NL17SZ38DBVT1G

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 2-Input NAND Gate, Open Drain Output NL17SZ38 The NL17SZ38 is a single 2−Input NAND gate with open drain output operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • www.onsemi.com Designed for 1.65 V to 5.5 V VCC Operation 2.4 ns tPD at VCC = 5 V (Typ) Inputs/Outputs Overvoltage Tolerant up to 5.5 V IOFF Supports Partial Power Down Protection Sink 32 mA at 4.5 V Available in SC−88, SC−74 and UDFN6 Packages Chip Complexity < 100 FETs These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MARKING DIAGRAMS IEEC / IEC A B & Y 1 Figure 1. Logic Symbol SC−88A DF SUFFIX CASE 419A XXXMG G SC−74A DBV SUFFIX CASE 318BQ XXX MG G UDFN6 1.45 x 1.0 CASE 517AQ XM UDFN6 1.0 x 1.0 CASE 517BX XM 1 X, XXX = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2019 October, 2020 − Rev. 1 1 Publication Order Number: NL17SZ38/D NL17SZ38 B 1 5 VCC B 1 6 VCC A 2 5 NC GND 3 4 Y OVT A 2 GND 3 Y 4 SC−88A / SC−74A UDFN6 Figure 2. Pinout (Top View) PIN ASSIGNMENT (SC−88A/SC−74A) PIN ASSIGNMENT (UDFN) Pin Function Pin Function 1 B 1 B 2 A 2 A 3 GND 3 GND 4 Y 4 Y 5 VCC 5 NC 6 VCC FUNCTION TABLE Inputs Output A B Y L L Z L H Z H L Z H H L www.onsemi.com 2 NL17SZ38 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +6.5 V VIN DC Input Voltage −0.5 to +6.5 V −0.5 to VCC + 0.5 −0.5 to +6.5 −0.5 to +6.5 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Characteristics DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±100 mA ICC or IGND TSTG −65 to +150 °C TL Storage Temperature Range Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88A SC−74A UDFN6 377 320 154 °C/W PD Power Dissipation in Still Air SC−88A SC−74A UDFN6 332 390 812 mW Level 1 − MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 2000 1000 V $100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Rise and Fall Time VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V Min Max Unit 1.65 5.5 V 0 5.5 V 0 0 0 VCC 5.5 5.5 −55 +125 °C 0 0 0 0 20 20 10 5 ns Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 NL17SZ38 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOL TA = 255C −555C 3 TA 3 1255C VCC (V) Min Typ Max Min Max Units High−Level Input Voltage 1.65 to 1.95 0.65 VCC − − 0.65 VCC − V 2.3 to 5.5 0.70 VCC − − 0.70 VCC − Low−Level Input Voltage 1.65 to 1.95 − − 0.35 VCC − 0.35 VCC 2.3 to 5.5 − − 0.30 VCC − 0.30 VCC Parameter Condition V Low−Level Output Voltage VIN = VIH or VIL IOH = 100 mA IOH = 4 mA IOH = 8 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA 1.65 to 5.5 1.65 2.3 3 3 4.5 − − − − − − − 0.08 0.12 0.24 0.26 0.31 0.1 0.24 0.3 0.4 0.55 0.55 − − − − − − 0.1 0.24 0.3 0.4 0.55 0.55 Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 − − ±0.1 − ±1.0 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 − − 1.0 − 10 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 − − 1.0 − 10 mA IOZ 3−State Output Leakage Current VOUT = 0 V to 5.5 V 1.65 to 5.5 − − ±0.5 − ±5.0 mA IIN V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS TA = +25°C Symbol tPZL tPLZ Parameter Propagation Delay, (A or B) to Y (Figure 3, 4) Propagation Delay, (A or B) to Y (Figure 3, 4) Conditions TA = −40 to +85°C VCC (V) Min Typ Max Min Max Unit 1.65 to 1.95 − 6.5 12.7 − 13.2 ns 2.3 to 2.7 − 3.5 7.0 − 7.5 3.0 to 3.6 − 2.8 5.0 − 5.2 4.5 to 5.5 − 2.8 5.0 − 5.2 1.65 to 1.95 − 5.5 12.7 − 13.2 2.3 to 2.7 − 3.0 7.0 − 7.5 3.0 to 3.6 − 2.1 6.0 − 5.2 4.5 to 5.5 − 1.3 4.3 − 4.5 ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF 5. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). www.onsemi.com 4 NL17SZ38 OPEN 2 x VCC Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC 50 500 500 tPHZ / tPZH GND 50 500 500 GND R1 OUTPUT DUT RL RT CL, pF RL, W R1 , W See AC Characteristics Table X = Don’t Care CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ ~VCC VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH OUTPUT tPHL Vmo tPZH VOH Vmo tPHZ VOH VOH − VY Vmo OUTPUT VOL ~0 V Figure 4. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL 1.65 to 1.95 VCC / 2 VCC / 2 VCC / 2 0.15 2.3 to 2.7 VCC / 2 VCC / 2 VCC / 2 0.15 3.0 to 3.6 VCC / 2 VCC / 2 VCC / 2 0.3 4.5 to 5.5 VCC / 2 VCC / 2 VCC / 2 0.3 www.onsemi.com 5 tPZL, tPLZ, tPZH, tPHZ VY, V NL17SZ38 DEVICE ORDERING INFORMATION Packages Specific Device Code Pin 1 Orientation (See below) Shipping† NL17SZ38DFT2G (In Development) SC−88A TBD Q4 3000 / Tape & Reel NL17SZ38DBVT1G SC−74A AT Q4 3000 / Tape & Reel NL17SZ38MU1TCG (In Development) UDFN6, 1.45 x 1.0, 0.5P TBD Q4 3000 / Tape & Reel NL17SZ38MU3TCG (In Development) UDFN6, 1.0 x 1.0, 0.35P TBD Q4 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Pin 1 Orientation in Tape and Reel www.onsemi.com 6 NL17SZ38 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ38 PACKAGE DIMENSIONS SC−74A CASE 318BQ ISSUE B 5X b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 L DETAIL A e A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. TOP VIEW A SIDE VIEW C DETAIL A c SEATING PLANE END VIEW DIM A A1 b c D E E1 e L M MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ RECOMMENDED SOLDERING FOOTPRINT* 0.95 PITCH 2.40 5X 1.00 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 NL17SZ38 PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉÉ ÉÉÉ EXPOSED Cu TOP VIEW 0.10 C DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 SIDE VIEW A2 e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 www.onsemi.com 9 NL17SZ38 PACKAGE DIMENSIONS UDFN6, 1x1, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X 0.08 C 2X ÉÉÉ ÉÉÉ 0.08 C 0.05 C L1 A B D L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. L3 E DETAIL A ALTERNATE TERMINAL CONSTRUCTION ÉÉ ÉÉ ÇÇ TOP VIEW EXPOSED Cu DETAIL B A3 A1 MOLD CMPD DETAIL B A ALTERNATE CONSTRUCTION 0.05 C SIDE VIEW C SEATING PLANE 3 1 6X MILLIMETERS MIN MAX 0.50 0.65 0.00 0.05 0.13 REF 0.17 0.23 1.00 BSC 1.00 BSC 0.35 0.20 0.40 −−− 0.15 0.26 0.33 RECOMMENDED SOLDERING FOOTPRINT* e DETAIL A DIM A A1 A3 b D E e L L1 L3 L 6X 0.25 6X 0.52 1.20 6 4 BOTTOM VIEW 6X PACKAGE OUTLINE b 0.07 M C A B 0.05 M C 1 0.35 PITCH NOTE 3 DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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