NC7SZ125P5X

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ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. NC7SZ125 TinyLogic® UHS Buffer with Three-State Output Features Description  Ultra-High Speed: tPD 2.6 ns (Typical) into 50 pF at 5 V VCC    High Output Drive: ±24 mA at 3 V VCC   Power Down High-Impedance Inputs/Outputs The NC7SZ125 is a single buffer with three-state output from Fairchild's Ultra-High Speed (UHS) of TinyLogic®. The device is fabricated with advanced CMOS technology to achieve ultra high speed with high output drive while maintaining low static power dissipation over a very broad V CC operating range. The device is specified to operate over the 1.65 V to 5.5 V range. The inputs and output are high impedance above ground when VCC is 0 V. Inputs tolerate voltages up to 6 V independent of VCC operating voltage. The output tolerates voltages above V CC when in the 3STATE condition.    Proprietary Noise/EMI Reduction Circuitry Broad VCC Operating Range: 1.65 V to 5.5 V Matches Performance of LCX Operated at 3.3 V VCC Over-Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation Ultra-Small MicroPak™ Packages Space-Saving SOT23 and SC70 Packages Ordering Information Part Number Top Mark Package Packing Method NC7SZ125M5X 7Z25 5-Lead SOT23, JEDEC MO-178 1.6 mm 3000 Units on Tape & Reel NC7SZ125P5X Z25 5-Lead SC70, EIAJ SC-88a, 1.25 mm Wide 3000 Units on Tape & Reel NC7SZ125L6X DD 6-Lead MicroPak™, 1.00 mm Wide 5000 Units on Tape & Reel NC7SZ125FHX DD 6-Lead, MicroPak2, 1x1 mm Body, .35mm Pitch 5000 Units on Tape & Reel © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 www.fairchildsemi.com NC7SZ125— TinyLogic® UHS Buffer with Three-State Output January 2014 IEEE/IEC Figure 1. Logic Symbol Pin Configurations Figure 2. SC70 and SOT23 (Top View) Figure 3. MicroPak™ (Top Through View) Pin Definitions Pin # SC70 / SOT23 Pin # MicroPak Name 1 1 OE Input 2 2 A Input 3 3 GND Ground 4 4 Y Output 5 6 VCC Supply Voltage 5 NC No Connect NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output Connection Diagrams Description Function Table Inputs Output /OE In A Out Y L L L L H H H X Z H = HIGH Logic Level L = LOW Logic Level X = HIGH or LOW Logic Level Z = HIGH Impedance State © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 www.fairchildsemi.com 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC Supply Voltage -0.5 6.0 V VIN DC Input Voltage -0.5 6.0 V 6.0 V VOUT DC Output Voltage -0.5 VIN < -0.5 V -50 VIN > 6.0 V +20 IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Current ±50 mA DC VCC or Ground Current ±50 mA ICC or IGND TSTG VOUT < -0.5 V -50 VOUT > 6 V, VCC=GND +20 -65 mA +150 °C TJ Junction Temperature Under Bias +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) +260 °C PD Storage Temperature Range mA Power Dissipation at +85°C SOT-23 200 SC70-5 150 MicroPak-6 130 MicroPak2-6 ESD mW 120 Human Body Model, JESD22-A114 4000 Charged Device Model, JESD22-C101 2000 V NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output Absolute Maximum Ratings Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol VCC VIN VOUT TA tr, tf JA Parameter Conditions Min. Max. Supply Voltage Operating 1.65 