TinyLogic UHS Buffer with
Three-State Output
NC7SZ125
Description
The NC7SZ125 is a single buffer with three−state output from
ON Semiconductor’s Ultra−High Speed (UHS) of TinyLogic. The
device is fabricated with advanced CMOS technology to achieve ultra
high speed with high output drive while maintaining low static power
dissipation over a very broad VCC operating range. The device is
specified to operate over the 1.65 V to 5.5 V range. The inputs and
output are high impedance above ground when VCC is 0 V. Inputs
tolerate voltages up to 5.5 V independent of VCC operating voltage.
The output tolerates voltages above VCC when in the 3−STATE
condition.
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MARKING
DIAGRAMS
DDKK
XYZ
SIP6
CASE 127EB
Pin 1
Features
•
•
•
•
•
•
•
•
•
•
Ultra−High Speed: tPD = 2.6 ns (Typical) into 50 pF at 5 V VCC
High Output Drive: ±24 mA at 3 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches Performance of LCX when Operated at 3.3 V VCC
Power Down High−Impedance Inputs / Outputs
Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
Proprietary Noise / EMI Reduction Circuitry
Ultra−Small MicroPak™ Packages
Space−Saving SC−74A and SC−88A Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
DDKK
XYZ
UDFN6
CASE 517DP
Pin 1
SC−74A
CASE 318BQ
SC−88A
CASE 419A−02
7Z25 M•
•
Z25 M•
•
IEEE / IEC
A
OE
1
EN
Y
DD, 7Z25, Z25 = Specific Device Code
KK
= 2−Digit Lot Run Traceability Code
XY
= 2−Digit Date Code Format
Z
= Assembly Plant Code
M
= Date Code
•
= Pb−Free Package
(Microdot may be in either location)
Figure 1. Logic Symbol
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 1996
January, 2021 − Rev. 4
1
Publication Order Number:
NC7SZ125/D
NC7SZ125
Pin Configurations
OE 1
5
OE 1
6 VCC
VCC
A 2
A 2
GND 3
4
Y
5 NC
GND 3
Figure 2. SC−88A and SC−74A (Top View)
4 Y
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
FUNCTION TABLE
Pin # SC−88A /
SC74A
Pin # MicroPak
Name
Inputs
1
1
OE
Input
2
2
A
Input
3
3
GND
Ground
4
4
Y
Output
5
6
VCC
Supply Voltage
5
NC
No Connect
Description
A
Y
L
L
L
L
H
H
H
X
Z
H = HIGH Logic Level
L = LOW Logic Level
X = HIGH or LOW Logic Level
Z = HIGH Impedance State
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2
Output
OE
NC7SZ125
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
VCC
Supply Voltage
−0.5
6.5
V
VIN
DC Input Voltage
−0.5
6.5
V
DC Output Voltage
−0.5
6.5
V
VOUT
Parameter
IIK
DC Input Diode Current
VIN < 0 V
−
−50
mA
IOK
DC Output Diode Current
VOUT < 0 V
−
−50
mA
IOUT
DC Output Current
−
±50
mA
DC VCC or Ground Current
−
±50
mA
−65
+150
°C
ICC or IGND
TSTG
Storage Temperature Range
TJ
Junction Temperature Under Bias
−
+150
°C
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
SC−74A
−
390
mW
SC−88A
−
332
MicroPak−6
−
812
MicroPak2™−6
−
812
Human Body Model, JEDEC: JESD22−A114
−
4000
Charge Device Model, JEDEC: JESD22−C101
−
2000
ESD
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
Parameter
Min
Max
Unit
Supply Voltage Operating
1.65
5.50
V
Supply Voltage Data Retention
1.50
5.50
Input Voltage
Output Voltage
TA
Operating Temperature
tr, tf
Input Rise and Fall Times
JA
Conditions
Thermal Resistance
0
5.5
V
Active State
0
VCC
V
Three−State
0
5.5
−40
+85
°C
VCC at 1.8 V, 2.5 V ±0.2 V
0
20
ns/V
VCC at 3.3 V ±0.3 V
0
10
VCC at 5.0 V ±0.5 V
0
5
SC−74A
−
320
SC−88A
−
377
MicroPak−6
−
154
MicroPak2−6
−
154
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZ125
DC ELECTICAL CHARACTERISTICS
TA = +25°C
Symbol
VIH
VIL
VOH
Parameter
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
