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UPD70F3040Y

UPD70F3040Y

  • 厂商:

    NEC(日电电子)

  • 封装:

  • 描述:

    UPD70F3040Y - V850/SV1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS - NEC

  • 数据手册
  • 价格&库存
UPD70F3040Y 数据手册
PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y V850/SV1 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS TM DESCRIPTION The µPD703039, 703039Y, 703040, 703040Y, 703041, and 703041Y (collectively known as the V850/SV1) are products in the low-power series of V850 FamilyTM products, which are NEC’s single-chip microcontrollers for realtime control. The V850/SV1 employs the CPU core of the V850 Family, and has on-chip peripheral functions such as large capacity ROM/RAM, a multi-function timer/counter, serial interface, A/D converter, DMA controller, PWM, and a Vsync/Hsync separation circuit. The V850/SV1 not only realizes the low power consumption necessary for applications such as camcorders, but also extremely high cost performance. Detailed function descriptions are provided in the following user’s manuals. Be sure to read them before designing. V850/SV1 User’s Manual Hardware : U14462E V850 Family User’s Manual Architecture : U10243E FEATURES { Number of instructions: 74 { Minimum instruction execution time: 62.5 ns (@ 16 MHz operation with main system clock) { General-purpose registers: 32 bits × 32 registers { Instruction set (signed multiplication, saturation operations, 32-bit shift instructions, bit manipulation instructions, load/store instructions) { Memory space: 16 MB linear address space Memory block allocation function: 2 MB per block { External bus: 16-bit multiplexed bus { Internal memory: { 10-bit resolution A/D converter: 16 channels { Timer/counter 24-bit: 2 channels, 16-bit: 2 channels 8-bit: 8 channels { Watchdog timer: 1 channel { DMA controller: 6 channels { Interrupts and exceptions Non-maskable interrupt: 2 sources Maskable interrupt : µPD703039, 703040, 703041 (51 sources) : µPD703039Y, 703040Y, 703041Y (52 sources) Software exception: 32 sources Exception trap: 1 source { Serial interface (SIO) Asynchronous serial interface (UART) Clocked serial interface (CSI) 3-wire variable length serial interface (CSI4) I2C bus interface (I2C) (µPD703039Y, 703040Y, 703041Y) { RTP: 8 bits × 2 channels or 4 bits × 4 channels 30.5 µs (@ 32.768 kHz operation with subsystem clock) { Watch timer: 1 channel µPD703039, 703039Y (ROM: 256 KB, RAM: 8 KB) µPD703040, 703040Y (ROM: 256 KB, RAM: 16 KB) µPD703041, 703041Y (ROM: 192 KB, RAM: 8 KB) { I/O lines Total: 151 The information contained in this document is being issued in advance of the production cycle for the device. The parameters for the device may change before final production or NEC Corporation, at its own discretion, may withdraw the device prior to its production. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. U13953EJ1V0DS00 (1st edition) Date Published March 2000 N CP(K) Printed in Japan The mark shows major revised points. © 2000 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y { PWM output: 4 channels { Vsync/Hsync separation circuit { On-chip key return function { On-chip clock generator { Power saving function: HALT/IDLE/STOP modes { ROM correction: 4 points changeable { Package: 176-pin plastic LQFP (24 × 24 mm) APPLICATIONS { System/servo/camera control of camcorders { Portable cameras such as digital still cameras { Cellular phones, portable information terminals, etc. ORDERING INFORMATION Part Number Package 176-pin plastic LQFP (fine pitch) (24 × 24 mm) 176-pin plastic LQFP (fine pitch) (24 × 24 mm) 176-pin plastic LQFP (fine pitch) (24 × 24 mm) 176-pin plastic LQFP (fine pitch) (24 × 24 mm) 176-pin plastic LQFP (fine pitch) (24 × 24 mm) 176-pin plastic LQFP (fine pitch) (24 × 24 mm) µPD703039GM-×××-UEU µPD703039YGM-×××-UEU µPD703040GM-×××-UEU µPD703040YGM-×××-UEU µPD703041GM-×××-UEU µPD703041YGM-×××-UEU Remark ××× indicates ROM code suffix. DIFFERENCES BETWEEN V850/SV1 PRODUCTS Internal ROM Internal RAM 8 KB IC None Provided 16 KB None Provided 192 KB (mask ROM) 8 KB None Provided 256 KB (flash memory) 16 KB None Provided Provided 2 VPP Pin None µPD703039 µPD703039Y µPD703040 µPD703040Y µPD703041 µPD703041Y µPD70F3040 µPD70F3040Y 256 KB (mask ROM) 2 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y PIN CONFIGURATION 176-pin plastic LQFP (fine pitch) (24 × 24 mm) µPD703039GM-×××-UEU µPD703039YGM-×××-UEU µPD703040GM-×××-UEU µPD703040YGM-×××-UEU µPD703041GM-×××-UEU µPD703041YGM-×××-UEU P12/SCK0/SCL0Note 2 P13/SI1/RXD0 P14/SO1/TXD0 P15/SCK1/ASCK0 P20/SI2/SDA1Note 2 P21/SO2 P22/SCK2/SCL1Note 2 P23/SI3/RXD1 P24/SO3/TXD1 P25/SCK3/ASCK1 P26/TI2/TO2 P27/TI3/TO3 VDD VSS P30/TI000 P31/TI001 P32/TI010 P33/TI011 P34/TO0 P35/TO1 P36/TI4/TO4 P37/TI5/TO5 P120/SI4 P121/SO4 P122/SCK4 P123/CLO P124/TI6/TO6 P125/TI7/TO7 P126/TI10/TO10 P127/TI11/TO11 P180 P181 P182 P183 P184 P185 P186 P187 VDD VSS P190 P191 P192 P193 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 P11/SO0 P10/SI0/SDA0Note 2 P113 P112 P111 P110 WAIT CLKOUT P65/A21 P64/A20 P63/A19 P62/A18 P61/A17 P60/A16 P57/AD15 P56/AD14 P55/AD13 P54/AD12 P53/AD11 P52/AD10 P51/AD9 P50/AD8 BVSS BVDD P47/AD7 P46/AD6 P45/AD5 P44/AD4 P43/AD3 P42/AD2 P41/AD1 P40/AD0 P96/HLDRQ P95/HLDAK P94/ASTB P93/DSTB/RD P92/R/W/WRH P91/UBEN P90/LBEN/WRL VSS VDD AVDD AVSS AVREF 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 P87/ANI15 P86/ANI14 P85/ANI13 P84/ANI12 P83/ANI11 P82/ANI10 P81/ANI9 P80/ANI8 P77/ANI7 P76/ANI6 P75/ANI5 P74/ANI4 P73/ANI3 P72/ANI2 P71/ANI1 P70/ANI0 P147 P146 P145/RTPTRG1 P144/TI9/INTTI9 P143/INTCP93 P142/INTCP92 P141/INTCP91 P140/INTCP90 P137/TO81 P136/TO80 P135/TCLR8/INTTCLR8 P134/TI8/INTTI8 P133/INTCP83 P132/INTCP82 P131/INTCP81 P130/INTCP80 VSS VDD P07/INTP6 P06/INTP5/RTPTRG0 P05/INTP4/ADTRG P04/INTP3 P03/INTP2 P02/INTP1 P01/INTP0 P00/NMI P157/RTP17 P156/RTP16 Notes 1. Connect directly to VSS. 2. SCL0, SCL1, SDA0, and SDA1 are valid for the µPD703039Y, 703040Y, and 703041Y only. P194 P195 P196 P197 P170/KR0 P171/KR1 P172/KR2 P173/KR3 P174/KR4 P175/KR5 P176/KR6 P177/KR7 