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LM7301SN1T1G

LM7301SN1T1G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT23-5

  • 描述:

    IC OPAMP GP 1 CIRCUIT 5TSOP

  • 数据手册
  • 价格&库存
LM7301SN1T1G 数据手册
Operational Amplifier, Rail-to-Rail Input-Output, Low Power, 4 MHz GBW LM7301 The LM7301 operational amplifier provides high performance in a wide range of applications. It features common mode input range beyond the rails, full rail-to-rail output swing, large capacitive load driving capability, and low signal distortion. The LM7301 operates on supplies of 1.8 V to 32 V and is excellent for a wide range of applications in low power systems. With a gain-bandwidth of 4 MHz while consuming only 0.6 mA supply current, it supports portable applications where higher power devices would reduce battery life. The wide input common mode voltage range allows the LM7301 to be driver by signals 100 mV beyond both rails, eliminating concerns associated with exceeding the common−mode voltage range. The capability for rail−to−rail output swing provides the maximum possible dynamic range at the output, which is particularly important when operating on low supply voltages. The LM7301 is available in a space-saving TSOP-5 package. Features • Wide Supply Range: 1.8 V to 32 V • Input Common Mode Voltage Range Extends Beyond Rails: • • • • • • • • • VEE − 0.1 V to VCC + 0.1 V Rail−to−Rail Output Swing: 0.07 V to 4.93 V at VS = 5 V Wide Gain−Bandwidth: 4 MHz Low Supply Current: 0.60 mA at VS = 5 V High PSRR: 104 dB at VS = 5 V High CMRR: 93 dB at VS = 5 V Excellent Gain: 97 dB at VS = 5 V Capable of Driving a 1 nF Capacitive Load Tiny 5−pin SOT23 Package Saves Space These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant August, 2020 − Rev. 5 1 TSOP−5 (SOT23−5) SN SUFFIX CASE 483 MARKING DIAGRAM 5 JFGAYWG G 1 A Y W G = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS 5 VCC OUT 1 VEE 2 Non−Inverting Input 3 + − 4 Inverting Input (Top View) See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. Portable Instrumentation Signal Conditioning Amplifiers/ADC Buffers Active Filters Modems PCMCIA Cards © Semiconductor Components Industries, LLC, 2014 5 ORDERING INFORMATION Typical Applications • • • • • www.onsemi.com 1 Publication Order Number: LM7301/D LM7301 PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 Output Description 2 VEE 3 Non−inverting Input 4 Inverting Input Inverting Amplifier Input 5 VCC Positive Power Supply Amplifier Output Negative Power Supply Non−inverting Amplifier Input ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Common Mode Range VCM VCC + 0.3 V, VEE − 0.3 V V Differential Input Voltage Range Vdiff 15 V Supply Voltage (VCC − VEE) VS 35 V Current at Input Pin IIN ±10 mA Current at Output Pin (Note 1) IOUT ±20 mA Current at Power Supply Pin ICC 25 mA TJ(max) 150 °C TSTG −65 to 150 °C ESDHBM 2.5 kV Maximum Junction Temperature (Note 2) Storage Temperature Range ESD Capability, Human Body Model (Note 3) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. 2. The maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable dissipation at any ambient temperature is PD = (TJ(max) − TA)/qJA. All numbers apply for packages soldered directly to a printed circuit board. 