NLV27WZ04DFT2G

DATA SHEET www.onsemi.com Dual Inverter MARKING DIAGRAMS NL27WZ04 6 The NL27WZ04 is a high performance dual inverter operating from a 1.65 to 5.5 V supply. 1 SC−88 DF SUFFIX CASE 419B 1 Features • • • • • • • • • Designed for 1.65 V to 5.5 V VCC Operation 2.0 ns tPD at VCC = 5 V (Typ) Inputs/Outputs Overvoltage Tolerant up to 5.5 V IOFF Supports Partial Power Down Protection Sink 32 mA at 4.5 V Available in SC−88, SC−74 and UDFN6 Packages Chip Complexity < 100 FETs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant A1 A2 1 1 SC−74 CASE 318F−05 6 Y2 XXX MG G 1 TSOP−6 CASE 318G−02 1 1 XXX MG G 1 UDFN6 1.45 x 1.0 CASE 517AQ UDFN6 1.0 x 1.0 CASE 517BX Y1 XXXM G G XM XM 1 X, XXX = Specific Device Code M = Date Code* G = Pb−Free Package Figure 1. Logic Symbol (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2013 March, 2022 − Rev. 13 1 Publication Order Number: NL27WZ04/D NL27WZ04 A1 A1 1 6 Y1 GND 2 5 VCC A2 3 4 Y2 Y1 1 6 GND 2 5 VCC A2 3 4 Y2 (SC−88/SC−74/TSOP−6) UDFN6 Figure 2. Pinout (Top View) PIN ASSIGNMENT FUNCTION TABLE A Input Y Output A1 L H 2 GND H L 3 A2 4 Y2 5 VCC 6 Y1 Pin Function 1 www.onsemi.com 2 NL27WZ04 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage SC−88 (NLV) SC−88, SC−74, UDFN6 −0.5 to +7.0 −0.5 to +6.5 V VIN DC Input Voltage SC−88 (NLV) SC−88, SC−74, UDFN6 −0.5 to +7.0 −0.5 to +6.5 V VOUT Characteristics DC Output Voltage SC−88 (NLV) Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +7.0 −0.5 to +7.0 V DC Output Voltage SC−88, SC−74, UDFN6 Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +6.5 −0.5 to +6.5 V VIN < GND −50 mA VOUT < GND −50 mA IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±100 mA −65 to +150 °C ICC or IGND TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88 SC−74 UDFN6 377 320 154 °C/W PD Power Dissipation in Still Air SC−88 SC−74 UDFN6 332 390 812 mW Level 1 − UL 94 V−0 @ 0.125 in − 2000 1000 N/A V $100 mA MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup Oxygen Index: 28 to 34 ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model (NLV) Charged Device Model Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Rise and Fall Time VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V Min Max Unit 1.65 5.5 V 0 5.5 V 0 0 0 VCC 5.5 5.5 −55 +125 °C 0 0 0 0 20 20 10 5 ns Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 NL27WZ04 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL TA = 255C *55°C 3 TA 3 125°C VCC (V) Min Typ Max Min Max Units High−Level Input Voltage (NLV) 1.65 to 1.95 0.75 x VCC − − 0.75 x VCC − V 2.3 to 5.5 0.70 x VCC − − 0.70 x VCC − High−Level Input Voltage 1.65 to 1.95 0.65 x VCC − − 0.65 x VCC − 2.3 to 5.5 0.70 x VCC − − 0.70 x VCC − Low−Level Input Voltage (NLV) 1.65 to 1.95 − − 0.25 x VCC − 0.25 x VCC 2.3 to 5.5 − − 0.30 x VCC − 0.30 x VCC Low−Level Input Voltage 1.65 to 1.95 − − 0.35 x VCC − 0.35 x VCC 2.3 to 5.5 − − 0.30 x VCC − 0.30 x VCC Parameter Condition V V V VOH High−Level Output Voltage VIN = VIH or VIL IOH = −100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3 3 4.5 VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.52 2.1 2.4 2.7 2.5 4 − − − − − − − VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 − − − − − − − VOL Low−Level Output Voltage VIN = VIH or VIL IOH = 100 mA IOH = 3 mA IOH = 8 mA IOH = 12 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3 3 4.5 − − − − − − − − 0.08 0.12 0.2 0.24 0.26 0.31 0.1 0.24 0.3 0.4 0.4 0.55 0.55 − − − − − − − 0.1 0.24 0.3 0.4 0.4 0.55 0.55 Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 − − ±0.1 − ±1.0 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 − − 1.0 − 10 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 − − 1.0 − 10 mA IIN V V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS TA = 25°C Symbol tPLH, tPHL Condition VCC (V) Min Typ Max Min Max Units RL = 1 MW, CL = 15 pF 1.65 to 1.95 − 2.3 9.2 − 11.0 ns RL = 1 MW, CL = 15 pF 2.3 to 2.7 − 3.0 5.1 − 5.6 RL = 1 MW, CL = 15 pF 3.0 to 3.6 − 2.2 3.4 − 3.8 − 2.9 4.5 − 5.0 − 1.8 2.8 − 3.1 − 2.3 3.6 − 4.0 Parameter Propagation Delay A to Y (Figure 3 and 4) *55°C 3 TA 3 125°C RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 4.5 to 5.