CAT24C512HU5IGT3

DATA SHEET www.onsemi.com EEPROM Serial 512-Kb I2C CAT24C512 TSSOP−8 Y SUFFIX CASE 948AL Description The CAT24C512 is a EERPOM Serial 512−Kb I2C internally organized as 65,536 words of 8 bits each. It features a 128−byte page write buffer and supports the Standard (100 kHz), Fast (400 kHz) and Fast−Plus (1 MHz) I2C protocol. Write operations can be inhibited by taking the WP pin High (this protects the entire memory). External address pins make it possible to address up to eight CAT24C512 devices on the same bus. On−Chip ECC (Error Correction Code) makes the device suitable for high reliability applications. A0 Features A1 • • • • • • • • • • • I2C Supports Standard, Fast and Fast−Plus Protocol 1.8 V to 5.5 V Supply Voltage Range 128−Byte Page Write Buffer Hardware Write Protection for Entire Memory Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA) Low Power CMOS Technology 1,000,000 Program/Erase Cycles 100 Year Data Retention Industrial and Extended Temperature Range 8−pin, SOIC, TSSOP, 8−pad UDFN and 8−ball WLCSP Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant VCC SCL CAT24C512 A2, A1, A0 SDA UDFN−8 HU5 SUFFIX CASE 517BU SOIC−8 X SUFFIX CASE 751BE WLCSP−8 C8A SUFFIX CASE 567JL SOIC−8 W SUFFIX CASE 751BD PIN CONFIGURATIONS 1 VCC Pin A1 Reference WP A2 SCL VSS SDA SDA SOIC (W, X), TSSOP (Y), UDFN (HU5) (Top View) VCC SCL A2 WP A1 VSS For the location of Pin 1, please consult the corresponding package drawing. A0 WLCSP (C8A) (Top View) PIN FUNCTION Pin Name A0, A1, A2 Function Device Address SDA Serial Data SCL Serial Clock WP Write Protect VCC Power Supply VSS Ground ORDERING INFORMATION WP See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. VSS Figure 1. Functional Symbol © Semiconductor Components Industries, LLC, 2015 April, 2022 − Rev. 9 1 Publication Order Number: CAT24C512/D CAT24C512 MARKING DIAGRAMS 24512A AYMXXX G 24512A A Y M XXX G = Specific Device Code = Assembly Location Code = Production Year (Last Digit) = Production Month (1−9, O, N, D) = Last Three Digits of Assembly Lot Number = Pb−Free Microdot C9L A LL Y M G = Specific Device Code = Assembly Location Code = Last Two Digits of Assembly Lot Number = Production Year (Last Digit) = Production Month (1−9, O, N, D) = Pb−Free Microdot C12A A Y M XXX G = Specific Device Code = Assembly Location Code = Production Year (Last Digit) = Production Month (1−9, O, N, D) = Last Three Digits of Assembly Lot Number = Pb−Free Microdot SOIC−8 (W, X) C9L ALL YM G UDFN−8 (HU5) C12A AYMXXX G TSSOP−8 (Y) C9A AYW WLCSP (C8A) C9A = Specific Device Code A = Assembly Location Y = Production Year W = Production Week www.onsemi.com 2 CAT24C512 Table 1. ABSOLUTE MAXIMUM RATINGS Parameters Ratings Units Storage Temperature –65 to +150 °C Voltage on any Pin with Respect to Ground (Note 1) –0.5 to +6.5 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may undershoot to no less than −1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns. Table 2. RELIABILITY CHARACTERISTICS (Note 2) Parameter Symbol NEND (Notes 3, 4) Endurance TDR Min Units 1,000,000 Program/Erase Cycles 100 Years Data Retention 2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 3. Page Mode, VCC = 5 V, 25°C. 4. The device uses ECC (Error Correction Code) logic with 6 ECC bits to correct one bit error in 4 data bytes. Therefore, when a single byte has to be written, 4 bytes (including the ECC bits) are re-programmed. It is recommended to write by multiple of 4 bytes in order to benefit from the maximum number of write cycles. Table 3. D.C. OPERATING CHARACTERISTICS VCC = 1.8 V to 5.5 V, TA = −40°C to +85°C and VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified. Symbol Parameter Test Conditions Min Max