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IRLM120ATF

IRLM120ATF

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO261-4

  • 描述:

    MOSFET N-CH 100V 2.3A SOT-223

  • 数据手册
  • 价格&库存
IRLM120ATF 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. IRLM120A Advanced Power MOSFET FEATURES BVDSS = 100 V n Avalanche Rugged Technology RDS(on) = 0.22 Ω n Rugged Gate Oxide Technology n Lower Input Capacitance ID = 2.3 A n Improved Gate Charge n Extended Safe Operating Area SOT-223 n Lower Leakage Current : 10 µA (Max.) @ VDS = 100V n Lower RDS(ON) : 0.176 Ω (Typ.) 2 1 3 1. Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS Characteristic Value Drain-to-Source Voltage o ID Units V 100 Continuous Drain Current (TC=25 C) 2.3 o Continuous Drain Current (TC=70 C) A 1.85 IDM Drain Current-Pulsed VGS Gate-to-Source Voltage EAS Single Pulsed Avalanche Energy (2) (1) 18 A ±20 V 105 mJ IAR Avalanche Current (1) 2.3 A EAR Repetitive Avalanche Energy (1) 0.27 mJ dv/dt Peak Diode Recovery dv/dt (3) 6.5 V/ns o PD Total Power Dissipation (TC=25 C) * Linear Derating Factor * 2.7 W 0.022 W/ C o Operating Junction and TJ, TSTG - 55 to +150 Storage Temperature Range o Maximum Lead Temp. for Soldering TL C 300 Purposes, 1/8” from case for 5-seconds Thermal Resistance Symbol Characteristic Typ. Max. RθJA Junction-to-Ambient * -- 46.3 Units o C/W * When mounted on the minimum pad size recommended (PCB Mount). 1 N-CHANNEL POWER MOSFET IRLM120A Electrical Characteristics (TC=25 oC unless otherwise specified) Symbol Characteristic BVDSS Drain-Source Breakdown Voltage VGS(th) IGSS IDSS RDS(on) Breakdown Voltage Temp. Coeff. Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse Drain-to-Source Leakage Current Static Drain-Source On-State Resistance 100 -- -- -- 0.09 -- 1.0 -- 2.0 -- -- 100 V nA See Fig 7 VDS=5V,ID=250µA VGS=20V VGS=-20V -- -100 -- 10 -- -- 100 -- -- 0.22 Ω VGS=5V,ID=1.15A (4) -- VDS=40V,ID=1.15A (4) Forward Transconductance -- 4.6 Input Capacitance -- 340 440 Coss Output Capacitance -- 90 115 Crss Reverse Transfer Capacitance -- 39 50 td(on) Turn-On Delay Time -- 5 20 Rise Time -- 10 30 Turn-Off Delay Time -- 19 50 Fall Time -- 9 30 tf V/ C ID=250µA -- gfs td(off) VGS=0V,ID=250µA o -- Ciss tr V Test Condition Ω ∆BV/∆TJ Min. Typ. Max. Units Qg Total Gate Charge -- 10.2 15 Qgs Gate-Source Charge -- 1.7 -- Qgd Gate-Drain (“Miller”) Charge -- 6.0 -- µA pF VDS=100V o VDS=80V,TC=125 C VGS=0V,VDS=25V,f =1MHz See Fig 5 VDD=50V,ID=9.2A, ns RG=9 Ω See Fig 13 (4)(5) VDS=80V,VGS=5V, nC ID=9.2A See Fig 6 & Fig 12 (4)(5) Source-Drain Diode Ratings and Characteristics Symbol Characteristic IS Continuous Source Current Min. Typ. Max. Units -- -- 2.3 A Test Condition Integral reverse pn-diode ISM Pulsed-Source Current (1) -- -- 18 VSD Diode Forward Voltage (4) -- -- 1.5 V TJ=25 C,IS=2.3A,VGS=0V trr Reverse Recovery Time -- 98 -- ns TJ=25 C,IF=9.2A Qrr Reverse Recovery Charge -- 0.34 -- µC diF/dt=100A/µs in the MOSFET o o (4) Notes ; ① Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature ② L=30mH, IAS=2.3A, VDD=25V, RG=27Ω, Starting TJ =25 oC ③ ISD < 9.2A, di/dt < 300A/μs, VDD < BVDSS , Starting TJ =25 oC ④ Pulse Test : Pulse Width = 250µs, Duty Cycle < 2% ⑤ Essentially Independent of Operating Temperature 2 N-CHANNEL POWER MOSFET IRLM120A Fig 1. Output Characteristics Fig 2. Transfer Characteristics VGS ID , Drain Current [A] 101 7.0 V 6.0 V 5.5 V 5.0 V 4.5 V 4.0 V 3.5 V Bottom : 3.0 V ID , Drain Current [A] Top : 100 @ Notes : 1. 