ENW89853AXKF

PAN1762 Bluetooth Low Energy Module Product Specification Rev. 1.0 Wireless Modules  PAN1762 Bluetooth Module Overview ® The PAN1762 is a Panasonic Bluetooth 5.0 Low Energy module based on the Toshiba TC35680 single-chip controller. Features • Small 15.6 mm x 8.7 mm x 1.9 mm SMD module • Same form factor and pinout as PAN1026A and PAN1760A • • • • • • • • Bluetooth Low Energy 5.0 compliant coded PHY • • • • • Bluetooth stack in ROM 128 kB flash memory available for application Host mode and stand-alone mode operation, AT command mode (soon) Standard SIG Bluetooth LE profiles as well as SPP over Bluetooth LE profile 18 General Purpose I/Os, which are shared by 2 SPI, 2 I²C, 2 UART, 4 PWM, 5 ADC, and Wake-Up inputs Low Energy advertising extensions (advertising on 40 channels) Channel selection algorithm #2 Low Energy secure connections Advertising function without CPU Wake-Up and interaction Bluetooth SIG certified Mesh stack (soon) Characteristics • Typical sensitivity -95 dBm @ 1 Mb/s and Max. 51 kB RAM for application code and ROM patches ® Bluetooth • 2 Mbps high-speed PHY, Low Energy long range -105 dBm @ 125 kb/s • • • • Output power max. 8 dBm Typical current consumption of 11 mA in TX (@ 8 dBm) and 5.1 mA in RX mode Voltage range: 1.9 V to 3.6 V Temperature range: -40 °C to 85 °C ® Toshiba TC35680 featuring ARM Cortex -M0 with SWD interface Block Diagram   PAN1762 Bluetooth Low Energy 5.0 Module 1.9 V to 3.6 V   Reset   Crystal 32 MHz  GPIOs UART Toshiba TC35680 Crystal 32.768 kHz  SPI I²C ADC Flash 128 kB  Chip Antenna DC-DC Conversion  SWD Product Specification Rev. 1.0 Page 2  PAN1762 Bluetooth Module By purchase of any of the products described in this document the customer accepts the document’s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2018. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:  The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer,  Deviation or lapse in function of the Engineering Sample,  Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 1.0 Page 3  PAN1762 Bluetooth Module Table of Contents 1 2 3 4 5 6 7 About This Document......................................................................................................................... 5 1.1 Purpose and Audience .............................................................................................................. 5 1.2 Revision History ......................................................................................................................... 5 1.3 Use of Symbols ......................................................................................................................... 5 1.4 Related Documents ................................................................................................................... 5 Overview .............................................................................................................................................. 6 2.1 Block Diagram ........................................................................................................................... 7 2.2 Pin Configuration ....................................................................................................................... 8 2.3 UART Interface ........................................................................................................................ 10 2.4 Bluetooth Features .................................................................................................................. 10 Detailed Description ......................................................................................................................... 11 3.1 Dimensions .............................................................................................................................. 11 3.2 Footprint .................................................................................................................................. 12 3.3 Packaging ................................................................................................................................ 13 3.4 Case Marking .......................................................................................................................... 16 Specification ..................................................................................................................................... 17 4.1 Default Test Conditions ........................................................................................................... 