DATA SHEET
www.onsemi.com
TinyLogic UHS Inverter
with Schmitt Trigger Input
MARKING
DIAGRAMS
NC7SZ14
Description
Pin 1
The NC7SZ14 is a single inverter with Schmitt trigger input from
onsemi’s Ultra−High Speed (UHS) series of TinyLogic. The device is
fabricated w ith advanced CMOS technology to achieve ultra−high
speed with high output drive while maintaining low static power
dissipation over a very broad VCC operating range. The device is
specified to operate over the 1.65 V to 5.5 V VCC range. The inputs
and outputs are high−impedance when VCC is 0 V. Inputs tolerate
voltages up to 5.5 V independent of VCC operating voltage.
UDFN6
CASE 517DP
SC−74A
CASE 318BQ
Ultra−High Speed: tPD = 3.7 ns (Typical) into 50 pF at 5 V VCC
High Output Drive: ±24 mA at 3 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches Performance of LCX when Operated at 3.3 V VCC
Power Down High Impedance Inputs / Outputs
Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
Proprietary Noise / EMI Reduction Circuitry
Ultra−Small MicroPak™ Packages
Space−Saving SOT23−5, SC−74A and SC−88A Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A
1
SOT23−5
CASE 527AH
SC−88A
CASE 419A−02
B6, 7Z14, Z14
KK
XY
Z
M
G
IEEC / IEC
Y
Figure 1. Logic Symbol
B6KK
XYZ
Pin 1
Features
•
•
•
•
•
•
•
•
•
•
B6KK
XYZ
SIP6
CASE 127EB
7Z14M G
G
7Z14 M
Z14M G
G
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 1996
June, 2022 − Rev. 6
1
Publication Order Number:
NC7SZ14/D
NC7SZ14
Pin Configurations
NC 1
5
NC 1
VCC
A 2
A 2
GND 3
4
Y
GND 3
Figure 2. SOT23−5, SC−88A and SC−74A
(Top View)
6 VCC
5 NC
4 Y
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
FUNCTION TABLE
Pin # SC−88A /
SC74A/
SOT23−5
Pin # MicroPak
Name
1
1, 5
NC
2
2
A
3
3
GND
Ground
4
4
Y
Output
5
6
VCC
Description
No Connect
Input
Inputs
Output
A
Y
L
H
H
L
H = HIGH Logic Level
L = LOW Logic Level
Supply Voltage
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
VCC
Supply Voltage
−0.5
6.5
V
VIN
DC Input Voltage
−0.5
6.5
V
DC Output Voltage
−0.5
6.5
V
VOUT
Parameter
IIK
DC Input Diode Current
VIN < 0 V
−
−50
mA
IOK
DC Output Diode Current
VOUT < 0 V
−
−50
mA
IOUT
DC Output Current
−
±50
mA
DC VCC or Ground Current
−
±50
mA
−65
+150
°C
ICC or IGND
TSTG
Storage Temperature Range
TJ
Junction Temperature Under Bias
−
+150
°C
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
SC−74A / SOT23−5
−
390
mW
SC−88A
−
332
MicroPak−6
−
812
MicroPak2™−6
−
812
Human Body Model, JEDEC: JESD22−A114
−
2000
Charge Device Model, JEDEC: JESD22−C101
−
1000
ESD
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com
2
NC7SZ14
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
Min
Max
Unit
Supply Voltage Operating
Parameter
1.65
5.5
V
Supply Voltage Data Retention
1.5
5.5
Input Voltage
0
5.5
V
Output Voltage
0
VCC
V
−40
+85
°C
SC−74A / SOT23−5
−
320
°C/W
SC−88A
−
377
MicroPak−6
−
154
MicroPak2−6
−
154
TA
Operating Temperature
qJA
Thermal Resistance
Conditions
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTRICAL CHARACTERISTICS
TA = +25°C
Min
Typ
Max
Min
Max
Unit
1.65
−
1.00
1.40
−
1.40
V
1.80
−
1.10
1.50
−
1.50
2.30
−
1.40
1.80
−
1.80
3.00
−
1.75
2.20
−
2.20
4.50
−
2.45
3.10
−
3.10
5.50
−
2.90
3.60
−
3.60
1.65
0.20
0.50
−
0.20
−
1.80
0.25
0.55
−
0.25
−
2.30
0.40
0.75
−
0.40
−
3.00
0.60
1.00
−
0.60
−
4.50
1.00
1.43
−
1.00
−
5.50
1.20
1.70
−
1.20
−
1.65
0.10
0.48
0.90
0.10
0.90
1.80
0.15
0.54
1.00
0.15
1.00
2.30
0.25
0.65
1.10
0.25
1.10
3.00
0.40
0.77
1.20
0.40
1.20
4.50
0.60
1.01
1.50
0.60
1.50
5.50
0.70
1.18
1.70
0.70
1.70
Symbol
Parameter
VCC (V)
VP
Positive Threshold Voltage
VN
VH
Negative Threshold Voltage
Hysteresis Voltage
