74AUP1G57GN

74AUP1G57 Low-power configurable multiple function gate Rev. 4 — 20 July 2010 Product data sheet 1. General description The 74AUP1G57 provides configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and buffer. All inputs can be connected to VCC or GND. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. The 74AUP1G57 has Schmitt trigger inputs making it capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT− is defined as the input hysteresis voltage VH. 2. Features and benefits Wide supply voltage range from 0.8 V to 3.6 V High noise immunity ESD protection: HBM JESD22-A114F exceeds 5000 V MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1000 V Low static power consumption; ICC = 0.9 μA (maximum) Latch-up performance exceeds 100 mA per JESD 78 Class II Inputs accept voltages up to 3.6 V Low noise overshoot and undershoot < 10 % of VCC IOFF circuitry provides partial power-down mode operation Multiple package options Specified from −40 °C to +85 °C and −40 °C to +125 °C NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 3. Ordering information Table 1. Ordering information Package Temperature range 74AUP1G57GW 74AUP1G57GM 74AUP1G57GF 74AUP1G57GN 74AUP1G57GS −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C Name SC-88 XSON6 XSON6 XSON6 XSON6 Description plastic surface-mounted package; 6 leads Version SOT363 Type number plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 × 1.45 × 0.5 mm plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 × 1 × 0.5 mm extremely thin small outline package; no leads; 6 terminals; body 0.9 × 1.0 × 0.35 mm extremely thin small outline package; no leads; 6 terminals; body 1.0 × 1.0 × 0.35 mm SOT1115 SOT1202 4. Marking Table 2. Marking Marking code[1] aC aC aC aC aC Type number 74AUP1G57GW 74AUP1G57GM 74AUP1G57GF 74AUP1G57GN 74AUP1G57GS [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 3 4 B 1 Y A C 6 001aab583 Fig 1. Logic symbol 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 2 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 6. Pinning information 6.1 Pinning 74AUP1G57 74AUP1G57 B GND 1 2 6 5 C VCC A A 3 001aab591 B 1 6 C B GND 74AUP1G57 1 2 3 6 5 4 C VCC Y GND 2 5 VCC 3 4 001aab592 Y A 4 Y 001aae058 Transparent top view Transparent top view Fig 2. Pin configuration SOT363 Fig 3. Pin configuration SOT886 Fig 4. Pin configuration SOT891, SOT1115 and SOT1202 6.2 Pin description Table 3. Symbol B GND A Y VCC C Pin description Pin 1 2 3 4 5 6 Description data input ground (0 V) data input data output supply voltage data input 7. Functional description Table 4. Input C L L L L H H H H [1] Function table[1] Output B L L H H L L H H A L H L H L H L H Y H L H L L L H H H = HIGH voltage level; L = LOW voltage level. 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 3 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 7.1 Logic configurations Table 5. Function selection table Figure see Figure 5 see Figure 8 see Figure 6 and Figure 7 see Figure 6 and Figure 7 see Figure 8 see Figure 5 see Figure 9 see Figure 10 see Figure 11 Logic function 2-input AND 2-input AND with both inputs inverted 2-input NAND with inverted input 2-input OR with inverted input 2-input NOR 2-input NOR with both inputs inverted 2-input XNOR Inverter Buffer VCC B C Y B 1 2 B C Y 3 6 5 4 Y B C Y C B C Y B 1 2 3 6 5 4 Y C VCC 001aab584 001aab585 Fig 5. 2-input AND gate or 2-input NOR gate with both inputs inverted Fig 6. 2-input NAND gate with input B inverted or 2-input OR gate with inverted C input VCC VCC A C Y 1 2 A C Y A 3 6 5 4 Y A C Y A C A C Y 1 2 3 6 5 4 Y C 001aab586 001aab587 Fig 7. 2-input NAND gate with input C inverted or 2-input OR gate with inverted A input Fig 8. 2-input NOR gate or 2-input AND gate with both inputs inverted VCC VCC B B C Y 1 2 3 6 5 4 Y A Y A 001aab588 001aab589 C 1 2 3 6 5 4 Y Fig 9. 