PAN1326C Bluetooth
Basic Data Rate and Low Energy Module
Design Guide
Rev. 1.0
Wireless Modules
Overview
Panasonic’s new PAN1326C is a Host Controlled
Interface (HCI) Bluetooth RF module that brings
Texas Instrument’s seventh generation Bluetooth
core integrated circuit, the CC2564, to an easy-touse module format. The PAN1326C is Bluetooth-4.2compliant and it offers best-in-class RF performance
with about twice the range of other Bluetooth Low
Energy solutions. Panasonic’s tiny footprint
technology has produced a module of only
85.5 mm². The module is designed to accommodate
PCBs pad pitch of 1.3 mm and as few as two layers
for easy implementation and manufacturing. The
module has been designed to be 100 % pincompatible with previous generations of Texas
Instruments-based Bluetooth HCI modules.
PAN1326C Bluetooth Module
Bluetooth
• Scatternet and piconets simultaneously
• Synchronous Connection Oriented (SCO) links on
the same piconet
•
Support for All Voice Air-Coding - Continuously
Variable Slope Delta (CVSD), A-law, µ-law,
modified Subband Coding (mSBC), and
transparent (uncoded)
•
Assisted mode for HFP 1.6 Wideband Speech
(WBS) profile or A2DP profile to reduce host
processing and power
•
Support of multiple Bluetooth profiles with
enhanced QoS
•
Multiple sniff instances tightly coupled to achieve
minimum power consumption
•
Independent buffering for Low Energy allows large
numbers of multiple connections without affecting
BR or EDR performance
Features
• Bluetooth 4.2 Basic Data Rate (BR) and Low
•
Built-in coexistence and prioritization handling for
BR, EDR, and Low Energy
•
Capabilities of link layer topology Scatternet - can
act concurrently as peripheral and central
•
•
•
•
Network support for up to 10 devices
Energy (LE)
Dimensions 15.6 x 8.7 x 1.9 mm
Integrated high speed crystal oscillator (26 MHz)
Time line optimization algorithms to achieve
maximum channel utilization
Characteristics
• Bluetooth 4.2
• Receiver sensitivity -93 dBm
• Output power 12 dBm
• Power supply 1.7 to 4.8 V
• Power consumption Tx 40 mA
• Power consumption Rx 20 mA
• Sleep mode 135 µA
• Operating temperature range -45 ºC to +85 ºC
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
Table of Contents
1
2
3
About This Document......................................................................................................................... 4
1.1
Purpose and Audience .............................................................................................................. 4
1.2
Revision History ......................................................................................................................... 4
1.3
Use of Symbols ......................................................................................................................... 4
1.4
Related Documents ................................................................................................................... 4
PAN1326C ............................................................................................................................................ 5
2.1
PAN1326C Block Diagram ........................................................................................................ 5
2.2
PAN1326C Placement Recommendations ................................................................................ 5
PAN1326C Breakout Board ................................................................................................................ 6
3.1
PAN1326C Breakout Board Component Placement ................................................................. 6
3.2
PAN1326C Breakout Board Schematic ..................................................................................... 7
4
EM Adapter BoosterPack ................................................................................................................... 8
5
MSP432 Launchpad ............................................................................................................................ 9
6
Appendix ........................................................................................................................................... 10
7
6.1
Ordering Information ................................................................................................................ 10
6.2
Contact Details ........................................................................................................................ 10
6.3
Product Information ................................................................................................................. 10
Life Support Policy ........................................................................................................................... 12
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
1 About This Document
1 About This Document
1.1
Purpose and Audience
This Design Guide applies to the Bluetooth development platform PAN1326C Experimenter Kit.
The intention is to enable our customers to easily and fast integrate our module PAN1326C in
their product. This guide describes the Hardware and gives useful hints.
1.2
1.3
Revision History
Revision
Date
Modifications/Remarks
1.0
14.11.2017
1st version.
Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product. Non-observance
can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates crossreferences within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4
Related Documents
Please refer to the Panasonic website for related documents 6.3 Product Information
For further information refer to the Ti WIKI for CC256x CC256x WIKI
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
2 PAN1326C
2 PAN1326C
2.1
PAN1326C Block Diagram
PAN132x
Bluetooth 4.2 Module
Vcc 3.3 V
UART
Crystal
26 MHz
GPIOs
Chip
Antenna
Audio PCM/I2C
Texas Instruments
CC256x
BT-HCI Chip
Reset
32 kHz input
LPF
2.2
PAN1326C Placement Recommendations
PAN1326C WITH ANTENNA
PLACEMENT
If possible place PAN1326C in the
center of mother PCB.
Min. 15mm
5.00
Min. 15mm
Top View
15.6
Min. 40mm
Restricted Area
No copper any layer
Place PAN1326C at the edge of
mother PCB.
3.00
8.7
Use a Ground plane in the
area surrounding the
PAN1326C module wherever
possible.
Dimensions are in mm.
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
3 PAN1326C Breakout Board
3 PAN1326C Breakout Board
3.1
PAN1326C Breakout Board Component Placement
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
3 PAN1326C Breakout Board
3.2
PAN1326C Breakout Board Schematic
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
4 EM Adapter BoosterPack
4 EM Adapter BoosterPack
Note: If you purchase the adapter board directly via Texas Instruments or a related distributor,
the crystal oscillator next to C7 is not equipped. Please be aware, that in this case you are
missing the 32 kHz slow clock and have to solder it on the board.
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
5 MSP432 Launchpad
5 MSP432 Launchpad
The installation and tools are described in the Quick Start Guide for the MSP432 Launch Pad
on the TI Wiki page Getting Started Guide for MSP432 + CC2564C
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
6 Appendix
6 Appendix
6.1
Ordering Information
Variants and Versions
6.2
6.2.1
1
Order Number
Brand Name
Description
MOQ
ENW89819AYKF
Experimenter Kit
1x PAN1326C Breakout Board,
1x Texas Instruments MSP430 Launchpad,
1x Texas Instruments Boost/CCEMAdapter
1
ENW89819AXKF
1326C Breakout Board
1x PAN1326C Breakout Board
1
Contact Details
Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to
find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
6.3
Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
1
Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces,
fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution
channels.
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
6 Appendix
http://www.panasonic.com/rfmodules
Design Guide Rev. 1.0
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PAN1326C Bluetooth Module
7 Life Support Policy
7 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
Design Guide Rev. 1.0
Page 12
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