TA = −40 to +85°C
Conditions
www.onsemi.com
3
V
V
NC7SZ14
DC ELECTRICAL CHARACTERISTICS (continued)
TA = −40 to +85°C
TA = +25°C
Conditions
Min
Typ
Max
Min
Max
Unit
VIN = VP or VN,
IOH = −100 mA
1.55
1.65
−
1.55
−
V
1.70
1.80
−
1.70
−
2.30
2.20
2.30
−
2.20
−
3.00
2.90
3.00
−
2.90
−
Symbol
Parameter
VCC (V)
VOH
HIGH Level Output Voltage
1.65
1.80
4.50
VOL
LOW Level Output Voltage
4.40
4.50
−
4.40
−
1.65
IOH = −4 mA
1.29
1.52
−
1.29
−
2.30
IOH = −8 mA
1.90
2.15
−
1.90
−
3.00
IOH = −16 mA
2.40
2.80
−
2.40
−
3.00
IOH = −24 mA
2.30
2.68
−
2.30
−
4.50
IOH = −32 mA
3.80
4.20
−
3.80
−
1.65
VIN = VP or VN,
IOL = 100 mA
−
0.00
0.10
−
0.10
−
0.00
0.10
−
0.10
2.30
−
0.00
0.10
−
0.10
3.00
−
0.00
0.10
−
0.10
4.50
−
0.00
0.10
−
0.10
1.80
IIN
Input Leakage Current
IOFF
Power Off Leakage Current
ICC
Quiescent Supply Current
V
1.65
IOL = 4 mA
−
0.08
0.24
−
0.24
2.30
IOL = 8 mA
−
0.10
0.30
−
0.30
3.00
IOL = 16 mA
−
0.15
0.40
−
0.40
3.00
IOL = 24 mA
−
0.22
0.55
−
0.55
4.50
IOL = 32 mA
−
0.22
0.55
−
0.55
VIN = 5.5 V, GND
−
−
±0.1
−
±1.0
mA
VIN or VOUT = 5.5 V
−
−
1
−
10
mA
VIN = 5.5 V, GND
−
−
1.0
−
10
mA
1.65 to 5.5
0
1.65 to 5.5
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
tPLH, tPHL
Parameter
Propagation Delay
(Figure 4, 5)
VCC (V)
Conditions
CL = 15 pF,
RL = 1 MW
1.65
1.80
TA = −40 to +85°C
Min
Typ
Max
Min
Max
Unit
−
9.1
15.0
−
15.6
ns
−
7.6
12.5
−
13.0
2.50 ±0.20
−
5.0
9.0
−
9.5
3.30 ±0.30
−
3.7
6.3
−
6.5
5.00 ±0.50
−
3.1
5.2
−
5.5
−
4.4
7.2
−
7.5
−
3.7
5.9
−
6.2
3.30 ±0.30
5.00 ±0.50
CL = 50 pF,
RL = 500 W
CIN
Input Capacitance
0.00
−
4
−
−
−
pF
CPD
Power Dissipation Capacitance
(Note 2) (Figure 6)
3.30
−
24
−
−
−
pF
5.00
−
30
−
−
−
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
www.onsemi.com
4
NC7SZ14
tr = 3 ns
tf = 3 ns
90%
VCC
50%
INPUT
INPUT
10%
OUTPUT
CL
RL
NOTE:
4. CL includes load and stray capacitance;
Input PRR = 1.0 MHz; tW = 500 ns
90%
50%
10%
TW
tPLH
OUTPUT
VCC
tPHL
50%
GND
VOH
50%
VOL
Figure 4. AC Test Circuit
Figure 5. AC Waveforms
VCC
A
INPUT
NOTE:
3. Input = AC Waveform; tr = tf = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
Figure 6. ICCD Test Circuit
ORDERING INFORMATION
Top Mark
Operating Temperature
Packages
Shipping†
NC7SZ14M5X
7Z14
−40 to +85°C
SC−74A
3000 / Tape & Reel
NC7SZ14M5X−L22090
7Z14
−40 to +85°C
SOT23−5
3000 / Tape & Reel
NC7SZ14P5X
Z14
−40 to +85°C
SC−88A
3000 / Tape & Reel
NC7SZ14P5X−L22057
Z14
−40 to +85°C
SC−88A
3000 / Tape & Reel
NC7SZ14L6X
B6
−40 to +85°C
SIP6, MicroPak
5000 / Tape & Reel
NC7SZ14L6X−L22175
B6
−40 to +85°C
SIP6, MicroPak
5000 / Tape & Reel
NC7SZ14FHX
B6
−40 to +85°C
UDFN6, MicroPak2
5000 / Tape & Reel
NC7SZ14FHX−L22175
B6
−40 to +85°C
UDFN6, MicroPak2
5000 / Tape & Reel
Part Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
www.onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
SCALE 2:1
5X
DATE 18 JAN 2018
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
GENERIC
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
G
2.40
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
5X
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC−01
ISSUE A
D
e
e
E1 E
DATE 29 JUN 2010
SYMBOL
MIN
A
0.80
MAX
1.10
A1
0.00
0.10
A2
0.80
1.00
b
0.15
0.30
0.18
c
0.10
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
0.65 BSC
e
L
TOP VIEW
NOM
0.26
0.36
L1
0.42 REF
L2
0.15 BSC
0.46
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
b
q1
L
L1
A1
SIDE VIEW
c
L2
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34260E
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70 5 LEAD), 1.25X2
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
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