NLAS3799BLMNR2G

NLAS3799B, NLAS3799BL Dual DPDT Ultra-Low RON Switch The NLAS3799B is an ultra−low RON dual DPDT and a 0.5  RON analog switch. This device is designed for low operating voltage, high current switching of speaker output and earpiece for cellphone applications. It can switch a balanced stereo output. The NLAS3799B can handle a balanced microphone/speaker/ring−tone generator in a monophone mode. The device contains a break−before−make (BBM) feature. http://onsemi.com MARKING DIAGRAMS 1 • Single Supply Operation • • • • 1.65 to 4.5 V VCC Function Directly from LiON Battery Maximum Breakdown Voltage: 5.5 V Low Static Power NLAS3799B Interfaces with 2.8 V Chipset NLAS3799BL Interfaces with 1.8 V Chipset These are Pb−Free Devices ÇÇ ÇÇ 16 1 1 Cell Phone Speaker/Microphone Switching Ringtone−Chip/Amplifier Switching Four Unbalanced (Single−Ended) Switches Stereo Balanced (Push−Pull) Switching XXMG G UQFN−16 CASE 488AU XX Important Information • ESD Protection: • • • XXMG G WQFN−16 CASE 488AP 1 Typical Applications • • • • ÇÇ ÇÇ 16 Features Human Body Model (HBM) > 8000 V Machine Model (MM) > 400 V Continuous Current Rating Through each Switch ±300 mA Conforms to: JEDEC MO−220, Issue H, Variation VEED−6 Package: ♦ 1.8 x 2.6 x 0.75 mm WQFN−16 Pb−Free ♦ 1.8 x 2.6 x 0.55 mm UQFN−16 Pb−Free = Specific Device Code AK = NLAS3799BMNR2G AL = NLAS3799BLMNR2G AX = NLAS3799BMUR2G M = Date Code/Assembly Location G = Pb−Free Package (Note: Microdot may be in either location) COMA NOA Vcc NCD 16 15 14 13 NCA 1 12 COMD A−B IN 2 11 NOD NOB 3 10 C−D IN COMB 4 9 NCC 5 6 7 8 NCB GND NOCCOMC ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. © Semiconductor Components Industries, LLC, 2008 July, 2008 − Rev. 3 1 Publication Order Number: NLAS3799B/D NLAS3799B, NLAS3799BL COM NC NO IN Figure 1. Input Equivalent Circuit PIN DESCRIPTION QFN PIN # Symbol Name and Function 1, 3, 5, 7, 9, 11, 13, 15 NO A−D, NC A−D Independent Channels 2, 10 A−B IN, C−D IN 4, 8, 12, 16 COM A−D Controls 6 GND Ground (V) 14 VCC Positive Supply Voltage Common Channels TRUTH TABLE IN NO NC H ON OFF* L OFF* ON *High impedance. http://onsemi.com 2 NLAS3799B, NLAS3799BL MAXIMUM RATINGS Symbol Parameter Value Unit −0.5 to +5.5 V −0.5 v VIS v VCC + 0.5 V −0.5 v VIN v +VCC V Continuous DC Current from COM to NC/NO ±300 mA Ianl−pk1 Peak Current from COM to NC/NO, 10 Duty Cycle (Note 1) ±500 mA Iclmp Continuous DC Current into COM/NO/NC with Respect to VCC or GND ±100 mA VCC Positive DC Supply Voltage VIS Analog Input Voltage (VNO, VNC, or VCOM) VIN Digital Select Input Voltage Ianl1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Defined as 10% ON, 90% OFF Duty Cycle. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC DC Supply Voltage 1.65 4.5 V VIN Digital Select Input Voltage GND VCC V VIS Analog Input Voltage (NC, NO, COM) GND VCC V TA Operating Temperature Range −40 +85 °C tr, tf Input Rise or Fall Time, IN 20 10 ns/V VCC = 1.6 V − 2.7 V VCC = 3.0 V − 4.5 V http://onsemi.com 3 NLAS3799B, NLAS3799BL NLAS3799B DC CHARACTERISTICS − DIGITAL SECTION (Voltages Referenced to GND) Guaranteed Limit Symbol Parameter Condition VCC 25°C −40°C to +85°C Unit VIH Minimum High−Level Input Voltage, Select Inputs 3.0 4.3 1.4 2.0 1.4 2.0 V VIL Maximum Low−Level Input Voltage, Select Inputs 3.0 4.3 0.5 0.8 0.5 0.8 V IIN Maximum Input Leakage Current, Select Inputs VIN = VCC or GND 4.3 ±0.1 ±1.0 A IOFF Power Off Leakage Current VIN = 4.5 V or GND 0 ±0.5 ±2.0 A ICC Maximum Quiescent Supply Current (Note 2) Select and VIS = VCC or GND 1.65 to 4.5 ±1.0 ±2.0 A 2. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. NLAS3799B DC ELECTRICAL CHARACTERISTICS − ANALOG SECTION Guaranteed Maximum Limit 25°C Symbol Parameter Condition VCC Min −40°C to +85°C Max Min Max Unit RON NC/NO On−Resistance (Note 3) VIN = VIL or VIN = VIH VIS = GND to VCC IINI = 100 mA 3.0 4.3 0.5 0.4 0.6 0.5  RFLAT NC/NO On−Resistance Flatness (Notes 3 and 4) ICOM = 100 mA VIS = 0 to VCC 3.0 4.3 0.15 0.15 0.15 0.15  RON On−Resistance Match Between Channels (Notes 3 and 5) VIS = 1.5 V; ICOM = 100 mA VIS = 2.2 V; ICOM = 100 mA 3.0 0.05 0.05  4.3 0.05 0.05 INC(OFF) INO(OFF) NC or NO Off Leakage Current (Note 3) VIN = VIL or VIH VNO or VNC = 0.3 V VCOM = 4.0 V 4.3 −10 10 −100 100 nA ICOM(ON) COM ON Leakage Current (Note 3) VIN = VIL or VIH VNO 0.3 V or 4.0 V with VNC floating or VNC 0.3 V or 4.0 V with VNO floating VCOM = 0.3 V or 4.0 V 4.3 −10 10 −100 100 nA 3. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. 4. Flatness is defined as the difference between the maximum and minimum value of On−resistance as measured over the specified analog signal ranges. 5. RON = RON(MAX) − RON(MIN) between NCn or NOn. http://onsemi.com 4 NLAS3799B, NLAS3799BL NLAS3799BL DC CHARACTERISTICS − DIGITAL SECTION (Voltages Referenced to GND) Guaranteed Limit Symbol Parameter Condition VCC 25°C −40 to +85°C Unit VIH Minimum High−Level Input Voltage, Select Inputs 3.0 4.3 1.3 1.6 1.3 1.6 V VIL Maximum Low−Level Input Voltage, Select Inputs 3.0 4.3 0.5 0.6 0.5 0.6 V IIN Maximum Input Leakage Current, Select Inputs VIN = VCC or GND 4.3 ±0.1 ±1.0 A IOFF Power Off Leakage Current VIN = 4.5 V or GND 0 ±0.5 ±2.0 A ICC Maximum Quiescent Supply Current (Note 6) Select and VIS = VCC or GND 1.65 to 4.3 ±40 ±45 A 6. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. NLAS3799BL DC ELECTRICAL CHARACTERISTICS − ANALOG SECTION Guaranteed Maximum Limit 25°C Max Unit RON NC/NO On−Resistance (Note 7) VIN = VIL or VIN = VIH VIS = GND to VCC IINI = 100 mA 3.0 4.3 0.5 0.4 0.6 0.5  RFLAT NC/NO On−Resistance Flatness (Notes 7 and 8) ICOM = 100 mA VIS = 0 to VCC 3.0 4.3 0.15 0.15 0.15 0.15  RON On−Resistance Match Between Channels (Notes 7 and 9) VIS = 1.5 V; ICOM = 100 mA VIS = 2.2 V; ICOM = 100 mA 3.0 0.05 0.05  4.3 0.05 0.05 INC(OFF) INO(OFF) NC or NO Off Leakage Current (Note 7) VIN = VIL or VIH VNO or VNC = 0.3 V VCOM = 4.0 V 4.3 −10 10 −100 100 nA ICOM(ON) COM ON Leakage Current (Note 7) VIN = VIL or VIH VNO 0.3 V or 4.0 V with VNC floating or VNC 0.3 V or 4.0 V with VNO floating VCOM = 0.3 V or 4.0 V 4.3 −10 10 −100 100 nA Symbol Parameter Condition VCC Min −40°C to +85°C Max Min 7. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. 8. Flatness is defined as the difference between the maximum and minimum value of On−resistance as measured over the specified analog signal ranges. 9. RON = RON(MAX) − RON(MIN) between NC1 and NC2 or between NO1 and NO2. http://onsemi.com 5 NLAS3799B, NLAS3799BL NLAS3799B/NLAS3799BL AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Maximum Limit Symbol Parameter Test Conditions VCC (V) VIS (V) −40°C to +85°C 25°C Min Typ* Max Min Max Unit tON Turn−On Time RL = 50 , CL = 35 pF (Figures 3 and 4) 2.3 − 4.3 1.5 50 60 ns tOFF Turn−Off Time RL = 50 , CL = 35 pF (Figures 3 and 4) 2.3 − 4.3 1.5 30 40 ns tBBM Minimum Break−Before−Make Time VIS = 3.0 RL = 50 , CL = 35 pF (Figure 2) 3.0 1.5 2 ns 15 Typical @ 25, VCC = 3.6 V CIN Control Pin Input Capacitance 3.0 pF CSN SN Port Capacitance 72 pF CD D Port Capacitance When Switch is Enabled 220 pF *Typical Characteristics are at 25°C. ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) Symbol Parameter Condition 25°C VCC (V) Typical Unit BW Maximum On−Channel −3 dB Bandwidth or Minimum Frequency Response (Figure 9) VIN centered between VCC and GND (Figure 5) 1.65 − 4.5 19 MHz VONL Maximum Feed−through On Loss VIN = 0 dBm @ 100 kHz to 50 MHz VIN centered between VCC and GND (Figure 5) 1.65 − 4.5 −0.06 dB VISO Off−Channel Isolation f = 100 kHz; VIS = 1 V RMS; CL = 5.0 pF VIN centered between VCC and GND(Figure 5) 1.65 − 4.5 −69 dB Q Charge Injection Select Input to Common I/O (Figure 8) VIN = VCC to GND, RIS = 0 , CL = 1.0 nF Q = CL x VOUT (Figure 6) 1.65 − 4.5 51 pC THD Total Harmonic Distortion THD + Noise (Figure 7) FIS = 20 Hz to 20 kHz, RL = Rgen = 600 , CL = 50 pF VIS = 2 VPP 4.3 0.042 % VCT Channel−to−Channel Crosstalk (Figure 10) f = 100 kHz; VIS = 1.0 V RMS, CL = 5.0 pF, RL = 50  VIN centered between VCC and GND (Figure 5) 1.65 − 4.5 −90 dB 10. Off−Channel Isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to off switch. http://onsemi.com 6 NLAS3799B, NLAS3799BL VCC DUT VCC Input Output GND VOUT 0.1 F 50  tBMM 35 pF 90% 90% of VOH Output Switch Select Pin GND Figure 2. tBBM (Time Break−Before−Make) VCC Input DUT VCC 0.1 F 50% Output VOUT Open 50% 0V 50  VOH 90% 35 pF 90% Output VOL Input tON tOFF Figure 3. tON/tOFF VCC VCC Input DUT Output 50% 50  VOUT Open 50% 0V VOH 35 pF Output 10% VOL Input tOFF Figure 4. tON/tOFF http://onsemi.com 7 10% tON NLAS3799B, NLAS3799BL 50  DUT Reference Transmitted Input Output 50  Generator 50  Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50  Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT VCC VIN Output Open GND CL Output Off VIN Figure 6. Charge Injection: (Q) http://onsemi.com 8 On Off VOUT NLAS3799B, NLAS3799BL 20 0.040 10 CHARGE INJECTION “Q” (pC) 0.045 0.035 THD (%) 0.030 0.025 0.020 0.015 0.010 0.005 0 10 100 1000 10000 0 −10 −20 −30 −40 −50 −60 100000 0 0.5 1 1.5 Figure 7. Total Harmonic Distortion vs. Frequency 3.5 4 4.5 0 −10 −3 −20 MAGNITUDE (dB) −6 BW (dB) 3 Figure 8. Charge Injection @ 0 V < VCC < 4.5 V 0 −9 −12 −15 −30 −40 −50 −60 −70 −80 −18 −90 −21 0.01 0.1 1 10 100 −100 0.01 1000 0.1 FREQUENCY (MHz) 1 10 100 FREQUENCY (MHz) Figure 9. Bandwidth vs. Frequency Figure 10. Cross−Talk vs. Frequency 0.6 0.7 0.6 85°C 0.5 0.5 25°C 0.4 0.4 −40°C RON () RON () 2.5 VIN (V) FREQUENCY (Hz) 0.3 85°C 25°C −40°C 0.3 0.2 0.2 0.1 0.1 0 2 0 0.5 1.0 1.5 2.0 2.5 0 3.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VIN (V) VIN (V) Figure 11. RON vs. VIN vs. Temperature @ VCC = 3.0 V Figure 12. RON vs. VIN vs. Temperature @ VCC = 4.3 V http://onsemi.com 9 NLAS3799B, NLAS3799BL DEVICE ORDERING INFORMATION Package Type Tape & Reel Size† NLAS3799BMNR2G WQFN−16 (Pb−Free) 3000 / Tape & Reel NLAS3799BLMNR2G WQFN−16 (Pb−Free) 3000 / Tape & Reel NLAS3799BMUR2G UQFN−16 (Pb−Free) 3000 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WQFN16, 1.8x2.6, 0.4P CASE 488AP−01 ISSUE B DATE 25 JUN 2008 1 SCALE 5:1 PIN 1 REFERENCE 2X 2X L A D ÉÉÉ ÉÉÉ ÉÉÉ DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E ÉÉ ÉÉ EXPOSED Cu 0.15 C B MILLIMETERS MIN MAX 0.70 0.80 0.00 0.050 0.20 REF 0.15 0.25 1.80 BSC 2.60 BSC 0.40 BSC 0.30 0.50 0.00 0.15 0.40 0.60 MOUNTING FOOTPRINT C A3 8 0.562 0.0221 15 X L 9 e 1 DIM A A1 A3 b D E e L L1 L2 SEATING PLANE A1 4 A1 ÇÇ ÉÉ ALTERNATE CONSTRUCTIONS 0.08 C DETAIL A A3 MOLD CMPD DETAIL B A DETAIL B 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. L1 0.15 C 0.10 C L 0.400 0.0157 0.225 0.0089 1 12 2.900 0.1142 16 L2 16 X b 0.463 0.0182 0.10 C A B 0.05 C NOTE 3 1.200 0.0472 2.100 0.0827 SCALE 20:1 DOCUMENT NUMBER: DESCRIPTION: 98AON20790D WQFN16, 1.8 X 2.6, 0.4P mm Ǔ ǒinches Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN16 1.8x2.6, 0.4P CASE 488AU−01 ISSUE A DATE 01 AUG 2007 1 SCALE 5:1 A ÉÉ ÉÉ ÉÉ ÉÉ PIN 1 REFERENCE 2X D EDGE OF PACKAGE L1 E DETAIL A Bottom View (Optional) 0.10 C EXPOSED Cu 2X 0.10 C B TOP VIEW A 0.05 C 16X 0.05 C 5 15X A1 A1 SIDE VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MOLD CMPD ÉÉÉ ÉÉÉ DETAIL B Side View (Optional) SEATING PLANE C MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.127 REF 0.15 0.25 1.80 BSC 2.60 BSC 0.40 BSC 0.30 0.50 0.00 0.15 0.40 0.60 DIM A A1 A3 b D E e L L1 L3 A3 GENERIC MARKING DIAGRAM* ÇÇÇ ÇÇÇ ÇÇÇ 16 8 1 L XXM G G 9 4 e 1 12 16 16X L3 XX = Specific Device Code M = Date Code/Assembly Location G = Pb−Free Package (Note: Microdot may be in either location) 0.10 C A B b 0.05 C BOTTOM VIEW NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. MOUNTING FOOTPRINT 0.562 0.0221 0.400 0.0157 0.225 0.0089 1 2.900 0.1142 0.463 0.0182 1.200 0.0472 2.100 0.0827 SCALE 20:1 DOCUMENT NUMBER: DESCRIPTION: 98AON22494D mm Ǔ ǒinches Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 16 PIN UQFN, 1.8 X 2.6, 0.4P PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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