3. Human Body Model, applicable std. MIL−STD−883, method 3015.7. THERMAL CHARACTERISTICS Rating Thermal Characteristics, SOT−5, 3 x 3.3 mm (Note 4) 4. Values based on copper area of 645 mm2 (or 1 in2) Symbol Value Unit qJA 333 °C/W of 1 oz copper thickness and FR4 PCB substrate. OPERATING RANGES Rating Symbol Min Max Unit Supply Voltage VS 1.8 32 V Operating Temperature Range TA −40 85 °C www.onsemi.com 2 LM7301 5.0 V DC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits guaranteed for TA = 25°C, VCC = 5 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply. Boldface limits apply at the temperature extremes. Symbol VOS Parameter Conditions Min Input Offset Voltage Typ Max Unit 0.03 6 mV 8 DVOS/DT IIB Input Offset Voltage Average Drift 2 Input Bias Current VCM = 0 V 65 mV/°C 200 nA 250 VCM = 5 V −55 −75 −85 IOS Input Offset Current VCM = 0 V 0.7 70 nA 80 VCM = 5 V 0.7 55 65 RIN CMRR Input Resistance, Common Mode 0 V ≤ VCM ≤ 5 V Common Mode Rejection Ratio 0 V ≤ VCM ≤ 5 V 70 39 MW 88 dB 67 0 V ≤ VCM ≤ 3.5 V PSRR Power Supply Rejection Ratio 2.2 V ≤ VS ≤ 30 V 93 87 104 dB 5.1 V 84 VCM Input Common−Mode Voltage Range CMRR ≥ 65 dB −0.1 AV VOH Large Signal Voltage Gain High Output Voltage Swing RL = 10 kW Vo = 4.0 Vpp 82 RL = 10 kW 4.88 97 dB 4.93 V 80 4.85 RL = 2 kW 4.8 4.87 4.78 VOL Low Output Voltage Swing RL = 10 kW 0.07 0.12 0.15 RL = 2 kW 0.14 0.2 0.22 ISC Output Short Circuit Current Sourcing 8 mA 10.5 5.5 Sinking 6 9.8 5 IS Supply Current RL = open 0.6 1.1 1.24 www.onsemi.com 3 mA LM7301 AC ELECTRICAL CHARACTERISTICS TA = 25°C, VCC = 2.2 V to 30 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply Symbol SR GBW Parameter Conditions Slew Rate Gain−Bandwidth Product Min Typ Max Unit ±4 V Step @ Vs = ±6 V 1.25 V/ms f = 100 kHz, RL = 10k 4 MHz eN Input−Referred Voltage Noise f = 1 kHz 30 nV/√Hz iN Input−Referred Current Noise f = 1 kHz 0.24 pA/√Hz Total Harmonic Distortion f = 10 kHz 0.004 % THD 2.2 V DC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits guaranteed for TA = 25°C, VCC = 2.2 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply. Boldface limits apply at the temperature extremes. Parameter Symbol VOS Conditions Min Input Offset Voltage Typ Max Unit 0.04 6 mV 8 DVOS/DT IIB Input Offset Voltage Average Drift 2 Input Bias Current VCM = 0 V 65 mV/°C 200 nA 250 VCM = 2.2 V −55 −75 −85 IOS Input Offset Current VCM = 0 V 0.8 VCM = 2.2 V 0.4 70 nA 80 55 65 RIN CMRR Input Resistance, Common Mode 0 V ≤ VCM ≤ 2.2 V Common Mode Rejection Ratio 0 V ≤ VCM ≤ 2.2 V 60 18 MW 82 dB 104 dB 2.3 V 56 PSRR Power Supply Rejection Ratio 2.2 V ≤ VS ≤ 30 V 87 84 VCM Input Common−Mode Voltage Range CMRR ≥ 60 dB −0.1 AV VOH Large Signal Voltage Gain High Output Voltage Swing RL = 10 kW Vo = 1.6 Vpp 76 RL = 10 kW 2.1 93 dB 2.15 V 74 2 RL = 2 kW 2.07 2.1 2 VOL Low Output Voltage Swing RL = 10 kW 0.05 0.08 0.1 RL = 2 kW 0.09 0.13 0.14 ISC Output Short Circuit Current Sourcing 8 8.7 5.5 Sinking 6 5 www.onsemi.com 4 8.7 mA LM7301 2.2 V DC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits guaranteed for TA = 25°C, VCC = 2.2 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply. Boldface limits apply at the temperature extremes. Symbol IS Parameter Conditions Supply Current Min RL = open Typ Max Unit 0.57 0.97 mA 1.24 30V DC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits guaranteed for TA = 25°C, VCC = 30 V, VEE = 0 V, VCM = mid−supply, and RL > 1 MW to mid−supply. Boldface limits apply at the temperature extremes. Parameter Symbol VOS Conditions Min Input Offset Voltage Typ Max Unit 0.04 6 mV 8 DVOS/DT IIB Input Offset Voltage Average Drift 2 Input Bias Current VCM = 0 V 70 mV/°C 300 nA 500 VCM = 30 V −60 −100 −200 IOS Input Offset Current VCM = 0 V 1.2 VCM = 30 V 0.5 90 nA 190 65 135 RIN CMRR Input Resistance, Common Mode 0 V ≤ VCM ≤ 30 V Common Mode Rejection Ratio 0 V ≤ VCM ≤ 30 V 80 200 