FAN48610BUC45X

FAN48610 Fixed-Output Synchronous Regulator, TINYBOOST), 2.5 MHz Description www.onsemi.com The FAN48610 is a low-power boost regulator designed to provide a minimum voltage-regulated rail from a standard single-cell Li-Ion battery and advanced battery chemistries. Even below the minimum system battery voltage, the device maintains the output voltage regulation for a minimum output load current of 1.0 A. The combination of built-in power transistors, synchronous rectification, and low supply current suit the FAN48610 for battery-powered applications. The FAN48610 is available in a 9-bump, 0.4 mm pitch, Wafer-Level Chip-Scale Package (WLCSP). WLCSP9 CASE 567QW MARKING DIAGRAM Features • • • • • • • • • • • XX&K &.&2&Z Input Voltage Range: 2.5 V to 4.8 V Output Voltages Range: 3.0 V to 5.0 V IOUT ≥ 1 A at VOUT = 5.0 V, VIN ≥ 2.5 V IOUT ≥ 1.5 A at VOUT = 5.0 V, VIN ≥ 3.0 V Up to 94% Efficient Internal Synchronous Rectification Soft-Start with True Load Disconnect Short-Circuit Protection 9-Bump, 1.215 mm × 1.215 mm, 0.4 mm Pitch WLCSP Three External Components: 2016 0.47 mH Inductor, 0603 Case Size Input / Output Capacitors Total Application Board Solution Size: < 11 mm2 XX &K &. &2 &Z = KA / KF / KN = Lot Code = Alphabetical Year Code = Numeric Date Code = Assembly Plant Code PIN ASSIGNMENT VOUT A1 VIN A2 SW Applications • Class-D Audio Amplifier and USB OTG Supply • Boost for Low-Voltage Li-Ion Batteries • Smart Phones, Tablets, Portable Devices, Wearables B1 EN B2 PGND C1 A3 B3 AGND C2 C3 (Top View) VIN + CIN COUT 10 mF L1 Battery VOUT FAN48610 0.47 mH 22 mF SW PGND EN AGND SYSTEM LOAD ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Figure 1. Typical Application © Semiconductor Components Industries, LLC, 2013 July, 2018 − Rev. 2 1 Publication Order Number: FAN48610/D FAN48610 Table 1. ORDERING INFORMATION Part Number FAN48610UC50X VOUT Operating Temperature Package Packing† Device Marking 5.0 V −40°C to 85°C WLCSP, 0.4 mm Pitch Tape and Reel KF FAN48610BUC50X (Note 1) FAN48610BUC45X (Note 1) 4.5 V KA FAN48610BUC33X (Note 1) 3.3 V KN †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1. Includes backside lamination. BLOCK DIAGRAM SW Q2A L1 Q2B VOUT VIN CIN PGND EN Q1 Q2 COUT Synchronous Rectifier Control Modulator Logic & Control AGND Figure 2. IC Block Diagram Table 2. RECOMMENDED COMPONENTS Component L1 Description 0.47 mH, 30%, 2016 Ventor Toko: DFE201612C DFR201612C Cyntec: PIFE20161B Parameter Typ. Unit L 0.47 mH DCR (Series R) 40 mW CIN 10 mF, 10%, 6.3 V, X5R, 0603 Murata: GRM188R60J106K TDK: C1608X5R0J106K C 10 mF COUT 22 mF, 20%, 6.3 V, X5R, 0603 TDK: C1608X5R0J226M C 22 mF www.onsemi.com 2 FAN48610 PIN CONFIGURATION VOUT A1 A2 SW VIN A3 A2 A1 B3 B3 B2 B1 AGND C3 C3 C2 C1 A3 EN B1 B2 C1 PGND C2 Figure 3. Top View Figure 4. Bottom View Table 3. PIN DEFINITIONS Pin # Name A1, A2 VOUT Description A3 VIN Input Voltage. Connect to Li-Ion battery input power source and the bias supply for the gate drivers. B1, B2 SW Switching Node. Connect to inductor. Enable. When this pin is HIGH, the circuit is enabled. Output Voltage. This pin is the output voltage terminal; connect directly to COUT. B3 EN C1, C2 PGND Power Ground. This is the power return for the IC. COUT capacitor should be returned with the shortest path possible to these pins. C3 AGND Analog Ground. This is the signal