Doc No. TT4-ZZ-02013
Revision. 1
Product Standards
MOS FET
FCAB21490L1
FCAB21490L1
Gate resistor installed Dual N-channel MOS FET
Unit: mm
For lithium-ion secondary battery protection circuits
Features
Source-source ON resistance:RSS(on) typ. = 2.2 m(VGS = 3.8 V)
CSP(Chip Size Package)
Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL : Level 1)
Marking Symbol: 7F
Packaging
Embossed type (Thermo-compression sealing) : 1 000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25 C
Parameter
Symbol
Source-source Voltage
Gate-source Voltage
Source Current
Total Power Dissipation
Channel Temperature
Storage Temperature Range
Note
DC *1
DC *2
Pulse *3
DC *1
DC *2
VSS
VGS
IS1
IS2
ISp
PD1
PD2
Tch
Tstg
Rating
Unit
12
8
13.5
29
135
0.54
3.5
150
-55 to +150
V
V
A
A
A
W
W
C
C
*1 Mounted on FR4 board ( 25.4 mm 25.4 mm t1.0 mm )
using the minimum recommended pad size (36m Copper ).
*2 Mounted on Ceramic substrate (70 mm 70 mm t1.0 mm).
*3 t = 10 s, Duty Cycle 1 %
1,2,4,5. Source1(FET1)
6,7,9,10. Source2(FET2)
Panasonic
JEITA
Code
3. Gate1 (FET1)
8. Gate2 (FET2)
TCSP1530011-N1
―
―
Equivalent circuit
6,7,9,10(S2)
8(G2)
1,2,4,5(S1)
3(G1)
FET2
FET1
Page 1 of 5
Established : 2016-11-09
Revised : ####-##-##
Doc No. TT4-ZZ-02013
Revision. 1
Product Standards
MOS FET
FCAB21490L1
Electrical Characteristics Ta = 25 C 3 C
Parameter
Symbol
Source-source Breakdown Voltage
Zero Gate Voltage Source Current
VSSS
ISSS
Gate-source Leakage Current
IGSS
Gate-source Threshold Voltage
Source-source On-state Resistance
Body Diode Forward Voltage
Input Capacitance *1
Output Capacitance *1
Reverse Transfer Capacitance *1
Turn-on delay Time *1,*2
Rise Time *1,*2
Turn-off delay Time *1,*2
Fall Time *1,*2
Total Gate Charge *1
Gate-source Charge *1
Gate-drain Charge *1
Note
Conditions
Min
IS = 1.0 mA, VGS = 0 V
VSS = 12 V, VGS = 0 V
VGS = 8 V, VSS = 0 V
VGS = 5 V, VSS = 0 V
IS = 1.11 mA, VSS = 10 V
IS = 6.0 A, VGS = 4.5 V
IS = 6.0 A, VGS = 3.8 V
IS = 6.0 A, VGS = 3.1 V
IS = 6.0 A, VGS = 2.5 V
IF = 6.0 A, VGS = 0 V
Vth
RSS(on)1
RSS(on)2
RSS(on)3
RSS(on)4
VF(s-s)
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
Typ
Max
Unit
V
A
12
0.35 0.90
1.55 2.1
1.6
2.2
1.65 2.4
1.9
3.1
0.6
3570
460
410
0.7
1.5
6.7
4.1
25
12
6
VSS = 10 V, VGS = 0 V, f = 1 kHz
VDD = 6.0 V, VGS = 0 to 4.0 V
IS = 6.0 A
VDD = 6.0 V, VGS = 4.0 to 0 V
IS = 6.0 A
VDD = 6.0 V
VGS = 0 to 4.0 V,
IS = 6.0 A
1.0
10
1.0
1.4
2.75
2.85
3.95
6.1
1.2
A
V
m
V
pF
s
s
nC
Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors.