MW 104 dB 78 0 V ≤ VCM ≤ 27 V 90 115 88 PSRR Power Supply Rejection Ratio 2.2 V ≤ VS ≤ 30 V 87 104 dB 30.1 V 84 VCM Input Common−Mode Voltage Range CMRR ≥ 80 dB −0.1 AV Large Signal Voltage Gain RL = 10 kW Vo = 28 Vpp 89 VOH High Output Voltage Swing RL = 10 kW 29.75 100 dB 29.8 V 86 28.65 VOL Low Output Voltage Swing RL = 10 kW 0.16 0.275 0.375 ISC Output Short Circuit Current Sourcing (Note 5) 8.8 mA 17 6.5 Sinking (Note 5) 8.2 14 6 IS Supply Current RL = open 0.7 1.3 mA 1.35 5. The maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable dissipation at any ambient temperature is PD = (TJ(max) − TA)/qJA. All numbers apply for packages soldered directly to a printed circuit board. www.onsemi.com 5 LM7301 TYPICAL CHARACTERISTICS 800 VCM = mid−supply RL = 1 MW 600 500 Vos (mV) SUPPLY CURRENT (mA) 700 400 300 200 +85°C +25°C 100 −40°C 0 0 5 10 15 20 25 0.45 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 −0.05 −0.1 −0.15 −0.2 30 −40°C +25°C +85°C 0 5 10 SUPPLY VOLTAGE (V) 0.4 Vos (mV) 0.3 0.2 0.1 0.5 0.4 −40°C −40°C 0.3 +25°C +85°C 0.2 +25°C 0.1 +85°C 0 −0.1 −0.1 −0.2 −0.2 −0.3 −0.3 −0.4 −1.2 −0.4 −2.5 −0.8 −0.4 0 0.4 0.8 1.2 VS = ±2.5 V −2 −1.5 VCM (V) 60 VS = ±15 V −40°C 0.2 +25°C BIAS CURRENT (nA) Vos (mV) 0.5 1 1.5 2 2.5 VS = ±1.1 V 40 0.3 0 0 Figure 4. Vos vs. VCM 0.4 0.1 −1 −0.5 VCM (V) Figure 3. Vos vs. VCM 0.5 30 0.6 VS = ±1.1 V 0 0.6 25 Figure 2. Vos vs. Supply Voltage Vos (mV) 0.5 20 SUPPLY VOLTAGE (V) Figure 1. Supply Current vs. Supply Voltage 0.6 15 +85°C −0.1 20 0 +25°C −20 −40 −0.2 −60 −0.3 −15 −80 −1.2 −40°C +85°C −10 −5 0 5 10 15 VCM (V) −0.8 −0.4 0 0.4 0.8 VCM, COMMON MODE VOLTAGE (V) Figure 5. Vos vs. VCM Figure 6. Inverting Input Bias Current vs. Common Mode www.onsemi.com 6 1.2 LM7301 TYPICAL CHARACTERISTICS 60 60 VS = ±1.1 V 20 0 −20 +25°C −40°C −40 −60 60 −0.8 −0.4 0 −20 0.4 0.8 1.2 −40 +85°C −2 100 3 BIAS CURRENT (nA) +25°C −40°C −1 0 25 0 +25°C −25 −40°C −50 +85°C −75 +85°C −2 50 1 2 −100 −15 3 −10 VCM, COMMON MODE VOLTAGE (V) −5 0 5 10 15 VCM, COMMON MODE VOLTAGE (V) Figure 9. Non−Inverting Input Bias Current vs. Common Mode Figure 10. Inverting Input Bias Current vs. Common Mode 0.018 VS = ±15 V 50 25 0 +25°C −40°C −50 +85°C −75 −10 TA = 25°C 0.016 OUTPUT CURRENT (A) BIAS CURRENT (nA) 2 VS = ±15 V 75 −60 −100 −15 1 Figure 8. Inverting Input Bias Current vs. Common Mode −20 −25 0 Figure 7. Non−Inverting Input Bias Current vs. Common Mode 0 75 −1 VCM, COMMON MODE VOLTAGE (V) 20 100 +25°C −40°C VCM, COMMON MODE VOLTAGE (V) 40 −80 −3 0 −80 −3 VS = ±2.5 V −40 20 −60 +85°C −80 −1.2 BIAS CURRENT (nA) VS = ±2.5 V 40 BIAS CURRENT (nA) BIAS CURRENT (nA) 40 −5 0 Sourcing 0.014 0.012 0.01 Sinking 0.008 0.006 0.004 0.002 5 10 0 15 0 VCM, COMMON MODE VOLTAGE (V) 2 4 6 8 10 12 14 SUPPLY VOLTAGE (V) Figure 11. Non−Inverting Input Bias Current vs. Common Mode Figure 12. Short−Circuit Current vs. Supply Voltage www.onsemi.com 7 16 LM7301 TYPICAL CHARACTERISTICS 14 VS = ±1.1 V VOL: −40°C VOL: 25°C VOL: 85°C VOH: −40°C VOH: 25°C VOH: 85°C 6 4 2 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 2 0 1.0 1.5 2.0 Figure 14. IO vs. VO 100 1 10 100 1k OPEN LOOP GAIN (dB) 50 k 10 k 40 40 20 20 0 1M 10 M Figure 16. Gain and Phase Margin 40 20 Gain: 0 pF Gain: 1000 pF 0 VS = 2.7 V RL = 10 kW TA = 25°C PHASE MARGIN (°) 60 40 10 k 100 k −20 Figure 15. Voltage Noise vs. Frequency PM: 0 pF PM: 1000 pF 0 10 k 0 Gain: 2.7 V Gain: 5 V Gain: 30 V RL = 10 kW CL = 0 pF TA = 25°C FREQUENCY (Hz) 80 20 60 FREQUENCY (Hz) 80 60 80 PM: 2.7 V PM: 5 V PM: 30 V 60 −40 100 1M 10 M −40 FREQUENCY (Hz) TIME (5 