CBTU02043
High-speed differential 1-to-2 switch
Rev. 3.1 — 23 September 2021
1
Product data sheet
General description
CBTU02043 is a high-speed differential 1-to-2 switch chip optimized to interface
with USB Type-C connector for mobile and PC applications. This high performance
switch chip can be used for single port USB3.1, PCIe-Gen3, MIPI high-speed serial
interface applications. It can also support DP1.4 or 4 single-ended DDR channels. The
CBTU02043 chip can also provide 2-to-1 MUX function by selecting 1 (Port A) out of two
differential ports (Port B or C) for other applications.
The pinouts are optimized for USB3.1 Type-C DeMUX application and achieve very
low crosstalk to meet the stringent USB Type-C crosstalk spec. The small package and
pinning is ideal for smartphone USB Type-C application.
CBTU02043 is available in 1.6 mm x 2.4 mm x 0.5 mm HUQFN16 package with 0.4 mm
pitch.
2
Features and benefits
• Optimized for USB Type-C connector PCB routing for signal integrity
– Minimize crosstalk to meet stringent USB Type-C requirement
– Minimize via with friendly USB Type-C PCB layout
• One port (two bidirectional differential channels) 1-to-2 switch
– Low insertion loss: -1.4 dB at 5 GHz; -0.9 dB at 2.5 GHz; -0.5 dB at 100 MHz
– Low off-state isolation: -20 dB at 5 GHz; -40 dB at 100 MHz
– Low return loss: -16 dB at 2.5 GHz; -12 dB @ 5 GHz
– Low ON-state resistance: 10 Ω (typ)
– Bandwidth: 12 GHz (typ)
– Very low DDNEXT crosstalk: < -37 dB at 5 GHz
– VIC common mode input voltage VIC: 0 V to 2 V
– Differential input voltage VID: 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 12.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Figure 12. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
CBTU02043
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 23 September 2021
© NXP B.V. 2021. All rights reserved.
15 / 21
CBTU02043
NXP Semiconductors
High-speed differential 1-to-2 switch
15 Soldering: PCB footprint
Footprint information for reflow soldering of HUQFN16 package
SOT1832-1
2.15
0.95
0.05
0.05
0.5
2.95
2.55
0.2
0.4
1.75
2.65
0.5
0.15
0.25
1.4
0.2
0.4
0.4
0.45
0.6
0.95
1.85
recommended stencil thickness: 0.1 mm
occupied area
solder resist
solder lands
solder paste
Dimensions in mm
Issue date
16-03-09
16-03-15
sot1832-1_fr
Figure 13. PCB footprint for SOT1832-1 (HUQFN16); reflow soldering
CBTU02043
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 23 September 2021
© NXP B.V. 2021. All rights reserved.
16 / 21
CBTU02043
NXP Semiconductors
High-speed differential 1-to-2 switch
16 Abbreviations
Table 17. Abbreviations
Acronym
Description
CDM
Charged Device Model
Gbps
Gigabits per second
HBM
Human Body Model
17 Revision history
Table 18. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
CBTU02043 v.3.1
20210923
Product data sheet
202109022I
CBTU02043 v.3
Modifications:
• Section 2, Table 2, Table 6: Temperature range increased from "-10 °C to +85 °C" to "-40 °C
to +85 °C"
• Table 8: Added condition for HIGH and LOW-level input leakage current
CBTU02043 v.3
20180719
Modifications:
• Table 2: Corrected temperature range from "-40 °C to +85 °C" to "-10 °C to +85 °C"
CBTU02043 v.2
20180423
Modifications:
• Table 8, tPD: Tightened performance spec from 80 ps (typ) to 33ps (typ), 45ps (max)
CBTU02043 v.1.1
20170531
Modifications:
• Removed "Company Confidential" watermark, released to public
CBTU02043 v.1
20161102
CBTU02043
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 23 September 2021
CBTU02043 v.2
CBTU02043 v.1.1
CBTU02043 v.1
-
© NXP B.V. 2021. All rights reserved.