P160/PWM0 P161/PWM1 P162/PWM2 P163/PWM3 P164/CSYNCIN P165/VSOUT P166/HSOUT0 P167/HSOUT1 ICNote 1 RESET XT1 XT2 VDD X2 X1 VSS P100/RTP00 P101/RTP01 P102/RTP02 P103/RTP03 P104/RTP04 P105/RTP05 P106/RTP06 P107/RTP07 VDD VSS P150/RTP10 P151/RTP11 P152/RTP12 P153/RTP13 P154/RTP14 P155/RTP15 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 Preliminary Data Sheet U13953EJ1V0DS00 3 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y PIN IDENTIFICATION A16 to A21: AD0 to AD15: ADTRG: ANI0 to ANI15: ASCK0, ASCK1: ASTB: AVDD: AVREF: AVSS: BVDD: BVSS: CLKOUT: CLO: CSYNCIN: DSTB: HLDAK: HLDRQ: IC: INTCP90 to INTCP93, INTP0 to INTP6, INTTCLR8, INTTI8, INTTI9 KR0 to KR7: LBEN: NMI: P00 to P07: P10 to P15: P20 to P27: P30 to P37: P40 to P47: P50 to P57: P60 to P65: P70 to P77: P80 to P87: P90 to P96: P100 to P107: Key Return Lower Byte Enable Non-Maskable Interrupt Request Port 0 Port 1 Port 2 Port 3 Port 4 Port 5 Port 6 Port 7 Port 8 Port 9 Port 10 Address Bus Address/Data Bus AD Trigger Input Analog Input Asynchronous Serial Clock Address Strobe Analog Power Supply Analog Reference Voltage Analog Ground Bus Interface Power Supply Bus Interface Ground Clock Output Clock Output (divided) Csync Input Data Strobe Hold Acknowledge Hold Request Internally Connected P110 to P113: P120 to P127: P130 to P137: P140 to P147: P150 to P157: P160 to P167: P170 to P177: P180 to P187: P190 to P197: PWM0 to PWM3: RD: RESET: RTP00 to RTP07,: RTP10 to RTP17 RTPTRG0, RTPTRG1: RTP Trigger Input R/W: RXD0, RXD1: SCK0 to SCK4: SCL0, SCL1: SDA0, SDA1: SI0 to SI4: SO0 to SO4: TCLR8: TI011, TI2 to TI11 TO0 to TO7, TO80,: TO81, TO10, TO11 TXD0,TXD1: UBEN: VDD: VSOUT: VSS: WAIT: WRH: WRL: X1, X2: XT1, XT2: Transmit Data Upper Byte Enable Power Supply Vsync Output Ground Wait Write Strobe High Level Data Write Strobe Low Level Data Crystal for Main System Clock Crystal for Subsystem Clock Timer Output Read/Write Status Receive Data Serial Clock Serial Clock Serial Data Serial Input Serial Output Timer Clear Port 11 Port 12 Port 13 Port 14 Port 15 Port 16 Port 17 Port 18 Port 19 Pulse Width Modulation Read Reset Real-time Output Port HSOUT0, HSOUT1: Hsync Output INTCP80 to INTPC83,: Interrupt Request from Peripherals TI000, TI001, TI010,: Timer Input 4 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y INTERNAL BLOCK DIAGRAM NMI INTP0 to INTP6 INTCP80 to INTCP83, INTCP90 to INTCP93 INTTCLR8 INTTI8, INTTI9 TI000, TI001, TI010, TI011 TO0, TO1 TO80, TO81 TI8, TI9 TCLR8 TI2/TO2, TI3/TO3 TI4/TO4, TI5/TO5 TI6/TO6, TI7/TO7 TI10/TO10, TI11/TO11 CSYNCIN HSOUT0, HSOUT1, VSOUT SO0 SI0/SDA0Note 3 SCK0/SCL0Note 3 SO2 SI2/SDA1Note 3 SCK2/SCL1Note 3 SO1/TXD0 SI1/RXD0 SCK1/ASCK0 SO3/TXD1 SI3/RXD1 SCK3/ASCK1 SO4 SI4 SCK4 KR0 to KR7 INTC ROM PC CPU ROM correction Multiplier 16 × 16 → 32 BCU ALU Instruction queue HLDRQ HLDAK ASTB DSTB/RD R/W/WRH UBEN LBEN/WRL WAIT A16 to A21 AD0 to AD15 Note 1 Timer/counter 16-bit timers : TM0, TM1 8-bit timers : TM2 to TM7, TM10, TM11 24-bit timers : TM8, TM9 32-bit barrel shifter RAM System register General registers 32 bits × 32 Note 2 Vsync/Hsync SIO CSI0/I2C0Note 4 Ports CSI2/I2C1Note 4 CSI1/UART0 CSI3/UART1 Variable length CSI4 Key return function DMAC: 6 ch RTP P190 to P197 P180 to P187 P170 to P177 P160 to P167 P150 to P157 P140 to P147 P130 to P137 P120 to P127 P110 to P113 P100 to P107 P90 to P96 P80 to P87 P70 to P77 P60 to P65 P50 to P57 P40 to P47 P30 to P37 P20 to P27 P10 to P15 P00 to P07 A/D converter CG AVDD AVREF AVSS ANI0 to ANI15 ADTRG CLKOUT CLO X1 X2 XT1 XT2 RESET Watch timer Watchdog timer RTP00 to RTP07, RTP10 to RTP17 RTPTRG0, RTPTRG1 VDD VSS BVDD BVSS IC PWM0 to PWM3 PWM Notes 1. µPD703039, 703039Y, 703040, 703040Y: 256 KB µPD703041, 703041Y: 192 KB 2. µPD703039, 703039Y, 703041, 703041Y: 8 KB µPD703040, 703040Y: 16 KB 3. SDA0, SDA1, SCL0, and SCL1 are valid for the µPD703039Y, 703040Y, and 703041Y only. 2 4. The I C function is valid for the µPD703039Y, 703040Y, and 703041Y only. Preliminary Data Sheet U13953EJ1V0DS00 5 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y CONTENTS 1. PIN FUNCTIONS .................................................................................................................................. 7 1.1 1.2 1.3 Port Pins .................................................................................................................................................... 7 Non-Port Pins........................................................................................................................................... 11 Pin I/O Circuits, I/O Buffer Supply, and Recommended Connection of Unused Pins ....................... 14 2. 3. 4. ELECTRICAL SPECIFICATIONS...................................................................................................... 18 PACKAGE DRAWING ....................................................................................................................... 37 RECOMMENDED SOLDERING CONDITIONS................................................................................ 38 6 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 1. PIN FUNCTIONS 1.1 Port Pins (1/4) Pin Name P00 P01 P02 P03 P04 P05 P06 P07 P10 P11 P12 P13 P14 P15 P20 P21 P22 P23 P24 P25 P26 P27 P30 P31 P32 P33 P34 P35 P36 P37 P40 P41 P42 P43 P44 I/O No Port 4 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O Yes Port 3 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O Yes Port 2 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O Yes Port 1 6-bit I/O port Input/output mode can be specified in 1-bit units. I/O I/O PULL Yes Function Port 0 8-bit I/O port Input/output mode can be specified in 1-bit units. Alternate Function NMI INTP0 INTP1 INTP2 INTP3 INTP4/ADTRG INTP5/RTPTRG0 INTP6 SI0/SDA0 SO0 SCK0/SCL0 SI1/RXD0 SO1/TXD0 SCK1/ASCK0 SI2/SDA1 SO2 SCK2/SCL1 SI3/RXD1 SO3/TXD1 SCK3/ASCK1 TI2/TO2 TI3/TO3 TI000 TI001 TI010 TI011 TO0 TO1 TI4/TO4 TI5/TO5 AD0 AD1 AD2 AD3 AD4 Remark PULL: on-chip pull-up resistor Preliminary Data Sheet U13953EJ1V0DS00 7 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y (2/4) Pin Name P45 