Units ICCR Read Current Read, fSCL = 400 kHz/1 MHz 1 mA ICCW Write Current VCC = 1.8 V 1.8 mA VCC = 5.5 V 2.5 ISB IL Standby Current I/O Pin Leakage All I/O Pins at GND or VCC Pin at GND or VCC TA = −40°C to +85°C 2 TA = −40°C to +125°C 5 TA = −40°C to +85°C 1 TA = −40°C to +125°C 2 mA mA VIL1 Input Low Voltage 2.5 V ≤ VCC ≤ 5.5 V −0.5 0.3 VCC V VIL2 Input Low Voltage 1.8 V ≤ VCC < 2.5 V −0.5 0.25 VCC V VIH1 Input High Voltage 2.5 V ≤ VCC ≤ 5.5 V 0.7 VCC VCC + 0.5 V VIH2 Input High Voltage 1.8 V ≤ VCC < 2.5 V 0.75 VCC VCC + 0.5 V VOL1 Output Low Voltage VCC ≥ 2.5 V, IOL = 3.0 mA 0.4 V VOL2 Output Low Voltage VCC < 2.5 V, IOL = 1.0 mA 0.2 V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Table 4. PIN IMPEDANCE CHARACTERISTICS VCC = 1.8 V to 5.5 V, TA = −40°C to +85°C and VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified. Symbol Parameter Conditions Max Units CIN (Note 5) SDA I/O Pin Capacitance VIN = 0 V 8 pF CIN (Note 5) Input Capacitance (other pins) VIN = 0 V 6 pF WP Input Current, Address Input Current (A0, A1, A2) VIN < VIH, VCC = 5.5 V 75 mA VIN < VIH, VCC = 3.3 V 50 VIN < VIH, VCC = 1.8 V 25 VIN > VIH 2 IWP, IA (Note 6) 5. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 6. When not driven, the WP, A0, A1, A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power, as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source. www.onsemi.com 3 CAT24C512 Table 5. A.C. CHARACTERISTICS (Note 7) VCC = 1.8 V to 5.5 V, TA = −40°C to +85°C and VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified. Standard VCC = 1.8 V − 5.5 V Parameter Symbol FSCL tHD:STA Max Min 100 START Condition Hold Time Max Fast−Plus VCC = 2.5 V − 5.5 V TA = −405C to +855C Min 400 Max Units 1,000 kHz 4 0.6 0.25 ms tLOW Low Period of SCL Clock 4.7 1.3 0.45 ms tHIGH High Period of SCL Clock 4 0.6 0.40 ms 4.7 0.6 0.25 ms tSU:STA START Condition Setup Time tHD:DAT Data In Hold Time 0 0 0 ms tSU:DAT Data In Setup Time 250 100 50 ns tR (Note 8) SDA and SCL Rise Time 1,000 300 100 ns tF (Note 8) SDA and SCL Fall Time 300 300 100 ns tSU:STO STOP Condition Setup Time tBUF Bus Free Time Between STOP and START tAA SCL Low to Data Out Valid tDH Data Out Hold Time Ti (Note 8) 4 0.6 0.25 ms 4.7 1.3 0.5 ms 3.5 50 0.9 50 Noise Pulse Filtered at SCL and SDA Inputs 50 0.40 50 50 ms ns 50 ns tSU:WP WP Setup Time 0 0 0 ms tHD:WP WP Hold Time 2.5 2.5 1 ms tWR tPU (Notes 8, 9) 7. 8. 9. Min Clock Frequency Fast VCC = 1.8 V − 5.5 V Write Cycle Time 5 5 Power-up to Ready Mode 1 1 0.1 Test conditions according to “A.C. Test Conditions” table. Tested initially and after a design or process change that affects this parameter. tPU is the delay between the time VCC is stable and the device is ready to accept commands. Table 6. A.C. TEST CONDITIONS Input Levels 0.2 x VCC to 0.8 x VCC Input Rise and Fall Times ≤ 50 ns Input Reference Levels 0.3 x VCC, 0.7 x VCC Output Reference Levels 0.5 x VCC Output Load Current Source: IL = 3 mA (VCC ≥ 2.5 V); IL = 1 mA (VCC < 2.5 V); CL = 100 pF www.onsemi.com 4 5 ms 1 ms CAT24C512 Power-On Reset (POR) The CAT24C512 incorporates Power−On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after VCC exceeds the POR trigger level and will power down into Reset mode when VCC drops below the POR trigger level. This bi−directional POR behavior protects the device against brown−out failure, following a temporary loss of power. device pulls down the SDA line to ‘transmit’ a ‘0’ and releases it to ‘transmit’ a ‘1’. Data transfer may be initiated only when the bus is not busy (see A.C. Characteristics). During data transfer, the SDA line must remain stable while the SCL line is HIGH. An SDA transition while SCL is HIGH will be interpreted as a START or STOP condition (Figure 2). START The START condition precedes all commands. It consists of a HIGH to LOW transition on SDA while SCL is HIGH. The START acts as a ‘wake−up’ call to all receivers. Absent a START, a Slave will not respond to commands. Pin Description SCL: The Serial Clock input pin accepts the Serial Clock signal generated by the Master. SDA: The Serial Data I/O pin receives input data and transmits data stored in EEPROM. In transmit mode, this pin is open drain. Data is acquired on the positive edge, and is delivered on the negative edge of SCL. A0, A1 and A2: The Address pins accept the device address. These pins have on−chip pull−down resistors. WP: The Write Protect input pin inhibits all write operations, when pulled HIGH. This pin has an on−chip pull−down resistor. STOP The STOP condition completes all commands. It consists of a LOW to HIGH transition on SDA while SCL is HIGH. The STOP starts the internal Write cycle (when following a Write command) or sends the Slave into standby mode (when following a Read command). Device Addressing The Master initiates data transfer by creating a START condition on the bus. The Master then broadcasts an 8−bit serial Slave address. The first 4 bits of the Slave address are set to 1010, for normal Read/Write operations (Figure 3). The next 3 bits, A2, A1 and A0, select one of 8 possible Slave devices. The last bit, R/W, specifies whether a Read (1) or Write (0) operation is to be performed. Functional Description The CAT24C512 supports the Inter−Integrated Circuit (I2C) Bus data transmission protocol, which defines a device that sends data to the bus as a transmitter and a device receiving data as a receiver. Data flow is controlled by a Master device, which generates the serial clock and all START and STOP conditions. The CAT24C512 acts as a Slave device. Master and Slave alternate as either transmitter or receiver. Up to 8 devices may be connected to the bus as determined by the device address inputs A0, A1, and A2. Acknowledge After processing the Slave address, the Slave responds with an acknowledge (ACK) by pulling down the SDA line during the 9th clock cycle (Figure 4). The Slave will also acknowledge the byte address and every data byte presented in Write mode. In Read mode the Slave shifts out a data byte, and then releases the SDA line during the 9th clock cycle. If the Master acknowledges the data, then the Slave continues transmitting. The Master terminates the session by not acknowledging the last data byte (NoACK) and by sending a STOP to the Slave. Bus timing is illustrated in Figure 5. I2C Bus Protocol The I2C bus consists of two ‘wires’, SCL and SDA. The two wires are connected to the VCC supply via pull−up resistors. Master and Slave devices connect to the 2−wire bus via their respective SCL and SDA pins. The transmitting www.onsemi.com 5 CAT24C512 SCL SDA START CONDITION STOP CONDITION Figure 2. Start/Stop Timing 1 0 1 0 A2 A1 A0 R/W DEVICE ADDRESS Figure 3. Slave Address Bits BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER 1 BUS RELEASE DELAY (RECEIVER) 8 9 DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER START ACK SETUP (≥ tSU:DAT) ACK DELAY (≤ tAA) Figure 4. Acknowledge Timing tHIGH tF tLOW tR tLOW SCL tSU:STA tHD:DAT tHD:STA tSU:DAT tSU:STO SDA IN tAA tDH SDA OUT Figure 5. Bus Timing www.onsemi.com 6 tBUF CAT24C512 WRITE OPERATIONS Acknowledge Polling Acknowledge polling can be used to determine if the CAT24C512 is busy writing or is ready to accept commands. Polling is implemented by interrogating the device with a ‘Selective Read’ command (see READ OPERATIONS). The CAT24C512 will not acknowledge the Slave address, as long as internal Write is in progress. Byte Write In Byte Write