17 4.2 Absolute Maximum Ratings ..................................................................................................... 17 4.3 Recommended Operating Conditions ...................................................................................... 18 4.4 Current Consumption............................................................................................................... 18 4.5 Bluetooth ................................................................................................................................. 19 4.6 Reliability Tests ....................................................................................................................... 19 4.7 Recommended Soldering Profile ............................................................................................. 20 Cautions ............................................................................................................................................ 21 5.1 Design Notes ........................................................................................................................... 21 5.2 Installation Notes ..................................................................................................................... 21 5.3 Usage Condition Notes ............................................................................................................ 22 5.4 Storage Notes .......................................................................................................................... 22 5.5 Safety Cautions ....................................................................................................................... 22 5.6 Other Cautions ........................................................................................................................ 23 5.7 Life Support Policy ................................................................................................................... 24 5.8 Restricted End Use .................................................................................................................. 24 Regulatory and Certification Information ....................................................................................... 25 6.1 Federal Communications Commission (FCC) for US .............................................................. 25 6.2 Innovation, Science, and Economic Development (ISED) for Canada .................................... 25 6.3 European Conformity According to RED (2014/53/EU) ........................................................... 25 6.4 Bluetooth ................................................................................................................................. 25 6.5 RoHS and REACH Declaration ............................................................................................... 25 Appendix ........................................................................................................................................... 26 7.1 Ordering Information ................................................................................................................ 26 7.2 Contact Details ........................................................................................................................ 27 Product Specification Rev. 1.0 Page 4  PAN1762 Bluetooth Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1762 module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the PAN1762” or “the module” within this document. 1.2 1.3 Revision History Revision Date Modifications/Remarks 1.0 2018-11-20 Initial release Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk.  [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document  1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents  7.2.2 Product Information. Product Specification Rev. 1.0 Page 5  PAN1762 Bluetooth Module 2 Overview 2 Overview The PAN1762 is a Panasonic Bluetooth 5.0 Low Energy module based on the Toshiba TC35680 single-chip controller. The new Bluetooth 5.0 features enable a higher symbol rate of 2 Mbps using the high-speed 2 M PHY or a significantly longer range using the Low Energy coded PHY at 500 kb/s or 125 kb/s. The new channel selection algorithm improves the performance in environments which are busy at 2.4 GHz. Furthermore, the new Low Energy advertising extensions allow for much larger amounts of data to be broadcast in connectionless scenarios and are therefore favorable for beacon