ground reference for the IC. All voltage levels are measured with respect to this pin – connect to PGND at a single point. Table 4. ABSOLUTE MAXIMUM RATINGS Symbol VIN VOUT SW Parameter Voltage on VIN Pin Min. Max. Unit −0.3 6.0 V 6.0 V V Voltage on VOUT Pin SW Node VCC Voltage on Other Pins ESD Electrostatic Discharge Protection Level DC −0.3 6.0 Transient: 10 ns, 3 MHz −1.0 8.0 −0.3 6.0 (Note 2) Human Body Model per JESD22−A114 2 Charged Device Model per JESD22−C101 1 V kV TJ Junction Temperature −40 +150 °C TSTG Storage Temperature −65 +150 °C +260 °C TL Lead Soldering Temperature, 10 Seconds Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. Lesser of 6.0 V or VIN + 0.3 V. www.onsemi.com 3 FAN48610 Table 5. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min. Max. Unit 2.5 4.8 V VIN Supply Voltage IOUT Maximum Output Current 1000 TA Ambient Temperature –40 +85 °C TJ Junction Temperature –40 +125 °C mA Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Table 6. THERMAL PROPERTIES Symbol qJA Parameter Typical Unit 50 °C/W Junction-to-Ambient Thermal Resistance Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA. Table 7. ELECTRICAL CHARACTERISTICS (Recommended operating conditions, unless otherwise noted, circuit per Figure 1, VOUT= 3.0 V to 5.0 V, VIN = 2.5 V to 4.5 V, TA = −40°C to 85°C. Typical values are given VIN = 3.6 V and TA = 25°C) Parameter Symbol Conditions Min. Typ. Max. Unit VIN = 3.6 V, IOUT = 0 A, EN = VIN 85 125 mA Shutdown: EN = 0, VIN = 3.6 V 3 10 2.2 2.3 POWER SUPPLY IQ VIN Quiescent Current VUVLO Under-Voltage Lockout VUVLO_HYS Under-Voltage Lockout Hysteresis VIN Rising 150 V mV INPUTS VIH Enable HIGH Voltage VIL Enable LOW Voltage IPD Current Sink Pull-Down EN Pin, Logic HIGH Low-State Active Pull-Down EN Pin, Logic LOW 200 Output Voltage Accuracy DC (Note 3) Referred to VOUT, 2.5 V ≤ VIN ≤ VOUT −150 mV −2 ILK_OUT VIN-to-VOUT Leakage Current VOUT = 0, EN = 0, VIN = 4.2 V ILK VOUT-to-VIN Reverse Leakage Current VOUT = 5.0 V, EN = 0, VIN = 2.5 V Output Voltage Accuracy Transient (Note 4) Referred to VOUT, 50−500 mA Load Step −5 fSW Switching Frequency VIN = 3.6 V, VOUT = 5.0 V, Load = 1000 mA 2.0 tSS Soft-Start EN HIGH to Regulation (Note 4) 50 W Load, VOUT = 5.0 V tRST FAULT Restart Timer (Note 4) RLOW 1.05 V 0.4 100 300 V nA 400 kW 4 % 1 mA 3.5 mA 5 % 3.0 MHz OUTPUTS VREG VTRSP TIMING www.onsemi.com 4 2.5 600 mA 20 ms FAN48610 Table 7. ELECTRICAL CHARACTERISTICS (continued) (Recommended operating conditions, unless otherwise noted, circuit per Figure 1, VOUT= 3.0 V to 5.0 V, VIN = 2.5 V to 4.5 V, TA = −40°C to 85°C. Typical values are given VIN = 3.6 V and TA = 25°C) Symbol Parameter Conditions Min. Typ. Max. Unit POWER STAGE RDS(ON)N N-Channel Boost Switch RDS(ON) VIN = 3.6 V, VOUT = 5.0 V 80 130 mW RDS(ON)P P-Channel Sync. Rectifier RDS(ON) VIN = 3.6 V, VOUT = 5.0 V 65 115 mW Boost Valley Current Limit VOUT = 5.0 V 3.0 A IV_LIM_SS Boost Soft-Start Valley Current Limit VIN < VOUT < VOUT_TARGET, SS Mode 1.7 A VMIN_1.0A Minimum VIN for 1000 mA Load (Note 4) VOUT = 5.0 V 2.5 V VMIN_1.5A Minimum VIN for 1500 mA Load (Note 4) VOUT = 5.0 V 3.0 V IV_LIM T150T Over-Temperature Protection (OTP) 150 °C T150H OTP Hysteresis 20 °C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. DC ILOAD from 0 to 1 A. VOUT measured from mid-point of output voltage ripple. Effective