminal. Time : 30 ± 5 seconds Measuring DC Current : 1 mA S A Regulated Power V 1mA Supply within ± ２０ ３０ % T1 T2 T3 S pecim en 7. Electrical Performance Measured between T1 and T3 terminal. Measuring Current : less than rated current. Capacitance shall be measured at each step specified in Table 1 after reaching thermal equilibrium. The capacitance change against the capacitance at step 3 shall be calculated. Table 1 Step Temperature (°C) 1 2 +20±2 -25± MURATA MFG CO.,LTD. 3 ０ ３ 4 +20±2 +85± 5 ３ ０ +20±2 Reference Only Spec. No. JEWE243B-0004E-01 No. 7.6 Item Temperature Characteristics (DC Resistance) 7.7 Withstanding Surge Current Specification within ± 30 % Meet Table 2. Table 2 Appearance Varistor Voltage Change No damage within ± 10% Test Method DC Resistance shall be measured at each step specified in Table 1 after reaching thermal equilibrium. The DC Resistance change against the DC Resistance at step 3 shall be calculated. Waveform : 80/20 µ s (rectangular pulse) Peak current : 30A The Number of Times : 2 times (5 minutes interval) Then measured after exposure in the room condition for 1 to 2 hours. Measuring varistor voltage : as same as the above surge current. Equipment of Surge test 7.8 P 2/ 7 T3 T1 Specimen T2 Waveform : 150pF,330Ω ESD contact discharge. (IEC1000-4-2) Peak Voltage : 15 kV The Number of Times : 100 times (10 times/s) Then measured after exposure in the room condition for 1 to 2 hours. Measuring varistor voltage : as same as the above surge current. Pulse Life Electrostatic Discharge Simulator T1 T3 Specimen T2 Output Shall be shorted 8. Mechanical Performance No. 8.1 8.2 8.3 8.4 Item Appearance and Dimensions Marking Solderability Resistance to Soldering Heat Specification Meet Item 5. Marking shall be legible Along the circumference of terminal shall be covered with new solder at least 90%. Meet Table 3. Table 3 Appearance Cap.Change Varistor Voltage Change I.R. 8.5 Terminal Pull Test 8.6 Terminal Bent Test No damage within ± 20% within ± 10% 10 MΩ min. Products shall be damaged. Test Method Visual inspection and measured with slide calipers. It is inspection Visually. Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150 ± 10 °C, 60 ~ 90 seconds Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 245 ± 5 °C Immersion Time : 2 ± 0.5 seconds Immersion Depth : 1.5 to 2.0 mm from the bottom of the body Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150 ± 10 °C, 60 ~ 90 seconds Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5 °C Immersion Time : 3 ± 0.5 seconds Immersion Depth : 1.5 to 2.0 mm from the bottom of the body Then measured after exposure in the room condition for 1 to 12 hours. It shall be fixed and the load shall be applied to three terminals gradually in the direction of the terminals. Applying Force : 10N Keeping Time : 10 seconds ∗ Products should be used by being mounted through P.C.B. hole. It shall be fixed and the load of 5N shall be suspended Then the body shall be bent through 90 ° and returned to its normal position. And the body shall be ben through 90 ° in the opposite direction, and returned to its normal position. ∗ Products should be used by being mounted through P.C.B. hole. MURATA MFG CO.,LTD. Reference Only Spec. No. JEWE243B-0004E-01 9. Environment Performance No. 9.1 9.2 9.3 Item Temperature Cycling Specification Test Method Meet Table 3. 1 Cycle °C / 30 minutes 1 step : -25 ± ０ ３ 2 step : Room Temperature / 5 min within. 3 step : +85 ± ３ ０ °C / 30 minutes 4 step : Room Temperature / 5 min within. Total of 10 cycles Then measured after exposure in the room condition for 1 to 12 hours. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Humidity Humidity Load Time : 500 ±２４ hours ０ Then measured after exposure in the room condition for 4 to 24 hours. