FUSB3301MPX

FUSB3301 USB Type-C Controller for Mobile Chargers and Power Adapters Description The FUSB3301 is an autonomous Source only Type−C controller optimized for mobile chargers and power adapters. It broadcasts the available current of the charger over CC1/CC2 using the USB Type−C standard and prevents VBUS from being asserted until a valid connection has been verified. It can be used for up to 15 W charging using Type−C protocols. The FUSB3301 has very low standby power consumption and is packaged in a 0.5 mm pitch MLP to accommodate power adapter PCBs. www.onsemi.com WDFN 10 LEAD CASE 511DM Features • • • • • • • • • Fully Autonomous Type−C Controller Supports Type−C Version 1.2 Fixed Source Mode Low Standby Power: ICC = 5 mA (Typical) VBUS Switch Control Advertises Three Standard Type−C VBUS Current Levels (900 mA, 1.5 A, 3.0 A) 2 kV HBM ESD Protection 10 Lead MLP Package VDD Operating Range, 3.0 V − 5.5 V MARKING DIAGRAM NZ NZ = Specific Device Marking PIN ASSIGNMENT CC1 NC1 NC2 NC3 HOST1 Applications • • • • USB Type−C Power Ports Mobile Chargers Power Adapters AC−DC Adapters CC2 VDD GND SW HOST2 (Top View) ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2015 March, 2018 − Rev. 2 1 Publication Order Number: FUSB3301/D FUSB3301 ORDERING INFORMATION Part Number Top Mark Operating Temperature Range FUSB3301MPX NZ −40 to 85°C VBUS _IN Package 10−Lead, MLP, 3 mm x 3 mm SW TYPE−C FUSB 3301 GND HOST 1 GND TX1+ RX1+ TX1− RX1− VBUS CC1 RFU 1 D+ D− D− D+ RFU 2 CC2 VBUS RX2− TX2− RX2+ TX2+ GND CC1 CC Switches , I(Rp)/Rd & Comparators Block Source State Machine Tape and Reel VBUS _OUT LOAD SWITCH VDD Packing Method CC2 HOST 2 Figure 1. Block Diagram Vo LOAD SWITCH VBUS TYPE−C GND TX1+ RX1+ TX1− RX1− VBUS CC1 RFU1 D+ D− D− D+ RFU2 CC2 VBUS RX2− TX2− RX2+ TX2+ GND SW FUSB3301 Secondary Side Controller Figure 2. Typical Application Table 1. PIN DESCRIPTIONS Pin # Name Type Description 1 CC1 Input/Output 2 NC1 (Note 1) NC No Connect 3 NC2 (Note 1) NC No Connect 4 NC3 (Note 1) NC No Connect 5 HOST1 Input Host Current Select Pin with Internal Pull−up 6 HOST2 Input Host Current Select Pin with Internal Pull−up 7 SW Output Open Drain output to control the VBUS load switch 8 GND Power Ground 9 VDD Power Power Supply 10 CC2 Input/Output Type−C Configuration Channel Type−C Configuration Channel 1. No connect pins can float or can be tied to ground. www.onsemi.com 2 FUSB3301 Table 2. CONNECTION STATE TABLE CC1 CC2 SW Description NC NC HiZ No Attach Rd NC L Attach to UFP (Sink) NC Rd L Attach to UFP (Sink) Rd Rd HiZ No Attach Ra NC HiZ No Attach NC Ra HiZ No Attach Ra Ra HiZ No Attach Host Current Table 3. HOST INPUT TRUTH TABLE HOST2 HOST1 CC Current (mA) Host Current (A) GND / LOW GND / LOW 330 3.0 GND / LOW FLOAT / HIGH 180 1.5 FLOAT / HIGH GND / LOW 180 1.5 FLOAT / HIGH FLOAT / HIGH 80 0.9 Unattached SOURCE Attach Detected for tCCDebounce? NO SW = HiZ YES YES Not Attached for tPDDebounce? Attached SOURCE SW = LOW Figure 3. Source Attach Flowchart www.onsemi.com 3 FUSB3301 Table 4. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit VDD Supply Voltage −0.5 6.0 V VCCX CC pins when configured as HOST −0.5 6.0 V Storage Temperature Range −65 +150 °C TSTORAGE TJ Maximum Junction Temperature +150 °C TL Lead Temperature (Soldering, 10 seconds) +260 °C ESD IEC 61000−4−2 System ESD Connector Pins (VBUS, CC1 & CC2) Human Body Model, JEDEC JESD22−A114 Charged Device Model, JEDEC JESD22−C101 Air Gap 15 Contact 8 Connector Pins (VBUS, CC1 and CC2) 4 Others 2 All Pins 1 kV kV kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 5. RECOMMENDED OPERATING CONDITIONS Symbol Min Typ Max Unit Supply Voltage 3.0 5.0 5.5 V TA Operating Ambient Temperature −40 +85 °C TJ Operating Junction Temperature −40 +125 °C VDD Parameter Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Table 6. DC AND TRANSIENT CHARACTERISTICS All typical values are at TA=25°C unless otherwise specified. TA = −40 to +855C TJ=−40 to +1255C Min Typ Max Unit Source 80 mA CC Current (Default) HOST2=VDD, HOST1=VDD 64 80 96 mA Source 180 mA CC Current (1.5 A) HOST2=VDD, HOST1=GND or HOST2=GND, HOST1=VDD 166 180 194 mA I330_CCX Source 330 mA CC Current (3 A) HOST2=GND, HOST1=GND 304 330 356 zOPEN CC Resistance for Disabled State 126 Ra Detection Threshold for CC Pin for Source for Default Current on VBUS 0.15 0.20 0.25 V Ra Detection Threshold for CC pin for Source for 1.5 A Current on VBUS 0.35 0.40 0.45 V vRa−SRC3A Ra Detection Threshold for CC Pin for Source for 3 A Current on VBUS 0.75 0.80 0.85 V vRd−SRCdef Rd Detection Threshold for Source for Default Current (HOST2/1=VDD/VDD) 1.50 1.60 1.65 V Rd detection threshold for Source for 1.5 A Current (HOST2/1=GND/VDD or VDD/GND) 1.50 1.60 1.65 V Rd Detection Threshold for Source for 3 A Current (HOST2/1=GND/GND) 2.45 2.60 2.75 V Parameter Symbol I80_CCX I180_CCX vRa−SRCdef vRa−SRC1.5A vRd−SRC1.5A vRd−SRC3A mA kW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 4 FUSB3301 Table 7. CURRENT CONSUMPTION TA = −40 to +855C TJ=−40 to +1255C Symbol Parameter Conditions VDD (V) Min Typ Max Unit Istby Unattached Source Nothing attached, Host Pins = VDD, GND, Float. 3.0 to 5.5 5 20 mA Iattach Attach Current (Less Host Current) Attached, Host Pins=VDD, GND, Float. 3.0 to 5.5 10 15 mA Table 8. TIMING PARAMETERS TA = −40 to +855C TJ=−40 to +1255C Min Typ Max Unit tCCDebounce Time from CC Voltage Detection until SW goes LOW 100 150 200 ms tPDDebounce Time from CC Voltage Not Detected until SW goes to High−Z 10 15 20 ms Symbol Parameter Table 9. IO SPECIFICATIONS TA = −40 to +855C TJ=−40 to +1255C Symbol Conditions VDD (V) Max Unit IOL=4 mA 3.0 to 5.5 0.4 V HOST1/2 Low−Level Input Voltage 3.0 to 5.5 0.3VDD V HOST1/2 High−Level Input Voltage 3.0 to 5.5 Parameter VOLSW SW Output Low Voltage VILHOST VIHHOST www.onsemi.com 5 Min 0.7VDD Typ V MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN10 3x3, 0.5P CASE 511DM ISSUE O DATE 31 AUG 2016 10 A 0.10 3.0 C 0.55 B 6 2.25 2.20 2.00 2X 0.78 2.33 3.0 0.10 TOP VIEW 0.80 MAX 0.23 C 0.02 2X C 0.10 1.55 2.00 3.10 0.50 0.20 0.25 1 5 D LAND PATTERN RECOMMENDATION C 0.08 SEATING PLANE 0.05 0.00 C SIDE VIEW NOTES: 0.30 0.20 0.5 1 5 A. CONFORMS TO JEDEC REGISTRATION MO−229, VARIATION WEED−5 B. DIMENSIONS ARE IN MILLIMETERS C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009 D. LAND PATTERN DIMENSIONS ARE NOMINAL REFERENCE VALUES ONLY 0.38 PIN #1 IDENT 1.60 1.50 0.45 0.35 10 3.10 2.90 6 2.0 2.30 2.20 3.10 2.90 0.10 M C 0.05 M C A B BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON13631G WDFN10 3X3, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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