and mesh applications. A high output power of up to 8 dBm and the industry leading sensitivity of the TC35680 in combination with the Low Energy coded PHY make the module very attractive in applications where a long range is required. The ultra-low current consumption of the PAN1762 makes the module an ideal choice for battery powered devices. Various sleep modes can be used to minimize power consumption and prolong battery life time. To provide maximum flexibility, the module can be operated in hosted as well as standalone mode. In standalone mode no external processor is necessary, which saves complexity, space, and cost. The built-in 128 kB flash memory is completely free for application use. PAN1762 shares the same small form factor and footprint as PAN1026A and PAN1760A. When migrating from PAN1760A or PAN1760 only minor code changes are required. Previously developed software, such as Bluetooth Low Energy profiles and applications, can be easily migrated with a minimal effort. FCC, IC, and CE approval are in preparation. Please refer to the Panasonic website for related documents  7.2.2 Product Information. Further information on the variants and versions  7.1 Ordering Information. Product Specification Rev. 1.0 Page 6  PAN1762 Bluetooth Module 2 Overview 2.1 Block Diagram   PAN1762 Bluetooth Low Energy 5.0 Module 1.9 V to 3.6 V   Reset   Crystal 32 MHz  GPIOs UART Toshiba TC35680 Crystal 32.768 kHz  SPI I²C ADC Flash 128 kB  Chip Antenna DC-DC Conversion  SWD   Product Specification Rev. 1.0 Page 7    PAN1762 Bluetooth Module 2 Overview 2.2 Pin Configuration Pin Assignment Top View All dimensions are in millimeters. 15.6 5.0 1.0 1.2 2.6 F1 F2 F3 0.6 F4 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A2 A3 A4 A5 A6 A7 A8 A9 1.85 F5 F6 F7 F8 F9 1.2 F11 F12 Ground plane keep- out area 5.0 8.7 0.6 A1 1.35 0.6 A11 A12 1.85 3.0 Pin Functions No Pin Name Pin Type Description A1 GND Ground Pin Connect to ground A2 GPIO3 Digital I/O A3 RESET Digital Input Reset, active low A4 NC NC Not connected A5 VCC Power Analog/digital power supply connection A6 VCC Power Analog/digital power supply connection A7 GND Ground Pin Connect to ground A8 GPIO16 Digital I/O A9 GND Ground Pin Connect to ground A11 GND Ground Pin Connect to ground A12 GND Ground Pin Connect to ground B1 GPIO9 Digital I/O B2 GPIO4 Digital I/O Product Specification Rev. 1.0 Page 8  PAN1762 Bluetooth Module 2 Overview No Pin Name Pin Type Description B3 NC NC Not connected, leave open B4 NC NC Not connected, leave open B5 GPIO7/UART RTS Digital I/O UART RTS B6 GPIO8/UART CTS Digital I/O UART CTS B7 GPIO17 Digital I/O B8 NC NC Not connected, leave open B9 GND Ground Pin Connect to ground C1 NC NC Not connected, leave open C2 NC NC Not connected, leave open C3 GPIO10 Digital I/O C4 SWDIO SWD C5 SWDCLK SWD C6 GPIO1 Digital I/O C7 NC NC Not connected, leave open C8 GND Ground Pin Connect to ground C9 GND Ground Pin Connect to ground D1 NC NC Not connected, leave open D2 NC NC Not connected, leave open D3 NC NC Not connected, leave open D4 GPIO0/WakeUp0 Digital I/O D5 NC NC D6 GPIO15/WakeUp1 Digital I/O D7 GND Ground Pin Connect to ground D8 GND Ground Pin Connect to ground D9 ANT RF-Signal Antenna pin (not connected for standard module version) E1 GPIO12/SDA Digital I/O I2C interface E2 GPIO11/SCL Digital I/O I2C interface E3 NC NC Not connected, leave open E4 NC NC Not connected, leave open E5 NC SLPXOIN Not connected for standard version (32 kHz clock input) E6 GPIO6/UARTRX Digital Input UART RX Product Specification Rev. 1.0 Not connected, leave open Page 9  PAN1762 Bluetooth Module 2 Overview No Pin Name Pin Type Description E7 NC NC Not connected, leave open E8 GND Ground Pin Connect to ground E9 GND Ground Pin Connect to ground F1 GND Ground Pin Connect to ground F2 NC NC Not connected, leave open F3 NC NC Not connected, leave open F4 NC NC Not connected, leave open F5 GPIO14 Digital Input F6 GPIO2 Digital I/O F7 GPIO5/UARTTX Digital Output F8 GPIO13 Digital Output F9 GND Ground Pin Connect to ground F11 GND Ground Pin Connect to ground F12 GND Ground Pin Connect to ground UART TX Minimal configuration: • • • 2.3 GND UART Rx, Tx, no flow control UART Interface • • • 2.4 VCC Default baud rate: 115 200 Data format: 8, Stop: 1, Parity: none, LSB first Rx, Tx, no flow control Bluetooth Features • • • • • • 2 Mbps high-speed PHY, Low Energy long range coded PHY Low Energy advertising extensions (advertising on 40 channels total) Channel selection algorithm #2 Low Energy secure