P46 P47 P50 P51 P52 P53 P54 P55 P56 P57 P60 P61 P62 P63 P64 P65 P70 P71 P72 P73 P74 P75 P76 P77 P80 P81 P82 P83 P84 P85 P86 P87 P90 P91 P92 P93 I/O No Port 9 7-bit I/O port Input/output mode can be specified in 1-bit units. Input No Port 8 8-bit input port Input No Port 7 8-bit input port I/O No Port 6 6-bit I/O port Input/output mode can be specified in 1-bit units. I/O No Port 5 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O I/O PULL No Function Port 4 8-bit I/O port Input/output mode can be specified in 1-bit units. Alternate Function AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 A16 A17 A18 A19 A20 A21 ANI0 ANI1 ANI2 ANI3 ANI4 ANI5 ANI6 ANI7 ANI8 ANI9 ANI10 ANI11 ANI12 ANI13 ANI14 ANI15 LBEN/WRL UBEN R/W/WRH DSTB/RD Remark PULL: on-chip pull-up resistor 8 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y (3/4) Pin Name P94 P95 P96 P100 P101 P102 P103 P104 P105 P106 P107 P110 P111 P112 P113 P120 P121 P122 P123 P124 P125 P126 P127 P130 P131 P132 P133 P134 P135 P136 P137 P140 P141 P142 P143 P144 P145 P146 P147 I/O No Port 14 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O No Port 13 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O No Port 12 8-bit I/O port Input/output mode can be specified in 1-bit units. SI4 SO4 SCK4 CLO TI6/TO6 TI7/TO7 TI10/TO10 TI11/TO11 INTCP80 INTCP81 INTCP82 INTCP83 TI8/INTTI8 TCLR8/INTTCLR8 TO80 TO81 INTCP90 INTCP91 INTCP92 INTCP93 TI9/INTTI9 RTPTRG1 – – I/O No Port 11 4-bit I/O port Input/output mode can be specified in 1-bit units. I/O Yes Port 10 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O I/O PULL No Function Port 9 7-bit I/O port Input/output mode can be specified in 1-bit units. Alternate Function ASTB HLDAK HLDRQ RTP00 RTP01 RTP02 RTP03 RTP04 RTP05 RTP06 RTP07 – – – – Remark PULL: on-chip pull-up resistor Preliminary Data Sheet U13953EJ1V0DS00 9 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y (4/4) Pin Name P150 P151 P152 P153 P154 P155 P156 P157 P160 P161 P162 P163 P164 P165 P166 P167 P170 P171 P172 P173 P174 P175 P176 P177 P180 P181 P182 P183 P184 P185 P186 P187 P190 P191 P192 P193 P194 P195 P196 P197 I/O No Port 19 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O No Port 18 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O Yes Port 17 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O No Port 16 8-bit I/O port Input/output mode can be specified in 1-bit units. I/O I/O PULL No Function Port 15 8-bit I/O port Input/output mode can be specified in 1-bit units. Alternate Function RTP10 RTP11 RTP12 RTP13 RTP14 RTP15 RTP16 RTP17 PWM0 PWM1 PWM2 PWM3 CSYNCIN VSOUT HSOUT0 HSOUT1 KR0 KR1 KR2 KR3 KR4 KR5 KR6 KR7 – – – – – – – – – – – – – – – – Remark PULL: on-chip pull-up resistor 10 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 1.2 Non-Port Pins (1/3) Pin Name A16 to A21 AD0 to AD7 AD8 to AD15 ADTRG ANI0 to ANI7 ANI8 to ANI15 ASCK0 ASCK1 ASTB AVDD Output – No – External address strobe signal output Positive power supply for A/D converter and ports used for alternate functions Reference voltage input for A/D converter Ground potential for A/D converter and ports used for alternate functions Positive power supply for bus interface and ports used for alternate functions Ground potential for bus interface and ports used for alternate functions Internal system clock output CLO output signal Csync signal input External data strobe signal output Bus hold acknowledge output Bus hold request input Hsync signal output before revision Hsync signal output after revision – Input – No Internal connection (connect directly to VSS) External capture input for CC80 to CC83 P123 P164 P93/RD P95 P96 P166 P167 – P130 to P133 Input Input Input Input Yes No No Yes Baud rate clock input for UART0 and UART1 A/D converter external trigger input Analog input to A/D converter I/O Output I/O PULL No No Address bus 16 to 21 Address/data multiplexed bus 0 to 15 Function Alternate Function P60 to P65 P40 to P47 P50 to P57 P05/INTP4 P70 to P77 P80 to P87 P15/SCK1 P25/SCK3 P94 – AVREF AVSS Input – – – – – BVDD – – – BVSS – – – CLKOUT CLO CSYNCIN DSTB HLDAK HLDRQ HSOUT0 HSOUT1 IC INTCP80 to INTCP83 INTCP90 to INTCP93 INTP0 to INTP3 INTP4 INTP5 INTP6 Output Output Input Output Output Input Output – No No No No No No – Input No External capture input for CP90 to CP93 P140 to P143 Input Yes External interrupt request input (digital noise elimination) External interrupt request input (digital noise elimination) P01 to P04 P05/ADTRG P06/RTPTRG0 External interrupt request input (digital noise elimination supporting remote controller) P07 Remark PULL: on-chip pull-up resistor Preliminary Data Sheet U13953EJ1V0DS00 11 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y (2/3) Pin Name INTTCLR8 INTTI8 INTTI9 KR0 to KR7 LBEN NMI PWM0 to PWM3 RD RESET RTP00 to RTP07 RTP10 to RTP17 RTPTRG0 RTPTRG1 R/W RXD0 RXD1 SCK0 SCK1 SCK2 SCK3 SCK4 SCL0 SCL1 SDA0 SDA1 SI0 SI1 SI2 SI3 SI4 SO0 SO1 SO2 SO3 SO4 TCLR8 TI000 Input Input No No Yes Variable-length CSI4 serial transmit data output External clear input for TM8 External count clock input/external capture trigger input for TM0 Output No Yes Variable-length CSI4 serial receive data input (3-wire mode) Serial transmit data output for CSI0 to CSI3 Input Yes I/O Yes I/O No Yes Variable-length CSI4 serial clock I/O Serial clock I/O for I C0 and I C1 (µPD703039Y, 703040Y and 703041Y) Serial transmit/receive data I/O for I C0 and I C1 (µPD703039Y, 703040Y and 703041Y) Serial receive data input for CSI0 to CSI3 (3-wire mode) 2 2 2 2 I/O Input Input PULL No No Function External interrupt request input (digital noise elimination) Alternate Function P135/TCLR8 P134/TI8 P144/TI9 Input Output Input Output Output Input Output Yes No Yes No No – Yes Key return input Lower byte enable signal output for external data bus Non-maskable interrupt request input Output of PWM channels 0 to 3 Bus read strobe signal output System reset input Real-time output port P170 to P177 P90/WRL P00 P160 to P163 P93/DSTB – P100 to P107 P150 to P157 Input Yes No RTP external trigger input P06 P146 Output