ESDL2031MX4T5G

ESD Protection Diodes Ultra Low Capacitance ESD Protection Diode for High Speed Data Line ESDL2031 The ESDL2031 ESD protection diodes are designed to protect high speed data lines from ESD. Ultra−low capacitance and low ESD clamping voltage make this device an ideal solution for protecting voltage sensitive high speed data lines. www.onsemi.com MARKING DIAGRAM Features • Ultra Low Capacitance (0.40 pF Typ, I/O to GND) • Protection for the Following IEC Standards: X4DFN2 (0201) CASE 152AX IEC 61000−4−2 (Level 4) • Low ESD Clamping Voltage • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS J J = Specific Device Code (Rotated 270 degrees) Compliant Typical Applications • • • • • USB 3.x MHL 2.0 SATA/SAS PCI Express HDMI PIN CONFIGURATION AND SCHEMATIC 1 2 MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Operating Junction Temperature Range TJ −55 to +125 °C Storage Temperature Range Tstg −55 to +150 °C Lead Solder Temperature − Maximum (10 Seconds) TL 260 °C ESD ESD ±30 ±30 kV kV ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Maximum Peak Pulse Current 8/20 ms @ TA = 25°C Ipp 9.75 A Maximum Peak Pulse Power 8/20 ms @ TA = 25°C Ppk 72 W = IEC 61000−4−2 Contact (ESD) IEC 61000−4−2 Air (ESD) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. See Application Note AND8308/D for further description of survivability specs. © Semiconductor Components Industries, LLC, 2016 May, 2020 − Rev. 2 1 Publication Order Number: ESDL2031/D ESDL2031 ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) Symbol VRWM IR IPP Parameter RDYN Working Peak Voltage IHOLD Maximum Reverse Leakage Current @ VRWM VBR IT Breakdown Voltage @ IT VBR IT IR VCVRWMVHOLD Test Current VHOLD Holding Reverse Voltage IHOLD Holding Reverse Current RDYN Dynamic Resistance V IR IT VBR VHOLDVRWMVC IHOLD RDYN IPP Maximum Peak Pulse Current VC Clamping Voltage @ IPP VC = VHOLD + (IPP * RDYN) −IPP VC = VHOLD + (IPP * RDYN) ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Parameter Symbol Reverse Working Voltage VRWM Breakdown Voltage VBR Conditions IT = 1 mA, I/O Pin to GND IR Reverse Holding Voltage VHOLD I/O Pin to GND Holding Reverse Current IHOLD I/O Pin to GND VC Typ I/O Pin to GND Reverse Leakage Current Clamping Voltage TLP (Note 2) Min 5.1 VRWM = 4.0 V, I/O Pin to GND Max Unit 4.0 V 8.5 V 0.05 mA 2.5 V 55 mA V IPP = 8 A IEC61000−4−2 Level 2 Equivalent (±4 kV Contact, ±8 kV Air) 5.25 IPP = 16 A IEC61000−4−4 Level 2 Equivalent (±8 kV Contact, ±16 kV Air) 7.1 Reverse Peak Pulse Current IPP per IEC61000−4−5 (8x20 ms) Figure 11 Clamping Voltage 8/20 ms Waveform per Figure 11 VC IPP = 9.75 A 9.75 A Dynamic Resistance RDYN Pin1 to Pin2 Pin2 to Pin1 0.22 0.22 Junction Capacitance CJ VR = 0 V, f = 1 MHz 0.40 7.4 V W 0.55 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. For test procedure see Figure 12 and application note AND8307/D. 2. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model. TLP conditions: Z0 = 50 W, tp = 100 ns, tr = 1 ns, averaging window: t1 = 70 ns to t2 = 90 ns. 10 90 0 80 −10 70 −20 60 VOLTAGE (V) VOLTAGE (V) 100 50 40 30 −30 −40 −50 −60 20 −70 10 −80 0 −90 −10 −20 0 20 40 60 80 TIME (ns) 100 120 −100 −20 140 Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000−4−2 0 20 40 60 80 TIME (ns) 100 120 Figure 2. