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CBTU02043HEJ

CBTU02043HEJ

  • 厂商:

    NXP(恩智浦)

  • 封装:

    HUQFN16_1.6X2.4MM

  • 描述:

    CBTU02043HEJ

  • 数据手册
  • 价格&库存
CBTU02043HEJ 数据手册
CBTU02043 High-speed differential 1-to-2 switch Rev. 3.1 — 23 September 2021 1 Product data sheet General description CBTU02043 is a high-speed differential 1-to-2 switch chip optimized to interface with USB Type-C connector for mobile and PC applications. This high performance switch chip can be used for single port USB3.1, PCIe-Gen3, MIPI high-speed serial interface applications. It can also support DP1.4 or 4 single-ended DDR channels. The CBTU02043 chip can also provide 2-to-1 MUX function by selecting 1 (Port A) out of two differential ports (Port B or C) for other applications. The pinouts are optimized for USB3.1 Type-C DeMUX application and achieve very low crosstalk to meet the stringent USB Type-C crosstalk spec. The small package and pinning is ideal for smartphone USB Type-C application. CBTU02043 is available in 1.6 mm x 2.4 mm x 0.5 mm HUQFN16 package with 0.4 mm pitch. 2 Features and benefits • Optimized for USB Type-C connector PCB routing for signal integrity – Minimize crosstalk to meet stringent USB Type-C requirement – Minimize via with friendly USB Type-C PCB layout • One port (two bidirectional differential channels) 1-to-2 switch – Low insertion loss: -1.4 dB at 5 GHz; -0.9 dB at 2.5 GHz; -0.5 dB at 100 MHz – Low off-state isolation: -20 dB at 5 GHz; -40 dB at 100 MHz – Low return loss: -16 dB at 2.5 GHz; -12 dB @ 5 GHz – Low ON-state resistance: 10 Ω (typ) – Bandwidth: 12 GHz (typ) – Very low DDNEXT crosstalk: < -37 dB at 5 GHz – VIC common mode input voltage VIC: 0 V to 2 V – Differential input voltage VID: 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 12. temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Figure 12. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. CBTU02043 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 23 September 2021 © NXP B.V. 2021. All rights reserved. 15 / 21 CBTU02043 NXP Semiconductors High-speed differential 1-to-2 switch 15 Soldering: PCB footprint Footprint information for reflow soldering of HUQFN16 package SOT1832-1 2.15 0.95 0.05 0.05 0.5 2.95 2.55 0.2 0.4 1.75 2.65 0.5 0.15 0.25 1.4 0.2 0.4 0.4 0.45 0.6 0.95 1.85 recommended stencil thickness: 0.1 mm occupied area solder resist solder lands solder paste Dimensions in mm Issue date 16-03-09 16-03-15 sot1832-1_fr Figure 13. PCB footprint for SOT1832-1 (HUQFN16); reflow soldering CBTU02043 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 23 September 2021 © NXP B.V. 2021. All rights reserved. 16 / 21 CBTU02043 NXP Semiconductors High-speed differential 1-to-2 switch 16 Abbreviations Table 17. Abbreviations Acronym Description CDM Charged Device Model Gbps Gigabits per second HBM Human Body Model 17 Revision history Table 18. Revision history Document ID Release date Data sheet status Change notice Supersedes CBTU02043 v.3.1 20210923 Product data sheet 202109022I CBTU02043 v.3 Modifications: • Section 2, Table 2, Table 6: Temperature range increased from "-10 °C to +85 °C" to "-40 °C to +85 °C" • Table 8: Added condition for HIGH and LOW-level input leakage current CBTU02043 v.3 20180719 Modifications: • Table 2: Corrected temperature range from "-40 °C to +85 °C" to "-10 °C to +85 °C" CBTU02043 v.2 20180423 Modifications: • Table 8, tPD: Tightened performance spec from 80 ps (typ) to 33ps (typ), 45ps (max) CBTU02043 v.1.1 20170531 Modifications: • Removed "Company Confidential" watermark, released to public CBTU02043 v.1 20161102 CBTU02043 Product data sheet Product data sheet Product data sheet Product data sheet Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 23 September 2021 CBTU02043 v.2 CBTU02043 v.1.1 CBTU02043 v.1 - © NXP B.V. 2021. All rights reserved. 17 / 21 CBTU02043 NXP Semiconductors High-speed differential 1-to-2 switch 18 Legal information 18.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. notice. This document supersedes and replaces all information supplied prior to the publication hereof. 18.2 Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without CBTU02043 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 23 September 2021 © NXP B.V. 2021. All rights reserved. 18 / 21 CBTU02043 NXP Semiconductors High-speed differential 1-to-2 switch No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive CBTU02043 Product data sheet applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 23 September 2021 © NXP B.V. 2021. All rights reserved. 19 / 21 CBTU02043 NXP Semiconductors High-speed differential 1-to-2 switch Tables Tab. 1. Tab. 2. Tab. 3. Tab. 4. Tab. 5. Tab. 6. Tab. 7. Tab. 8. Tab. 9. Ordering information ..........................................2 Ordering options ................................................2 Pin description ...................................................4 ON/OFF control table ........................................ 5 Limiting values .................................................. 