Input No Yes External read/write status output Serial receive data input for UART0 and UART1 P92/WRH P13/SI1 P23/SI3 I/O Yes Serial clock I/O for CSI0 to CSI3 (3-wire mode) P12/SCL0 P15/ASCK0 P22/SCL1 P25/ASCK1 P122 P12/SCK0 P22/SCK2 P10/SI0 P20/SI2 P10/SDA0 P13/RXD0 P20/SDA1 P23/RXD1 P120 P11 P14/TXD0 P21 P24/TXD1 P121 P135/INTTCLR8 P30 Remark PULL: on-chip pull-up resistor 12 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y (3/3) Pin Name TI001 TI010 TI011 TI2 TI3 TI4 TI5 TI6 TI7 TI8 TI9 TI10 TI11 TO0 TO1 TO2 TO3 TO4 TO5 TO6 TO7 TO80 TO81 TO10 TO11 TXD0 TXD1 UBEN VDD VSOUT VSS WAIT WRH WRL X1 X2 XT1 XT2 Input – Input – No Resonator connection for subsystem clock No Output – Output – Input Output No – No – No No Higher byte enable signal output for external data bus Positive power supply pin Vsync signal output Ground potential External WAIT signal input Higher byte write strobe signal output for external data bus Lower byte write strobe signal output for external data bus Resonator connection for main system clock P92/R/W P90/LBEN – – – – P165 – – Output Yes No Output Yes No I/O Input PULL Yes Function External capture trigger input for TM0 External count clock input/external capture trigger input for TM1 External capture trigger input for TM1 External count clock input for TM2 External count clock input for TM3 External count clock input for TM4 External count clock input for TM5 External count clock input for TM6 External count clock input for TM7 External count clock input for TM8 External count clock input for TM9 External count clock input for TM10 External count clock input for TM11 Pulse signal output for TM0 Pulse signal output for TM1 Pulse signal output for TM2 Pulse signal output for TM3 Pulse signal output for TM4 Pulse signal output for TM5 Pulse signal output for TM6 Pulse signal output for TM7 Pulse signal output 0 for TM8 Pulse signal output 1 for TM8 Pulse signal output for TM10 Pulse signal output for TM11 Serial transmit data output for UART0 and UART1 Alternate Function P31 P32 P33 P26/TO2 P27/TO3 P36/TO4/A15 P37/TO5 P124/TO6 P125/TO7 P134/INTTI8 P144/INTTI9 P126/TO10 P127/TO11 P34 P35 P26/TI2 P27/TI3 P36/TI4 P37/TI5 P124/TI6 P125/TI7 P136 P137 P126/TI10 P127/TI11 P14/SO1 P24/SO3 P91 – Remark PULL: on-chip pull-up resistor Preliminary Data Sheet U13953EJ1V0DS00 13 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 1.3 Pin I/O Circuits, I/O Buffer Supply, and Recommended Connection of Unused Pins Table 1-1 shows the I/O circuit type of each pin and the recommended connection of unused pins. For the input/output configuration of each type, refer to Figure 1-1. Table 1-1. Types of Pin I/O Circuit and Recommended Connection of Unused Pins (1/2) Pin Alternate Function I/O Circuit Type 5-W I/O Buffer Power Supply VDD Input: Output: Recommended Connection Method P00 P01 to P04 P05 P06 P07 P10 P11 P12 P13 P14 P15 P20 P21 P22 P23 P24 P25 P26, P27 P30, P31 P32, P33 P34, P35 P36 P37 P40 to P47 P50 to P57 P60 to P65 P70 to P77 P80 to P87 P90 P91 P92 P93 P94 P95 P96 P100 to P107 P110 to P113 P120 NMI INTP0 to INTP3 INTP4/ADTRG INTP5/RTPTRG0 INTP6 SI0/SDA0 SO0 SCK0/SCL0 SI1/RXD0 SO1/TXD0 SCK1/ASCK0 SI2/SDA1 SO2 SCK2/SCL1 SI3/RXD1 SO3/TXD1 SCK3/ASCK1 TI2/TO2, TI3/TO3 TI000, TI001 TI010, TI011 TO0, TO1 TI4/TO4 TI5/TO5 AD0 to AD7 AD8 to AD15 A16 to A21 ANI0 to ANI7 ANI8 to ANI15 LBEN/WRL UBEN R/W/WRH DSTB/RD ASTB HLDAK HLDRQ RTP00 to RTP07 – SI4 Independently connect to VDD or VSS via a resistor Leave open 10-F 10-E 10-F 5-W 10-E 10-F 10-F 10-E 10-F 5-W 10-E 10-F 5-W 5-W VDD VDD VDD 5-A 5-W 5 5 5 9 9 5 BVDD BVDD BVDD AVDD AVDD BVDD Input: Output: Independently connect to BVDD or BVSS via a resistor Leave open Connect to AVSS Input: Output: Independently connect to BVDD or BVSS via a resistor Leave open 10-E 5 5-K VDD VDD VDD Input: Output: Independently connect to VDD or VSS via a resistor Leave open 14 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Table 1-1. Types of Pin I/O Circuit and Recommended Connection of Unused Pins (2/2) Pin Alternate Function I/O Circuit Type 10-G 10-H 5 5-K Output: I/O Buffer Power Supply VDD Input: Recommended Connection Method P121 P122 P123 P124 P125 P126 P127 P130 to P133 P134 P135 P136, P137 P140 to P143 P144 P145 P146, P147 P150 to P157 P160 to P163 P164 P165 P166 P167 P170 to P177 P180 to P187 P190 to P197 CLKOUT WAIT RESET X1 X2 XT1 XT2 AVREF IC VDD VSS AVDD AVSS BVDD BVSS SO4 SCK4 CLO TI6/TO6 TI7/TO7 TI10/TO10 TI11/TO11 INTCP80 to INTCP83 TI8/INTTI8 TCLR8/INTTCLR8 TO80, TO81 INTCP90 to INTCP93 TI9/INTTI9 RTPTRG1 – RTP10 to RTP17 PWM0 to PWM3 CSYNCIN VSOUT HSOUT0 HSOUT1 KR0 to KR7 – – – – – – – – – – – – – – – – – Independently connect to VDD or VSS via a resistor Leave open 5-K VDD 5 5-K VDD 5 5 5 5-K 5 VDD VDD 5-K 5 5 4 1 2 – – – – – – – – – – – – VDD VDD VDD BVDD BVDD VDD VDD VDD VDD VDD – – – – – – – – Connect to VDD Leave open Connect to VSS Leave open Connect to AVSS Connect directly to VSS – – Leave open Connect to VDD via a resistor – – Connect to VSS Connect to VDD Connect to VSS Preliminary Data Sheet U13953EJ1V0DS00 15 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Figure 1-1. Pin Input/Output Circuits (1/2) Type 1 Type 5 VDD VDD P-ch IN N-ch Output disable N-ch Data P-ch IN/OUT Input enable Type 2 Type 5-A VDD Pullup enable Data IN Output disable Input enable Type 5-K VDD Data Data P-ch OUT Output disable N-ch Output disable P-ch VDD P-ch IN/OUT N-ch Schmitt-triggered input with hysteresis characteristics Type 4 VDD P-ch IN/OUT N-ch Push-pull output that can be set for high impedance output (both P-ch and N-ch are off) Input enable 16 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Figure 1-1. Pin Input/Output Circuits (2/2) Type 5-W VDD Type 10-F VDD Pullup enable Data P-ch VDD P-ch IN/OUT Pullup enable Data P-ch VDD P-ch IN/OUT Output disable Input enable Type 9 N-ch Open Output disable Input enable Type 10-G N-ch VDD P-ch IN N-ch + – Data Comparator P-ch IN/OUT Open drain VREF (Threshold voltage) Output disable N-ch Input enable Input enable Type 10-E VDD Type 10-H VDD Pullup enable Data P-ch VDD Data P-ch IN/OUT P-ch IN/OUT Open Output disable Input enable Open drain Output disable N-ch N-ch Input enable Preliminary Data Sheet U13953EJ1V0DS00 17 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 2. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25°C, VSS = 0 V) Parameter Supply voltage Symbol VDD AVDD BVDD AVSS BVSS Input voltage VI1 VI2 Clock input voltage Analog input voltage Analog reference input voltage Output current, low VK VIAN AVREF IOL Note 1 (VDD) Note 2 (BVDD) X1, XT1, VDD = 2.7 to 3.6 V Note 3 (AVDD) AVREF pin Per pin Total for P00 to P07, P150 to P157 Total for P100 to P107, P160 to P167 Total for P170 to P177, P190 to P197 Total for P124 to P127, P180 to P187 Total for P30 to P37, P120 to P123 Total for P12 to P15, P20 to P27, P110 to P113 Total for P50 to P57, P60 to P65, CLKOUT Total for P40 to P47, P90 to P96 Total for P130 to P137, P140 to P147 Output current, high IOH Per pin Total for P00 to P07, P150 to P157 Total for P100 to P107, P160 to P167 Total for P170 to P177, P190 to P197 Total for P124 to P127, P180 to P187 Total for P30 to P37, P120 to P123 Total for P12 to P15, P20 to P27, P110 to P113 Total for P50 to P57, P60 to P65, CLKOUT Total for P40 to P47, P90 to P96 Total for P130 to P137, P140 to P147 Output voltage VO1 VO2 Operating ambient temperature Storage temperature TA Tstg Note 1 (VDD) Note 2 (BVDD) Conditions Ratings –0.5 to +4.6 –0.5 to +4.6 –0.5 to +4.6 –0.5 to +0.5 –0.5 to +0.5 –0.5 to VDD + 0.5 Note 4 Unit V V V V V V V –0.5 to BVDD + 0.5 –0.5 to VDD + 1.0 Note 4 Note 4 –0.5 to AVDD + 0.5 –0.5 to AVDD + 0.5 4.0 25 25 25 25 25 25 Note 4 V V mA mA mA mA mA mA mA Note 4 25 25 25 –4.0 –25 –25 –25 –25 –25 –25 mA mA mA mA mA mA mA mA mA mA –25 –25 –25 –0.5 to VDD + 0.5 –0.5 to BVDD + 0.5 –40 to +85 –65 to +150 mA mA mA V V °C °C Notes 1. 2. Ports 0, 1, 2, 3, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, RESET (includes alternate function pins) Ports 4, 5, 6, 9, CLKOUT, WAIT (includes alternate function pins) 18 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 3. 4. Cautions Ports 7, 8 (includes alternate function pins) Be sure not to exceed each absolute maximum rating (MAX.). 1. Do not directly connect to each other output pins (or I/O pins) of IC products, and do not connect them directly to VDD, VCC, or GND. However, open-drain pins and open-connector pins can be directly connected to each other. Moreover, external circuits that implement a timing that avoids conflict with the output of pins that go into high-impedance can be directly connected. 2. Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. The ratings and conditions indicated for DC characteristics and AC characteristics represent the quality assurance range during normal operation. Capacitance (TA = 25°C, VDD = VSS = 0 V) Parameter Input capacitance I/O capacitance Output capacitance Symbol CI CIO CO Conditions fC = 1 MHz Unmeasured pins returned to 0 V MIN. TYP. MAX. 15 15 15 Unit pF pF pF Operating Conditions (1) CPU Operation Frequency Parameter CPU operation frequency Symbol fCPU Conditions @ main system clock operation @ subsystem clock operation MIN. 0.5 32.768 TYP. MAX. 16 Unit MHz MHz (2) Supply Voltage Parameter Supply voltage Symbol VDD AVDD BVDD Conditions MIN. 2.7 2.7 2.7 TYP. MAX. 3.6 3.6 3.6 Unit V V V (3) Operation Frequency for Each Supply Voltage Internal Operation Clock Frequency 4 MHz ≤ fXX ≤ 16 MHz fXT = 32.768 kHz 2.7 to 3.6 V 2.7 to 3.6 V Supply Voltage (VDD = AVDD = BVDD) Preliminary Data Sheet U13953EJ1V0DS00 19 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Recommended Oscillator (1) Main System Clock Oscillator (TA = −40 to +85°C) X2 X1 Parameter Oscillation frequency Oscillation stabilization time Symbol fXX Conditions MIN. 4 TYP. MAX. 16 Unit MHz s s After reset release After STOP mode release 2 /fXX Note 19 Note Values vary depending on the settings of the oscillation stabilization time selection register (OSTS). Remarks 1. Place the oscillator as close as possible to X1 and X2. 2. Do not wire other signal lines within the broken lines. 3. For resonator selection and oscillation constants, customers are advised to either evaluate the oscillation themselves, or apply to the resonator manufacturer for evaluation. (2) Subsystem Clock Oscillator (TA = −40 to +85°C) XT1 XT2 Parameter Oscillation frequency Oscillation stabilization time Symbol fXT Conditions MIN. 32 TYP. 32.768 10 MAX. 35 Unit kHz s Remarks 1. Place the oscillator as close as possible to XT1 and XT2. 2. Do not wire other signal lines within the broken lines. 3. For resonator selection and oscillation constants, customers are advised to either evaluate the oscillation themselves, or apply to the resonator manufacturer for evaluation. 20 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y DC Characteristics (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter Input voltage, high Symbol VIH1 VIH2 VIH3 VIH4 VIH5 Input voltage, low VIL1 VIL2 VIL3 VIL4 VIL5 Output voltage, high VOH1 VOH2 Output voltage, low VOL1 VOL2 Conditions Pins in Note 1 , WAIT Pins in Note 2 Pins in Note 3, RESET Pins in Note 4 X, XT1, XT2 Pins in Note 1 , WAIT Pins in Note 2 Pins in Note 3, RESET Pins in Note 4 X, XT1, XT2 Note 1, CLKOUT Notes 2, 3 Note 1, CLKOUT Notes 2, 3 (except P10, 12, 20, 22) VOL3 Input leakage current, high ILIH1 ILIH2 Input leakage current, low ILIL1 ILIL2 Output leakage current, high Output leakage current, low Supply current Note 5 MIN. 0.7BVDD 0.7VDD 0.75VDD 0.7AVDD 0.8VDD BVSS – 0.5 VSS – 0.5 VSS – 0.5 AVSS – 0.5 VSS TYP. MAX. BVDD VDD VDD AVDD VDD 0.3BVDD 0.3VDD 0.3VDD 0.3AVDD 0.2VDD Unit V V V V V V V V V V V V IOH = –3 mA IOH = –1 mA IOL = 1.6 mA IOL = 1.6 mA 0.8BVDD 0.8VDD 0.4 0.4 V V P10, 12, 20, 22 VI = VDD = AVDD = BVDD VI = 0 V IOL = 3 mA Other than X1, XT1, XT2 X1, XT1, XT2 Other than X1, XT1, XT2 X1, XT1, XT2 0.4 5 20 –5 –20 5 –5 25 14 1.2 10 55 30 4 70 V µA µA µA µA µA µA mA mA mA ILOH ILOL IDD1 IDD2 IDD3 IDD4 VO = VDD = AVDD = BVDD VO = 0 V Normal operation mode (fXX = 16 MHz) HALT mode (fXX = 16 MHz) IDLE mode (fXX = 16 MHz) STOP mode (subsystem clock operation: fXT = 32.768 kHz, watch timer operation) STOP mode (subsystem clock stopped) µA µA kΩ 1 10 30 60 100 Pull-up resistor RL Notes 1. Ports 4, 5, 6, 9 (includes alternate-function pins) 2. P11, P14, P21, P24, P34, P35, P100 to P107, P110 to P113, P121, P123, P136, P137, P146, P147, P150 to P157, P160 to P163, P165 to P167, P180 to P187, P190 to P197 (includes alternate-function pins) 3. P00 to P07, P10, P12, P13, P15, P20, P22, P23, P25 to P27, P30 to P33, P36, P37, P120, P122, P124 to P127, P130 to P135, P140 to P145, P164, P170 to P177 (includes alternate-function pins) 4. Ports 7, 8 (includes alternate-function pins) 5. The typical values listed are those of at VDD = 3.3 V. The current that is consumed at output buffers is not included. Preliminary Data Sheet U13953EJ1V0DS00 21 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Data Retention Characteristics (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter Data retention voltage Data retention current Supply voltage rising time Supply voltage falling time Supply voltage hold time (from STOP mode setting) STOP release signal input time Data retention high-level input voltage Data retention low-level input voltage Symbol VDDDR IDDDR tRVD tFVD tHVD Conditions STOP mode VDDDR [V] 200 200 0 MIN. 1.8 1 TYP. MAX. 3.6 60 Unit V µA µs µs ms tDREL VIHDR VILDR All input port All input port 0 VIHn 0 VDDDR VILn ms V V Remark n = 1 to 5 Setting STOP mode tFVD tRVD VDD tHVD VDDDR tDREL RESET (input) VIHDR NMI, INTP0 to INTP3 (input) VIHDR STOP release interrupt (NMI, etc.) (when STOP mode is released at rising edge) VILDR Caution Be sure to shift to and return from STOP mode when VDD is 2.7 V or higher. 22 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y AC Characteristics AC Test Input Waveforms (VDD, BVDD, AVDD) VDD VIH Test points VIL VIH VIL 0V AC Test Output Test Point (BVDD) VOH Test points VOL VOH VOL Load Conditions DUT (Device under test) CL = 50 pF Caution If the load capacitance exceeds 50 pF due to the circuit configuration, bring the load capacitance of the device to 50 pF or less by inserting a buffer or by some other means. Preliminary Data Sheet U13953EJ1V0DS00 23 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Clock Timing Operating Conditions (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter X1 input cycle XT1 input cycle X1 input high-level width XT1 input high-level width X1 input low-level width XT1 input low-level width X1 input rise time X1 input fall time CLKOUT output cycle CLKOUT high-level width CLKOUT low-level width CLKOUT rise time CLKOUT fall time tXR tXF tCYK tWKH tWKL tKR tKF 62.5 ns 0.4(T – 20) 0.4(T – 20) 10 10 tWXL tWXH Symbol tCYX Condition MIN. 62.5 28.6 31.2 14.3 31.2 14.3 MAX. 250 31.2 125 15.6 125 15.6 ( – – )/2 ( – – )/2 Unit ns µs ns µs ns µs ns ns 31.2 µs ns ns ns ns Remark T = tCYK Clock Timing X1, XT1 (input) CLKOUT (output) Timing of Pins Other Than X1 and CLKOUT Pins (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, Output Pin Load Capacitance: CL = 50 pF) Parameter Output rise time Output fall time Symbol tOR tOF Condition MIN. MAX. 20 20 Unit ns ns 24 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Bus Timing (CLKOUT Asynchronous) (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter Address setup time (to ASTB↓) Address hold time (from ASTB↓) Address float from DSTB↓ Data input setup time from address Data input setup time from DSTB↓ DSTB↓ delay time from ASTB↓ Data input hold time (from DSTB↑) Address output time from DSTB↑ ASTB↑ delay time from DSTB↑ ASTB↓ delay time from DSTB↑ DSTB low-level width ASTB high-level width Data output time from DSTB↓ Data output setup time (to DSTB↑) Data output hold time (from DSTB↑) WAIT setup time (to address) Symbol tSAST tHSTA tFDA tDAID tDDID tDSTD tHDID tDDA tDDST1 tDDST2 tWDL tWSTH tDDOD tSODD tHDOD tSAWT1 tSAWT2 WAIT hold time (from address) tHAWT1 tHAWT2 WAIT setup time (to ASTB↓) tSSTWT1 tSSTWT2 WAIT hold time (from ASTB↓) tHSTWT1 tHSTWT2 HLDRQ high-level width HLDAK low-level width Bus output delay time from HLDAK↑ HLDAK↓ delay time from HLDRQ↓ HLDAK↑ delay time from HLDRQ↑ tWHQH tWHAL tDHAC tDHQHA1 tDHQHA2 n≥1 nT + 5 (1 + n)T + 5 T + 10 T – 15 0 1.5T 0.5T (2n + 7.5)T + 25 1.5T + 25 n≥1 n≥1 (0.5 + n)T (1.5 + n)T 1.5T – 25 (1.5 + n)T – 25 n≥1 (1 + n)T – 20 T – 15 1.5T – 30 (1.5 + n)T – 30 0.5T – 15 0 (1 + i)T – 15 0.5T – 15 (1.5 + i)T – 15 (1 + n)T – 15 T – 15 15 Condition MIN. 0.5T – 20 0.5T – 15 2 (2 + n)T – 30 (1 + n)T – 30 MAX. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Remarks 1. T = 1/fCPU (fCPU: CPU operation clock frequency) 2. n: Number of wait clocks inserted in the bus cycle. Sampling timing changes when a programmable wait is inserted. 3. 4. i: Number of idle states inserted after the read cycle (0 or 1). The specifications described above are the values of when a clock of duty ratio 1:1 is input from X1. Preliminary Data Sheet U13953EJ1V0DS00 25 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Bus Timing (CLKOUT Synchronous) (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter Address delay time from CLKOUT↑ Address float delay time from CLKOUT↑ ASTB↓ delay time from CLKOUT↓ DSTB↑ delay time from CLKOUT↑ Data input setup time (to CLKOUT↑) Data input hold time (from CLKOUT↑) Data output delay time from CLKOUT↑ WAIT setup time (to CLKOUT↓) WAIT hold time (from CLKOUT↓) HLDRQ setup time (to CLKOUT↓) HLDRQ hold time (from CLKOUT↓) Address float delay time from CLKOUT↑ HLDAK delay time from CLKOUT↑ Symbol tDKA tFKA tDKST tDKD tSIDK tHKID tDKOD tSWTK tHKWT tSHQK tHKHQ tDKF tDKHA 15 5 15 5 19 19 Condition MIN. 0 –12 –12 –5 15 5 19 MAX. 19 7 7 14 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns Remark The specifications described above are the values of when a clock of duty ratio 1:1 is input from X1. 