NOA2301
Digital Proximity Sensor
with Interrupt
Description
The NOA2301 combines an advanced digital proximity sensor and
LED driver coupled with a tri−mode I2C interface with interrupt
capability in an integrated monolithic device. Multiple power
management features and very low active sensing power consumption
directly address the power requirements of battery operated mobile
phones and mobile internet devices.
The proximity sensor measures reflected light intensity with a high
degree of precision and excellent ambient light rejection. The
NOA2301 enables a proximity sensor system with a 16:1
programmable LED drive current range and a 30 dB overall proximity
detection range.
The NOA2301 is ideal for improving the user experience by
enhancing the screen interface with the ability to measure distance for
near/far detection in real time.
Features
• Proximity Sensor and LED Driver in One Device
• Proximity Detection Distance Threshold I2C Programmable with
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CUDFN8
CU SUFFIX
CASE 505AP
1
PIN CONNECTIONS
VDD
1
8
SCL
VSS
2
7
SDA
LED_GND
3
6
NC
LED
4
5
INT
(Top View)
12−bit Resolution and Eight Integration Time Ranges (16−bit
ORDERING INFORMATION
effective resolution)
Effective for Measuring Distances up to 200 mm and Beyond
Device
Package
Shipping†
Excellent IR and Ambient Light Rejection including Sunlight (up to
NOA2301CUTAG*
CUDFN8
2500 /
(Pb−Free)
Tape & Reel
50K lux) and CFL Interference
Programmable LED Drive Current from 10 mA to 160 mA in 5 mA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
Steps, No External Resistor Required
refer to our Tape and Reel Packaging Specifications
User Programmable LED Pulse Frequency
Brochure, BRD8011/D.
*Temperature Range: −40°C to 80°C.
Very Low Power Consumption
2
♦ Stand−by current 2.8 A (monitoring I C interface only, Vdd=3V)
♦ Proximity sensing average operational current 100 A
• No External Components Required except the IR LED
♦ Average LED sink current 75 A
and Power Supply Decoupling Caps
Programmable interrupt function including independent
• These Devices are Pb−Free, Halogen Free/BFR Free
upper and lower threshold detection or threshold based
and are RoHS Compliant
hysteresis
Applications
Level or Edge Triggered Interrupts
• Senses human presence in terms of distance for saving
Proximity persistence feature reduces interrupts by
display power and preventing inadvertent command
providing hysteresis to filter fast transients such as
initiation in applications such as:
camera flash
♦ Smart phones, mobile internet devices, MP3 players,
Automatic power down after single measurement or
GPS
continuous measurements with programmable interval
♦ Mobile device displays and backlit keypads
time
♦ Headphone use detection
Wide Operating Voltage Range (2.3 V to 3.6 V)
♦ Cameras
Wide Operating Temperature Range (−40°C to 80°C)
♦ Game controllers, media players
I2C Serial Communication Port
• Contactless Switches
♦ Standard mode – 100 kHz
♦ Touch−less switches for light controls
♦ Fast mode – 400 kHz
♦ Money detection, coin or paper
♦ High speed mode – 3.4 MHz
♦ Sanitary switches for medical environments
© Semiconductor Components Industries, LLC, 2017
January, 2017 − Rev. 2
1
Publication Order Number:
NOA2301/D
NOA2301
VDD_I2C
VDD
1μF
NOA2301
MCU
ADC
INT
SCL
INT
SCL
SDA
SDA
VDD
I2C Interface
&
Control
DSP
22μF
h
Proximity
IR Diode
LED
Drive
IR LED
LED
Osc
VSS_LED
VSS
Figure 1. NOA2301 Application Block Diagram
Table 1. PAD FUNCTION DESCRIPTION
Pad
Pad Name
Description
1
VDD
Power pad
2
VSS
Ground pad
3
LED_GND
4
LED
IR LED output pad
5
INT
Interrupt output pad, open−drain
6
SDA
Bi−directional data signal for communications with the I2C master
7
SCL
External I2C clock supplied by the I2C master
Ground pad for IR LED driver
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2
