DATA SHEET
www.onsemi.com
High- and Low-Side Gate
Driver
SOIC8
(8−SOP)
CASE 751EG
FAN7842
Description
The FAN7842, a monolithic high and low side gate drive IC, which
can drive MOSFETs and IGBTs that operate up to +200 V.
onsemi’s high−voltage process and common−mode noise canceling
technique provide stable operation of the high−side driver under
high−dv/dt noise circumstances. An advanced level−shift circuit
allows high−side gate driver operation up to VS = −9.8 V (typical) for
VBS = 15 V. The input logic level is compatible with standard
TTL−series logic gates.
The UVLO circuits for both channels prevent malfunction when
VCC and VBS are lower than the specified threshold voltage. Output
driver current (source/sink) is typically 350 mA/650 mA, respectively.
MARKING DIAGRAM
7842
ALYW
7842
A
L
YW
= Specific Device Code
= Assembly Site
= Wafer Lot Number
= Assembly Start Week
Features
• Floating Channels Designed for Bootstrap Operation to +200 V
• Typically 350 mA/650 mA Sourcing/Sinking Current Driving
•
•
•
•
•
•
•
•
Capability for Both Channels
Common−Mode dv/dt Noise Canceling Circuit
Extended Allowable Negative VS Swing to −9.8 V for Signal
Propagation at VCC = VBS = 15 V
VCC & VBS Supply Range from 10 V to 20 V
UVLO Functions for Both Channels
TTL Compatible Input Logic Threshold Levels
Matched Propagation Delay Below 50 ns
Output In−phase with Input Signal
This Device is Pb−Free, Halide Free and is RoHS Compliant
ORDERING INFORMATION
See detailed ordering and shipping information on page 11 of
this data sheet.
Applications
• Battery Based Motor Applications (E−bike, Power Tool)
• Telecom DC−DC Converter
Related Resources
• AN−6076 − Design and Application Guide of Bootstrap Circuit
•
•
for High−Voltage Gate−Drive IC
AN−9052 − Design Guide for Selection of Bootstrap Components
AN−8102 − Recommendations to Avoid Short Pulse Width Issues
in HVIC Gate Driver Applications
© Semiconductor Components Industries, LLC, 2006
July, 2022 − Rev. 2
1
Publication Order Number:
FAN7842/D
FAN7842
TYPICAL APPLICATION CIRCUIT
600 V
15 V
RBOOT
DBOOT
1 VCC
VB 8
Q1
HIN
2 HIN
HO 7
LIN
3 LIN
VS 6
4 COM
LO 5
R1
R2
CBOOT
Q2
C1
R3
Load
R4
Figure 1. Application Circuit for Half−Bridge
INTERNAL BLOCK DIAGRAM
8
VB
7
HO
6
VS
1
VCC
5
LO
4
COM
UVLO
HS(ON/OFF)
500K
NOISE
CANCELLER
RR
S Q
DRIVER
2
PULSE
GENERATOR
HIN
UVLO
DELAY
3
DRIVER
LS(ON/OFF)
LIN
500K
Figure 2. Functional Block Diagram
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2
FAN7842
PIN ASSIGNMENTS
VCC
1
8
VB
HIN
2
7
HO
LIN
3
6
VS
COM
4
5
LO
Figure 3. Pin Configuration (Top View)
PIN DEFINITIONS
Name
Description
VCC
Low−Side Supply Voltage
HIN
Logic Input for High−Side Gate Driver Output
LIN
Logic Input for Low−Side Gate Driver Output
COM
Logic Ground and Low−Side Driver Return
LO
Low−Side Driver Output
VS
High−Voltage Floating Supply Return
HO
High−Side Driver Output
VB
High−Side Floating Supply
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3
FAN7842
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VS
High−side Offset Voltage
VB
High−side Floating Supply Voltage
Min
Max
Unit
VB − 25
VB + 0.3
V
−0.3
225
VS − 0.3
VB + 0.3
VHO
High−side Floating Output Voltage HO
VCC
Low−side and Logic Fixed Supply Voltage
−0.3
25
VLO
Low−side Output Voltage LO
−0.3
VCC + 0.3
VIN
Logic Input Voltage (HIN, LIN)
−0.3
VCC + 0.3
VCC − 25
VCC + 0.3
Allowable Offset Voltage Slew Rate
−
50
V/ns
Power Dissipation
−
0.625
W
qJA
Thermal Resistance, Junction−to−ambient
−
200
°C/W
TJ
Junction Temperature
−
150
°C
TSTG
Storage Temperature
−
150
°C
COM
Logic Ground
dVS/dt
PD (Note 1)
(Note 2) (Note 3)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted on 76.2 x 114.3 x 1.6 mm PCB (FR−4 glass epoxy material).
