MC74LVX74
Dual D-Type Flip-Flop
with Set and Clear
With 5.0 V−Tolerant Inputs
The MC74LVX74 is an advanced high speed CMOS D−type
flip−flop. The inputs tolerate voltages up to 7.0 V, allowing the
interface of 5.0 V systems to 3.0 V systems.
The signal level applied to the D input is transferred to O output
during the positive going transition of the Clock pulse.
Clear (CD) and Set (SD) are independent of the Clock (CP) and are
accomplished by setting the appropriate input Low.
http://onsemi.com
SOIC−14 NB
D SUFFIX
CASE 751A
TSSOP−14
DT SUFFIX
CASE 948G
Features
•
•
•
•
•
•
•
•
•
PIN ASSIGNMENT
High Speed: fmax = 145 MHz (Typ) at VCC = 3.3 V
Low Power Dissipation: ICC = 2 mA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: VOLP = 0.5 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance:
Human Body Model > 2000 V;
Machine Model > 200 V
These Devices are Pb−Free and are RoHS Compliant
VCC CD2 D2 CP2 SD2 O2 O2
14 13 12 11 10 9
8
1
2
3
4
5
6
7
CD1 D1 CP1 SD1 O1 O1 GND
14−Lead (Top View)
MARKING DIAGRAMS
14
14
SD1
4
SD
D1
CP1
2
3
D
1
Q
Q
CP
5
6
O1
1
SOIC−14 NB
O1
LVX74
A
WL, L
Y
W, WW
G or G
CD
CD1
LVX
74
ALYW G
G
LVX74G
AWLYWW
1
TSSOP−14
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
SD2
10
PIN NAMES
SD
D2
CP2
12
11
D
Q
Q
CP
9
8
O2
O2
CD
CD2
13
Function
CP1, CP2
D1, D2
CD1, CD2
SD1, SD2
On, On
Clock Pulse Inputs
Data Inputs
Direct Clear Inputs
Direct Set Inputs
Outputs
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Figure 1. Logic Diagram
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 5
Pins
1
Publication Order Number:
MC74LVX74/D
MC74LVX74
OUTPUTS
INPUTS
SDn
CDn
CPn
Dn
On
On
OPERATING MODE
L
H
H
L
X
X
X
X
H
L
L
H
Asynchronous Set
Asynchronous Clear
L
L
X
X
H
H
Undetermined
H
H
H
H
↑
↑
h
l
H
L
L
H
Load and Read Register
H
H
↑
X
NC
NC
Hold
H = High Voltage Level; h = High Voltage Level One Setup Time Prior to the Low−to−High Clock Transition; L = Low Voltage Level; l = Low Voltage
Level One Setup Time Prior to the Low−to−High Clock Transition; NC = No Change; X = High or Low Voltage Level or Transitions are Acceptable;
↑ = Low−to−High Transition; ↑ = Not a Low−to−High Transition; For ICC Reasons DO NOT FLOAT Inputs
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
–0.5 to +7.0
V
Vin
DC Input Voltage
–0.5 to +7.0
V
Vout
DC Output Voltage
–0.5 to VCC +0.5
V
IIK
Input Diode Current
−20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
_C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
DC Supply Voltage
Vin
DC Input Voltage
Vout
DC Output Voltage
TA
Dt/DV
Operating Temperature, All Package Types
Input Rise and Fall Time
Min
Max
Unit
2.0
3.6
V
0
5.5
V
0
VCC
V
−40
+85
_C
0
100
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
TA = 25°C
VCC
V
Min
1.5
2.0
2.4
VIH
High−Level Input Voltage
2.0
3.0
3.6
VIL
Low−Level Input Voltage
2.0
3.0
3.6
VOH
High−Level Output Voltage
(Vin = VIH or VIL)
IOH = −50mA
IOH = −50mA
IOH = −4mA
2.0
3.0
3.0
VOL
Low−Level Output Voltage
(Vin = VIH or VIL)
IOL = 50mA
IOL = 50mA
IOL = 4mA
2.0
3.0
3.0
Iin
Input Leakage Current
Vin = 5.5V or GND
ICC
Quiescent Supply Current
Vin = VCC or GND
Typ
TA = − 40 to 85°C
Max
Min
1.5
2.0
2.4
0.5
0.8
0.8
1.9
2.9
2.58
Max
2.0
3.0
0.0
0.0
Unit
V
0.5
0.8
0.8
1.9
2.9
2.48
V
V
0.1