26 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Read Cycle (CLKOUT Synchronous/Asynchronous, 1 Wait) T1 T2 TW T3 CLKOUT (output) A16 to A21 (output), Note AD0 to AD15 (I/O) Address ASTB (output) Hi-Z Data DSTB (output), RD (output) WAIT (input) Note R/W (output), UBEN (output), LBEN (output) Remark WRL and WRH are high level. Preliminary Data Sheet U13953EJ1V0DS00 27 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Write Cycle (CLKOUT Synchronous/Asynchronous, 1 Wait) T1 T2 TW T3 CLKOUT (output) A16 to A21 (output), Note AD0 to AD15 (I/O) Address Data ASTB (output) DSTB (output), WRL (output), WRH (output) WAIT (input) Note R/W (output), UBEN (output), LBEN (output) Remark RD is high level. 28 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Bus Hold TH CLKOUT (output) TH TH TI HLDRQ (input) HLDAK (output) A16 to A21 (output), Note Hi-Z AD0 to AD15 (I/O) Data Hi-Z ASTB (output) Hi-Z DSTB (output), RD (output), WRL (output), WRH (output) Hi-Z Note R/W (output), UBEN (output), LBEN (output) Preliminary Data Sheet U13953EJ1V0DS00 29 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Reset/Interrupt Timing (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter RESET high-level width RESET low-level width NMI high-level width NMI low-level width INTPn high-level width Symbol tWRSH tWRSL tWNIH tWNIL tWITH n = 0 to 3, analog noise elimination n = 4, 5, digital noise elimination n = 6, digital noise elimination INTPn low-level width tWITL n = 0 to 3, analog noise elimination n = 4, 5, digital noise elimination n = 6, digital noise elimination Condition MIN. 500 500 500 500 500 3T + 20 3Tsmp + 20 500 3T + 20 3Tsmp + 20 MAX. Unit ns ns ns ns ns ns ns ns ns ns Remarks 1. T = 1/fXX 2. Tsmp = Noise elimination sampling clock frequency Reset RESET (input) Interrupt NMI (input) INTPn (input) Remark n = 0 to 6 30 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y TIn Input Timing (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter TIn0, TIn1 (n = 00, 01) high-level width TIn (n = 2 to 7, 10, 11) high-level width TIn0, TIn1 (n = 00, 01) low-level width TIn (n = 2 to 7, 10, 11) low-level width tTIL Symbol tTIH Condition MIN. 2Tsam + 20 Note MAX. Unit ns 3/fXX + 20 Note ns 2Tsam + 20 ns 3/fXX + 20 ns Note Tsam can be selected by setting the PRMn1 and PRMn0 bits of prescaler mode registers n0, n1 (PRMn0, PRMn1) (n = 0, 1). TM0 (PRM00, PRM01 registers): Tsam = 2/fXX, 4/fXX, 16/fXX, 64/fXX, 256/fXX, 1/INTWTI period TM1 (PRM10, PRM11 registers): Tsam = 2/fXX, 4/fXX, 16/fXX, 32/fXX, 128/fXX, 256/fXX However, when the TIn0 valid edge is selected as the count clock, Tsam = 4/fXX (n = 0, 1). TIn Remark n = 000, 001, 010, 011, 10, 11, 2 to 7 Preliminary Data Sheet U13953EJ1V0DS00 31 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 3-Wire SIO Timing (1) Master Mode (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter SCKn cycle time SCKn high-level width SCKn low-level width SIn setup time (to SCKn↑) SIn hold time (from SCKn↓) SOn output delay time from SCKn↓ Symbol tKCY1 tKH1 tKL1 tSIK1 tKSI1 tKSO1 Condition MIN. 400 140 140 50 50 60 MAX. Unit ns ns ns ns ns ns Remark n = 0 to 3 (2) Slave Mode (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter SCKn cycle time SCKn high-level width SCKn low-level width SIn setup time (to SCKn↑) SIn hold time (from SCKn↓) SOn output delay time from SCKn↓ Symbol tKCY2 tKH2 tKL2 tSIK2 tKSI2 tKSO2 Condition MIN. 400 140 140 50 50 60 MAX. Unit ns ns ns ns ns ns Remark n = 0 to 3 SIn (input) SOn (output) SCKn (I/O) Remark n = 0 to 3 32 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 3-Wire Variable-Length CSI Timing (1) Master Mode (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter SCK4 cycle time SCK4 high-level width SCK4 low-level width SI4 setup time (to SCK4↑) SI4 hold time (from SCK4↑) SO4 output delay time from SCK4↓ Symbol tKCY1 tKH1 tKL1 tSIK1 tKSI1 tKSO1 Condition MIN. 400 140 140 50 50 60 MAX. Unit ns ns ns ns ns ns (2) Slave Mode (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter SCK4 cycle time SCK4 high-level width SCK4 low-level width SI4 setup time (to SCK4↑) SI4 hold time (from SCK4↑) SO4 output delay time from SCK4↓ Symbol tKCY2 tKH2 tKL2 tSIK2 tKSI2 tKSO2 Condition MIN. 400 140 140 50 50 60 MAX. Unit ns ns ns ns ns ns SI4 (input) SO4 (output) SCK4 (I/O) Preliminary Data Sheet U13953EJ1V0DS00 33 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y UART Timing (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter ASCKn cycle time ASCKn high-level width ASCKn low-level width Symbol tKCY13 tKH13 tKL13 Condition MIN. 200 80 80 MAX. Unit ns ns ns Remark n = 0, 1 ASCKn (input) Remark n = 0, 1 34 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y I C Bus Mode (Only for µPD703039Y, 703040Y, and 703041Y) 2 (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V) Parameter Symbol Standard Mode MIN. SCLn clock frequency Bus free time (between stop and start conditions) Hold time Note 1 High-Speed Mode MIN. 0 1.3 MAX. 400 – Unit MAX. 100 – fCLK tBUF 0 4.7 kHz µs µs µs µs µs µs µs ns ns ns tHD : STA tLOW tHIGH tSU : STA 4.0 4.7 4.0 4.7 5.0 0 Note 2 – – – – – – – 1000 300 – – 0.6 1.3 0.6 0.6 – 0 Note 2 – – – – – 0.9 Note 3 SCLn clock low-level width SCLn clock high-level width Setup time of start/restart conditions Data hold time Data setup time Rising time of SDAn and SCLn signals Falling time of SDAn and SCLn signals Setup time of stop condition Pulse width of spike suppressed by input filter Load capacitance of bus lines CBUS-compatible master tHD : DAT I C mode tSU : DAT tR tF tSU : STO tSP 2 250 – – 4.0 – 100 Note 4 – Note 5 20 + 0.1Cb 20 + 0.1Cb 0.6 0 300 300 – 50 Note 5 µs ns Cb – 400 – 400 pF Notes 1. The first clock pulse in the start condition is generated after the hold time. 2. The system must internally provide at least 300 ns hold time for the SDAn signal (at VIHmin. of the SCLn signal) in order to fill the undefined area that appears at the SCLn falling edge. 3. If the system does not extend the low hold time (tLOW), it is required to satisfy only the maximum data hold time (tHD: DAT). 