CM1406-08DE

CM1406 4 and 8-Channel EMI Filter Arrays with ESD Protection Product Description The CM1406 is an EMI filter array with ESD protection, which integrates either four or eight pi filters (C−R−C). Each CM1406 filter has component values of 15 pF − 200 W − 15 pF. These parts include ESD protection diodes on every pin, providing a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV contact discharge, twice the specification requirement of the IEC 61000−4−2, Level 4 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy−to−use pin assignments. In particular, the CM1406 is ideal for EMI filtering and protecting data lines from ESD in wireless handsets. The CM1406 is available in space−saving, low−profile, 8−lead and 16−lead WDFN packages. It is fabricated with Centuriont process and available with lead−free finishing. Features • • • • • • • Four and Eight Channels of EMI Filtering with ESD Protection Greater than 30 dB of Attenuation from 800 MHz to 3 GHz ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge) ±30 kV ESD Protection (HBM) Fabricated with Centuriont Advanced Low Capacitance Zener Process Technology Space Saving, Low−Profile 8 and 16−Lead WDFN Packages These Devices are Pb−Free and are RoHS Compliant http://onsemi.com BLOCK DIAGRAM 200 W FILTERn* FILTERn* 15 pF • • PDAs etc. EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers EMI Filtering for LCD, Camera and Chip−to−Chip Data Lines 15 pF GND 1 of 4/8 EMI Filtering + ESD Channels *See Package/Pinout Diagrams for Expanded Pin Information. MARKING DIAGRAM N68E M N06 4E N06 4E = CM1406−04DE N68E = CM1406−08DE Applications • I/O Port Protection for Mobile Handsets, Notebook Computers, WDFN16 DE SUFFIX CASE 511AU WDFN8 DE SUFFIX CASE 511BE ORDERING INFORMATION Device Package Shipping† CM1406−04DE WDFN8 (Pb−Free) 3000/Tape & Reel CM1406−08DE WDFN16 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 3 1 Publication Order Number: CM1406/D CM1406 PACKAGE / PINOUT DIAGRAMS Top View (Pins Down View) 8 7 6 Bottom View (Pins Up View) 5 1 2 3 4 CM1406−04DE 8−Lead WDFN Package GND PAD N06 4E Pin 1 Marking 8 7 6 5 1 2 3 4 16 15 14 13 12 11 10 9 1 CM1406−08DE 16−Lead WDFN Package with Exposed End Pads 7 8 16 15 14 13 12 11 10 9 N68E Pin 1 Marking 1 2 3 4 5 2 3 4 5 6 GND PAD 6 7 8 Table 1. PIN DESCRIPTIONS Pins Pins 1406−04Dx 1406−08Dx Name Description 1406−04Dx 1406−08Dx Name Description 1 1 FILTER1 Filter Channel 1 8 16 FILTER1 Filter Channel 1 2 2 FILTER2 Filter Channel 2 7 15 FILTER2 Filter Channel 2 3 3 FILTER3 Filter Channel 3 6 14 FILTER3 Filter Channel 3 4 4 FILTER4 Filter Channel 4 5 13 FILTER4 Filter Channel 4 5 FILTER5 Filter Channel 5 12 FILTER5 Filter Channel 5 6 FILTER6 Filter Channel 6 11 FILTER6 Filter Channel 6 7 FILTER7 Filter Channel 7 10 FILTER7 Filter Channel 7 8 FILTER8 Filter Channel 8 9 FILTER8 Filter Channel 8 GND Device Ground GND Pad http://onsemi.com 2 CM1406 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units –65 to +150 °C DC Power per Resistor 100 mW Package DC Power Rating 300 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max 160 200 240 W 12 15 18 pF R Resistance C Capacitance At 2.5 V DC, 1 MHz, 30 mV AC Diode Standoff Voltage IDIODE = 10 mA 6.0 ILEAK Diode Leakage Current (Reverse Bias) VDIODE = 3.3 V 0.1 1 VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 −0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Note 2) Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W