AYF512415

AYF51 For FPC/FFC Y5S Series FPC connectors (0.5mm pitch) Slide lock FEATURES APPLICATIONS 1. A wide variety of digital equipments The 0.5mm pitch, 1.9mm height, and 5.2mm depth are suitable for a variety of digital equipment. Digital equipment, such as PCs, digital TVs, HDDs, car navigation systems, home-use game machines, multifunction fax machines, and security cameras 1.9 mm 5.2 mm (15°) 2. Slide lock structure The slide lock structure facilitates FPC connection work. 3. Equipped with soldering terminals for higher mounting strength RoHS compliant ORDERING INFORMATION AYF 5 1 1 5 51: FPC Connector 0.5 mm pitch (Slide lock) Number of contacts (2 digits) Contact direction 1: Bottom contact Surface treatment (Contact portion / Terminal portion) 5: Au plating/Au flash plating PRODUCT TYPES Height Number of pins Part number 1.9 mm 15 24 AYF511515 AYF512415 Packing Inner carton Outer carton 2,000 pieces 4,000 pieces Note: Order unit; For mass production: in 1-inner carton (1-reel) units Samples for mounting check: in 50-connector units. Samples: Small lot orders are possible. Please contact our sales office. Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e ACCTB19E 201201-T AYF51 SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Insulation resistance Specifications 0.5A/pin contact 50V AC/DC Min. 1,000MΩ (initial) Breakdown voltage 250V AC for 1 min. Contact resistance Max. 45mΩ FPC/FFC holding force Min. 0.2N/pin contacts × pin contacts (initial) Contact holding force Min. 1.5N/pin contacts Soldering terminal holding force Ambient temperature Storage temperature Thermal shock resistance (with FPC/FFC inserted) Environmental characteristics Humidity resistance (with FPC/FFC inserted) Saltwater spray resistance (with FPC/FFC inserted) H2S resistance (with FPC/FFC inserted) Soldering heat resistance Lifetime characteristics Unit weight Insertion and removal life Conditions Using 250V DC megger No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C 5402. Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed Measuring the maximum force. As the contact is axially pull out. Measuring the maximum force. As the soldering terminal is axially pull out. Min. 1.5N/pin contacts –55°C to +85°C –55°C to +85°C (product only) –40°C to +50°C (emboss packing) No freezing at low temperatures. No dew condensation. 5 cycles, contact resistance max. 45mΩ Sequence 1. –40°C, 30 minutes 2. Normal temperature (+20 to 35°C), 5 to 15 minutes 3. +85°C, 30 minutes 4. Normal temperature (+20 to 35°C), 5 to 15 minutes 120 hours, insulation resistance min. 500MΩ, contact resistance max. 45mΩ 24 hours, contact resistance max. 45mΩ 48 hours, contact resistance max. 45mΩ Peak temperature: 250°C or less 300°C within 5 sec. 350°C within 3 sec. Bath temperature 40±2°C, humidity 90 to 95% R.H. Bath temperature 35±2°C, saltwater concentration 5±1% Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75% R.H. Reflow soldering Soldering iron 30 times Repeated insertion and removal: min. 10 sec./time 24 pin contact type: 0.32 g 2. Material and surface treatment Part name Material Housing: Polyamide resin Slider: PPS resin Molded portion Contact Copper alloy Soldering terminal portion Copper alloy Surface treatment — Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Base: Ni plating, Surface: Sn plating A±0.15 B±0.10 0.50±0.10 0.60 (1.55) (15°) 0.50 0.20±0.05 1.20 4.75 5.20 1.60 (0.20) (0.45) DIMENSIONS (Unit: mm) C±0.15 1.90 When the slider is opened (reference) 2.70 (FPC insertion depth) ACCTB19E 201201-T Panasonic Corporation Automation Controls Business Unit Number of pins/ dimension 15 A B C 12.0 7.0 13.4 24 16.5 11.5 17.9 industrial.panasonic.com/ac/e AYF51 RECOMMENDED FPC/FFC DIMENSIONS Surface finish: Au plating 3.00min. (4.00) Reinforcing plate (FFC) 0.30+0.05 –0.02 (FPC) 0.35±0.03 0.50±0.05 0.50±0.10 0.30±0.05 B±0.05 (B+1) ±0.07 Number of pins/ dimension 15 7.0 24 11.5 B EMBOSSED TAPE DIMENSIONS (Unit: mm) • Specifications for taping • Specifications for reel Tape I Tape II (A±0.30) (C) (A±0.30) (B) (C) Top cover tape (1.75) (D±1) Taping reel 370 dia. (2.0) (4.0) Embossed carrier tape 12.0 12.0 (2.0) (4.0) Leading direction after packaging (1.75) 5 5 .0 .0 +0 +0 55 55 1. 