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NLAS3799_06

NLAS3799_06

  • 厂商:

    ONSEMI(安森美)

  • 封装:

  • 描述:

    NLAS3799_06 - Dual DPDT Ultra−Low RON Switch - ON Semiconductor

  • 数据手册
  • 价格&库存
NLAS3799_06 数据手册
NLAS3799, NLAS3799L Dual DPDT Ultra−Low RON Switch The NLAS3799 is an ultra−low RON DPDT and a 0.5 W RON DPDT analog switch. This device is designed for low operating voltage, high current switching of speaker output and earpiece for cellphone applications. It can switch a balanced stereo output. The NLAS3799 can handle a balanced microphone/speaker/ring−tone generator in a monophone mode. The device contains a break−before−make (BBM) feature. Features http://onsemi.com MARKING DIAGRAMS 16 1 1 WQFN−16 CASE 488AP • Single Supply Operation • • • • • • • • 1.65 to 3.6 V VCC Maximum Breakdown Voltage: 4.6 V Low Static Power NLAS3799 Interfaces with 2.8 V Chipset NLAS3799L Interfaces with 1.8 V Chipset These are Pb−Free Devices* Cell Phone Speaker/Microphone Switching Ringtone−Chip/Amplifier Switching Four Unbalanced (Single−Ended) Switches Stereo Balanced (Push−Pull) Switching NCA A−B IN NOB COMB 1 XX Typical Applications M G = Specific Device Code AR = NLAS3799 AT = NLAS3799L = Date Code/Assembly Location = Pb−Free Package COMA NOA Vcc NCD 16 15 14 13 Important Information • ESD Protection: • • • HBM (Human Body Model) > 8000 V MM (Machine Model) > 400 V Continuous Current Rating Through each Switch ±300 mA Conforms to: JEDEC MO−220, Issue H, Variation VEED−6 Package: 1.8 x 2.6 x 0.75 mm WQFN−16 Pb−Free 2 3 4 5 6 7 8 NCB GND NOCCOMC ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 1 January, 2006 − Rev. 1 Publication Order Number: NLAS3799/D ÇÇ ÇÇ 12 11 10 9 XXM G COMD NOD C−D IN NCC NLAS3799, NLAS3799L COM NC NO IN Figure 1. Input Equivalent Circuit PIN DESCRIPTION QFN PIN # 1, 3, 5, 7, 9, 11, 13, 15 2, 10 4, 8, 12, 16 6 14 Symbol NO A−D, NC A−D A−B IN, C−D IN COM A−D GND VCC Independent Channels Controls Common Channels Ground (V) Positive Supply Voltage Name and Function TRUTH TABLE IN H L *High impedance. NO ON OFF* NC OFF* ON http://onsemi.com 2 NLAS3799, NLAS3799L MAXIMUM RATINGS Symbol VCC VIS VIN Ianl1 Ianl−pk1 Iclmp Positive DC Supply Voltage Analog Input Voltage (VNO, VNC, or VCOM) Digital Select Input Voltage Continuous DC Current from COM to NC/NO Peak Current from COM to NC/NO, 10 Duty Cycle (Note 1) Continuous DC Current into COM/NO/NC with Respect to VCC or GND Parameter Value −0.5 to +4.6 −0.5 v VIS v VCC + 0.5 −0.5 v VIN v +VCC ±300 ±500 ±100 Unit V V V mA mA mA Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Defined as 10% ON, 90% OFF Duty Cycle. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VIS TA tr, tf DC Supply Voltage Digital Select Input Voltage Analog Input Voltage (NC, NO, COM) Operating Temperature Range Input Rise or Fall Time, IN VCC = 1.6 V − 2.7 V VCC = 3.0 V − 3.6 V Parameter Min 1.65 GND GND −40 Max 3.6 VCC VCC +85 20 10 Unit V V V °C ns/V http://onsemi.com 3 NLAS3799, NLAS3799L NLAS3799 DC CHARACTERISTICS − DIGITAL SECTION (Voltages Referenced to GND) Guaranteed Limit Symbol VIH VIL IIN IOFF ICC Parameter Minimum High−Level Input Voltage, Select Inputs Maximum Low−Level Input Voltage, Select Inputs Maximum Input Leakage Current, Select Inputs Power Off Leakage Current Maximum Quiescent Supply Current (Note 2) VIN = VCC or GND VIN = 3.6 V or GND Select and VIS = VCC or GND Condition VCC 3.0 3.6 3.0 3.6 3.6 0 1.65 to 3.6 25°C 1.4 1.7 0.5 0.5 ±0.1 ±0.5 ±1.0 −40°C to +85°C 1.4 1.7 0.5 0.5 ±1.0 ±2.0 ±2.0 Unit V V mA mA mA 2. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. NLAS3799 DC ELECTRICAL CHARACTERISTICS − ANALOG SECTION Guaranteed Maximum Limit 25°C Symbol RON Parameter NC/NO On−Resistance (Note 3) NC/NO On−Resistance Flatness (Notes 3 and 4) On−Resistance Match Between Channels (Notes 3 and 5) Condition VIN = VIL or VIN = VIH VIS = GND to VCC IINI = 100 mA ICOM = 100 mA VIS = 0 to VCC VIS = 1.5 V; ICOM = 100 mA VIS = 1.8 V; ICOM = 100 mA VIN = VIL or VIH VNO or VNC = 0.3 V VCOM = 3.3 V VIN = VIL or VIH VNO 0.3 V or 3.3 V with VNC floating or VNC 0.3 V or 3.3 V with VNO floating VCOM = 0.3 V or 3.3 V VCC 3.0 3.6 3.0 3.6 3.0 3.6 3.6 −10 Min Max 0.5 0.4 0.15 0.15 0.05 0.05 10 −100 −40°C to +85°C Min Max 0.5 0.4 0.15 0.15 0.05 0.05 100 nA Unit W RFLAT DRON W W INC(OFF) INO(OFF) ICOM(ON) NC or NO Off Leakage Current (Note 3) COM ON Leakage Current (Note 3) 3.6 −10 10 −100 100 nA 3. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. 4. Flatness is defined as the difference between the maximum and minimum value of On−resistance as measured over the specified analog signal ranges. 5. DRON = RON(MAX) − RON(MIN) between nS2 or nS1. http://onsemi.com 4 NLAS3799, NLAS3799L NLAS3799L DC CHARACTERISTICS − DIGITAL SECTION (Voltages Referenced to GND) Guaranteed Limit Symbol VIH VIL IIN IOFF ICC Parameter Minimum High−Level Input Voltage, Select Inputs Maximum Low−Level Input Voltage, Select Inputs Maximum Input Leakage Current, Select Inputs Power Off Leakage Current Maximum Quiescent Supply Current (Note 6) VIN = VCC or GND VIN = 3.6 V or GND Select and VIS = VCC or GND Condition VCC 3.0 3.6 3.0 3.6 3.6 0 1.65 to 3.6 25°C 1.2 1.3 0.5 0.5 ±0.1 ±0.5 ±10 −40 to +85°C 1.2 1.3 0.5 0.5 ±1.0 ±2.0 ±20 Unit V V mA mA mA 6. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. NLAS3799L DC ELECTRICAL CHARACTERISTICS − ANALOG SECTION Guaranteed Maximum Limit 25°C Symbol RON Parameter NC/NO On−Resistance (Note 7) NC/NO On−Resistance Flatness (Notes 7 and 8) On−Resistance Match Between Channels (Notes 7 and 9) Condition VIN = VIL or VIN = VIH VIS = GND to VCC IINI = 100 mA ICOM = 100 mA VIS = 0 to VCC VIS = 1.5 V; ICOM = 100 mA VIS = 1.8 V; ICOM = 100 mA VIN = VIL or VIH VNO or VNC = 0.3 V VCOM = 3.3 V VIN = VIL or VIH VNO 0.3 V or 3.3 V with VNC floating or VNC 0.3 V or 3.3 V with VNO floating VCOM = 0.3 V or 3.3 V VCC 3.0 3.6 3.0 3.6 3.0 3.6 3.6 −10 Min Max 0.5 0.5 0.15 0.15 0.05 0.05 10 −100 −40°C to +85°C Min Max 0.5 0.5 0.15 0.15 0.05 0.05 100 nA Unit W RFLAT DRON W W INC(OFF) INO(OFF) ICOM(ON) NC or NO Off Leakage Current (Note 7) COM ON Leakage Current (Note 7) 3.6 −10 10 −100 100 nA 7. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. 8. Flatness is defined as the difference between the maximum and minimum value of On−resistance as measured over the specified analog signal ranges. 9. DRON = RON(MAX) − RON(MIN) between NC1 and NC2 or between NO1 and NO2. http://onsemi.com 5 NLAS3799, NLAS3799L NLAS3799/NLAS3799L AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Maximum Limit 25°C Min Typ* Max 50 30 −40°C to +85°C Min Max 60 40 Unit ns ns ns 3.0 1.5 2 15 Symbol tON tOFF tBBM Parameter Turn−On Time Turn−Off Time Minimum Break−Before−Make Time Test Conditions RL = 50 W, CL = 35 pF (Figures 3 and 4) RL = 50 W, CL = 35 pF (Figures 3 and 4) VIS = 3.0 RL = 50 W, CL = 35 pF (Figure 2) VCC (V) 2.3 − 3.6 2.3 − 3.6 VIS (V) 1.5 1.5 Typical @ 25, VCC = 3.6 V CIN CSN CD Control Pin Input Capacitance SN Port Capacitance D Port Capacitance When Switch is Enabled 3.0 72 220 pF pF pF *Typical Characteristics are at 25°C. ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) VCC (V) 1.65 − 3.6 25°C Typical 19 Unit MHz Symbol BW Parameter Maximum On−Channel −3 dB Bandwidth or Minimum Frequency Response (Figure 9) Maximum Feed−through On Loss Off−Channel Isolation Charge Injection Select Input to Common I/O (Figure 8) Total Harmonic Distortion THD + Noise (Figure 7) Channel−to−Channel Crosstalk (Figure 10) Condition VIN centered between VCC and GND (Figure 5) VIN = 0 dBm @ 100 kHz to 50 MHz VIN centered between VCC and GND (Figure 5) f = 100 kHz; VIS = 1 V RMS; CL = 5.0 pF VIN centered between VCC and GND(Figure 5) VIN = VCC to GND, RIS = 0 W, CL = 1.0 nF Q = CL x DVOUT (Figure 6) FIS = 20 Hz to 20 kHz, RL = Rgen = 600 W, CL = 50 pF VIS = 2 VPP f = 100 kHz; VIS = 1.0 V RMS, CL = 5.0 pF, RL = 50 W VIN centered between VCC and GND (Figure 5) VONL VISO Q THD VCT 1.65 − 3.6 1.65 − 3.6 1.65 − 3.6 3.0 1.65 − 3.6 −0.06 −69 42 0.11 −90 dB dB pC % dB 10. Off−Channel Isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to off switch. http://onsemi.com 6 NLAS3799, NLAS3799L DUT VCC 0.1 mF 50 W Output VOUT 35 pF 90% Output Input GND tBMM 90% of VOH VCC Switch Select Pin GND Figure 2. tBBM (Time Break−Before−Make) VCC DUT VCC 0.1 mF Open Output VOUT 50 W 35 pF Output VOL Input tON tOFF Input 0V VOH 90% 90% 50% 50% Figure 3. tON/tOFF VCC DUT Output Open 50 W VOUT 35 pF Input VCC 50% 0V VOH Output VOL 10% 10% 50% Input tOFF tON Figure 4. tON/tOFF http://onsemi.com 7 NLAS3799, NLAS3799L 50 W Reference Input Output 50 W Generator 50 W DUT Transmitted Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VISO = Off Channel Isolation = 20 Log VONL = On Channel Loss = 20 Log VOUT VIN for VIN at 100 kHz VOUT VIN for VIN at 100 kHz to 50 MHz Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 W Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT Open Output VIN VCC GND CL Output Off Off DVOUT VIN On Figure 6. Charge Injection: (Q) http://onsemi.com 8 NLAS3799, NLAS3799L 0.14 0.13 0.12 0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 10 0 CHARGE INJECTION “Q” (pC) −5 −10 −15 −20 −25 −30 −35 −40 −45 100 1000 FREQUENCY (Hz) 10000 100000 0 0.5 1 1.5 VIN (V) 2 2.5 3 3.5 THD (%) Figure 7. Total Harmonic Distortion vs. Frequency Figure 8. Charge Injection @ VCC = 3.0 V 0 −3 MAGNITUDE (dB) 0.1 1 10 100 1000 −6 BW (dB) −9 −12 −15 −18 −21 0.01 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0.01 0.1 1 FREQUENCY (MHz) 10 100 FREQUENCY (MHz) Figure 9. Bandwidth vs. Frequency Figure 10. Cross−Talk vs. Frequency 0.5 0.45 0.4 0.35 RON (W) 0.3 0.25 0.2 0.15 0.1 0.05 0 0.0 0.5 1.0 1.5 VIN (V) 2.0 2.5 3.0 −40°C 85°C 25°C 0.45 0.4 0.35 0.3 RON (W) 0.25 0.2 −40°C 85°C 25°C 0.15 0.1 0.05 0.0 0.0 0.5 1.0 1.5 2.0 VIN (V) 2.5 3.0 3.5 4.0 Figure 11. RON vs. VIN vs. Temperature @ VCC = 3.0 V Figure 12. RON vs. VIN vs. Temperature @ VCC = 3.6 V http://onsemi.com 9 NLAS3799, NLAS3799L DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NLAS3799MNR2G NLAS3799LMNR2G Circuit Indicator NL NL Technology AS AS Device Function 3799 3799L Package Suffix MN MN Tape & Reel Suffix R2 R2 Package Type WQFN (Pb−Free) WQFN (Pb−Free) Tape & Reel Size† 3000 / Tape & Reel 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 NLAS3799, NLAS3799L PACKAGE DIMENSIONS WQFN16 (1.8x2.6x0.4P) CASE 488AP−01 ISSUE A D A PIN 1 REFERENCE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. DIM A A1 A3 b D E e L L1 SEATING PLANE MILLIMETERS MIN MAX 0.70 0.80 0.00 0.050 0.20 REF 0.15 0.25 1.80 BSC 2.60 BSC 0.40 BSC 0.30 0.50 0.40 0.60 2X 0.15 C 0.15 C 2X 0.10 C 0.08 C A1 A3 5 15 X L 4 9 8 L1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan : ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. ÉÉÉ ÉÉÉ ÉÉÉ 1 12 16 16 X B A C MOUNTING FOOTPRINT 0.562 0.0221 0.400 0.0157 0.225 0.0089 1 e 2.900 0.1142 b 0.10 C A B 0.05 C NOTE 3 0.463 0.0182 1.200 0.0472 2.100 0.0827 SCALE 20:1 mm inches http://onsemi.com 11 NLAS3799/D
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