2. Refer to the following standards:
JESD51−2: Integral circuits thermal test method environmental conditions − natural convection
JESD51−3: Low effective thermal conductivity test board for leaded surface mount packages
3. Do not exceed PD under any circumstances.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
VB
High−side Floating Supply Voltage
VS + 10
VS + 20
VS
High−side Floating Supply Offset Voltage
6 − VCC
200
VHO
High−side (HO) Output Voltage
VS
VB
VLO
Low−side (LO) Output Voltage
COM
VCC
VIN
Logic Input Voltage (HIN, LIN)
COM
VCC
VCC
Low−side Supply Voltage
10
20
Ambient Temperature
−40
125
TA
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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4
FAN7842
ELECTRICAL CHARACTERISTICS (VBIAS (VCC, VBS) = 15.0 V, TA = 25°C, unless otherwise specified. The VIN and IIN parameters are
referenced to COM. The VO and IO parameters are referenced to VS and COM and are applicable to the respective outputs HO and LO.)
Symbol
Characteristics
Test Condition
Min
Typ
Max
Unit
V
VCCUV+
VBSUV+
VCC and VBS Supply Under−voltage Positive
Going Threshold
8.2
9.2
10.0
VCCUV−
VBSUV−
VCC and VBS Supply Under−voltage Negative
Going Threshold
7.6
8.7
9.6
VCCUVH
VBSUVH
VCC Supply Under−voltage Lockout Hysteresis
−
0.6
−
ILK
Offset Supply Leakage Current
VB = VS = 200 V
−
−
50
IQBS
Quiescent VBS Supply Current
VIN = 0 V or 5 V
−
45
120
IQCC
Quiescent VCC Supply Current
VIN = 0 V or 5 V
−
70
180
IPBS
Operating VBS Supply Current
fIN = 20 kHz, rms value
−
−
600
IPCC
Operating VCC Supply Current
fIN = 20 kHz, rms value
−
−
600
VIH
Logic “1” Input Voltage
2.9
−
−
VIL
Logic “0” Input Voltage
−
−
0.8
VOH
High−level Output Voltage, VBIAS−VO
−
−
1.0
VOL
Low−level Output Voltage, VO
−
−
0.6
IIN+
Logic “1” Input Bias Current
VIN = 5 V
−
10
20
IIN−
Logic “0” Input Bias Current
VIN = 0 V
−
1.0
2.0
IO+
Output High Short−circuit Pulsed Current
VO = 0 V, VIN = 5 V with PW < 10 ms
250
350
−
IO−
Output Low Short−circuit Pulsed Current
VO = 15 V, VIN = 0 V with PW < 10 ms
500
650
−
VS
Allowable Negative VS Pin Voltage for HIN
Signal Propagation to HO
−
−9.8
−7.0
IO = 20 mA
mA
mA
V
mA
mA
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
DYNAMIC ELECTRICAL CHARACTERISTICS (VBIAS (VCC, VBS) = 15.0 V, VS = COM, CL = 1000 pF and, TA = 25°C, unless
otherwise specified.)
Symbol
Characteristics
Test Condition
Min
Typ
Max
Unit
ton
Turn−on Propagation Delay
VS = 0 V
100
170
300
ns
toff
Turn−off Propagation Delay
VS = 0 V or 200 V (Note 4)
100
200
300
ns
tr
Turn−on Rise Time
20
60
140
ns
tf
Turn−off Fall Time
−
30
80
ns
Delay Matching, HS & LS Turn−on/off
−
−
50
ns
MT
4. This parameter guaranteed by design.
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5
FAN7842
TYPICAL CHARACTERISTICS
250
300
VCC = VBS
COM = 0 V
CL = 1 nF
TA = 25°C
200
Turn−On Propagation Delay (ns)
Turn−On Propagation Delay (ns)
300
High−Side
150
Low−Side
100
10
12
14
16
18
275
250
225
High−Side
200
175
Low−Side
150
125
100
75
50
−40
20
VCC = VBS = 15 V
COM = 0 V
CL = 1 nF
−20
0
Supply Voltage (V)
300
VCC = VBS
COM = 0 V
CL = 1 nF
TA = 25°C
260
240
High−Side
200
Low−Side
160
140
120
100
10
12
14
16
18
275
64
Turn−On Raising Time (ns)
Turn−On Raising Time (ns)
56
54
Low−Side
High−Side
46
44
11
12
13
14
15
16
High−Side
Low−Side
200
175
150
−20
0
20
40
60
80
100
120
Figure 7. Turn−Off Propagation Delay vs.