mode the Master sends a START, followed by Slave address, two byte address and data to be written (Figure 6). The Slave acknowledges all 4 bytes, and the Master then follows up with a STOP, which in turn starts the internal Write operation (Figure 7). During internal Write, the Slave will not acknowledge any Read or Write request from the Master. Hardware Write Protection With the WP pin held HIGH, the entire memory is protected against Write operations. If the WP pin is left floating or is grounded, it has no impact on the operation of the CAT24C512. The state of the WP pin is strobed on the last falling edge of SCL immediately preceding the first data byte (Figure 9). If the WP pin is HIGH during the strobe interval, the CAT24C512 will not acknowledge the data byte and the Write request will be rejected. Page Write The CAT24C512 contains 65,536 bytes of data, arranged in 512 pages of 128 bytes each. A two byte address word, following the Slave address, points to the first byte to be written. The most significant 9 bits (A15 to A7) identify the page and the last 7 bits identify the byte within the page. Up to 128 bytes can be written in one Write cycle (Figure 8). The internal byte address counter is automatically incremented after each data byte is loaded. If the Master transmits more than 128 data bytes, then earlier bytes will be overwritten by later bytes in a ‘wrap−around’ fashion (within the selected page). The internal Write cycle starts immediately following the STOP. Delivery State The CAT24C512 is shipped erased, i.e., all bytes are FFh. www.onsemi.com 7 CAT24C512 S T BUS ACTIVITY: A MASTER R T SLAVE ADDRESS BYTE ADDRESS A15 − A8 A7 − A0 S T O P DATA P SDA LINE S A C K A C K A C K A C K Figure 6. Byte Write Timing SCL SDA 8th Bit Byte n ACK tWR STOP CONDITION START CONDITION ADDRESS Figure 7. Write Cycle Timing S BUS T ACTIVITY: A MASTER R T BYTE ADDRESS A15 − A8 A7 − A0 SLAVE ADDRESS DATA DATA n S T O P DATA n+127 P SDA LINE S A C K A C K A C K A C K A C K Figure 8. Page Write Timing ADDRESS BYTE DATA BYTE 1 8 a7 a0 9 1 8 d7 d0 SCL SDA tSU:WP WP tHD:WP Figure 9. WP Timing www.onsemi.com 8 A C K A C K CAT24C512 READ OPERATIONS The address counter can be initialized by performing a ‘dummy’ Write operation (Figure 11). Here the START is followed by the Slave address (with the R/W bit set to ‘0’) and the desired two byte address. Instead of following up with data, the Master then issues a 2nd START, followed by the ‘Immediate Address Read’ sequence, as described earlier. Immediate Address Read In standby mode, the CAT24C512 internal address counter points to the data byte immediately following the last byte accessed by a previous operation. If that ‘previous’ byte was the last byte in memory, then the address counter will point to the 1st memory byte, etc. When, following a START, the CAT24C512 is presented with a Slave address containing a ‘1’ in the R/W bit position (Figure 10), it will acknowledge (ACK) in the 9th clock cycle, and will then transmit data being pointed at by the internal address counter. The Master can stop further transmission by issuing a NoACK, followed by a STOP condition. Sequential Read If the Master acknowledges the 1st data byte transmitted by the CAT24C512, then the device will continue transmitting as long as each data byte is acknowledged by the Master (Figure 12). If the end of memory is reached during sequential Read, then the address counter will ‘wrap−around’ to the beginning of memory, etc. Sequential Read works with either ‘Immediate Address Read’ or ‘Selective Read’, the only difference being the starting byte address. Selective Read The Read operation can also be started at an address different from the one stored