NLAS4717MR2

NLAS4717 Analog Switch, High Bandwidth, Dual SPDT The NLAS4717 is an advanced CMOS analog switch fabricated in sub-micron silicon gate CMOS technology. The device is a dual independent Single Pole Double Throw (SPDT) switch featuring two low RDS(on) of 4.5  at 3.0 V. The device also features guaranteed Break-Before-Make (BBM) switching, assuring the switches never short the driver. The NLAS4717 is available in two small size packages: ♦Micro10: 3.0 x 5.0 mm ♦Flip-Chip-10: 2.0 x 1.5 mm Features http://onsemi.com MARKING DIAGRAMS A1 •Low RDS(on): 4.5  @ 3.0 V •Matching Between the Switches ±0.5  •Wide Low Voltage Range: 1.8 V to 5.5 V •High Bandwidth > 40 MHz •1.65 V to 5.5 V Operating Range •Low Threshold Voltages on Pins 4 and 8 (CTRL Pins) •Ultra-Low Charge Injection ≤ 6.0 pC •Low Standby Current – ICC = 1.0 nA (Max) @ TA = 25°C •OVT* on Pins 4 and 8 (CTRL Logic Pins) •Pb-Free Packages are Available FLIP-CHIP-10 CASE 489AA A1 4717 AYWWG G 10 4717 AYWG G Micro10 CASE 846B A Y W, WW G Typical Applications •Cell Phones •PDAs •MP3s •Digital Still Cameras 1 = Assembly Location = Year = Work Week = Pb-Free Package FUNCTION TABLE Important Information IN_ NO_ NC_ 0 1 OFF ON ON OFF •ESD Protection: ORDERING INFORMATION HBM = 2000 V, MM = 200 V •Latchup Max Rating: 200 mA (Per JEDEC EIA/JESD78) •Pin-to-Pin Compatible with MAX4717 Package Shipping† Flip-Chip-10 3000 / Tape & Reel NLAS4717FCT1G Flip-Chip-10 (Pb-Free) 3000 / Tape & Reel NLAS4717MR2 Micro10 4000 / Tape & Reel Micro10 (Pb-Free) 4000 / Tape & Reel Device NLAS4717FCT1 *OVT •Overvoltage Tolerance (OVT) specific pins to operate higher than normal supply voltages, with no damage to the devices or to signal integrity. NLAS4717MR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2007 May, 2007 - Rev. 9 1 Publication Order Number: NLAS4717/D NLAS4717 GND VCC 1 10 NO2 NO1 2 9 COM2 COM1 3 8 IN2 IN1 NC1 4 7 5 6 B1 NC1 C1 A1 NC2 IN1 C2 A2 IN2 COM1 C3 A3 COM2 NO1 C4 A4 NO2 NC2 B4 GND VCC Flip-Chip-10 (Top View) Micro10 (Top View) Figure 1. Device Circuit Diagrams and Pin Configurations MAXIMUM RATINGS Symbol Parameter V+ Positive DC Supply Voltage Value Unit *0.5 to )7.0 V *0.5 v VIS v VCC )0.5 V *0.5 v VI v)7.0 V VIS Analog Input Voltage (VNO, VNC, or VCOM) (Note 1) VIN Digital Select Input Voltage IIK DC Current, Into or Out of Any Pin (Continuous) $100 mA IPK Peak Current (10% Duty Cycle) $200 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Signal voltage on NC, NO, and COM exceeding VCC or GND are clamped by the internal diodes. Limit forward diode current to maximum current rating. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.8 5.5 V V+ DC Supply Voltage VIN Digital Select Input Voltage GND 5.5 V VIS Analog Input Voltage (NC, NO, COM) GND VCC V TA Operating Temperature Range -40 +85 °C tr, tf Input Rise or Fall Time, SELECT 0 0 100 20 ns/V VCC = 3.3 V $ 0.3 V VCC = 5.0 V $ 0.5 V ANALOG SWITCH DC CHARACTERISTICS -40 °C to +85°C Symbol Parameter Condition VCC (V) Min VIH Input Logic High Voltage VOUT = 0.1 V 1.65 to 2.2 VCC x 0.55 - IOUT ≤ 20 A 2.7 to 3.6 VCC x 0.5 - 4.5 to 5.5 2.0 - VOUT = -VCC - 0.1 V 1.65 to 2.2 - VCC x 0.2 IOUT ≤ 20 A 2.7 to 3.6 - VCC x 0.2 4.5 to 5.5 - 0.8 VIL Input Logic Low Voltage Max Unit V V IIN Input Leakage Current VIN – VCC or GND 5.0 -100 +100 nA VCC Power Supply Range All - 1.65 5.5 