Temperature
VCC = VBS
COM = 0 V
CL = 1 nF
TA = 25°C
60
58
42
10
120
Temperature (°C)
62
48
100
225
125
−40
20
Figure 6. Turn−Off Propagation Delay vs.
Supply Voltage
50
80
VCC = VBS = 15 V
COM = 0 V
CL = 1 nF
250
Supply Voltage (V)
52
60
Figure 5. Turn−On Propagation Delay vs.
Temperature
Turn−Off Propagation Delay (ns)
Turn−Off Propagation Delay (ns)
300
280
180
40
Temperature (°C)
Figure 4. Turn−On Propagation Delay vs.
Supply Voltage
220
20
17
18
19
20
80
VCC = VBS = 15 V
75
70
COM = 0 V
65
CL = 1 nF
60
55
50
Low−Side
45
40
High−Side
35
30
25
20
15
10
5
0
−40 −20
0
20
40
60
80 100
Supply Voltage (V)
Temperature (°C)
Figure 8. Turn−On Rising Time vs. Supply Voltage
Figure 9. Turn−On Rising Time vs. Temperature
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6
120
FAN7842
TYPICAL CHARACTERISTICS (CONTINUED)
50
VCC = VBS
COM = 0 V
CL = 1 nF
TA = 25°C
32
30
28
45
Turn−Off Falling Time (ns)
Turn−Off Falling Time (ns)
34
High−Side
26
24
Low−Side
22
20
18
40
VCC = VBS = 15 V
COM = 0 V
CL = 1 nF
35
High−Side
30
Low−Side
25
20
15
16
10
11
12
13
14
15
16
17
18
19
10
−40
20
−20
0
Supply Voltage (V)
20
40
60
80
100
120
Temperature (°C)
Figure 10. Turn−Off Falling Time vs. Supply Voltage
Figure 11. Turn−Off Falling Time vs. Temperature
440
VCC = VBS
COM = 0 V
LO = HO = 0 V
TA = 25°C
500
450
Output Sourcing Current (mA)
Output Sourcing Current (mA)
600
550
400
350
High−Side
300
Low−Side
250
200
150
100
10
VCC = VBS = 15 V
COM = 0 V
LO = HO = 0 V
420
400
380
High−Side
360
Low−Side
340
320
300
280
12
14
16
18
20
−40
−20
0
Supply Voltage (V)
40
60
80
100
120
Temperature (°C)
Figure 12. Output Sourcing Current vs.
Supply Voltage
Figure 13. Output Sourcing Current vs. Temperature
900
850
VCC = VBS
COM = 0 V
LO = VCC, HO = VB
TA = 25°C
800
700
Low−Side
600
Output Sinking Current (mA)
Output Sinking Current (mA)
20
High−Side
500
400
300
10
VCC = VBS = 15 V
COM = 0 V
LO = VCC, HO = VB
800
750
700
High−Side
650
Low−Side
600
550
500
12
14
16
18
−20
20
Supply Voltage (V)
0
20
40
60
80
100
120
Temperature (°C)
Figure 14. Output Sinking Current vs.
Supply Voltage
Figure 15. Output Sinking Current vs. Temperature
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7
FAN7842
−4
Allowable Negative VS Voltage for
Signal Propagation to High−Side (V)
Allowable Negative VS Voltage for
Signal Propagation to High−Side (V)
TYPICAL CHARACTERISTICS (CONTINUED)
VCC = VBS
COM = 0 V
TA = 25°C
−6
−8
−10
−12
−14
−16
−18
10
12
14
16
18
20
−9.0
−9.2
VCC = VBS = 15 V
COM = 0 V
−9.4
−9.6
−9.8
−10.0
−10.2
−10.4
−40
−20
0
Supply Voltage (V)
40
60
80
100
120
Temperature (°C)
Figure 16. Allowable Negative VS Voltage for Signal
Propagation to High Side vs. Supply Voltage
Figure 17. Allowable Negative VS Voltage for Signal
Propagation to High Side vs. Temperature
95
100
VBS = 15 V
COM = 0 V
HIN = LIN = 0 V
TA = 25°C
VCC = VBS = 15 V
COM = 0 V
HIN = LIN = 0 V
90
85
80
IQCC (mA)
80
IQCC (mA)
20
60
40
75
70
65
60
55
20
50
45
−40
0
0
5
10
15
20
−20
0
Supply Voltage (V)
20
40
60
80
100
120
Temperature (°C)
Figure 18. IQCC vs. Supply Voltage
Figure 19. IQCC vs. Temperature
80
60
VCC = 15 V
COM = 0 V
HIN = LIN = 0 V
50
48
50
IQBS (mA)
IQBS (mA)
52
VCC = 15 V
COM = 0 V
HIN = LIN = 0 V
TA = 25°C
70
40
30
46
44
42
40
20
38
10
36
0
0
5
10
15
20
−40
Supply Voltage (V)
−20
0
20
40
60
80
Temperature (°C)
Figure 20. IQBS vs. Supply Voltage
Figure 21. IQBS vs. Temperature
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8
100
120
FAN7842
TYPICAL CHARACTERISTICS (CONTINUED)
0.60
0.7
VCC = VBS
COM = 0 V
HIN = LIN = 5 V
IL = 20 mA
TA = 25°C
0.5
0.50
VOH (V)
VOH (V)
0.6
0.55
High−Side
0.4
VCC = VBS = 15 V
COM = 0 V
HIN = LIN = 5 V
IL = 20 mA
0.45
Low−Side
0.40
High−Side
Low−Side
0.35
0.3
0.30
0.2
10
12
14
16
18
0.25
−40
20
−20
0
20
Supply Voltage (V)
0.22
0.20
0.18
VOL (V)
VOL (V)
0.16
80
100
120
Figure 23. High−Level Output Voltage vs.