connections Advertising function without CPU Wake-Up and interaction Bluetooth SIG certified Mesh stack (soon) Product Specification Rev. 1.0 Page 10  PAN1762 Bluetooth Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. No. Item Dimension Tolerance Remark 1 Width 8.70 ± 0.35 2 Length 15.60 ± 0.35 3 Height 1.80 Product Specification Rev. 1.0 ± 0.35 With case Page 11  PAN1762 Bluetooth Module 3 Detailed Description 3.2 Footprint The outer dimensions have a tolerance of 0.35 mm. All dimensions are in millimeters. Top View 15.6 5.0 1.0 1.2 2.6 F1 F2 F3 0.6 F4 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A2 A3 A4 A5 A6 A7 A8 A9 1.85 F5 F6 F7 F8 F9 1.2 F11 F12 Ground plane keep- out area 5.0 8.7 0.6 A1 0.6 Product Specification Rev. 1.0 1.35 A11 A12 1.85 3.0 Page 12  PAN1762 Bluetooth Module 3 Detailed Description 3.3 Packaging The product is an ES status product and will be delivered in the package described below. 3.3.1 Tape Dimensions 3.3.2 Packing in Tape Direction of unreeling (for customer) trailer (empty) 1 x circumference / hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. 100730-PAN1720.vsd The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 1.0 Page 13  PAN1762 Bluetooth Module 3 Detailed Description 3.3.3 Component Direction 3.3.4 Reel Dimension Product Specification Rev. 1.0 Page 14  PAN1762 Bluetooth Module 3 Detailed Description 3.3.5 Package Label Example (1T) (1P) (2P) (9D) (Q) (HW/SW) 3.3.6 Lot code Customer order number, if applicable Order number Date code Quantity Hardware/software version Total Package Product Specification Rev. 1.0 Page 15  PAN1762 Bluetooth Module 3 Detailed Description 3.4 Case Marking Example 1 2 3 4 5 6 7 8 9 Product Specification Rev. 1.0 MIC ID Brand name Hardware/software version Order number FCC ID Lot code Engineering Sample marking, if applicable Marking for Pin 1 2D barcode, for internal usage only Page 16  PAN1762 Bluetooth Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature: Humidity: Supply Voltage: 4.2 25 °C ± 10 °C 40 % to 85 % RH 3.3 V Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. TSTOR Storage temperature -40 85 °C VDD Power supply -0.3 3.9 mA VESD ESD robustness All pads, according to human body model (HBM), (Target value) JEDEC STD 22, method A114 According to charged device model (CDM), JEDEC STD 22, method C101 Max. Units 1 000 V 500 V 10 dBm PRF RF input level VDIG Voltage on any digital pins -0.3 VDD 0.3 IIN Input current for any digital pin -10 10 Product Specification Rev. 1.0 V mA Page 17  PAN1762 Bluetooth Module 4 Specification 4.3 Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. 4.4 Symbol Parameter Condition Min. Typ. TA Ambient operating temperature range -40 VDD 3V3 Supply voltage 1.8 Max. 3.3 Units 85 °C 3.6 V Current Consumption The current consumption depends on the user scenario, on the setup, and timing in the power modes. Assume VDD = 3.0 V, Tamb = 25 °C, if nothing else stated. Parameter Condition Current consumption of the digital circuits at operation Bluetooth wireless: not used Data transmission current consumption Min. Typ. Max. Units 1.2 mA Target value, 1 Mbps, 0 dBm 5.2 mA Target value, 2 Mbps, 0 dBm 5.4 mA Target value, 1 Mbps, 8 dBm 11.3 mA Target value, 2 Mbps, 8 dBm 11.5 mA Target value, 1 Mbps 5.1 mA Target value, 2 Mbps 5.6 mA Current consumption in Power supply of CPU: on The oscillation of Low power mode the sleep clock is operated. Whole of the (sleep mode) data is retained. 2.5 µA Current consumption in Power supply of CPU: off The oscillation of the sleep clock is operated. Whole of the Low power mode data is retained. (backup mode) 2.5 µA Deep sleep mode 50 nA Data reception current consumption Built-in flash memory: not used Power supply of CPU: off The oscillation of the sleep clock is stopped. No data is retained. Product Specification Rev. 1.0 Page 18  PAN1762 Bluetooth Module 4 Specification 4.5 Bluetooth Parameter Condition Min. Operation frequency range Channel spacing Typ. 2 402 2 480 Bluetooth LE Units MHz 2 MHz 8 dBm -95 dBm -93 dBm 500 kbps (S = 2), PER = 30.8 % at 1 500 packets with dirty Tx, 37 octets -101 dBm 125 kbps (S = 8), PER = 30.8 % at 1 500 -105 dBm Output Power Maximum setting, measured at module bottom pad Sensitivity Max. 1 Mbps, PER = 30.8 % at 1 500 packets with dirty Tx, 37 octets 2 Mbps, PER = 30.8 % at 1 500 packets with dirty Tx, 37 octets packets with dirty Tx, 37 octets Symbol Parameter 1 Spurious emissions 4.6 Condition Min. Typ. Conducted measurement at module RF bottom pad Max.