capacitance of COUT > 3 mF. 4. Guaranteed by design and characterization; not tested in production. www.onsemi.com 5 FAN48610 TYPICAL CHARACTERISTICS 96% 96% 92% 92% 88% 88% Efficiency Efficiency (Unless otherwise specified; VIN = 3.6 V, VOUT = 5.0 V, TA = 25°C, and circuit and components according to Figure 1) 84% 84% 2.6 VIN 80% 3.0 VIN −40C 80% 3.6 VIN +25C 4.2 VIN 76% 1 10 100 +85C 76% 1000 1 10 Load Current (mA) 100 1000 Load Current (mA) Figure 5. Efficiency vs. Load Current and Input Voltage Figure 6. Efficiency vs. Load Current and Temperature 98% 96% 94% Efficiency Efficiency 92% 88% 90% 86% 84% −40C 82% 2.5 VIN +25C 2.7 VIN +85C 3.0 VIN 78% 80% 10 100 10 1000 1000 Load Current (mA) Load Current (mA) Figure 7. Efficiency vs. Load Current and Input Voltage, VOUT = 3.3 V Figure 8. Efficiency vs. Load Current and Temperature, VIN = 3.0 V, VOUT = 3.3 V 2 3 Output Regulation (%) 2 Output Regulation (%) 100 1 0 2.6 VIN 3.0 VIN −1 1 0 −1 −40C 3.6 VIN +25C 4.2 VIN −2 0 250 500 750 +85C −2 1000 0 Load Current (mA) 250 500 750 1000 Load Current (mA) Figure 9. Output Regulation vs. Load Current and Input Voltage (Normalized to 3.6 VIN, 500 mA Load) Figure 10. Output Regulation vs. Load Current and Temperature (Normalized to 3.6 VIN, 500 mA Load, TA = 255C) www.onsemi.com 6 FAN48610 TYPICAL CHARACTERISTICS 120 60 100 50 Output Ripple (mVpp) Input Current ( A) (Unless otherwise specified; VIN = 3.6 V, VOUT = 5.0 V, TA = 25°C, and circuit and components according to Figure 1) 80 60 40 −40C Auto 20 2.5 3.0 3.5 4.0 20 2.6 VIN 3.0 VIN 3.6 VIN 4.2 VIN +85C Auto 2.0 30 10 +25C Auto 0 40 0 0 4.5 250 500 750 1000 Input Voltage (V) Load Current (mA) Figure 11. Quiescent Current vs. Input Voltage, Temperature Figure 12. Output Ripple vs. Load Current and Input Voltage 3,000 Switching Frequency (KHz) 2,500 2,000 1,500 1,000 2.6 VIN 3.0 VIN 500 3.6 VIN 4.2 VIN 0 0 250 500 750 1000 Load Current (mA) Figure 13. Frequency vs. Load Current and Input Voltage Figure 14. Startup, 50 W Load Figure 15. Overload Protection Figure 16. Load Transient, 100−500 mA, 100 ns Edge www.onsemi.com 7 FAN48610 TYPICAL CHARACTERISTICS (Unless otherwise specified; VIN = 3.6 V, VOUT = 5.0 V, TA = 25°C, and circuit and components according to Figure 1) Figure 17. Load Transient, 500−1000 mA, 100 ns Edge Figure 18. Simultaneous Line / Load Transient, 3.3 −3.9 VIN, 10 ms Edge, 500−1000 mA Load, 100 ns Edge Maximum Output Current (A) 2.60 2.20 1.80 1.40 1.00 +25C +85C 0.60 2.5 3.0 3.5 4.0 4.5 Input Voltage (V) Figure 19. Line Transient, 3.3−3.9 VIN, 10 ms Edge, 500 mA Load Figure 20. Typical Maximum Output Current vs. Input Voltage www.onsemi.com 8 FAN48610 CIRCUIT DESCRIPTION Boost Mode Regulation FAN48610 is a synchronous boost regulator, typically operating at 2.5 MHz in Continuous Conduction Mode (CCM), which occurs at moderate to heavy load current and low VIN voltages. The regulator’s Pass-Through Mode automatically activates when VIN is above the boost regulator’s set point. The FAN48610 uses a current-mode modulator to achieve excellent transient response and smooth transitions between CCM and DCM operation. During CCM operation, the device maintains a switching frequency of about 2.5 MHz. In lightload operation (DCM), frequency is naturally reduced to maintain high efficiency. Table 8. OPERATING MODES LIN Linear Startup SS Boost Soft-Start