250 µs Pulse Test 2. TC = 25 oC 10-1 -1 10 100 101 150 oC 100 25 oC @ Notes : 1. VGS = 0 V 2. VDS = 40 V 3. 250 µs Pulse Test - 55 oC 10-1 101 0 2 4 6 8 10 VDS , Drain-Source Voltage [V] VGS , Gate-Source Voltage [V] Fig 3. On-Resistance vs. Drain Current Fig 4. Source-Drain Diode Forward Voltage IDR , Reverse Drain Current [A] Drain-Source On-Resistance VGS = 5 V 0.3 0.2 0.1 VGS = 10 V @ Note : TJ = 25 oC 0.0 0 10 20 30 40 101 100 @ Notes : 1. VGS = 0 V 2. 250 µs Pulse Test 150 oC 25 oC 10-1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 ID , Drain Current [A] VSD , Source-Drain Voltage [V] Fig 5. Capacitance vs. Drain-Source Voltage Fig 6. Gate Charge vs. Gate-Source Voltage 600 360 C iss Ciss= Cgs+ Cgd ( Cds= shorted ) Coss= Cds+ Cgd Crss= Cgd C oss 240 @ Notes : 1. VGS = 0 V 2. f = 1 MHz C rss 120 00 10 101 VDS , Drain-Source Voltage [V] 6 VDS = 20 V VGS , Gate-Source Voltage [V] 480 Capacitance [pF] RDS(on) , [ Ω ] 0.4 VDS = 50 V VDS = 80 V 4 2 @ Notes : ID = 9.2 A 0 0 2 4 6 8 10 12 QG , Total Gate Charge [nC] 3 N-CHANNEL POWER MOSFET IRLM120A Fig 7. Breakdown Voltage vs. Temperature Fig 8. On-Resistance vs. Temperature 1.1 1.0 0.9 @ Notes : 1. V = 0 V GS Drain-Source On-Resistance 2.5 RDS(on) , (Normalized) BVDSS , (Normalized) Drain-Source Breakdown Voltage 1.2 2.0 1.5 1.0 @ Notes : 1. V = 5 V 0.5 GS 2. ID = 4.6 A 2. ID = 250 µA 0.8 -75 -50 -25 0 25 50 75 100 125 150 0.0 -75 175 -50 -25 o 102 0 25 50 75 100 125 150 175 TJ , Junction Temperature [oC] TJ , Junction Temperature [ C] Fig 9. Max. Safe Operating Area Fig 10. Max. Drain Current vs. Case Temperature 10 ID , Drain Current [A] 100 µs 101 1 ms 10 ms DC 100 @ Notes : 1. TC = 25 oC 2. TJ = 150 oC 3. Single Pulse 8 6 4 2 10-1 0 10 101 0 25 102 50 100 125 150 Fig 11. Thermal Response 101 Thermal Response 75 Tc , Case Temperature [oC] VDS , Drain-Source Voltage [V] D=0.5 100 0.2 @ Notes : 1. Z J C (t)=3.5 o C/W Max. 0.1 0.05 10- 1 θ 2. Duty Factor, D=t1 /t2 0.02 3. TJ M -TC =PD M *Zθ J C (t) 0.01 PDM single pulse t1 θJC Z (t) , ID , Drain Current [A] Operation in This Area is Limited by R DS(on) t2 -2 10 10- 5 10- 4 10- 3 10- 2 10- 1 t 1 , Square Wave Pulse Duration 100 101 [sec] 4 N-CHANNEL POWER MOSFET IRLM120A Fig 12. Gate Charge Test Circuit & Waveform * Current Regulator ” VGS Same Type as DUT 50KΩ Qg 200nF 12V 10V 300nF VDS Qgs VGS Qgd DUT 3mA R1 R2 Current Sampling (IG) Resistor Current Sampling (ID) Resistor Charge Fig 13. Resistive Switching Test Circuit & Waveforms RL Vout Vout 90% VDD Vin ( 0.5 rated VDS ) RG DUT Vin 10% 10V td(on) tr td(off) t on tf t off Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD LL VDS Vary tp to obtain required peak ID BVDSS IAS ID RG C DUT ID (t) VDD VDS (t) VDD 5V tp tp Time 5 N-CHANNEL POWER MOSFET IRLM120A Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS -- IS L Driver VGS RG VGS VGS ( Driver ) Same Type as DUT VDD • dv/dt controlled by "RG" • IS controlled by Duty Factor "D" Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop 6 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST  FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench  QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER  SMART START™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET  VCX™ STAR*POWER is used under license DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H3 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com © Semiconductor Components Industries, LLC N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com
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