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FDB8860
N-Channel Logic Level PowerTrench® MOSFET
30V, 80A, 2.6mΩ
Features
Applications
RDS(ON) = 1.9mΩ (Typ), VGS = 5V, ID = 80A
DC-DC Converters
Qg(5) = 89nC (Typ), VGS = 5V
Low Miller Charge
Low QRR Body Diode
UIS Capability (Single Pulse and Repetitive Pulse)
RoHS Compliant
FDB8860 Rev A2
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
1
www.fairchildsemi.com
FDB8860 N-Channel Logic Level PowerTrench® MOSFET
December 2010
Symbol
VDSS
Drain to Source Voltage
Parameter
Ratings
30
Units
V
VGS
Gate to Source Voltage
±20
V
Drain Current
Continuous (VGS = 10V, TC < 163oC)
80
A
80
A
Continuous (VGS = 5V, TC < 162oC)
ID
Continuous (VGS = 10V, TC = 25oC, with RθJA = 43oC/W)
31
A
Figure 4
A
Single Pulse Avalanche Energy (Note 1)
947
mJ
Power Dissipation
254
W
Derate above 25oC
1.7
W/oC
-55 to +175
oC
0.59
oC/W
Pulsed
EAS
PD
TJ, TSTG
Operating and Storage Temperature
Thermal Characteristics
RθJC
Thermal Resistance Junction to Case
RθJA
Thermal Resistance Junction to Ambient (Note 2)
RθJA
2
Thermal Resistance Junction to Ambient TO-263,1in copper pad area
62
o
C/W
43
o
C/W
Package Marking and Ordering Information
Device Marking
FDB8860
Device
FDB8860
Package
TO-263AB
Reel Size
330mm
Tape Width
24mm
Quantity
800units
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
30
-
-
-
V
-
1
-
-
250
±100
nA
V
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 1mA, VGS = 0V
IDSS
Zero Gate Voltage Drain Current
VDS = 24V
VGS = 0V
IGSS
Gate to Source Leakage Current
VGS = ±20V
-
-
VDS = VGS, ID = 250μA
1
1.7
3
ID = 80A, VGS = 10V
-
1.6
2.3
ID = 80A, VGS = 5V
-
1.9
2.6
ID = 80A, VGS = 4.5V
-
2.1
2.7
ID = 80A, VGS = 10V,
TJ = 175°C
-
2.5
3.6
-
9460
12585
pF
-
1710
2275
pF
pF
TJ = 150°C
μA
On Characteristics
VGS(th)
RDS(ON)
Gate to Source Threshold Voltage
Drain to Source On Resistance
mΩ
Dynamic Characteristics
CISS
Input Capacitance
COSS
Output Capacitance
CRSS
Reverse Transfer Capacitance
-
1050
1575
RG
Gate Resistance
f = 1MHz
-
1.8
-
Ω
Qg(TOT)
Total Gate Charge at 10V
VGS = 0V to 10V
-
165
214
nC
-
89
115
nC
-
9.1
12
nC
-
26
-
nC
-
18
-
nC
-
33
-
nC
VDS = 15V, VGS = 0V,
f = 1MHz
Qg(5)
Total Gate Charge at 5V
VGS = 0V to 5V
Qg(TH)
Threshold Gate Charge
VGS = 0V to 1V
Qgs
Gate to Source Gate Charge
Qgs2
Gate Charge Threshold to Plateau
Qgd
Gate to Drain “Miller” Charge
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
2
VDD = 15V
ID = 80A
Ig = 1.0mA
www.fairchildsemi.com
FDB8860 N-Channel Logic Level PowerTrench® MOSFET
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
ns
Switching Characteristics
t(on)
Turn-On Time
-
-
340
td(on)
Turn-On Delay Time
-
14
-
ns
tr
Turn-On Rise Time
-
213
-
ns
td(off)
Turn-Off Delay Time
-
79
-
ns
tf
Turn-Off Fall Time
-
49
-
ns
toff
Turn-Off Time
-
-
192
ns
ISD = 80A
-
-
1.25
V
ISD = 40A
-
-
1.0
V
VDD = 15V, ID = 80A
VGS = 5V, RGS = 1Ω
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Voltage
trr
Reverse Recovery Time
ISD = 80A, dISD/dt = 100A/μs
-
-
43
ns
Qrr
Reverse Recovery Charge
ISD = 80A, dISD/dt = 100A/μs
-
-
29
nC
Notes:
1: Starting TJ = 25oC, L =0.47mH, IAS = 64A , VDD = 30V, VGS = 10V.