1. . . dia dia • Dimension table (Unit: mm) Number of pins 15 pin contacts 24 pin contacts Type of taping Tape I Tape II A 24.0 32.0 B – 28.4 C 11.5 14.2 D 25.0 33.0 Quantity per reel 2,000 2,000 • Connector orientation with respect to embossed tape feeding direction Type Y5S Direction of tape progress NOTES 1. Recommended PC board pattern 2.10 2.80 0.50 3.30 1.10 (0.20) B±0.05 0.50±0.05 0.30±0.05 Connector outline 2. Precautions for insertion/removal of FPC/FFC A load applied to the slider unevenly or on only one side may deform the slider. Fully open the slider lock to insert an FPC. Don’t further apply an excessive load to the fully released slider lock; otherwise, the slider may be deformed. (1.55) Number of pins/ dimension 15 7.0 24 11.5 Remove the FPC in a direction parallel to the board with the slider lock fully released. If the slider is closed, or if the FPC is forcedly pulled into a direction parallel to the board, the connector may break. After an FPC is inserted, carefully handle it so as not to apply excessive stress to the base of the FPC. B (15°) Panasonic Corporation Automation Controls Business Unit Please refer to the latest product specifications when designing your product. industrial.panasonic.com/ac/e ACCTB19E 201201-T NOTES FOR USING FPC CONNECTORS (Common)
PC board design Design the recommended foot pattern in order to secure the mechanical strength in the soldered areas of the terminal.
FPC and equipment design Design the FPC based with recommended dimensions to ensure the required connector performance. Due to the FPC size, weight, or the reaction force of the routed FPC. Carefully check the equipment design and take required measures to prevent the FPC from being removed due to a fall, vibration, or other impact.
Connector mounting Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied.
Soldering 1) Manual soldering. • Due to the connector’s low profile, if an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. • Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. • Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use. • Be aware that a load applied to the connector terminals while soldering may displace the contact. • Thoroughly clean the iron tip. 2) Reflow soldering • Screen-printing is recommended for printing paste solder. • To determine the relationship between the screen opening area and the PC board foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks when setting. • Note that excess solder on the terminals prevents complete insertion of the FPC, and that excess solder on the soldering terminals prevents the lever from rotating. Terminal Paste solder PC board foot pattern Panasonic Corporation • Screen thickness of 120µm is recommended for paste solder printing. • Consult us when using a screen-printing thickness other than that recommended. • Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. • The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile Upper limit (Soldering heat resistance) Lower limit (Solder wettability) Temperature Peak temperature 260°C 230°C 180°C Preheating 220°C 200°C 25 sec. 150°C 60 to 120 sec. 70 sec. Time
When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive forces. The soldered areas should not be subjected to forces.
Other Notes When coating the PC board after soldering the connector (to prevent the deterioration of insulation), perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching. Please refer to the latest product specifications when designing your product. • The temperature is measured on the surface of the PC board near the connector terminal. • Certain solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. • When performing reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector using, for example, an adhesive. (Double reflow soldering on the same side is possible) 3) Reworking on a soldered portion • Finish reworking in one operation. • For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise the flux may creep to the contact parts. • Use a soldering iron whose tip temperature is within the temperature range specified in the specifications.
Do not drop or handle the connector carelessly. Otherwise, the terminals may become deformed due to excessive force or applied solderability may be during reflow degrade.
Don’t open/close the lever or insert/ remove an FPC until the connector is soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. In addition, do not insert an FPC into the connector before soldering the connector. Automation Controls Business Unit industrial.panasonic.com/ac/e ACCTB13E 201201-T