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Test Voltage : 35 V(DC) Meet Table 4. Table 4 9.4 P 3/ 7 Heat Life Appearance Cap.Change Varistor Voltage Change I.R. No damage within ± 20% within ± 10% 1 MΩ min. Time : 500 ±２４ hours ０ Then measured after exposure in the room condition for 4 to 24 hours. Temperature : 85 ± 3 °C Test Voltage : 35 V(DC) hours Time : 500 ±２４ ０ Then measured after exposure in the room condition for 4 to 24 hours. The voltage shall be applied between T1 and T2 terminal. Measuring direction of varistor voltage : as same as that of applied voltage. 10. Insertion Loss (Typ.) Insertion Loss measuring circuit Sample Impedance Transducer (3k Ω - 50Ω ) 50 Ω RF Voltmeter ～ 50 Ω SG MURATA MFG CO.,LTD. Reference Only Spec. No. JEWE243B-0004E-01 P 4/ 7 11. Style and Dimensions 11.1. Bulk (VFR3VD31E131T51B Type) 8.0 max. φ 0.8 to 1.0 × 3 5.0 max. 1 ＡＹ Mark of (T1) Terminal Mounting Hole 2.3 max. 2 2.5±0.2 2.5±0.2 25.0 min. F1 F1 3 φ 0.45±0.1 5.0±0.5 T1 T2 No. 1 2 ITEM Over Coating Armor 3 Lead Wire ■ Unit Mass (Typical value) 0.23g T3 F = 2.5 ± 0.5 ∗ Lower side of ceramic dielectric may be expo 11.2. Taping (VFR3VD31E131U31A Type) P AY AY AY H Δ h2 φd W0 L P0 φ 1.0 × 3 φ D0 l T1 T2 T3 Mounting Hole t1 t2 W1 W2 Ｆ Ｆ1 W Δ h1 ΔS D P1 2.3 max. 5.0 max. P2 MATERIAL Epoxy Resin Phenol Resin Annealed Copper Wire Solder Coating 2.5±0.2 ∗ Lower side of ceramic dielectric may be exposed. Code P P0 P1 P2 Description D ΔS W Pitch of Component Pitch of Sprocket Hole Length from Hole Center to Lead Length from Hole Center to Component Center Width of Body Deviation along tape, Left or Right Carrier Tape Width W1 Position of Sprocket Hole l D0 d t1 t2 Δh1 Δh2 L W0 W2 H Protrusion Length Diameter of Sprocket Hole Lead Diameter Total Tape Thickness Total Thickness, Tape and Lead Wire Deviation across Tape , front Deviation across Tape , rear Portion to Cut in Case of Defect Hold Down Tape Width Hold Down Tape Position Lead length between sprocket hole and forming position F F1 Lead Spacing 2.5±0.2 (in mm) Dimensions Remarks 12.7 12.7 ± 0.2 3.85 ± 0.7 Product Inclination ΔS Determines Crossing 6.35 ± 1.3 Shift In Tape In Direction of Feed 8.0 max. 0 ± 1.0 18.0 ± 0.5 9.0 ± ０ ０．５ + 0.5 to + 1.0 φ 4.0 ± 0.1 φ 0.45 ± 0.1 0.7 ± 0.2 1.5 max. 1.0 max. 1.0 max. 11.0 ± 12.0 ± 0.5 1.5 ± 1.5 Tape Widthwise Shift Includes Thickness of Bonding Tape 18.5 ± 1.0 5.0 ± ０．８ 2.5 ± ０．４ ０．２ ０．２ MURATA MFG CO.,LTD. Reference Only Spec. No. JEWE243B-0004E-01 12. Taping P 5/ 7 12.1. A maximum of 0.3 % of the components quantity per Ammo pack may be missing without consecutive missing components. 12.2. The adhesive power of the tape shall have over 2.94N at the following condition. F 2.94 N Hold down tape Carrier tape 12.3. Splicing method of tape Overall thickness Hold down tape Direction of feed (1) Carrier tape Carrier tape Cellophane tape 30 to 50 Carrier tape shall be spliced by cellophane tape. Overall thickness shall be less than 1.05 mm. (2) Hold down tape Direction of feed 20 to 30 (in mm) Hold down tape Hold down tape Carrier tape Overall thickness · Hold down tape shall be spliced with overlapping. · Overall thickness shall be less than 1.05 mm. (in mm) (3) Both carrier tape and hold down tape Both tapes shall be cut zigzag and spliced with splicing tape. 13. Packing Quantity and Packing Form The standard packing is as follows. (The packing quantity may be changed due to a fraction of order) Minimum Packing From and Quantity Terminal Configuration A Unit Quantity Bulk : in a plastic bag Taping : in an Ammo pack ∗ Standard Quantity in a container (corrugated cardboard box) 250 pcs. 2000 pcs. 5000 pcs. 20000 pcs. VFR3VD31E131T51B (Bulk) VFR3VD31E131U31A (Taping) ∗ A quantity in a container is depending on a quantity of an order. 