2 2 4. The high-speed I C bus is available in the standard mode I C bus system. In this case, following conditions should be satisfied. • When the system does not extend the low-state hold time of the SCLn signal tSU: DAT ≥ 250 ns • When the system extends the low-state hold time of the SCLn signal Before the SCLn line is released (tRmax. + tSU: 5. Cb: Total capacitance of one bus line (Unit: pF) Remark n = 0, 1 DAT = 1000 + 250 = 1250 ns: Standard mode I2C bus specification), send the next data bit to the SDAn line. Preliminary Data Sheet U13953EJ1V0DS00 35 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y I C Bus Mode (Only for µPD703039Y, 703040Y, and 703041Y) 2 SCLn SDAn Stop Start condition condition Restart condition Stop condition Remark n = 0, 1 A/D Converter (TA = –40 to +85°C, VDD = AVDD = AVREF = 2.7 to 3.6 V, AVSS = VSS = 0 V, Output Pin Load Capacitance: CL = 50 pF) Parameter Resolution Overall error Note 1 Symbol Conditions MIN. 10 TYP. 10 MAX. 10 ±0.8 Unit bit %FSR Conversion time Zero-scale error Full-scale error Note 1 tCONV 5 100 ±0.4 ±0.4 µs %FSR %FSR LSB LSB V V Note 1 Integral linearity error Note 2 ±4.0 ±4.0 AVREF VIAN AIREF AIDD AVREF = AVDD 2.7 AVSS 240 1 3.6 AVREF 360 3 Differential linearity error Note 2 Analog reference voltage Analog input voltage AVREF current Supply current µA mA Notes 1. Excluding quantization error (±0.05%FSR) 2. Excluding quantization error (±0.5LSB) Remark LSB: Least Significant Bit FSR: Full Scale Range 36 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 3. PACKAGE DRAWING 176-PIN PLASTIC LQFP (FINE PITCH) (24x24) A B 132 133 89 88 detail of lead end S P C D T R Q 176 1 45 44 L U F G H I M J K S N S M NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. ITEM A B C D F G H I J K L M N P Q R S MILLIMETERS 26.0 ± 0.2 24.0 ± 0.2 24.0 ± 0.2 26.0 ± 0.2 1.25 1.25 0.22 ± 0.05 0.08 0.5 (T.P.) 1.0 ± 0.2 0.5 0.17 + 0.03 − 0.07 0.08 1.4 0.1 ± 0.05 3°+4° −3° 1.5 ± 0.1 S176GM-50-UEU Preliminary Data Sheet U13953EJ1V0DS00 37 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y 4. RECOMMENDED SOLDERING CONDITIONS The µPD703039, 703039Y, 703040, 703040Y, 703041, and 703041Y should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Table 4-1. Surface Mounting Type Soldering Conditions µPD703039GM-×××-UEU: 176-pin plastic LQFP (fine pitch) (24 × 24 mm) µPD703040GM-×××-UEU: 176-pin plastic LQFP (fine pitch) (24 × 24 mm) Soldering Method Soldering Conditions Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher), Note Count: Twice or less, Exposure limit: 3 days (after that, prebake at 125°C for 10 hours) VPS Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher), Note Count: Twice or less, Exposure limit: 3 days (after that, prebake at 125°C for 10 hours) Partial heating Pin temperature: 300°C Max., Time 3 sec. Max. (per pin row)  VP15-103-2 Recommended Condition Symbol IR35-103-2 Infrared reflow Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period. Cautions 1. Do not use different soldering methods together (except for partial heating). 2. Soldering conditions for µPD703039Y, 703040Y, 703041, and 703041Y are undetermined. 38 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y [MEMO] Preliminary Data Sheet U13953EJ1V0DS00 39 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y [MEMO] 40 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y [MEMO] Preliminary Data Sheet U13953EJ1V0DS00 41 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD o r GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Purchase of NEC I C components conveys a license under the Philips I C Patent Rights to use these components in an I C 2 system, provided that the system conforms to the I C Standard Specification as defined by Philips. 2 2 2 Related document Reference document µPD70F3040, 70F3040Y Data Sheet (U14622E) Electrical Characteristics for Microcomputer (IEI-601) Note Note This document number is that of the Japanese version. The documents indicated in this publication may include preliminary versions. versions are not marked as such. V850 Family and V850/SV1 are trademarks of NEC Corporation. However, preliminary 42 Preliminary Data Sheet U13953EJ1V0DS00 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y Regional Information Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify: • • • • • Device availability Ordering information Product release schedule Availability of related technical literature Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) Network requirements • In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. NEC Electronics Inc. (U.S.) Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 NEC Electronics (Germany) GmbH Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580 NEC Electronics Hong Kong Ltd. Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 NEC Electronics Hong Kong Ltd. NEC Electronics (France) S.A. Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411 NEC Electronics (Germany) GmbH Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490 NEC Electronics (France) S.A. NEC Electronics (UK) Ltd. Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860 NEC Electronics Singapore Pte. Ltd. United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583 NEC Electronics Taiwan Ltd. NEC Electronics Italiana s.r.l. Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99 NEC Electronics (Germany) GmbH Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388 Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951 NEC do Brasil S.A. Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829 J99.1 Preliminary Data Sheet U13953EJ1V0DS00 43 µPD703039, 703039Y, 703040, 703040Y, 703041, 703041Y The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited without governmental license, the need for which must be judged by the customer. The export or re-export of this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative. • T he information contained in this document is being issued in advance of the production cycle for the device. The parameters for the device may change before final production or NEC Corporation, at its own discretion, may withdraw the device prior to its production. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M5 98. 8
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