2-input XNOR gate Fig 10. Inverter 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 4 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate VCC B B Y 1 2 3 6 5 4 Y 001aab590 Fig 11. Buffer 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IO ICC IGND Tstg Ptot [1] [2] Parameter supply voltage input clamping current input voltage output clamping current output voltage output current supply current ground current storage temperature total power dissipation Conditions VI < 0 V [1] Min −0.5 −50 −0.5 −50 [1] Max +4.6 +4.6 +4.6 ±20 50 +150 250 Unit V mA V mA V mA mA mA °C mW VO < 0 V Active mode and Power-down mode VO = 0 V to VCC −0.5 −50 −65 Tamb = −40 °C to +125 °C [2] - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For SC-88 packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K. 9. Recommended operating conditions Table 7. Symbol VCC VI VO Tamb Recommended operating conditions Parameter supply voltage input voltage output voltage ambient temperature Active mode Power-down mode; VCC = 0 V Conditions Min 0.8 0 0 0 −40 Max 3.6 3.6 VCC 3.6 +125 Unit V V V V °C 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 5 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 10. Static characteristics Table 8. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = 25 °C VOH HIGH-level output voltage VI = VT+ or VT− IO = −20 μA; VCC = 0.8 V to 3.6 V IO = −1.1 mA; VCC = 1.1 V IO = −1.7 mA; VCC = 1.4 V IO = −1.9 mA; VCC = 1.65 V IO = −2.3 mA; VCC = 2.3 V IO = −3.1 mA; VCC = 2.3 V IO = −2.7 mA; VCC = 3.0 V IO = −4.0 mA; VCC = 3.0 V VOL LOW-level output voltage VI = VT+ or VT− IO = 20 μA; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V II IOFF ΔIOFF ICC ΔICC CI CO VOH input leakage current power-off leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V 1.1 1.7 0.1 0.3 × VCC 0.31 0.31 0.31 0.44 0.31 0.44 ±0.1 ±0.2 ±0.2 0.5 40 V V V V V V V V μA μA μA μA μA pF pF VCC − 0.1 1.11 1.32 2.05 1.9 2.72 2.6 V V V V V V V V 0.75 × VCC Conditions Min Typ Max Unit additional power-off leakage VI or VO = 0 V to 3.6 V; current VCC = 0 V to 0.2 V supply current additional supply current input capacitance output capacitance HIGH-level output voltage VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V VI = GND or VCC; VCC = 0 V to 3.6 V VO = GND; VCC = 0 V VI = VT+ or VT− IO = −20 μA; VCC = 0.8 V to 3.6 V IO = −1.1 mA; VCC = 1.1 V IO = −1.7 mA; VCC = 1.4 V IO = −1.9 mA; VCC = 1.65 V IO = −2.3 mA; VCC = 2.3 V IO = −3.1 mA; VCC = 2.3 V IO = −2.7 mA; VCC = 3.0 V IO = −4.0 mA; VCC = 3.0 V Tamb = −40 °C to +85 °C VCC − 0.1 0.7 × VCC 1.03 1.30 1.97 1.85 2.67 2.55 V V V V V V V V 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 6 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate Table 8. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOL LOW-level output voltage Conditions VI = VT+ or VT− IO = 20 μA; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V II IOFF ΔIOFF ICC ΔICC input leakage current power-off leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V 0.1 0.3 × VCC 0.37 0.35 0.33 0.45 0.33 0.45 ±0.5 ±0.5 ±0.6 0.9 50 V V V V V V V V μA μA μA μA μA Min Typ Max Unit additional power-off leakage VI or VO = 0 V to 3.6 V; current VCC = 0 V to 0.2 V supply current additional supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V VI = VT+ or VT− IO = −20 μA; VCC = 0.8 V to 3.6 V IO = −1.1 mA; VCC = 1.1 V IO = −1.7 mA; VCC = 1.4 V IO = −1.9 mA; VCC = 1.65 V IO = −2.3 mA; VCC = 2.3 V IO = −3.1 mA; VCC = 2.3 V IO = −2.7 mA; VCC = 3.0 V IO = −4.0 mA; VCC = 3.0 V Tamb = −40 °C to +125 °C VOH HIGH-level output voltage VCC − 0.11 0.6 × VCC 0.93 1.17 1.77 1.67 2.40 2.30 0.11 0.41 0.39 0.36 0.50 0.36 0.50 ±0.75 ±0.75 V V V V V V V V V V V V V V V μA μA VOL LOW-level output voltage VI = VT+ or VT− IO = 20 μA; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V 0.33 × VCC V II IOFF input leakage current power-off leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 7 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate Table 8. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter ΔIOFF ICC ΔICC Conditions Min Typ Max ±0.75 1.4 75 Unit μA μA μA additional power-off leakage VI or VO = 0 V to 3.6 V; current VCC = 0 V to 0.2 V supply current additional supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V 11. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 13. Symbol Parameter Conditions Min CL = 5 pF tpd propagation delay A, B and C to Y; see Figure 12 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V CL = 10 pF tpd propagation delay A, B and C to Y; see Figure 12 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V CL = 15 pF tpd propagation delay A, B and C to Y; see Figure 12 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [2] [2] [2] 25 °C Typ[1] Max −40 °C to +125 °C Min Max (85 °C) Max (125 °C) Unit 2.8 2.2 2.1 2.0 1.8 22.6 6.5 4.6 3.9 3.1 2.8 12.6 7.6 6.2 4.5 3.9 2.5 2.5 2.0 1.8 1.5 13.0 8.2 6.8 5.1 4.1 13.2 8.6 7.2 5.3 4.3 ns ns ns ns ns ns 3.2 2.6 2.5 2.4 2.3 26.1 7.3 5.2 4.5 3.7 3.4 14.4 8.7 7.0 5.2 4.6 2.8 2.8 2.2 2.1 1.9 14.9 9.3 7.8 5.9 4.9 15.2 9.8 8.2 6.2 5.1 ns ns ns ns ns ns 3.4 2.8 2.6 2.6 2.5 31.6 8.0 5.7 4.9 4.1 3.8 15.7 9.4 7.7 5.7 5.0 3.1 3.1 2.5 2.4 2.2 16.7 10.4 8.7 6.5 5.5 17.0 10.9 9.2 6.9 5.7 ns ns ns ns ns ns 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 8 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate Table 9. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 13. Symbol Parameter Conditions Min CL = 30 pF tpd propagation delay A, B and C to Y; see Figure 12 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V CL = 5 pF, 10 pF, 15 pF and 30 pF CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [1] [2] [3] [4] All typical values are measured at nominal VCC. tpd is the same as tPLH and tPHL. All specified values are the average typical values over all stated loads. CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. [3][4] [2] 25 °C Typ[1] Max −40 °C to +125 °C Min Max (85 °C) Max (125 °C) Unit 4.6 3.6 3.5 3.4 3.2 37.8 10.4 7.4 6.2 5.2 4.9 20.9 12.2 9.9 7.4 6.6 3.9 3.8 3.1 3.1 2.8 21.8 13.4 11.1 8.3 7.0 22.3 14.1 11.8 8.8 7.4 ns ns ns ns ns ns - 2.6 2.8 2.9 3.1 3.7 4.3 - - - - pF pF pF pF pF pF 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 9 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 12. Waveforms VI A, B, C input GND t PHL VOH Y output VOL t PLH VOH Y output VOL VM VM t PHL VM VM t PLH VM VM 001aab593 Measurement points are given in Table 10. VOL and VOH are typical output voltage drops that occur with the output load. Fig 12. Input A, B and C to output Y propagation delay times Table 10. VCC 0.8 V to 3.6 V Measurement points Output VM 0.5 × VCC Input VM 0.5 × VCC VI VCC tr = tf ≤ 3.0 ns Supply voltage 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 10 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate VCC VEXT 5 kΩ G VI VO DUT RT CL RL 001aac521 Test data is given in Table 11. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 13. Test circuit for measuring switching times Table 11. VCC 0.8 V to 3.6 V [1] Test data Load CL RL[1] 5 pF, 10 pF, 15 pF and 30 pF 5 kΩ or 1 MΩ VEXT tPLH, tPHL open tPZH, tPHZ GND tPZL, tPLZ 2 × VCC Supply voltage For measuring enable and disable times, RL = 5 kΩ. For measuring propagation delays, set-up and hold times, and pulse width, RL = 1 MΩ. 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 11 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 13. Transfer characteristics Table 12. Transfer characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 13. Symbol Parameter Conditions Min VT+ positive-going threshold voltage see Figure 14 and Figure 15 VCC = 0.8 V VCC = 1.1 V VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 3.0 V VT− negative-going threshold voltage see Figure 14 and Figure 15 VCC = 0.8 V VCC = 1.1 V VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 3.0 V VH hysteresis voltage (VT+ − VT−); see Figure 14, Figure 15, Figure 16 and Figure 17 VCC = 0.8 V VCC = 1.1 V VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 3.0 V 0.07 0.08 0.18 0.27 0.53 0.79 0.50 0.46 0.56 0.66 0.92 1.31 0.07 0.08 0.18 0.27 0.53 0.79 0.50 0.46 0.56 0.66 0.92 1.31 0.50 0.46 0.56 0.66 0.92 1.31 V V V V V V 0.10 0.26 0.39 0.47 0.69 0.88 0.60 0.65 0.75 0.84 1.04 1.24 0.10 0.26 0.39 0.47 0.69 0.88 0.60 0.65 0.75 0.84 1.04 1.24 0.60 0.65 0.75 0.84 1.04 1.24 V V V V V V 0.30 0.53 0.74 0.91 1.37 1.88 0.60 0.90 1.11 1.29 1.77 2.29 0.30 0.53 0.74 0.91 1.37 1.88 0.60 0.90 1.11 1.29 1.77 2.29 0.62 0.92 1.13 1.31 1.80 2.32 V V V V V V 25 °C Typ Max −40 °C to +125 °C Min Max (85 °C) Max (125 °C) Unit 14. Waveform transfer characteristics VO VT+ VI VT− VH VO VH VT− VT+ VI mna207 mna208 VT+ and VT− limits at 70 % and 20 %. Fig 14. Transfer characteristic 74AUP1G57 Fig 15. Definition of VT+, VT−, and VH All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 12 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 240 ICC (μA) 160 001aad691 80 0 0 0.4 0.8 1.2 1.6 VI (V) 2.0 Fig 16. Typical transfer characteristics; VCC = 1.8 V 1200 ICC (μA) 800 001aad692 400 0 0 1.0 2.0 VI (V) 3.0 Fig 17. Typical transfer characteristics; VCC = 3.0 V 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 13 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 15. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 18. Package outline SOT363 (SC-88) 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 14 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× L1 L (2) e 6 e1 5 e1 4 6× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Fig 19. Package outline SOT886 (XSON6) 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 15 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm SOT891 1 2 b 3 4× (1) L1 e L 6 e1 5 e1 4 6× (1) A A1 D E terminal 1 index area 0 1 scale DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 max 0.04 b 0.20 0.12 D 1.05 0.95 E 1.05 0.95 e 0.55 e1 0.35 L 0.35 0.27 L1 0.40 0.32 2 mm Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION SOT891 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 Fig 20. Package outline SOT891 (XSON6) 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 16 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm SOT1115 1 2 b 3 (4×)(2) L1 e L 6 e1 5 e1 4 (6×)(2) A1 A D E terminal 1 index area 0 Dimensions Unit mm A(1) A1 b D E e e1 0.3 L L1 0.5 scale 1 mm max 0.35 0.04 0.20 0.95 1.05 nom 0.15 0.90 1.00 0.55 min 0.12 0.85 0.95 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version SOT1115 References IEC JEDEC JEITA European projection sot1115_po Issue date 10-04-02 10-04-07 Fig 21. Package outline SOT1115 (XSON6) 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 17 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm SOT1202 1 2 b 3 (4×)(2) L L1 e 6 e1 5 e1 4 (6×)(2) A1 A D E terminal 1 index area 0 Dimensions Unit mm A(1) A1 b D E e e1 L L1 0.5 scale 1 mm max 0.35 0.04 0.20 1.05 1.05 0.35 0.40 nom 0.15 1.00 1.00 0.55 0.35 0.30 0.35 min 0.12 0.95 0.95 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version SOT1202 References IEC JEDEC JEITA European projection sot1202_po Issue date 10-04-02 10-04-06 Fig 22. Package outline SOT1202 (XSON6) 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 18 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 16. Abbreviations Table 13. Acronym CDM DUT ESD HBM MM Abbreviations Description Charged Device Model Device Under Test ElectroStatic Discharge Human Body Model Machine Model 17. Revision history Table 14. Revision history Release date 20100720 Data sheet status Product data sheet Change notice Supersedes 74AUP1G57 v.3 Document ID 74AUP1G57 v.4 Modifications: 74AUP1G57 v.3 74AUP1G57 v.2 74AUP1G57 v.1 • • Added type number 74AUP1G57GN (SOT1115/XSON6 package). Added type number 74AUP1G57GS (SOT1202/XSON6 package). Product data sheet Product data sheet Product data sheet 74AUP1G57 v.2 74AUP1G57 v.1 - 20090622 20090323 20061123 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 19 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 18. Legal information 18.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 20 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74AUP1G57 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 20 July 2010 21 of 22 NXP Semiconductors 74AUP1G57 Low-power configurable multiple function gate 20. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 12 13 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Logic configurations . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Transfer characteristics . . . . . . . . . . . . . . . . . 12 Waveform transfer characteristics. . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 July 2010 Document identifier: 74AUP1G57