R = 200 W, C = 15 pF VDIODE fC 5.6 −1.5 Units V mA V kV 30 15 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. http://onsemi.com 3 105 MHz CM1406 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 1. Channel 1 EMI Filter Performance (CM1406−04 only) Figure 2. Channel 2 EMI Filter Performance (CM1406−04 only) http://onsemi.com 4 CM1406 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 3. Channel 3 EMI Filter Performance (CM1406−04 only) Figure 4. Channel 4 EMI Filter Performance (CM1406−04 only) http://onsemi.com 5 CM1406 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 5. Channel 1 EMI Filter Performance (CM1406−08 only) Figure 6. Channel 2 EMI Filter Performance (CM1406−08 only) http://onsemi.com 6 CM1406 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 7. Channel 3 EMI Filter Performance (CM1406−08 only) Figure 8. Channel 4 EMI Filter Performance (CM1406−08 only) http://onsemi.com 7 CM1406 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 9. Channel 5 EMI Filter Performance (CM1406−08 only) Figure 10. Channel 6 EMI Filter Performance (CM1406−08 only) http://onsemi.com 8 CM1406 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 11. Channel 7 EMI Filter Performance (CM1406−08 only) Figure 12. Channel 8 EMI Filter Performance (CM1406−08 only) http://onsemi.com 9 CM1406 PERFORMANCE INFORMATION (Cont’d) Figure 13. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 V DC and 255C) Centurion is a trademark of Semiconductor Components Industries, LLC (SCILLC). http://onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN16, 4x1.6, 0.5P CASE 511AU−01 ISSUE O 16 DATE 06 JUL 2010 1 SCALE 4:1 PIN ONE REFERENCE 2X ÉÉ ÉÉ L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS 0.10 C 2X 0.10 C ÉÉ ÇÇ ÇÇ EXPOSED Cu TOP VIEW (A3) DETAIL B 0.10 C 0.08 C A1 SIDE VIEW D2 DETAIL A K F C 16X 1 8 16 9 e e/2 MOLD CMPD SEATING PLANE A3 ÉÉÉ ÇÇÇ ÇÇÇ A1 DETAIL B A NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L A B D ALTERNATE CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e F K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 4.00 BSC 3.10 3.30 1.60 BSC 0.30 0.50 0.50 BSC 0.25 REF 0.30 REF 0.20 0.40 −−− 0.15 L E2 16X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 4.30 2X 0.35 16X 3.30 0.53 1.90 3X 0.50 16X 0.30 0.50 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON48925E WDFN16, 4X1.6, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN8 2x2, 0.5P CASE 511BE−01 ISSUE A 1 DATE 27 MAY 2011 SCALE 2:1 A D PIN ONE REFERENCE 2X 0.10 C 2X E DETAIL A ALTERNATE CONSTRUCTIONS TOP VIEW ÇÇÇ ÉÉÉ ÉÉÉ EXPOSED Cu DETAIL B A 0.10 C A3 MOLD CMPD 0.08 C ALTERNATE CONSTRUCTIONS A1 SIDE VIEW C D2 DETAIL A 1 8X 4 SEATING PLANE K 5 e L 1 8X MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.50 1.70 2.00 BSC 0.80 1.00 0.50 BSC 0.25 REF 0.20 0.40 −−− 0.15 XX MG G XX = Specific Device Code M = Date Code G = Pb−Free Package b 0.10 C A B BOTTOM VIEW 0.05 C (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. NOTE 3 RECOMMENDED SOLDERING FOOTPRINT* 8X 1.70 PACKAGE OUTLINE A3 DIM A A1 A3 b D D2 E E2 e K L L1 GENERIC MARKING DIAGRAM* E2 8 ÇÇ ÉÉ A1 DETAIL B NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 ÇÇ ÇÇ ÇÇ 0.10 C L L B 0.50 2.30 1.00 1 0.50 PITCH 8X 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON48936E WDFN8, 2X2, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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