CM1405-03CP

CM1405 LCD EMI Filter Array with ESD Protection Description ON Semiconductor’s CM1405 is an EMI filter array with ESD protection, which integrates eight Pi− filters (C−R−C). The CM1405 has component values of 25 pF − 100  − 25 pF. The parts include avalanche−type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±30 kV, exceeding the maximum requirement of the IEC61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well−suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy−to−use pin assignments. In particular, the CM1405 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in mobile handsets. The CM1405−03 incorporates OptiGuardt coating which results in improved reliability at assembly and is available in a space−saving, low−profile Chip Scale Package with RoHS compliant lead−free finishing. http://onsemi.com WLCSP20 CP SUFFIX CASE 567BZ MARKING DIAGRAM N051 N053 CM1405−01 20−Bump CSP Package CM1405−03 20−Bump CSP Package N051 N053 = CM1405−01CP = CM1405−03CP Features • Eight Channels of EMI Filtering • ±30 kV ESD Protection on Each Channel • • • • • • ORDERING INFORMATION (IEC 61000−4−2 Level 4, Contact Discharge) ±30 kV ESD Protection on Each Channel (HBM) Better than 35 dB of Attenuation at 800−2700 MHz Chip Scale Package Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance 20−Bump, 4.000 mm x 1.458 mm Footprint Chip Scale Package OptiGuardtCoated Version Available for Improved Reliability at Assembly These Devices are Pb−Free and are RoHS Compliant Device Package Shipping† CM1405−01CP CSP−20 (Pb−Free) 3500/Tape & Reel CM1405−03CP CSP−20 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Applications • • • • • • • LCD Data Lines in Mobile Handsets EMI Filtering & ESD Protection for High−Speed I/O Ports EMI Filtering for High−Speed Data Lines Wireless Handsets Cell Phones Notebook Computers PDAs / Handheld PCs © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 3 1 Publication Order Number: CM1405/D CM1405 BLOCK DIAGRAM 100  FILTERn* FILTERn* 25 pF 25 pF GND (Pins B1−B4) 1 of 8 EMI Filtering + ESD Channels *See Package/Pinout Diagrams for expanded pin information. PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Orientation Marking (see Note) A + 1 2 4 3 5 6 Bottom View (Bumps Up View) 7 8 C1 N051 B Orientation Marking C C2 C3 B1 C4 B2 C5 C6 C7 B3 C8 B4 A1 A1 A2 A3 A4 A5 A6 A7 A8 C1 C2 C3 C4 C5 C6 C7 C8 CM1405−01 Chip Scale Package Orientation Marking (see Note) + A 1 2 4 3 5 6 7 N053 B 8 Orientation Marking C B1 A1 A1 B2 A2 A3 B3 A4 A5 B4 A6 A7 A8 CM1405−03 Chip Scale Package Note: Lead−free devices are specified by using a “+” character for the top side orientation mark. Table 1. PIN DESCRIPTIONS Pins Name A1 FILTER1 A2 FILTER2 A3 Description Pins Name Filter Channel 1 C1 FILTER1 Filter Channel 1 Filter Channel 2 C2 FILTER2 Filter Channel 2 FILTER3 Filter Channel 3 C3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 C4 FILTER4 Filter Channel 4 A5 FILTER5 Filter Channel 5 C5 FILTER5 Filter Channel 5 A6 FILTER6 Filter Channel 6 C6 FILTER6 Filter Channel 6 A7 FILTER7 Filter Channel 7 C7 FILTER7 Filter Channel 7 A8 FILTER8 Filter Channel 8 C8 FILTER8 Filter Channel 8 B1−B4 GND Device Ground http://onsemi.com 2 Description CM1405 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions R Resistance C Capacitance At 2.5 V DC, 1 MHz, 30 mV AC VDIODE Min Typ Max 80 100 120  20 25 30 pF A Diode Standoff Voltage IDIODE = 10 A 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE = +3.3 V 0.1 1 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 −0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 RDYN Dynamic Resistance Positive Negative fC (Note 2) 5.6 −1.5 R = 100 , C = 25 pF 1. TA = 25 °C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. http://onsemi.com 3 V V kV 30 30 1.5 0.9 Cut−off Frequency ZSOURCE = 50 , ZLOAD = 50  Units 70  MHz CM1405 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 1. A1−C1 EMI Filter Performance Figure 2. A2−C2 EMI Filter Performance http://onsemi.com 4 CM1405 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 3. A3−C3 EMI Filter Performance Figure 4. A4−C4 EMI Filter Performance http://onsemi.com 5 CM1405 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 5. A5−C5 EMI Filter Performance Figure 6. A6−C6 EMI Filter Performance http://onsemi.com 6 CM1405 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 7. A7−C7 EMI Filter Performance Figure 8. A8−C8 EMI Filter Performance http://onsemi.com 7 CM1405 PERFORMANCE INFORMATION (Cont’d) Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 VDC and 255C) http://onsemi.com 8 CM1405 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 m Solder Ball Side Coplanarity ±20 m Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 10. Recommended Non−Solder Mask Defined Pad Illustration Figure 11. Lead−free (SnAgCu) Solder Ball Reflow Profile OptiGuardt is a trademark of Semiconductor Components Industries, LLC. http://onsemi.com 9 260°C MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 4.00x1.46 CASE 567BZ−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X D ÈÈ A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW A2 0.05 C MILLIMETERS MIN MAX 0.65 0.56 0.21 0.27 0.40 REF 0.29 0.35 4.00 BSC 1.46 BSC 0.50 BSC 0.435 BSC A 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE eD/2 20X eD b 0.05 C A B 0.03 C eE C B A 1 2 3 4 5 6 7 8 9 10 11 12 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE A1 0.87 0.44 20X 0.50 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON49833E WLCSP20, 4.00X1.46 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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