2: Pulse width = 100s
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
3
www.fairchildsemi.com
FDB8860 N-Channel Logic Level PowerTrench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
POWER DISSIPATION MULIPLIER
1.2
300
VGS = 10V
ID, DRAIN CURRENT (A)
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
TC, CASE TEMPERATURE( oC)
NORMALIZED THERMAL
IMPEDANCE ZθJA
1
CURRENT LIMITED
BY PACKAGE
VGS = 5V
150
75
0
25
175
50
75
100
125
150
175
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs Case
Temperature
2
225
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
PDM
0.1
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
SINGLE PULSE
0.01
-5
10
-4
10
-3
-2
10
10
-1
0
10
1
10
10
t, RECTANGULAR PULSE DURATION (s)
Figure 3. Normalized Maximum Transient Thermal Impedance
3000
I(PK), PEAK CURRENT (A)
TC = 25oC
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
1000
CURRENT AS FOLLOWS:
175 - TC
I = I25
150
100
SINGLE PULSE
50
-5
10
-4
10
-3
10
-2
10
t, PULSE WIDTH (s)
-1
10
0
10
1
10
Figure 4. Peak Current Capability
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
4
www.fairchildsemi.com
FDB8860 N-Channel Logic Level PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
1000
500
IAS, AVALANCHE CURRENT (A)
ID, DRAIN CURRENT(A)
10us
100
100
100us
10
CURRENT LIMITED
BY PACKAGE
1
OPERATION IN THIS
AREA MAY BE
LIMITED BY RDS(ON)
0.1
1
1ms
10ms
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
100ms
DC
10
VDS, DRAIN TO SOURCE VOLTAGE(V)
120
TJ = 175oC
80
TJ = 25oC
TJ = -55oC
40
1.5
2.0
2.5
3.0
VGS, GATE TO SOURCE VOLTAGE (V)
60
40
20
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
RDS(ON), DRAIN TO SOURCE
ON-RESISTANCE (mΩ)
2.5
TJ = 25oC
5
6
7
8
9
10
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 9. Drain to Source On-Resistance
Variation vs Gate to Source Voltage
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
0.2
0.4
0.6
0.8
VDS, DRAIN TO SOURCE VOLTAGE (V)
1.0
Figure 8. Saturation Characteristics
TJ = 175oC
4
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
0.0
3.0
1.5
3
VGS = 10V
80
3.5
PULSE DURATION = 80μs
DUTY CYCLE=0.5% MAX
2.0
VGS = 3V
VGS = 5V
0
4.0
3.5
10000
VGS = 4V
100
Figure 7. Transfer Characteristics
ID = 40A
1
10
100
1000
tAV, TIME IN AVALANCHE (ms)
Figure 6. Unclamped Inductive Switching
Capability
VDD = 5V
1.0
STARTING TJ = 150oC
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
120
10
1
0.1
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
160
STARTING TJ = 25oC
60
Figure 5. Forward Bias Safe Operating Area
0
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
1.6
1.4
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
1.2
1.0
0.8
0.6
-80
ID = 80A
VGS = 10V
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE( OC)
200
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
5
www.fairchildsemi.com
FDB8860 N-Channel Logic Level PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
1.10
VGS = VDS
ID = 250μA
1.2
NORMALIZED GATE
THRESHOLD VOLTAGE
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
1.4
1.05
1.0
1.00
0.8
0.6
0.95
0.4
0.2
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE( oC)
0.90
-80
200
VGS, GATE TO SOURCE VOLTAGE(V)
Ciss
10000
Coss
500
0.1
f = 1MHz
VGS = 0V
Crss
1
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
30
40
80
120
160
200
10
VDD = 15V
8
6
4
2
ID = 80A
ID = 1A
0
0
20
40
60
80
100 120 140 160 180
Qg, GATE CHARGE (nC)
Figure 13. Capacitance vs Drain to Source
Voltage
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
0
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
20000
1000
-40
TJ, JUNCTION TEMPERATURE( oC)
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
CAPACITANCE (pF)
ID = 1mA
Figure 14. Gate Charge vs Gate to Source Voltage
6
www.fairchildsemi.com
FDB8860 N-Channel Logic Level PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
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No Identification Needed
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Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I51
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
7
www.fairchildsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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