5.50 Supply Voltage Data Retention 1.50 5.50 0 5.5 Active State 0 VCC Three-State 0 5.5 -40 +85 VCC at 1.8 V, 2.5 V ±0.2 V 0 20 VCC at 3.3 V ±0.3 V 0 10 VCC at 5.0 V ±0.5 V 0 5 Input Voltage Output Voltage Operating Temperature Input Rise and Fall Times Thermal Resistance SOT-23 300 SC70-5 425 MicroPak-6 500 MicroPak2-6 560 Unit V V V °C ns/V °C/W Note: 1. Unused inputs must be held HIGH or LOW. They may not float. © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 www.fairchildsemi.com 3 Symbol Parameter VCC TA=+25°C Conditions Min. Typ. TA=-40 to +85°C Max. Min. Max. VIH HIGH Level Input Voltage 1.65 to 1.95 0.75VCC 0.75VCC 2.30 to 5.50 0.70VCC 0.70VCC VIL LOW Level Input Voltage 1.65 to 1.95 0.25VCC 0.25VCC 2.30 to 5.50 0.30VCC 0.30VCC 1.65 1.80 2.30 VIN=VIH, IOH=-100 µA 3.00 VOH 4.50 HIGH Level Output Voltage 1.55 1.70 1.80 1.70 2.20 2.30 2.20 2.90 3.00 2.90 4.40 4.50 4.40 IOH=-4 mA 1.29 1.52 1.29 2.30 IOH=-8 mA 1.90 2.15 1.90 3.00 IOH=-16 mA 2.40 2.80 2.40 3.00 IOH=-24 mA 2.30 2.68 2.30 4.50 IOH=-32 mA 3.80 4.20 1.80 2.30 VIN=VIL, IOL=100 µA 3.00 4.50 LOW Level Output Voltage 1.65 1.65 1.65 VOL 1.55 Units V V V 3.80 0.00 0.10 0.00 0.00 0.10 0.10 0.00 0.10 0.10 0.00 0.10 0.10 0.00 0.10 0.10 1.65 IOL=4 mA 0.80 0.24 0.24 2.30 IOL=8 mA 0.10 0.30 0.30 3.00 IOL=16 mA 0.15 0.40 0.40 3.00 IOL=24 mA 0.22 0.55 0.55 4.50 IOL=32 mA 0.22 0.55 0.55 V IIN Input Leakage Current 0 to 5.5 0 ≥ VIN ≥ 5.5 V ±1 ±10 µA IOZ 3-STATE Output Leakage 0 to 5.5 VIN=VIH or VIL 0 ≥ VO ≥ 5.5 V ±1 ±10 µA IOFF Power Off Leakage Current 0 VIN or VOUT=5.5 V 1 10 µA ICC Quiescent Supply Current VIN=5.5 V, GND 2 20 µA 1.65 to 5.50 © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output DC Electrical Characteristics www.fairchildsemi.com 4 Symbol tPLH,tPHL Parameter Propagation Delay VCC 1.65 1.80 2.50 ±0.20 3.30 ±0.30 5.00 ±0.50 3.30 ±0.30 5.00 ±0.50 tPZL,tPZH Output Enable Time tPLZ,tPHZ Output Disable Time CIN COUT Input Capacitance Output Capacitance CPD Power Dissipation (2) Capacitance 1.65 1.80 2.50 ±0.20 3.30 ±0.30 5.00 ±0.50 1.65 1.80 2.50 ±0.20 3.30 ±0.30 5.00 ±0.50 0.00 0.00 3.30 TA=+25°C Min. Typ. Max. Conditions CL=15 pF, RD=1 M S1=OPEN CL=50 pF, RD=500  S1=OPEN CL=50 pF, RD=500  RU=500  S1=GND for tPZH S1=VIN for tPZL VIN=2•VCC CL=50 pF, RD=500  RU=500  S1=GND for tPHZ S1=VIN for tPLZ VIN=2•VCC 5.00 2.0 2.0 0.8 0.5 0.5 1.5 6.4 5.3 3.4 2.5 2.1 3.2 0.8 2.0 2.0 1.5 1.5 0.8 2.0 2.0 1.5 1.0 0.5 TA=-40 to +85°C Units Min. Max. 13.2 11.0 7.5 5.2 4.5 5.7 2.0 2.0 0.8 0.5 0.5 1.5 13.8 11.5 8.0 5.5 4.8 6.0 2.6 5.0 0.8 5.3 8.4 7.0 4.6 3.5 2.8 6.5 5.4 3.5 2.8 2.1 4 8 17 15.0 12.5 8.5 6.2 5.5 13.2 11.0 8.0 5.7 4.7 2.0 2.0 1.5 1.5 0.8 2.0 2.0 1.5 1.0 0.5 15.6 13.0 9.0 6.5 5.8 14.5 12.0 8.5 6.0 5.0 Figure ns Figure 4 Figure 6 ns Figure 4 Figure 6 pF pF 24 Figure 5 Note: 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output lading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic). NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output AC Electrical Characteristics Note: 3. CL includes load and stray capacitance. Input PRR=1.0 MHz, tW =500 ns. Figure 4. AC Test Circuit Note: 4. Input=AC Waveform; tr=tf=1.8 ns; PRR=10 MHz; Duty Cycle=50%. Figure 5. ICCD