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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
FCPF400N80ZL1
N-Channel SuperFET® II MOSFET
800 V, 11 A, 400 mΩ
Features
Description
• Typ. RDS(on) = 340 mΩ
SuperFET® II MOSFET is Fairchild Semiconductor’s brand-new
high voltage super-junction (SJ) MOSFET family that is utilizing
charge balance technology for outstanding low on-resistance
and lower gate charge performance. This technology is tailored
to minimize conduction loss, provide superior switching performance, dv/dt rate and higher avalanche energy. In addition,
internal gate-source ESD diode allows to withstand over 2kV
HBM surge stress. Consequently, SuperFET II MOSFET is very
suitable for the switching power applications such as Audio,
Laptop adapter, Lighting, ATX power and industrial power applications.
• Ultra Low Gate Charge (Typ. Qg = 43 nC)
• Low Eoss (Typ. 4.1 uJ @ 400 V)
• Low Effective Output Capacitance (Typ. Coss(eff.) = 138 pF)
• 100% Avalanche Tested
• RoHS Compliant
• ESD Improved Capability
Applications
• AC-DC Power Supply
• LED Lighting
D
G
D
S
G
TO-220F
S
Absolute Maximum Ratings TC = 25oC unless otherwise noted.
Symbol
VDSS
Drain to Source Voltage
VGSS
Gate to Source Voltage
ID
Drain Current
IDM
Drain Current
EAS
Single Pulsed Avalanche Energy
IAR
Avalanche Current
(Note 1)
2.2
A
EAR
Repetitive Avalanche Energy
(Note 1)
0.36
mJ
dv/dt
Parameter
- DC
±20
- AC
(f >1 Hz)
- Continuous (TC = 25oC)
- Pulsed
±30
11*
- Continuous (TC = 100oC)
6.9*
(TC = 25oC)
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds
- Derate Above 25oC
A
33*
A
339
mJ
(Note 3)
Power Dissipation
V
(Note 1)
100
Peak Diode Recovery dv/dt
Unit
V
(Note 2)
MOSFET dv/dt
PD
TL
FCPF400N80ZL1
800
20
V/ns
35.7
W
0.29
W/oC
-55 to +150
oC
300
o
C
*Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
Parameter
FCPF400N80ZL1
RθJC
Thermal Resistance, Junction to Case, Max.
3.5
RθJA
Thermal Resistance, Junction to Ambient, Max.
62.5
©2014 Fairchild Semiconductor Corporation
FCPF400N80ZL1 Rev. C1
1
Unit
oC/W
www.fairchildsemi.com
FCPF400N80ZL1 — N-Channel SuperFET® II MOSFET
November 2014
Part Number
FCPF400N80ZL1
Top Mark
FCPF400N80ZL1
Package
TO-220F
Packing Method
Tube
Reel Size
N/A
Tape Width
N/A
Quantity
50 units
Electrical Characteristics TC = 25oC unless otherwise noted.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
800
-
-
V
-
0.8
-
V/oC
Off Characteristics
BVDSS
ΔBVDSS
/ ΔTJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
VGS = 0 V, ID = 1 mA, TJ = 25°C
o
ID = 1 mA, Referenced to 25 C
VDS = 800 V, VGS = 0 V
-
-
25
VDS = 640 V, TC = 125oC
-
-
250
VGS = ±20 V, VDS = 0 V
-
-
±10
VGS = VDS, ID = 1.1 mA
2.5
-
4.5
VGS = VDS, ID = 0.68 mA
2.5
-
4.5
VGS = 10 V, ID = 5.5 A
-
0.34
0.4
VGS = 10 V, ID = 7.1 A
-
0.35
0.4
-
0.89
-
-
12
-
μA
μA
On Characteristics
VGS(th)
Gate Threshold Voltage
RDS(on)
Static Drain to Source On Resistance
gFS
Forward Transconductance
VGS = 10 V, ID = 7.1 A, TC = 150oC
VDS = 20 V, ID = 5.5 A
V
Ω
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss
Output Capacitance
VDS = 480 V, VGS = 0 V, f = 1 MHz
Coss(eff.)
Effective Output Capacitance
Qg(tot)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
ESR
Equivalent Series Resistance
-
1770
2350
pF
-
51
70
pF
-
0.5
-
pF
-
28
-
pF
VDS = 0 V to 480 V, VGS = 0 V
-
138
-
pF
VDS = 640 V, ID = 11 A,
VGS = 10 V
-
43
56
nC
-
8.6
-
nC
VDS = 100 V, VGS = 0 V,
f = 1 MHz
(Note 4)
-
17
-
nC
f = 1 MHz
-
2.3
-
Ω
-
20
50
ns
VDD = 400 V, ID = 11 A,
VGS = 10 V, Rg = 4.7 Ω
-
12
34
ns
-
51
112
ns
-
2.6
15
ns
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
(Note 4)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
11
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
33
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0 V, ISD = 11 A
-
-
1.2
V
trr
Reverse Recovery Time
395
-
ns
Qrr
Reverse Recovery Charge
VGS = 0 V, ISD = 11 A,
dIF/dt = 100 A/μs
-
7.4
-
μC
Notes:
1. Repetitive rating: pulse-width limited by maximum junction temperature.
2. IAS = 2.2 A, VDD = 50 V, RG = 25 Ω, starting TJ = 25°C.
3. ISD ≤ 11 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, starting TJ = 25°C.
4. Essentially independent of operating temperature typical characteristics.
©2014 Fairchild Semiconductor Corporation
FCPF400N80ZL1 Rev. C1
2
www.fairchildsemi.com
FCPF400N80ZL1 — N-Channel SuperFET® II MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
50
VGS = 10.0V
8.0V
7.0V
6.5V
6.0V
5.5V
ID, Drain Current[A]
ID, Drain Current[A]
50
10
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
10
o
150 C
o
25 C
*Notes:
1. 250μs Pulse Test
o
-55 C
o
2. TC = 25 C
2
1
10
VDS, Drain to Source Voltage[V]
1
20
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
*Notes:
1. VGS = 0V
0.6
0.5
VGS = 10V
VGS = 20V
0.3
0.2
0
6
12
18
24
ID, Drain Current [A]
30
o
25 C
1
VGS, Gate to Source Voltage [V]
10
Ciss
1000
Capacitances [pF]
o
150 C
100
Coss
*Note:
1. VGS = 0V
2. f = 1MHz
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
0.1
0.1
Crss
1
10
100
VDS, Drain to Source Voltage [V]
©2014 Fairchild Semiconductor Corporation
FCPF400N80ZL1 Rev. C1
0.4
0.6
0.8
1.0
1.2
VSD, Body Diode Forward Voltage [V]
1.4
Figure 6. Gate Charge Characteristics
10000
1
2. 250μs Pulse Test
10
0.1
0.2
35
Figure 5. Capacitance Characteristics
10
7
50
o
*Note: TC = 25 C
0.4
4
5
6
VGS, Gate toSource Voltage[V]
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
IS, Reverse Drain Current [A]
RDS(ON) [Ω],
Drain to Source On-Resistance
0.7
3
3
VDS = 160V
8
VDS = 400V
VDS = 640V
6
4
2
0
1000
*Note: ID = 11A
0
15
30
Qg, Total Gate Charge [nC]
45
www.fairchildsemi.com
FCPF400N80ZL1 — N-Channel SuperFET® II MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
*Notes:
1. VGS = 0V
2. ID = 1mA
RDS(on), [Normalized]
Drain to Source On-Resistance
BVDSS, [Normalized]
Drain to Source Breakdown Voltage
1.2
1.1
1.0
0.9
0.8
-100
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
2.5
*Notes:
1. VGS = 10V
2. ID = 5.5A
2.0
1.5
1.0
0.5
0.0
-100
200
Figure 9. Maximum Safe Operating Area
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
200
Figure 10. Maximum Drain Current
vs. Case Temperature
12
100
10μs
ID, Drain Current [A]
ID, Drain Current [A]
10
100μs
10
1ms
10ms
1
Operation in This Area
is Limited by RDS(on)
DC
*Notes:
0.1
o
1. TC = 25 C
2. TJ = 150 C
3. Single Pulse
1
10
100
VDS, Drain to Source Voltage [V]
6
4
2
o
0.01
0.1
8
0
25
1000
50
75
100
125
o
TC, Case Temperature [ C]
150
Figure 11. Eoss vs. Drain to Source Voltage
12
EOSS, [μJ]
10
8
6
4
2
0
0
200
400
600
VDS, Drain to Source Voltage [V]
©2014 Fairchild Semiconductor Corporation
FCPF400N80ZL1 Rev. C1
800
4
www.fairchildsemi.com
FCPF400N80ZL1 — N-Channel SuperFET® II MOSFET
Typical Performance Characteristics (Continued)
FCPF400N80ZL1 — N-Channel SuperFET® II MOSFET
Typical Performance Characteristics (Continued)
ZθJC(t), Thermal Response [oC/W]
Figure 12. Transient Thermal Response Curve
5
0.5
1
0.2
0.1
PDM
0.05
0.1
t1
0.02
t2
*Notes:
0.01
o
0.01
1. ZθJC(t) = 3.5 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
Single pulse
0.005
-5
10
©2014 Fairchild Semiconductor Corporation
FCPF400N80ZL1 Rev. C1
-4
10
-3
-2
-1
0
10
10
10
10
t1, Rectangular Pulse Duration [sec]
5
1
10
2
10
www.fairchildsemi.com
FCPF400N80ZL1 — N-Channel SuperFET® II MOSFET
IG = const.
Figure 13. Gate Charge Test Circuit & Waveform
VDS
RG
RL
VDS
VDD
VGS
VGS
DUT
V
10V
GS
90%
10%
td(on)
tr
t on
td(off)
tf
t off
Figure 14. Resistive Switching Test Circuit & Waveforms
VGS
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms
©2014 Fairchild Semiconductor Corporation
FCPF400N80ZL1 Rev. C1
6
www.fairchildsemi.com
FCPF400N80ZL1 — N-Channel SuperFET® II MOSFET
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VSD
VDD
Body Diode
Forward Voltage Drop
Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms
©2014 Fairchild Semiconductor Corporation
FCPF400N80ZL1 Rev. C1
7
www.fairchildsemi.com
10.30
9.80
A
2.90
2.50
3.40
3.00
6.60
6.20
3.00
2.60
B
1 X 45°
19.00
17.70
B
15.70
15.00
3.30
2.70 B
1
2.14
10.70
10.30
1.20
1.00
3
2.70
2.30
1.20
0.90 (2X)
0.90
(3X)
0.50
0.50 M
2.74
(2X)
2.34
B
0.60
0.40
A
NOTES:
4.60
4.30
A. EXCEPT WHERE NOTED CONFORMS TO
EIAJ SC91A.
B DOES NOT COMPLY EIAJ STD. VALUE.
C. ALL DIMENSIONS ARE IN MILLIMETERS.
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
E. DIMENSION AND TOLERANCE AS PER ASME
Y14.5-2009.
F. DRAWING FILE NAME: TO220V03REV1
G. FAIRCHILD SEMICONDUCTOR
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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