0.01μF
NOA2301
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input power supply
VDD
4.0
V
Input voltage range
Vin
−0.3 to VDD + 0.2
V
Output voltage range
Vout
−0.3 to VDD + 0.2
V
TJ(max)
100
°C
TSTG
−40 to 80
°C
ESD Capability, Human Body Model (Note 1)
ESDHBM
2
kV
ESD Capability, Charged Device Model (Note 1)
ESDCDM
500
V
Moisture Sensitivity Level
MSL
3
−
Lead Temperature Soldering (Note 2)
TSLD
260
°C
Maximum Junction Temperature
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Charged Device Model tested per ESD−STM5.3.1−1999
Latchup Current Maximum Rating: 100 mA per JEDEC standard: JESD78
2. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Table 3. OPERATING RANGES
Rating
Power supply voltage
Power supply current, stand−by mode (VDD = 3.0 V)
Power supply average current, PS operating 300 s integration
time and 100 ms intervals
LED average sink current, PS operating at 300 s integration time
and 100 ms intervals and LED current set at 50 mA
I2C signal voltage (Note 3)
Symbol
Min
VDD
2.3
Typ
Max
Unit
3.6
V
IDDSTBY
2.8
5
A
IDDPS
47
100
A
ILED
75
VDD_I2C
1.6
Low level input voltage (VDD_I2C related input levels)
VIL
High level input voltage (VDD_I2C related input levels)
1.8
A
2.0
V
−0.3
0.3 VDD_I2C
V
VIH
0.7 VDD_I2C
VDD_I2C + 0.2
V
Hysteresis of Schmitt trigger inputs
Vhys
0.1 VDD_I2C
Low level output voltage (open drain) at 3 mA sink current (INT)
VOL
V
0.2 VDD_I2C
V
II
−10
10
A
Output low current (INT)
IOL
3
−
mA
Operating free−air temperature range
TA
−40
80
°C
Input current of IO pin with an input voltage between 0.1 VDD and
0.9 VDD
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. The I2C interface is functional to 3.0 V, but timing is only guaranteed up to 2.0 V. High Speed mode is guaranteed to be functional to 2.0 V.
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NOA2301
Table 4. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over 2.3 V < VDD < 3.6 V,
1.7 V < VDD_I2C < 1.9 V, −40°C < TA < 80°C, 10 pF < Cb < 100 pF) (See Note 4)
Parameter
LED pulse current
Symbol
Min
ILED_pulse
10
Typ
Max
Unit
160
mA
LED pulse current step size
ILED_pulse_step
LED pulse current accuracy
ILED_acc
−20
+20
%
Interval Timer Tolerance
Tolf_timer
−35
+35
%
Edge Triggered Interrupt Pulse Width
SCL clock frequency
Hold time for START condition. After this period, the first
clock pulse is generated.
Low period of SCL clock
High period of SCL clock
SDA Data hold time
SDA Data set−up time
Rise time of both SDA and SCL (input signals) (Note 5)
Fall time of both SDA and SCL (input signals) (Note 5)
Rise time of SDA output signal (Note 5)
Fall time of SDA output signal (Note 5)
Set−up time for STOP condition
5
PWINT
mA
S
50
fSCL_std
10
100
fSCL_fast
100
400
fSCL_hs
100
3400
THD;STA_std
4.0
−
tHD;STA_fast
0.6
−
tHD;STA_hs
0.160
−
tLOW_std
4.7
−
tLOW_fast
1.3
−
tLOW_hs
0.160
−
tHIGH_std
4.0
−
tHIGH_fast
0.6
−
tHIGH_hs
0.060
−
tHD;DAT_d_std
0
3.45
tHD;DAT_d_fast
0
0.9
tHD;DAT_d_hs
0
0.070
tSU;DAT_std
250
−
tSU;DAT_fast
100
−
tSU;DAT_hs
10
tr_INPUT_std
20
1000
tr_INPUT_fast
20
300
tr_INPUT_hs
10
40
tf_INPUT_std
20
300
tf_INPUT_fast
20
300
tf_INPUT_hs
10
40
tr_OUT_std
20
300
tr_OUT_fast
20 + 0.1 Cb
300
tr_OUT_hs
10
80
tf_OUT_std
20
300
tf_OUT_fast
20 + 0.1 Cb
300
tf_OUT_hs
10
80
tSU;STO_std
4.0
−
tSU;STO_fast
0.6
−
tSU;STO_hs
0.160
−
kHz
S
S
S
S
nS
nS
nS
nS
nS
S
4. Refer to Figure 2 and Figure 3 for more information on AC characteristics.
5. The rise time and fall time are dependent on both the bus capacitance (Cb) and the bus pull−up resistor Rp. Max and min pull−up resistor
values are determined as follows: Rp(max) = tr (max)/(0.8473 x Cb) and Rp(min) = (Vdd_I2C – Vol(max))/Iol.
6. Cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 100 pF. Bus capacitance
up to 400 pF is supported, but at relaxed timing.