V ICC Supply Current VIN = VCC or GND 1.8 - 1.0 A IOUT = 0 A 3.3 - 1.0 5.0 - 1.0 - 0 VCC VIS Analog Signal Range Key parameter http://onsemi.com 2 V NLAS4717 ANALOG SWITCH CHARACTERISTICS - Digital Section (Voltages Referenced to GND) -40 °C to +85°C Symbol Parameter Condition VCC (V) Min Max Unit RON ON Resistance (Note 2) VCC = 3.0 V 3.0 - Typ 4.5  5.0 - 3.5 3.6 - ICOM = 10 mA VNO or VNC = VIH or VIL VCC = 5.0 V ICOM = 10 mA VNO or VNC = VIH or VIL RON ON Resistance Match Between Channels (Note 2 and 3) VCC = 3.6 V 0.1 0.4   ICOM = 10 mA VNO or VNC = VIH or VIL VCC = 5.5 V 5.5 ICOM = 10 mA VNO or VNC = VIH or VIL RFLAT[ON] ON Resistance Flatness (Note 4) ICOM = 10 mA 3.0 - 1.5 5.5 - 1.36 3.6 -1.0 0.01 +1.0 5.5 -1.0 0.01 +1.0 3.6 -2.0 0.01 +2.0 5.5 -2.0 0.01 +2.0 VIS = 0 to VCC ICOM = 10 mA VIS = 0 to VCC INO_[OFF] INC_[OFF] NO_, NC_ Off-Leakage Current (Note 5) VCC = 3.6 V nA VCOM = 0.3 V or 3.3 V VNO or VNC = 0.3 V or 3.3 V VCC = 5.5 V VCOM = 0 V or 5.0 V VNO or VNC = 0 V or 5.0 V ICOM_[ON] COM_ On-Leakage Current (Note 5) VCC = 3.6 V nA VCOM = 0.3 V or 3.3 V VNO or VNC = 0.3 V or 3.3 V VCC = 5.5 V VCOM = 0 V or 5.0 V VNO or VNC = 0 V or 5.0 V ANALOG SWITCH AC CHARACTERISTICS -40 °C to +85°C Symbol Parameter Condition VCC (V) Min Typ Max Unit tON Turn-On Time VNC_, VNO_ = VIH or VIL 1.8 to 5.5 - - 30 nS 1.8 to 5.5 - - 40 nS - - 8.0 - nS - - 0.15 2.0 nS RL = 300 , CL = 35 pF VIN[x] = VIH or VIL tOFF Turn-Of f Time VNC_, VNO_ = VIH or VIL RL = 300 , CL = 35 pF VIN[x] = VIH or VIL tBBM tSKEW 2. 3. 4. 5. Break-Before-Make Time Delay (Note 5) Skew (Note 5) VNC_, VNO_ = 1.5 V RL = 300 , CL = 35 pF RS = 39 , CL = 50 pF RON characterized for VCC range (1.65 V to 5.5 V). RON = RON(MAX) - RON(MIN). RFLAT[ON] = RON(MAX) - RON(MIN), measured over VCC range. Guaranteed by design. http://onsemi.com 3 NLAS4717 ANALOG SWITCH APPLICATION CHARACTERISTICS -40 °C to +85°C Min Typ Symbol Parameter Condition VCC (V) Q Charge Injection VIN = VCC to GND 3.0 6.0 RIn = 0 , CL = 1.0 nF 5.0 9.0 1.65 to 5.5 -50 Max Unit pC Q = CL - VOUT VISO Off-Isolation f = 10 MHz dB VNO_, VNC_ = 1.0 Vp-p RL = 50 , CL = 5.0 pF f = 1.0 MHz -75 VNO_, VNC_ = 1.0 Vp-p RL = 50 , CL = 5.0 pF VCT Cross-T alk f = 10 MHz 1.65 to 5.5 -80 dB VNO_, VNC_ = 1.0 Vp-p RL = 50 , CL = 5.0 pF f = 1.0 MHz -1 10 VNO_, VNC_ = 1.0 Vp-p RL = 50 , CL = 5.0 pF BW On-Channel -3.0 db Bandwidth Signal = 0 dB 1.8 to 5.0 40 MHz RL = 50 , CL = 5.0 pF THD Total Harmonic Distortion VCOM = 2.0 Vp-p, RL = 600  TA = 25°C - 0.02 % CNO_[OFF] CNC_[OFF] NO_, NC_ OFF-Capacitance F = 10 MHz - 30 pF CNO_[ON] CNC_[ON] NO_, NC_ ON-Capacitance F = 10 MHz - 110 pF http://onsemi.com 4 NLAS4717 3.0 2.0 2.5 +85°C +25°C 1.0 RDS(on) () RDS(on) () 1.5 -40 °C 2.0 +85°C 1.5 +25°C 1.0 -40 °C 0.5 0.5 0.0 0.0 1.0 2.0 3.0 4.0 0.0 0.0 5.0 0.5 1.0 VCOM (V) 2.5 3.0 Figure 3. Low RDS(on) @ VCC = 3.0 V 1.5 1.5 1.4 1.4 1.3 1.3 RDS(on) () RDS(on) () 2.0 VCOM (V) Figure 2. Low RDS(on) @ VCC = 5.0 V 1.2 1.1 1.0 1.5 1.2 1.1 3.0 V 1.0 5.0 V 0.9 0.9 0.8 -40C 0.8 -40C +85C +25C +85C +25C TEMPERATURE (°C) TEMPERATURE (°C) Figure 4. Delta RDS(on) @ VCC = 5.0 V Figure 5. Delta RDS(on) @ VCC = 3.0 V 8 1 6 4 Q (cP) THD (%) 5.0 V 2 0 3.0 V -2 0.1 -4 -6 -8 3.0 V 0.01 -10 0.0 1.0 2.0 3.0 4.0 10 5.0 100 1000 10000 VCOM (V) FREQUENCY (Hz) Figure 6. Charge Injection Figure 7. Total Harmonic Distortion