in the internal address counter. S T BUS ACTIVITY: A MASTER R T S T O P SLAVE ADDRESS SDA LINE S P A C K SCL 8 SDA N O A C K DATA 9 8th Bit DATA OUT NO ACK STOP Figure 10. Immediate Address Read Timing S T BUS ACTIVITY: A MASTER R T S T A R T BYTE ADDRESS A15 − A8 A7 − A0 SLAVE ADDRESS SDA LINE S SLAVE ADDRESS S T O P DATA P S A C K A C K A C K N O A C K A C K Figure 11. Selective Read Timing BUS ACTIVITY: MASTER SLAVE ADDRESS DATA n DATA n+1 S T O P DATA n+x DATA n+2 P SDA LINE A C K A C K A C K Figure 12. Sequential Read Timing www.onsemi.com 9 A C K N O A C K CAT24C512 ORDERING INFORMATION (Notes 10, 11) Device Order Number Specific Device Marking Package Type Temperature Range Lead Finish Shipping† CAT24C512WI−GT3 24512A SOIC−8, JEDEC −40°C to +85°C NiPdAu Tape & Reel, 3,000 Units / Reel CAT24C512XI−T2 24512A SOIC−8, EIAJ −40°C to +85°C Matte−Tin Tape & Reel, 2,000 Units / Reel CAT24C512XE−T2 24512A SOIC−8, EIAJ −40°C to +85°C Matte−Tin Tape & Reel, 2,000 Units / Reel CAT24C512YI−GT3 C12A TSSOP−8 −40°C to +85°C NiPdAu Tape & Reel, 3,000 Units / Reel C9L UDFN8 −40°C to +125°C NiPdAu Tape & Reel, 3,000 Units / Reel CAT24C512HU5EGT3 CAT24C512HU5IGT3 C9L UDFN8 −40°C to +85°C NiPdAu Tape & Reel, 3,000 Units / Reel CAT24C512C8ATR C9A WLCSP−8 −40°C to +85°C SnAgCu Tape & Reel, 5,000 Units / Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 10. All packages are RoHS-compliant (Lead-free, Halogen-free). 11. For detailed information and a breakdown of device nomenclature and numbering systems, please see the onsemi Device Nomenclature document, TND310/D, availablse at www.onsemi.com onsemi is licensed by the Philips Corporation to carry the I2C bus protocol. www.onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN8 3.0x2.0, 0.5P CASE 517BU−01 ISSUE O DATE 06 APR 2011 SCALE 4:1 A B D PIN 1 REFERENCE 0.15 C (0.065) ÍÍÍ ÍÍÍ ÍÍÍ 0.15 C E (0.127) DETAIL A DIM A A1 b D D2 E E2 e L TOP VIEW DETAIL A 0.05 C A 0.05 C A1 SIDE VIEW NOTE 4 D2 1 8X 4 XXX ALL YM G C A B M L 0.10 M C A B XXX = Specific Device Code A = Assembly Location Code LL = Assembly Lot Y = Year M = Month G = Pb−Free Package E2 5 8 8X e b 0.10 M C A B 0.05 M C D BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.20 0.30 2.00 BSC 1.35 1.45 3.00 BSC 0.85 0.95 0.50 BSC 0.35 0.45 GENERIC MARKING DIAGRAM* SEATING PLANE C 0.10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED MOUNTING FOOTPRINT 1.56 8X 1.06 0.63 3.30 PKG OUTLINE 1 8X 0.50 PITCH 0.32 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98AON55336E UDFN8 3.0 X 2.0, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 DATE 19 DEC 2008 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 MAX 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50 L 0.40 1.27 θ 0º 8º TOP VIEW D h A1 A θ c e b SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. DOCUMENT NUMBER: DESCRIPTION: 98AON34272E SOIC 8, 150 MILS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−8, 208 mils CASE 751BE−01 ISSUE O DATE 19 DEC 2008 SYMBOL MIN NOM A E1 E MAX 2.03 A1 0.05 0.25 b 0.36 0.48 c 0.19 0.25 D 5.13 5.33 E 7.75 8.26 E1 5.13 5.38 e 1.27 BSC L 0.51 0.76 θ 0º 8º PIN#1 IDENTIFICATION TOP VIEW D A e b q L A1 SIDE VIEW c END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with EIAJ EDR-7320. DOCUMENT NUMBER: DESCRIPTION: 98AON34273E SOIC−8, 208 MILS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP8, 4.4x3.0, 0.65P CASE 948AL ISSUE A DATE 20 MAY 2022 q q GENERIC MARKING DIAGRAM* XXX YWW AG XXX Y WW A G = Specific Device Code = Year = Work Week = Assembly Location = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON34428E TSSOP8, 4.4X3.0, 0.65P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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