BST PT Shutdown and Startup Description Mode When EN is LOW, all bias circuits are off and the regulator is in Shutdown Mode. During shutdown, current flow is prevented from VIN to VOUT, as well as reverse flow from VOUT to VIN. It is recommended to keep load current draw below 500 mA until the devices successfully executes startup. The following table describes the startup sequence. Invoked When: VIN > VOUT VIN < VOUT < VOUT(TARGET) Boost Operating Mode Pass-Through Mode VOUT= VOUT(TARGET) VIN > VOUT(TARGET) Table 9. BOOST STARTUP SEQUENCE Start Mode Entry Exit End Mode LIN1 VIN > VUVLO, EN = 1 VOUT > VIN − 300 mV SS TIMEOUT LIN2 VOUT > VIN − 300 mV SS TIMEOUT FAULT VOUT = VOUT(TARGET) BST OVERLOAD TIMEOUT FAULT LIN2 SS LIN1 Exit LIN1 or LIN2 Exit Timeout (ms) 512 1024 64 LIN Mode Pass-Through (PT) Mode When EN is HIGH and VIN > VUVLO, the regulator first attempts to bring VOUT within 300 mV of VIN by using the internal fixed-current source from VIN (Q2). The current is limited to the LIN1 set point. If VOUT reaches VIN − 300 mV during LIN1 Mode, the SS Mode is initiated. Otherwise, LIN1 times out after 512 ms and LIN2 Mode is entered. In LIN2 Mode, the current source is incremented to 1.6 A. If VOUT fails to reach VIN − 300 mV after 1024 ms, a fault condition is declared and the device waits 20 ms to attempt an automatic restart. In normal operation, the device automatically transitions from Boost Mode to Pass-Through Mode if VIN goes above the target VOUT. In Pass-Through Mode, the device fully enhances Q2 to provide a very low impedance path from VIN to VOUT. Entry to the Pass-Through Mode is triggered by condition where VIN > VOUT and no switching has occurred during the past 5 ms. To soften the entry into Pass-Through Mode, Q2 is driven as a linear current source for the first 5 ms. Pass-Through Mode exit is triggered when VOUT reaches the target VOUT voltage. During Automatic Pass-Through Mode, the device is short-circuit protected by a voltage comparator tracking the voltage drop from VIN to VOUT; if the drop exceeds 300 mV, a fault is declared. Soft−Start (SS) Mode Upon the successful completion of LIN Mode (VOUT ≥ VIN − 300 mV), the regulator begins switching with boost pulses current limited to 50% of nominal level. During SS Mode, if VOUT fails to reach regulation during the SS ramp sequence for more than 64 ms, a fault is declared. If large COUT is used, the reference is automatically stepped slower to avoid excessive input current draw. Fault State The regulator enters Fault State under any of the following conditions: • VOUT fails to achieve the voltage required to advance from LIN Mode to SS Mode. • VOUT fails to achieve the voltage required to advance from SS Mode to BST Mode. • Boost current limit triggers for 2 ms during BST Mode. Boost (BST) Mode This is a normal operating mode of the regulator. www.onsemi.com 9 FAN48610 • VIN – VOUT > 300 mV; this fault can occur only after • Over-Temperature The regulator shuts down if the die temperature exceeds 150°C. Restart occurs when the IC has cooled by approximately 20°C. successful completion of the soft-start sequence. VIN < VUVLO. Once a fault is triggered, the regulator stops switching and presents a high-impedance path between VIN and VOUT. After waiting 20 ms, an automatic restart is attempted. APPLICATION INFORMATION Output Capacitance (COUT) additional capacitance on the VOUT line. If the output fails to achieve regulation within the limits described in the Soft-Start section above, a fault occurs, causing the circuit to shut down. It waits about 20 ms before attempting a restart. If the total combined output capacitance is very high, the circuit may not start on the first attempt, but eventually achieves regulation if no load is present. If a high current load and high capacitance are both present during soft-start, the circuit may fail to achieve regulation and continually attempt soft-start, only to have the output capacitance discharged by the load when in Fault State. The effective capacitance (CEFF (Note 5)) of small, high-value ceramic capacitors decreases as their bias voltage increases, as illustrated in the graph below: 25 Capacitance ( F) 20 15 10 Output Voltage Ripple Output voltage ripple is inversely proportional to COUT. During tON, when the boost switch is on, all load current is supplied by COUT. 5 0 0 1 2 3 4 5 6 V RIPPLE(P*P) + t ON @ DC Bias Voltage (V) Figure 21. CEFF for 22 mF, 0603, X5R, 6.3 V-Rated Capacitor (TDK C1608X5R0J226M) And VIN (V) ILOAD (mA) CEFF(MIN) (mF) 5.0 2.5 to 4.5 0 to 1000 3.0 ǒ V RIPPLE(P*P) + t SW @ 1 * Table 10. MINIMUM CEFF REQUIRED FOR STABILITY VOUT (V) ǒ therefore: t SW + 1 f SW (eq. 1) C OUT t ON + t SW @ D + t SW @ 1 * FAN48610 is guaranteed for stable operation with the minimum value of CEFF (CEFF(MIN)) outlined in Table 10. Operating Conditions I LOAD V IN V OUT V IN V OUT Ǔ @ Ǔ I LOAD C OUT (eq. 2) (eq. 3) (eq. 4) The maximum VRIPPLE occurs when VIN is minimum and ILOAD is maximum. For better ripple performance, more output capacitance can be added. 5. CEFF varies by manufacturer, capacitor material, and case size. 6. CEFF、  。 Introduction Selection Layout Recommendations Recommended nominal inductance value is 0.47 mH. The FAN48610 employs valley-current limiting, so peak inductor current can reach 3.8 A for a short duration during overload conditions. Saturation effects cause the inductor current ripple to become higher under high loading, as only the valley of the inductor current ripple is controlled. The layout recommendations below highlight various topcopper pours by using different colors. To minimize spikes at VOUT, COUT must be placed as close as possible to PGND and VOUT, as shown below. For thermal reasons, it is suggested to maximize the pour area for all planes other than SW. Especially the ground pour should be set to fill all available PCB surface area and tied to internal layers with a cluster of thermal vias. Startup Input current limiting is in effect during soft-start, which limits the current available to charge COUT and any www.onsemi.com 10 FAN48610 Figure 22. Layout Recommendation PRODUCT-SPECIFIC DIMENSIONS (This table pertains to the package information on the following page.) D E X Y 1.215 ±0.030 mm 1.215 ±0.030 mm 0.2075 mm 0.2075 mm TINYBOOST is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 11 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP9 1.215x1.215x0.581 CASE 567QW ISSUE O DATE 31 OCT 2016 DOCUMENT NUMBER: STATUS: 98AON13355G ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 http://onsemi.com WLCSP9 1.215x1.215x0.581 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. 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