17 / 21
CBTU02043
NXP Semiconductors
High-speed differential 1-to-2 switch
18 Legal information
18.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
18.2 Definitions
Draft — A draft status on a document indicates that the content is still
under internal review and subject to formal approval, which may result
in modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included in a draft version of a document and shall have no
liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
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Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
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liability towards customer for the products described herein shall be limited
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Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
CBTU02043
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
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© NXP B.V. 2021. All rights reserved.
18 / 21
CBTU02043
NXP Semiconductors
High-speed differential 1-to-2 switch
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
CBTU02043
Product data sheet
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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CBTU02043
NXP Semiconductors
High-speed differential 1-to-2 switch
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.
Tab. 8.
Tab. 9.
Ordering information ..........................................2
Ordering options ................................................2
Pin description ...................................................4
ON/OFF control table ........................................ 5
Limiting values .................................................. 5
Operating conditions ......................................... 6
General characteristics ......................................6
Dynamic and static characteristics .................... 7
SEL input buffer characteristics .........................8
Tab. 10.
Tab. 11.
Tab. 12.
Tab. 13.
Tab. 14.
Tab. 15.
Tab. 16.
Tab. 17.
Tab. 18.
XSD input buffer characteristics ........................ 8
Dimensions and quantities .............................. 10
Carrier tape dimensions .................................. 11
Reel dimensions ..............................................12
Barcode label dimensions ............................... 13
SnPb eutectic process (from J-STD-020D) ..... 14
Lead-free process (from J-STD-020D) ............ 15
Abbreviations ...................................................17
Revision history ...............................................17
Fig. 9.
Fig. 10.
Fig. 11.
Carrier tape dimensions .................................. 11
Schematic view of reel .................................... 12
Example of typical box and reel information
barcode label ...................................................13
Temperature profiles for large and small
components ..................................................... 15
PCB footprint for SOT1832-1 (HUQFN16);
reflow soldering ............................................... 16
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
Fig. 7.
Fig. 8.
Application diagram ...........................................2
Block diagram ................................................... 3
Pin configuration for HUQFN16
(transparent top view) ....................................... 3
USB Type-C smartphone application ................ 5
Enable time definition ........................................7
Package outline SOT1832-1 (HUQFN16) ......... 9
Reel dry pack for SMD: Light weight reel ........ 10
Product orientation in carrier tape ................... 11
CBTU02043
Product data sheet
Fig. 12.
Fig. 13.
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 23 September 2021
© NXP B.V. 2021. All rights reserved.
20 / 21
CBTU02043
NXP Semiconductors
High-speed differential 1-to-2 switch
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
8
9
10
11
11.1
11.2
11.3
12
13
13.1
13.1.1
13.1.2
13.1.3
13.1.4
13.1.5
14
14.1
14.2
14.3
14.4
15
16
17
18
General description ............................................ 1
Features and benefits .........................................1
Application diagram ............................................2
Ordering information .......................................... 2
Ordering options ................................................ 2
Block diagram ..................................................... 3
Pinning information ............................................ 3
Pinning ............................................................... 3
Pin description ................................................... 4
Functional description ........................................4
Application examples ......................................... 5
Limiting values .................................................... 5
Recommended operating conditions ................ 6
Characteristics .................................................... 6
Device general characteristics ...........................6
Switch channel characteristics ...........................7
Control signals characteristics ........................... 8
Package outline ...................................................9
Packing information ..........................................10
SOT1832-1 (HUQFN16); Reel pack, SMD,
13" Q1/T1 standard product orientation;
Orderable part number ending ,118 or J;
Ordering code (12NC) ending 118 ...................10
Packing method ............................................... 10
Product orientation ...........................................11
Carrier tape dimensions .................................. 11
Reel dimensions .............................................. 12
Barcode label ...................................................13
Soldering of SMD packages .............................13
Introduction to soldering .................................. 13
Wave and reflow soldering .............................. 13
Wave soldering ................................................ 14
Reflow soldering .............................................. 14
Soldering: PCB footprint .................................. 16
Abbreviations .................................................... 17
Revision history ................................................ 17
Legal information .............................................. 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2021.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 September 2021
Document identifier: CBTU02043