5 Operating conditions ......................................... 6 General characteristics ......................................6 Dynamic and static characteristics .................... 7 SEL input buffer characteristics .........................8 Tab. 10. Tab. 11. Tab. 12. Tab. 13. Tab. 14. Tab. 15. Tab. 16. Tab. 17. Tab. 18. XSD input buffer characteristics ........................ 8 Dimensions and quantities .............................. 10 Carrier tape dimensions .................................. 11 Reel dimensions ..............................................12 Barcode label dimensions ............................... 13 SnPb eutectic process (from J-STD-020D) ..... 14 Lead-free process (from J-STD-020D) ............ 15 Abbreviations ...................................................17 Revision history ...............................................17 Fig. 9. Fig. 10. Fig. 11. Carrier tape dimensions .................................. 11 Schematic view of reel .................................... 12 Example of typical box and reel information barcode label ...................................................13 Temperature profiles for large and small components ..................................................... 15 PCB footprint for SOT1832-1 (HUQFN16); reflow soldering ............................................... 16 Figures Fig. 1. Fig. 2. Fig. 3. Fig. 4. Fig. 5. Fig. 6. Fig. 7. Fig. 8. Application diagram ...........................................2 Block diagram ................................................... 3 Pin configuration for HUQFN16 (transparent top view) ....................................... 3 USB Type-C smartphone application ................ 5 Enable time definition ........................................7 Package outline SOT1832-1 (HUQFN16) ......... 9 Reel dry pack for SMD: Light weight reel ........ 10 Product orientation in carrier tape ................... 11 CBTU02043 Product data sheet Fig. 12. Fig. 13. All information provided in this document is subject to legal disclaimers. Rev. 3.1 — 23 September 2021 © NXP B.V. 2021. All rights reserved. 20 / 21 CBTU02043 NXP Semiconductors High-speed differential 1-to-2 switch Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 8 9 10 11 11.1 11.2 11.3 12 13 13.1 13.1.1 13.1.2 13.1.3 13.1.4 13.1.5 14 14.1 14.2 14.3 14.4 15 16 17 18 General description ............................................ 1 Features and benefits .........................................1 Application diagram ............................................2 Ordering information .......................................... 2 Ordering options ................................................ 2 Block diagram ..................................................... 3 Pinning information ............................................ 3 Pinning ............................................................... 3 Pin description ................................................... 4 Functional description ........................................4 Application examples ......................................... 5 Limiting values .................................................... 5 Recommended operating conditions ................ 6 Characteristics .................................................... 6 Device general characteristics ...........................6 Switch channel characteristics ...........................7 Control signals characteristics ........................... 8 Package outline ...................................................9 Packing information ..........................................10 SOT1832-1 (HUQFN16); Reel pack, SMD, 13" Q1/T1 standard product orientation; Orderable part number ending ,118 or J; Ordering code (12NC) ending 118 ...................10 Packing method ............................................... 10 Product orientation ...........................................11 Carrier tape dimensions .................................. 11 Reel dimensions .............................................. 12 Barcode label ...................................................13 Soldering of SMD packages .............................13 Introduction to soldering .................................. 13 Wave and reflow soldering .............................. 13 Wave soldering ................................................ 14 Reflow soldering .............................................. 14 Soldering: PCB footprint .................................. 16 Abbreviations .................................................... 17 Revision history ................................................ 17 Legal information .............................................. 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2021. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 23 September 2021 Document identifier: CBTU02043
CBTU02043HEJ 价格&库存

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CBTU02043HEJ
    •  国内价格
    • 1+9.05279
    • 10+7.51909
    • 25+7.44438
    • 100+7.41714
    • 250+7.38901
    • 500+7.36177
    • 1000+7.33452

    库存:10583