ms/div) Figure 17. Gain/Phase vs. Capacitive Load Figure 18. Large Signal Step Response www.onsemi.com 8 −40 VS = ±2.5 V RL = 1 MW CL = 10 pF TA = 25°C −20 100 k 2.5 100 80 100 −40 0.5 Figure 13. IO vs. VO −20 −20 0 VOLTAGE DROP FROM VS (V) 100.E−9 VOLTAGE NOISE (V/√Hz) 4 VOLTAGE DROP FROM VS (V) VS = ±2.5 V RL = 10 kW TA = 25°C 10.E−9 VOL: −40°C VOL: 25°C VOL: 85°C VOH: −40°C VOH: 25°C VOH: 85°C 6 1.0 0.9 1.E−6 OPEN LOOP GAIN (dB) 8 PHASE MARGIN (°) 8 10 OUTPUT (500 mVp/div) 10 VS = ±2.5 V 12 OUTPUT CURRENT (mA) 12 INPUT (500 mV/div) OUTPUT CURRENT (mA) 14 LM7301 INPUT (10 mV/div) VS = ±2.5 V RL = 1 MW CL = 10 pF TA = 25°C TIME (5 ms/div) TIME (5 ms/div) Figure 21. Inverting Large Signal Step Response Figure 22. Inverting Small Signal Step Response 100 1 kHz THD+n 10 kHz THD+n 1 kHz THD 10 kHz THD VS = ±15 V RL = 100 kW ⎢⎥ 100 pF TA = 25°C 1 0.1 THD (%) THD (%) THD+n (%) 10 0.01 0.001 OUTPUT (10 mV/div) Figure 20. Small Signal Step Response OUTPUT (10 mV/div) Figure 19. Large Signal Step Response 1 kHz THD+n 10 kHz THD+n 1 kHz THD 10 kHz THD VS = ±1.1 V RL = 100 kW ⎢⎥ 100 pF TA = 25°C 0.1 INPUT (10 mV/div) TIME (5 ms/div) VS = ±2.5 V RL = 1 MW CL = 10 pF TA = 25°C 1 VS = ±2.5 V RL = 1 MW CL = 10 pF TA = 25°C TIME (5 ms/div) OUTPUT (500 mV/div) INPUT (500 mV/div) VS = ±6 V RL = 1 MW CL = 10 pF TA = 25°C 10 THD+n (%) OUTPUT (1 V/div) INPUT (1 V/div) TYPICAL CHARACTERISTICS 0.01 0.01 0.1 1 0.001 10 0.01 0.1 1 10 INPUT (VP) INPUT (VP) Figure 23. Harmonic Distortion Figure 24. Harmonic Distortion www.onsemi.com 9 100 LM7301 TYPICAL CHARACTERISTICS 1.35 V− 1.35 V+ 2.5 V− 2.5 V+ 5 V− 5 V+ PSRR (dB) −20 −30 −40 0 −10 AV = +1 RL = 10 kW Input = 100 mVpp −50 −60 −70 −80 −90 10 100 1K 10 K 2.7 V 5V 10 V 20 V 30 V −20 −30 CMRR (dB) 0 −10 100 K 1M −40 AV = +1 RL = 10 kW TA = 25°C −50 −60 −70 −80 −90 −100 −110 −120 10 100 1K 10 K 100 K FREQUENCY (Hz) FREQUENCY (Hz) Figure 25. PSRR vs. Frequency Figure 26. CMRR vs. Frequency www.onsemi.com 10 1M LM7301 APPLICATIONS INFORMATION GENERAL INFORMATION application. Furthermore, the low profile can help in height limited designs, such as consumer hand−held remote controls, sub−notebook computers, and PCMCIA cards. An additional advantage of the tiny TSOP-5 package is that it allows better system performance due to ease of package placement. Because the package is so small, it can fit on the board right where the op amp needs to be placed for optimal performance, unconstrained by the usual space limitations. This optimal placement allows for many system enhancements, which cannot be easily achieved with the constraints of a larger package. For example, problems such as system noise due picking up undesired digital signal can be easily reduced or mitigated. This pick−up problem is often caused by long wires in the board layout going to or from an op amp. By placing the tiny package closer to the signal source and allowing the LM7301 output to drive the long wire, the signal becomes less sensitive to such noise. An overall reduction of system noise results. Often, trying to save space by using dual or quad op amps causes complicated board layouts due to the requirement of routing several signals to and from the same place on the board. Using the tiny op amp eliminates this problem. The LM7301 is ideal in a variety of situations due to low supply current, wide bandwidth, wide input common mode range extending 100 mV beyond the rails, full rail-to-rail output, high capacitive load driving ability, wide supply voltage (1.8 V to 32 V), and low distortion. The high common mode rejection