Typ
Max
Min
Max
Unit
1.65 to 1.95
0.65 VCC
−
−
0.65 VCC
−
V
2.30 to 5.50
0.70 VCC
−
−
0.70 VCC
−
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.30 to 5.50
−
−
0.30 VCC
−
0.30 VCC
1.55
1.65
−
1.55
−
1.70
1.80
−
1.70
−
2.30
2.20
2.30
−
2.20
−
3.00
2.90
3.00
−
2.90
−
4.50
4.40
4.50
−
4.40
−
VCC (V)
1.65
1.80
VOL
LOW Level Output Voltage
TA = −40 to +85°C
Min
Conditions
VIN = VIH or VIL,
IOH = −100 A
1.65
IOH = −4 mA
1.29
1.52
−
1.29
−
2.30
IOH = −8 mA
1.90
2.15
−
1.90
−
3.00
IOH = −16 mA
2.40
2.80
−
2.40
−
3.00
IOH = −24 mA
2.30
2.68
−
2.30
−
4.50
IOH = −32 mA
3.80
4.20
−
3.80
−
1.65
VIN = VIH or VIL,
IOL = 100 A
−
0.00
0.10
−
0.00
−
0.00
0.10
−
0.10
2.30
−
0.00
0.10
−
0.10
3.00
−
0.00
0.10
−
0.10
4.50
−
0.00
0.10
−
0.10
1.80
1.65
IOL = 4 mA
−
0.80
0.24
−
0.24
2.30
IOL = 8 mA
−
0.10
0.30
−
0.30
3.00
IOL = 16 mA
−
0.15
0.40
−
0.40
3.00
IOL = 24 mA
−
0.22
0.55
−
0.55
4.50
V
V
V
IOL = 32 mA
−
0.22
0.55
−
0.55
1.65 to 5.5
0 ≥ VIN ≥ 5.5 V
−
−
±1
−
±10
A
3−STATE Output Leakage
0 to 5.5
VIN = VIH or VIL
0 ≥ VO ≥ 5.5 V
−
−
±1
−
±10
A
IOFF
Power Off Leakage Current
0
VIN or VOUT = 5.5 V
−
−
1
−
10
A
ICC
Quiescent Supply Current
VIN = 5.5 V, GND
−
−
2
−
20
A
IIN
Input Leakage Current
IOZ
1.65 to 5.50
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4
NC7SZ125
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
TA = −40 to +85°C
Min
Typ
Max
Min
Max
Unit
−
6.4
13.2
−
13.8
ns
−
5.3
11.0
−
11.5
2.50 ±0.20
−
3.4
7.5
−
8.0
3.30 ±0.30
−
2.5
5.2
−
5.5
5.00 ±0.50
−
2.1
4.5
−
4.8
3.30 ±0.30
CL = 50 pF,
RD = 500
5.00 ±0.50 S1 = OPEN
−
3.2
5.7
−
6.0
−
2.6
5.0
−
5.3
CL = 50 pF,
RD = 500
1.80
RU = 500
2.50 ±0.20 S1 = GND for tPZH
S1 = VIN for tPZL
3.30 ±0.30 VIN = 2 · VCC
−
8.4
15.0
−
15.6
−
7.0
12.5
−
13.0
−
4.6
8.5
−
9.0
−
3.5
6.2
−
6.5
5.00 ±0.50
−
2.8
5.5
−
5.8
CL = 50 pF,
1.65
RD = 500
1.80
RU = 500
2.50 ±0.20 S1 = GND for tPHZ
S1 = VIN for tPLZ
3.30 ±0.30 VIN = 2 · VCC
−
6.5
13.2
−
14.5
−
5.4
11.0
−
12.0
−
3.5
8.0
−
8.5
−
2.8
5.7
−
6.0
5.00 ±0.50
−
2.1
4.7
−
5.0
Input Capacitance
0.00
−
4
−
−
−
COUT
Output Capacitance
0.00
−
8
−
−
−
CPD
Power Dissipation Capacitance
(Note 2) (Figure 5)
3.30
−
17
−
−
−
Symbol
Parameter
VCC (V)
tPLH, tPHL
Propagation Delay (Figure 4, 6)
1.65
1.80
tPZL, tPZH
tPLZ, tPHZ
CIN
Output Enable Time
(Figure 4, 6)
Output Disable Time
(Figure 4, 6)
Conditions
CL = 15 pF,
RD = 1 M
S1=OPEN
1.65
ns
pF
pF
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
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5
NC7SZ125
VI
OPEN
GND
VCC
OE INPUT
RU
OUTPUT
INPUT
CL
RD
NOTE:
3. CL includes load and stray capacitance;
Input PRR = 1.0 MHz; tW = 500 ns
Figure 4. AC Test Circuit
VCC
A
OE
OUTPUT
INPUT
NOTE:
4. Input = AC Waveform; tr = tf = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
Figure 5. ICCD Test Circuit
Figure 6. AC Waveforms
ORDERING INFORMATION
Part Number
Top Mark
Operating
Temperature
Packages
Shipping†
NC7SZ125M5X
7Z25
−40 to +85°C
SC−74A
3000 / Tape & Reel
NC7SZ125P5X
Z25
−40 to +85°C
SC−88A
3000 / Tape & Reel
NC7SZ125L6X
DD
−40 to +85°C
MicroPak
5000 / Tape & Reel
NC7SZ125FHX
DD
−40 to +85°C
MicroPak2
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
SCALE 2:1
5X
DATE 18 JAN 2018
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
GENERIC
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
G
2.40
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
5X
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
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1
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