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000−4−2 www.onsemi.com 2 140 ESDL2031 20 10 9 18 9 16 8 16 8 14 7 14 7 12 6 12 6 10 5 10 5 8 4 8 4 6 3 6 3 4 2 4 2 2 1 2 1 0 12 0 0 0 1 2 3 4 5 6 7 8 9 10 11 ITLP (A) 10 18 0 1 2 3 VOLTAGE (V) 6 7 8 9 10 11 0 12 Figure 4. Negative TLP I−V Curve 8 9 7 8 6 7 5 VC @ IPK (V) VC @ IPK (V) 5 VOLTAGE (V) Figure 3. Positive TLP I−V Curve 4 3 2 6 5 4 3 2 1 0 4 VIEC Eq (kV) 20 VIEC Eq (kV) ITLP (A) TYPICAL CHARACTERISTICS 1 0 2 4 6 IPK (A) 8 10 0 12 0 Figure 5. Positive Clamping Voltage vs. Peak Pulse Current (tp = 8/20 ms) 2 4 6 IPK (A) 8 10 12 Figure 6. Negative Clamping Voltage vs. Peak Pulse Current (tp = 8/20 ms) 1.E−03 1.E−03 1.E−04 1.E−04 1.E−05 1.E−05 1.E−06 1.E−06 IR (A) IR (A) 1.E−07 1.E−07 1.E−08 1.E−09 1.E−08 1.E−10 1.E−09 1.E−11 1.E−10 1.E−12 1.E−11 −8 −7 −6 −5 −4 −3 −2 −1 0 1 2 3 4 5 6 7 8 1.E−13 −8 −7 −6 −5 −4 −3 −2 −1 0 1 VR (V) 2 3 4 5 VR (V) Figure 7. Breakdown Voltage Figure 8. Reverse Leakage Current www.onsemi.com 3 6 7 8 ESDL2031 S21 (dB) TYPICAL CHARACTERISTICS 0 −0.2 −0.4 −0.6 −0.8 −1.0 −1.2 −1.4 −1.6 −1.8 −2.0 −2.2 −2.4 −2.6 −2.8 −3.0 1.E+07 m1 m3 m5 m2 m4 m6 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz) Figure 9. Insertion Loss Interface Data Rate (Gb/s) Fundamental Frequency (GHz) 3rd Harmonic Frequency (GHz) USB 3.0 5 2.5 (m1) 7.5 (m2) m1 = −0.23 m2 = −0.81 USB 3.1 10 5.0 (m3) 15 (m4) m3 = −0.53 m4 = −1.47 HDMI 2.1 12 6.0 (m5) 18 (m6) m5 = −0.65 m6 = −1.82 Ipp - PEAK PULSE CURRENT - %Ipp Figure 10. ESDL2031 Insertion Loss tr = rise time to peak value [8 ms] tf = decay time to half value [20 ms] Peak Value 100 Half Value 50 0 0 tr tf TIME (ms) Figure 11. 8 X 20 ms Pulse Waveform www.onsemi.com 4 ESDL2031 Insertion Loss (dB) ESDL2031 IEC61000−4−2 Waveform IEC 61000−4−2 Spec. Ipeak Level Test Voltage (kV) First Peak Current (A) Current at 30 ns (A) Current at 60 ns (A) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 100% 90% I @ 30 ns I @ 60 ns 10% tP = 0.7 ns to 1 ns Figure 12. IEC61000−4−2 Spec Transmission Line Pulse (TLP) Measurement L Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in Figure 13. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10s of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 14 where an 8 kV IEC 61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP I−V curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. 50 W Coax Cable S Attenuator ÷ 50 W Coax Cable 10 MW IM VM DUT VC Oscilloscope Figure 13. Simplified Schematic of a Typical TLP System Figure 14. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms www.onsemi.com 5 ESDL2031 ORDERING INFORMATION Device ESDL2031MX4T5G Package Shipping† X4DFN2 (0201) (Pb−Free) 10,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. HDMI is a registered trademark of HDMI Licensing, LLC. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS X4DFN2, 0.60x0.30, 0.36P CASE 152AX ISSUE G SCALE 8:1 D PIN 1 INDICATOR ÈÈ DATE 12 APR 2019 A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. E DIM A A1 b D E e L TOP VIEW A 0.02 C A1 GENERIC MARKING DIAGRAM* 0.01 C C SIDE VIEW MILLIMETERS MIN NOM MAX 0.175 0.200 0.225 0.018 REF 0.205 0.215 0.225 0.575 0.600 0.625 0.275 0.300 0.325 0.36 BSC 0.145 0.155 0.165 SEATING PLANE X e X b X = Specific Device Code 1 0.05 M 2X L C A B 0.05 M C A B BOTTOM VIEW *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. Some products may not follow the Generic Marking. RECOMMENDED SOLDER FOOTPRINT* 0.65 2X 1 2X 0.27 0.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON06808G X4DFN2, 0.60x0.30, 0.36P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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