ratio and full rail-to-rail input range provides precision performance, particularly in non− inverting applications where the common mode error is added directly to the other system errors. CAPACITIVE LOAD DRIVING The LM7301 is capable of driving large capacitive loads. A 1000 pF load only reduces the phase margin to about 25°. WIDE SUPPLY RANGE High PSRR and CMRR provide precision performance when the LM7301 is operating on a battery or other unregulated supplies. This advantage is further enhanced by the very wide supply range of 1.8 V to 32 V. In situations where highly variable or unregulated supplies are present, the excellent PSRR and wide supply range will maintain this precision performance, even in such adverse supply conditions. LOW DISTORTION, HIGH OUTPUT DRIVE CAPABILITY The LM7301 offers excellent low distortion performance, with a THD+N of 0.02% at f = 10 kHz. Low distortion levels are offered even at in scenarios with high output current and low load resistance. SPECIFIC ADVANTAGES OF 5−Pin TSOP The most apparent advantage of the 5−pin TSOP is that it can save board space, a critical aspect of any portable or miniaturized system design. The need to decrease the overall system size is inherent in any portable or lightweight system TYPICAL APPLICATIONS HANDHELD REMOTE CONTROLS low distortion at relatively high currents. Due to its low distortion at high output drive currents, the LM7301 fulfills this need, in this as well as other telecom applications. The LM7301 offers outstanding specifications for applications requiring balance between speed and power. In applications such as remote control operation, where high bandwidth and low power consumption are needed, the LM7301 performance can easily meet these requirements. REMOTE MICROPHONE IN PERSONAL COMPUTERS Remote microphones in computers often utilize a microphone at the top of the monitor, which requires driving a long cable in a high noise environment. One method often used to reduce the noise is to lower the signal impedance to reduce the noise pickup. In this configuration, the amplifier usually requires 30 db to 40 db of gain, at bandwidths higher than most low−power CMOS parts can achieve. The LM7301 offers the tiny package, higher bandwidth, and large output drive capability necessary for this application. OPTICAL LINE ISOLATION FOR MODEMS The combination of low distortion and high load driving capabilities of the LM7301 make it an excellent choice in modems for driving opto-isolator circuits to achieve line isolation. This technique prevents telephone line noise from coupling onto the modem signal. Superior isolation is achieved by coupling the signal optically from the computer modem to the telephone lines; however, this also requires a ORDERING INFORMATION Device LM7301SN1T1G Marking Package Shipping† JFG SOT23−5 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 11 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−5 CASE 483 ISSUE N 5 1 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 2X DATE 12 AUG 2020 0.20 C A B 0.10 T M 2X 0.20 T 5 B 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H C SIDE VIEW SEATING PLANE END VIEW GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 1.9 0.074 5 5 XXXAYWG G 1 1 Analog 2.4 0.094 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package 1.0 0.039 XXX MG G Discrete/Logic XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ARB18753C TSOP−5 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
LM7301SN1T1G 价格&库存

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