13.1. Bulk · A plastic bag pack (1) Products are packed into a plastic bag. a plastic bag (2) The plastic bags are put into a container (corrugated cardboard box) depending on a quantity of an order. the plastic bag with products a container 13.2. Taping container label · An ammo pack (1) Folding the tape per 25 pitches, products are packed into an ammo package so that each product of each layer wound zigzag is put on top of one another. (2) The dimensions of the ammo package are as follows. (3) The ammo packages are put into a container (corrugated cardboard box) depending on a quantity of an order. (4) Not less than 3 consecutive of component shall be missing on both edge of tape. MURATA MFG CO.,LTD. Reference Only Spec. No. JEWE243B-0004E-01 zig zag P 6/ 7 240 max. 340 max. label 25 pitches 51 max. The unloading direction : Right The hold down tape : Upper The product body : Left along the unloading direction (in mm) 14. Marking on package 14.1. Unit package · Bulk : Marked on plastic bag · Taping : Marked on a label stuck on an ammo package. Necessary things are printed on a unit package as follows. Customer part number, MURATA part number, Inspection number(∗1), RoHS marking (∗2), Quantity, etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) 14.2. Container Stick a label on which necessary things are printed as follows. Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking (∗2), Quantity , etc 15. ! Caution 15.1. Mounting holes Mounting holes should be designed as specfied in this specifications. Or different design from this specifications may cause cracks in ceramics which may lead to smoking / firing. 15.2. Caution for the product angle adjust work Take care not to apply any mechanical stress to product body at the lead terminal bending process for product angle adjustment after insertion. 15.3. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life,body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 16. Notice 16.1. Usage Condition Terminal (Marked with ●) should be connected to the line of incoming electrostatic surge. (There is directional characteristics.) · Example on output terminal · Example on input terminal Incoming Electrostatic Surages Incoming Elctrostatic Surges MURATA MFG CO.,LTD. Reference Only Spec. No. JEWE243B-0004E-01 P 7/ 7 16.2. Products should be used at rated voltage or less and rated current or less. 16.3. Products should not be applied for the absorption of surge which have large energy (ex. induced lighting surges, switching surges) because it is designed for the absorption of electrostatic surges. 16.4. Electrostatic test Electrostatic test should be done on the following conditions. n : Times applies n • [ C / R • V2 ]2 < 8.0 × 105 C : Charging Capacitance (pF) 16.5. Soldering V : Testing Voltage (kV) R : Charging Resistance (Ω) T e m p e ra tu re (° C ) (1) Flux, Solder · Rosin-based flux should be used. Do not use strong acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value.) · Use Sn-3.0Ag-0.5Cu solder. (2) Standard flow soldering profile. 300 Pre- heating(in air) 150 Gradual Cooling (in air) Solder Temperature 250 200 Soldering 150°C Solder Temperature 250 ~ 260 °C 100 50 Soldering Time 4~6s 1 minutes min. Soldering Time (3) Resistance to soldering iron goes in the following condition that tip temperature is 350 °C max. and soldering time is 5 s max. (4) Products and the leads should not be subjected to any mechanical stress during soldering process. (and also while subjected to the equivalent high temperature.) 16.6. Cleaning Avoid cleaning products. 16.7. Operating Environment (1) Do not use products in corrosive gased such as chlorine gas, acid or sulfide gas. (2) Do not use products in the environment where water, oil or organic solvents may adhere to products. (3) Do not adhere any resin to products, coat nor mold products with any resin (including adhesive) to prevent mechanical and chemical stress on products. 16.8. Storage condition (1) Storage period Products which inspected in MURATA over 12 months ago should be examined and used, which can be confirmed with inspection No. marked on the container. (2) Storage environment condition · Products should be storage in the warehouse on the following conditions. Temperature : - 10 °C to + 40 °C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity · Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. · Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. · Products s should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 17. ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO.,LTD.