0.1
0.36
0.1
0.1
0.44
V
3.6
±0.1
±1.0
mA
3.6
2.0
20.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
http://onsemi.com
2
MC74LVX74
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
TA = 25°C
Symbol
tPLH,
tPHL
tPLH,
tPHL
fmax
tOSHL
tOSLH
Parameter
Test Conditions
Propagation Delay
CP to O or O
Propagation Delay
SD or CD to O or O
Maximum Clock Frequency
(50% Duty Cycle)
Output−to−Output Skew
(Note 1)
Min
TA = −40 to 85°C
Typ
Max
Min
Max
Unit
ns
VCC = 2.7V
CL = 15pF
CL = 50pF
7.3
9.8
15.0
18.5
1.0
1.0
18.5
22.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
5.7
8.2
9.7
13.2
1.0
1.0
11.5
15.0
VCC = 2.7V
CL = 15pF
CL = 50pF
8.4
10.9
15.6
19.1
1.0
1.0
18.5
22.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
6.6
9.1
10.1
13.6
1.0
1.0
12.0
15.5
VCC = 2.7V
CL = 15pF
CL = 50pF
55
45
135
60
50
40
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
95
60
145
85
80
50
VCC = 2.7V
VCC = 3.3 ±0.3V
CL = 50pF
CL = 50pF
ns
MHz
1.5
1.5
1.5
1.5
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
TIMING REQUIREMENTS (Input tr = tf = 3.0ns)
Parameter
Symbol
Guaranteed Limit
VCC
V
TA = 25_C
TA = −40 to 85_C
Unit
tw
Minimum Pulse Width, CP
2.7V
3.3V ±0.3
8.5
6.0
10.0
7.0
ns
tw
Minimum Pulse Width, CD or SD
2.7V
3.3V ±0.3
8.5
6.0
10.0
7.0
ns
tsu
Minimum Setup Time, D to CP
2.7V
3.3V ±0.3
8.0
5.5
9.5
6.5
ns
th
Minimum Hold Time, D to CP
2.7V
3.3V ±0.3
0.5
0.5
0.5
0.5
ns
Minimum Recovery Time, SD or CD to CP
2.7V
3.3V ±0.3
6.5
5.0
7.5
5.0
ns
TA = 25°C
TA = −40 to 85°C
trec
CAPACITIVE CHARACTERISTICS
Typ
Max
Cin
Input Capacitance
4
10
CPD
Power Dissipation Capacitance (Note 2)
25
Symbol
Min
Parameter
Min
Max
Unit
10
pF
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 2 (per flip−flop). CPD is used to determine the
no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package)
TA = 25°C
Characteristic
Symbol
Typ
Max
Unit
VOLP
Quiet Output Maximum Dynamic VOL
0.3
0.5
V
VOLV
Quiet Output Minimum Dynamic VOL
−0.3
−0.5
V
VIHD
Minimum High Level Dynamic Input Voltage
2.0
V
VILD
Maximum Low Level Dynamic Input Voltage
0.8
V
http://onsemi.com
3
MC74LVX74
SWITCHING WAVEFORMS
tw
VCC
50%
SD or CD
GND
tPHL
VCC
CP
50%
50% VCC
O or O
GND
tw
tPLH
1/fmax
tPLH
tPHL
50% VCC
O or O
trec
50% VCC
VCC
O or O
50%
CP
GND
Figure 2.
Figure 3.
VALID
VCC
D
50%
GND
tsu
th
VCC
50%
CP
GND
Figure 4.
TEST CIRCUIT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
Figure 5.
http://onsemi.com
4
MC74LVX74
ORDERING INFORMATION
Package
Shipping†
SOIC−14 NB
(Pb−Free)
2500 Tape & Reel
MC74LVX74DTG
TSSOP−14
(Pb−Free)
96 Units / Rail
MC74LVX74DTR2G
TSSOP−14
(Pb−Free)
2500 Tape & Reel
Device
MC74LVX74DR2G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
SCALE 1:1
D
DATE 03 FEB 2016
A
B
14
8
A3
E
H
L
1
0.25
B
M
DETAIL A
7
13X
M
b
0.25
M
C A
S
B
S
0.10
X 45 _
M
A1
e
DETAIL A
h
A
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
1.27
PITCH
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 2:
CANCELLED
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
DETAIL E
K
A
−V−
K1
J J1
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
G
D
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98ASH70246A
DESCRIPTION:
TSSOP−14 WB
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
工商网监
湘ICP备2023018690号