*1 Guaranteed by design, not subject to production testing
*2 Measurement circuit for Turn-on Delay Time / Rise Time / Turn-off Delay Time / Fall Time
Note2:Measurement circuit
VDD = 6.0 V
IS = 6.0 A
RL = 1
Vout
S2
90 %
Vin
10 %
Rg
G2
90 %
G1
Vin
4.0 V
90 %
Vout
Rg
10 %
10 %
0V
PW = 10 s
D.C. 1 %
S1
td(on) tr
td(off)
tf
Page 2 of 5
Established : 2016-11-09
Revised : ####-##-##
Doc No. TT4-ZZ-02013
Revision. 1
Product Standards
MOS FET
FCAB21490L1
IS - VSS
4.0
※Pulse measurement
10
VGS = 4.5 V
3.8 V
8
3.1 V
6
2.5 V
4
※Pulse measurement
Source-Source On-resistance
RSS(on) ( mΩ )
Source Current , IS ( A )
12
RSS(on) - IS
2
3.5
3.0
2.5 V
3.1 V
2.5
3.8 V
2.0
VGS = 4.5 V
1.5
0
0
1
0.01
0.02
0.03
0.04
0.05
Source-source Voltage , VSS(V)
2
3
IS - VGS
6
7
8
Source-source On-resistance
RSS(on) ( mΩ )
12
85 ºC
25 ºC
0.1
-40 ℃
※Pulse measurement
0.01
0
10
0.5
1
8
6
25 ºC
4
85 ºC
2
-40 ℃
0.5
1.5
1.5
2.5
3.5
4.5
5.5
6.5
Gate-source Voltage , VGS ( V )
IF - VF
IGS - VGS
1
25 ºC
- 40 ºC
0.01
0.2
0.4
7.5
1.E-04
85 ºC
0
IS = 6. A
Gate-source Voltage , VGS( V )
※Pulse measurement
0.1
※Pulse measurement
10
0
Gate-source Leakage Current
IGS ( A )
Source Current , IS ( A )
5
RSS(on) - VGS
1
Diode Forward Current , IF ( A )
4
Source Current , IS ( A )
0.6
0.8
Body Diode Forward Voltage , VF ( V )
85 ºC
1.E-05
25 ºC
1.E-06
- 40 ºC
1.E-07
1.E-08
※Pulse measurement
1.E-09
0
5
10
15
Gate-source Voltage , VGS ( V )
Page 3 of 5
Established : 2016-11-09
Revised : ####-##-##
Doc No. TT4-ZZ-02013
Revision. 1
Product Standards
MOS FET
FCAB21490L1
Dynamic Input / Output Characteristics
1.E-03
Gate-source Voltage , VGS ( V )
Zero Gate Voltage Source Current
ISS ( A )
ISS - VSS
※Pulse measurement
1.E-04
1.E-05
85 ºC
1.E-06
1.E-07
25 ºC
1.E-08
1.E-09
- 40 ºC
1.E-10
0
5
10
15
4.0
VDD = 6.0 V
IS = 6.0 A
3.0
2.0
1.0
0.0
20
0
Source-source Voltage , VSS ( V )
5
10
15
20
25
Gate Charge , Qg ( nC )
Normalized Effective Transient Thermal Impedance
Safe Operating Area
1000
1000
(A)
100
(B)
10
1
Ta=25 ºC
(A) Mounted on FR4 board (25.4 mm×25.4 mm×t1.0 mm).
using the minimum recommended pad size (36 m Copper) .
(B) Mounted on Ceramic substrate (70 mm×70 mm×t1.0 mm).
0.1
0.001 0.01
Source Current, IS ( A )
Thermal Resistance , Rth ( ºC / W )
Rth - tsw
30
100
1 ms
3 ms
10
11 ms
100 ms
1
DC
0.1
0.01
0.1
1
10 100 1000
Pulse Width , tsw ( s )
limited by RSS(on) (VGS = 3.8 V)
Absolute Maximum
1s
Ta = 25 ºC,
Mounted on FR4 board
(25.4 mm×25.4 mm×t1.0 mm).
using the minimum recommended
pad size(36 m Copper) .
0.1
1
10
100
Source-source Voltage , VSS ( V )
Thermal Response
10
1
Ta = 25 ºC,
Mounted on FR4 board (25.4 mm×25.4 mm×t1.0 mm).
using the minimum recommended pad size(36 m Copper) .
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
Single Pulse
0.001
0.0001 0.001 0.01
0.1
1
10
100
1000
Square Wave Pulse Duration ( s )
Page 4 of 5
Established : 2016-11-09
Revised : ####-##-##
Doc No. TT4-ZZ-02013
Revision. 1
Product Standards
MOS FET
FCAB21490L1
Outline
Land Pattern (Reference)
Unit: mm
Unit: mm
Page 5 of 5
Established : 2016-11-09
Revised : ####-##-##
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
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of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
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defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or
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No.020210