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. www.onsemi.com 4 NL27WZ04 OPEN 2 x VCC Test OUTPUT DUT CL, pF RL, W R1 , W tPLH / tPHL Open tPLZ / tPZL 2 x VCC 50 500 500 tPHZ / tPZH GND 50 500 500 R1 See AC Characteristics Table X = Don’t Care RL RT Switch Position GND CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ ~VCC VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH OUTPUT tPHL Vmo tPZH VOH Vmo tPHZ VOH VOH − VY Vmo OUTPUT VOL ~0 V Figure 4. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL tPZL, tPLZ, tPZH, tPHZ VY, V 1.65 to 1.95 VCC/2 VCC/2 VCC/2 0.15 2.3 to 2.7 VCC/2 VCC/2 VCC/2 0.15 3.0 to 3.6 VCC/2 VCC/2 VCC/2 0.3 4.5 to 5.5 VCC/2 VCC/2 VCC/2 0.3 www.onsemi.com 5 NL27WZ04 DEVICE ORDERING INFORMATION Packages Specific Device Code Pin 1 Orientation (See below) Shipping† NL27WZ04DFT2G SC−88 M5 Q4 3000 / Tape & Reel NL27WZ04DFT2G−L22348** SC−88 M5 Q4 3000 / Tape & Reel NLV27WZ04DFT2G* SC−88 M5 Q4 3000 / Tape & Reel NL27WZ04DFT1G SC−88 M5 Q2 3000 / Tape & Reel NLV27WZ04DFT1G* SC−88 M5 Q2 3000 / Tape & Reel NL27WZ04DBVT1G SC−74 M5 Q4 3000 / Tape & Reel NL27WZ04DTT1G** TSOP−6 M5 Q4 3000 / Tape & Reel NL27WZ04MU1TCG (In Development) UDFN6, 1.45 x 1.0, 0.5P 2 (Rotated 90° CW) Q4 3000 / Tape & Reel NL27WZ04MU3TCG (In Development) UDFN6, 1.0 x 1.0, 0.35P E (Rotated 180° CW) Q4 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. **Please refer to NLV specifications for this device. Pin 1 Orientation in Tape and Reel www.onsemi.com 6 NL27WZ04 PACKAGE DIMENSIONS SC*88/SC70*6/SOT*363 CASE 419B*02 ISSUE Y 2X aaa H D D H A D GAGE PLANE 65 4 L L2 E1 E DETAIL A 12 3 aaa C 2X bbb H 2X 3 TIPS D e B 6X b ddd TOP VIEW C A-B D M A2 DETAIL A A 6X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU− SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI− TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. ccc C A1 SIDE VIEW C SEATING PLANE END VIEW c RECOMMENDED SOLDERING FOOTPRINT* 6X 0.30 6X 0.66 2.50 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 DIM A A1 A2 b C D E E1 e L L2 aaa bbb ccc ddd MILLIMETERS MIN NOM MAX *** *** 1.10 0.00 *** 0.10 0.70 0.90 1.00 0.15 0.20 0.25 0.08 0.15 0.22 1.80 2.00 2.20 2.00 2.10 2.20 1.15 1.25 1.35 0.65 BSC 0.26 0.36 0.46 0.15 BSC 0.15 0.30 0.10 0.10 INCHES MIN NOM MAX *** *** 0.043 0.000 ***0.004 0.027 0.035 0.039 0.006 0.008 0.010 0.003 0.006 0.009 0.070 0.078 0.086 0.078 0.082 0.086 0.045 0.049 0.053 0.026 BSC 0.010 0.014 0.018 0.006 BSC 0.006 0.012 0.004 0.004 NL27WZ04 PACKAGE DIMENSIONS SC−74 CASE 318F−05 ISSUE N D 6 HE 1 5 4 2 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05. E b e 0.05 (0.002) q c A L A1 SOLDERING FOOTPRINT* 2.4 0.094 0.95 0.037 1.9 0.074 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 − 10° MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° NL27WZ04 PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE V D ÉÉ ÉÉ 6 E1 1 5 2 NOTE 5 H L2 4 GAUGE PLANE E 3 L b DETAIL Z e C SEATING PLANE c A 0.05 M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. A1 DETAIL Z RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 3.20 6X 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9 DIM A A1 b c D E E1 e L L2 M MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10° − NL27WZ04 PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉÉ ÉÉÉ EXPOSED Cu TOP VIEW 0.10 C DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 SIDE VIEW A2 e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 www.onsemi.com 10 NL27WZ04 PACKAGE DIMENSIONS UDFN6, 1x1, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X 0.08 C 2X ÉÉÉ ÉÉÉ 0.08 C 0.05 C L1 A B D L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. L3 E DETAIL A ALTERNATE TERMINAL CONSTRUCTION ÉÉ ÉÉ ÇÇ TOP VIEW EXPOSED Cu DETAIL B A3 A1 MOLD CMPD DETAIL B A ALTERNATE CONSTRUCTION 0.05 C SIDE VIEW C SEATING PLANE 3 1 6X MILLIMETERS MIN MAX 0.50 0.65 0.00 0.05 0.13 REF 0.17 0.23 1.00 BSC 1.00 BSC 0.35 0.20 0.40 −−− 0.15 0.26 0.33 RECOMMENDED SOLDERING FOOTPRINT* e DETAIL A DIM A A1 A3 b D E e L L1 L3 L 6X 0.25 6X 0.52 1.20 6 4 BOTTOM VIEW 6X PACKAGE OUTLINE b 0.07 M C A B 0.05 M C 1 0.35 PITCH NOTE 3 DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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