Test Circuit © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 Figure 6. AC Waveforms www.fairchildsemi.com 5 NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output Physical Dimensions 3.00 2.80 5 SYMM CL 0.95 0.95 A 4 B 3.00 2.60 1.70 1.50 1 2 2.60 3 (0.30) 1.00 0.50 0.30 0.95 0.20 1.90 C A B 0.70 TOP VIEW LAND PATTERN RECOMMENDATION SEE DETAIL A 1.30 0.90 1.45 MAX 0.15 0.05 0.22 0.08 C 0.10 C NOTES: UNLESS OTHEWISE SPECIFIED GAGE PLANE A) THIS PACKAGE CONFORMS TO JEDEC MO-178, ISSUE B, VARIATION AA, B) ALL DIMENSIONS ARE IN MILLIMETERS. C) MA05Brev5 0.25 8° 0° 0.55 0.35 0.60 REF SEATING PLANE Figure 7. 5-Lead SOT23, JEDEC MO-178 1.6 mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/MA/MA05B.pdf. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/SOT23-5L_tr.pdf. Package Designator M5X © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 6 NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output Physical Dimensions Figure 8. 5-Lead, SC70, EIAJ SC-88a, 1.25 mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/MA/MAA05A.pdf. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-5_tr.pdf. Package Designator P5X © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 7 NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output Physical Dimensions 2X 0.05 C 1.45 B 2X (1) 0.05 C (0.254) (0.49) 5X 1.00 (0.75) PIN 1 IDENTIFIER 5 (0.52) 1X A TOP VIEW 0.55MAX (0.30) 6X PIN 1 0.05 C 0.05 0.00 RECOMMENED LAND PATTERN 0.05 C C 1.0 DETAIL A 0.10 0.05 0.45 0.35 0.10 0.00 6X 0.25 0.15 6X C B A C 0.40 0.30 0.35 5X 0.25 0.40 5X 0.30 0.5 (0.05) 6X BOTTOM VIEW DETAIL A PIN 1 TERMINAL 0.075 X 45 CHAMFER (0.13) 4X Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 4. FILENAME AND REVISION: MAC06AREV4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. Figure 9. 6-Lead, MicroPak™, 1.0 mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/MA/MAC06A.pdf. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator L6X © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 8 NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output Physical Dimensions 0.89 0.35 0.05 C 1.00±0.050 2X B A 5X 0.40 PIN 1 MIN 250uM 0.66 1.00±0.050 1X 0.45 6X 0.19 0.05 C TOP VIEW RECOMMENDED LAND PATTERN FOR SPACE CONSTRAINED PCB 2X 0.90 0.05 C 0.35 0.50±0.05 C 5X 0.52 SIDE VIEW 0.73 1X 0.57 6X (0.08) 4X 1 DETAIL A 2 3 0.14±0.05 0.20 6X ALTERNATIVE LAND PATTERN FOR UNIVERSAL APPLICATION (0.05) 6X 5X 0.30±0.05 6 5 4 0.60 0.35 (0.08) 4X 0.10 .05 C C B A 0.35±0.050 BOTTOM VIEW NOTES: A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009 D. LANDPATTERN RECOMMENDATION IS BASED ON FSC DESIGN. E. DRAWING FILENAME AND REVISION: MGF06AREV4 F. FAIRCHILD SEMICONDUCTOR 0.075X45° CHAMFER DETAIL A PIN 1 LEAD SCALE: 2X Figure 10. 6-Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/MG/MGF06A.pdf. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator FHX © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 9 NC7SZ125 — TinyLogic® UHS Buffer with Three-State Output © 1996 Fairchild Semiconductor Corporation NC7SZ125 • Rev. 1.0.5 www.fairchildsemi.com 10 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. 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