http://onsemi.com 5 100000 NLAS4717 20 0 5 VCC = 1.65 V to 5.5 V Bandwidth -3 dB -20 0 ( (dB) (dB) -40 -60 Cross-T alk -80 -5 -100 -120 -140 0.001 VCC = 1.8 V to 5.0 V TA = -55°C to +125°C OFF-Isolation 0.01 0.1 1 10 -10 100 0.1 (MHz) 10 1 (MHz) Figure 8. Frequency Response Figure 9. Bandwidth and Phase http://onsemi.com 6 100 NLAS4717 VCC DUT VCC Input Output GND VOUT 0.1 F 50  tBMM 35 pF 90% 90% of VOH Output Switch Select Pin GND Figure 10. tBBM (Time Break-Before-Make) VCC Input DUT VCC 0.1 F 50% Output VOUT Open 50% 0V 50  VOH 90% 35 pF 90% Output VOL Input tON tOFF Figure 11. tON/tOFF VCC VCC Input DUT Output 50  50% 0V VOUT Open 50% VOH 35 pF Output Input tOFF Figure 12. tON/tOFF http://onsemi.com 7 10% 10% VOL tON NLAS4717 50  DUT Reference Transmitted Input Output 50  Generator 50  Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VONL = On Channel Loss = 20 Log ǒVOUTǓ for VIN at 100 kHz to 50 MHz VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3.0 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50  Figure 13. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT VCC VIN Output Open GND CL Output Off VIN Figure 14. Charge Injection: (Q) http://onsemi.com 8 On Off VOUT MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 10 PIN FLIP−CHIP CASE 489AA−01 ISSUE A DATE 04 MAY 2004 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. SCALE 4:1 D 4X A B 0.10 C MILLIMETERS DIM MIN MAX A −−− 0.650 A1 0.210 0.270 A2 0.280 0.380 D 1.965 BSC E 1.465 BSC b 0.250 0.350 e 0.500 BSC D1 1.500 BSC 1.000 BSC E1 E PIN ONE CORNER A1 0.10 C A2 GENERIC MARKING DIAGRAM* A 0.075 C C SEATING PLANE xxxx YYWW D1 A1 e 10 X b 0.15 C A B 0.05 C C E1 B xxxx YY WW = Specific Device Code = Year = Work Week A DOCUMENT NUMBER: DESCRIPTION: 1 2 3 4 e 98AON12946D 10 PIN FLIP−CHIP *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS Micro10 CASE 846B−03 ISSUE D DATE 07 DEC 2004 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846B−01 OBSOLETE. NEW STANDARD 846B−02 −A− −B− K D 8 PL 0.08 (0.003) PIN 1 ID G 0.038 (0.0015) −T− M T B S A C SEATING PLANE H MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.95 1.10 0.20 0.30 0.50 BSC 0.05 0.15 0.10 0.21 4.75 5.05 0.40 0.70 DIM A B C D G H J K L S L J GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 10X 1.04 0.041 0.32 0.0126 3.20 0.126 8X xxxx AYW 10X 4.24 0.167 0.50 0.0196 INCHES MIN MAX 0.114 0.122 0.114 0.122 0.037 0.043 0.008 0.012 0.020 BSC 0.002 0.006 0.004 0.008 0.187 0.199 0.016 0.028 SCALE 8:1 5.28 0.208 xxxx A Y W
= Device Code = Assembly Location = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “
”, may or may not be present. mm 
inches Micro10 DOCUMENT NUMBER: 98AON03799D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD:  Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com Micro10 DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98AON03799D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ BY J. HOSKINS. 09 NOV 2000 A DIM “D” WAS 0.25−0.4MM/0.10−0.016IN. ADDED NOTE 5. USED ON: WAS 10 LEAD TSSOP, PITCH 0.65 REQ BY J. HOSKINS. 13 NOV 2000 B CHANGED “USED ON” WAS: 10 LEAD TSSOP, PITCH 0.50MM. REQ BY A. HAMID. 11 JUL 2001 C CHANGED “D” DIMENSION MAX FROM 0.35 TO 0.30MM AND 0.014 TO 0.012IN. REQ BY D. TRUHITTE. 31 JUL 2003 D ADDED FOOTPRINT INFORMATION. REQ. BY K. 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