Temperature
VCC = VBS
COM = 0 V
HIN = LIN = 0 V
IL = 20 mA
TA = 25°C
0.17
60
Temperature (°C)
Figure 22. High−Level Output Voltage vs.
Supply Voltage
0.18
40
0.15
High−Side
VCC = VBS = 15 V
COM = 0 V
HIN = LIN = 0 V
IL = 20 mA
High−Side
0.16
Low−Side
0.14
0.14
0.12
Low−Side
0.13
0.10
0.12
10
12
14
16
18
20
−40
−20
0
20
Supply Voltage (V)
Figure 24. Low−Level Output Voltage vs.
Supply Voltage
60
80
100
120
Figure 25. Low−Level Output Voltage vs.
Temperature
16
40
VCC = VBS
COM = 0 V
IN = VCC or IN = 0 V
TA = 25°C
30
HIN = LIN = 5 V
14
IN+/IN− (mA)
35
IN+/IN− (mA)
40
Temperature (°C)
25
IN+
20
15
12
LIN
10
HIN
8
10
6
5
IN−
0
0
5
10
15
4
−40
20
Supply Voltage (V)
−20
0
20
40
60
80
100
Temperature (°C)
Figure 26. Input Bias Current vs. Supply Voltage
Figure 27. Input Bias Current vs. Temperature
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9
120
FAN7842
10.0
10.0
9.8
9.8
9.6
9.6
VSBUV+/VSBUV+ (V)
VCCUV+/VCCUV+ (V)
TYPICAL CHARACTERISTICS (CONTINUED)
VCCUV+
9.4
9.2
9.0
VCCUV−
8.8
8.6
9.2
9.0
8.6
8.4
8.2
8.2
−20
0
20
40
60
80
100
8.0
−40
120
Temperature (°C)
Input Logic Threshold Voltage (V)
VB−to−COM = 650 V
ILK (mA)
4
3
2
1
0
20
40
60
0
20
40
60
80
100
120
Figure 29. VBS UVLO Threshold Voltage vs.
Temperature
5
−20
−20
Temperature (°C)
Figure 28. VCC UVLO Threshold Voltage vs.
Temperature
0
−40
VSBUV−
8.8
8.4
8.0
−40
VSBUV+
9.4
80
100
120
3.4
3.2
3.0
VIN (LIN)
2.8
2.6
2.4
VIH (HIN)
2.2
2.0
VIL (LIN)
1.8
1.6
1.4
1.2
VIL (HIN)
1.0
0.8
0.6
0.4
0.2
0.0
−40 −20
0
20
Temperature (°C)
VCC = VBS = 15 V
COM = 0 V
40
60
80
100
Temperature (°C)
Figure 30. VB to COM Leakage Current vs.
Temperature
Figure 31. Input Logic Threshold Voltage vs.
Temperature
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10
120
FAN7842
TYPICAL CHARACTERISTICS (CONTINUED)
15 V
15 V
100 nF
10 mF
1 VCC
4 COM
VB
8
10 mF
VS
6
100 nF
1 nF
HIN
2 HIN
HO
7
LIN
3 LIN
LO
5
1 nF
Figure 32. Switching Time Test Circuit
Figure 33. Input / Output Timing Diagram
Figure 34. Switching Time Waveform Definition
Figure 35. Delay Matching Waveform Definition
ORDERING INFORMATION
Part Number
FAN7842MX (Note 5)
Package
Operating Temperature Range
Shipping†
SOIC8 (8−SOP)
(Pb−Free, Halide Free)
−40°C~125°C
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
5. These devices passed wave soldering test by JESD22A−111.
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11
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC8
CASE 751EG
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13741G
SOIC8
DATE 30 SEP 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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