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NOA2301
Table 4. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over 2.3 V < VDD < 3.6 V,
1.7 V < VDD_I2C < 1.9 V, −40°C < TA < 80°C, 10 pF < Cb < 100 pF) (See Note 4)
Parameter
Bus free time between STOP and START condition
Symbol
Min
Typ
Max
Unit
S
tBUF_std
4.7
−
tBUF_fast
1.3
−
tBUF_hs
0.160
−
Capacitive load for each bus line (including all parasitic
capacitance) (Note 6)
Cb
10
100
pF
Noise margin at the low level (for each connected device − including hysteresis)
VnL
0.1 VDD
−
V
Noise margin at the high level (for each connected device − including hysteresis)
VnH
0.2 VDD
−
V
4. Refer to Figure 2 and Figure 3 for more information on AC characteristics.
5. The rise time and fall time are dependent on both the bus capacitance (Cb) and the bus pull−up resistor Rp. Max and min pull−up resistor
values are determined as follows: Rp(max) = tr (max)/(0.8473 x Cb) and Rp(min) = (Vdd_I2C – Vol(max))/Iol.
6. Cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 100 pF. Bus capacitance
up to 400 pF is supported, but at relaxed timing.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 5. OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications are for VDD = 3.0 V, TA = 25°C)(Note 7)
Parameter
Symbol
Detection range, Tint = 4800 s, ILED = 160 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), LED Modulation Frequency = 308 kHz, Sample Delay = 250 ns, SNR = 7:1
DPS_4800_WHITE_
MOD
200
mm
Detection range, Tint = 4800 s, ILED = 160 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_4800_WHITE_
160
148
mm
Detection range, Tint = 4800 s, ILED = 25 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_4800_WHITE_
25
66
mm
Detection range, Tint = 2400 s, ILED = 50 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_2400_WHITE_
25
80
mm
Detection range, Tint = 1800 s, ILED = 75 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_1800_WHITE_
75
88
mm
Detection range, Tint = 1200 s, ILED = 100 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_1200_WHITE_
100
90
mm
Detection range, Tint = 600 s, ILED = 125 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_600_WHITE_
125
88
mm
Detection range, Tint = 600 s, ILED = 100 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_600_WHITE_
100
76
mm
Detection range, Tint = 300 s, ILED = 150 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_300_WHITE_
150
74
mm
Detection range, Tint = 300 s, ILED = 100 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_300_WHITE_
100
62
mm
Detection range, Tint = 150 s, ILED = 100 mA, 860 nm IR LED (OSRAM SFH4650), White Reflector (RGB = 220, 224, 223), SNR = 8:1
DPS_150_WHITE_
100
48
mm
Detection range, Tint = 1200 s, ILED = 100 mA, 860 nm IR LED (OSRAM SFH4650), Grey Reflector (RGB = 162, 162, 160), SNR = 6:1
DPS_1200_GREY_
100
64
mm
Detection range, Tint = 2400 s, ILED = 150 mA, 860 nm IR LED (OSRAM SFH4650), Black Reflector (RGB = 16, 16, 15), SNR = 6:1
DPS_2400_BLACK_
150
36
mm
Saturation power level
PDMAX
0.8
mW/cm2
Measurement resolution, Tint = 150 s
MR150
11
bits
7. Measurements performed with default modulation frequency and sample delay unless noted.
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5
Min
Typ
Max
Unit
NOA2301
Table 5. OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications are for VDD = 3.0 V, TA = 25°C)(Note 7)
Parameter
Symbol
Min
Typ
Max
Unit
Measurement resolution, Tint = 300 s
MR300
12
bits
Measurement resolution, Tint = 600 s
MR600
13
bits
Measurement resolution, Tint = 1200 s
MR1200
14
bits
Measurement resolution, Tint = 1800 s
MR1800
15
bits
Measurement resolution, Tint = 2400 s
MR2400
15
bits
Measurement resolution, Tint = 3600 s
MR3600
16
bits
Measurement resolution, Tint = 4800 s
MR4800
16
bits
7. Measurements performed with default modulation frequency and sample delay unless noted.
Figure 2. AC Characteristics, Standard and Fast Modes
Figure 3. AC Characteristics, High Speed Mode
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NOA2301
TYPICAL CHARACTERISTICS
16K
9K
14K
8K
160 mA
7K
12K
80 mA
PS COUNT
PS COUNT
160 mA
10K
8K
40 mA
6K
6K
5K 80 mA
4K
3K
4K 20 mA
2K
2K
1K
0 10 mA
0
50
100
150
200
40 mA
20 mA
0 10 mA
0
250
50
100
150
200
DISTANCE (mm)
DISTANCE (mm)
Figure 4. PS Response vs. Distance and LED
Current (1200 ms Integration Time, White
Reflector (RGB = 220, 224, 223))
Figure 5. PS Response vs. Distance and LED
Current (1200 ms Integration Time, Grey
Reflector (RGB = 162, 162, 160))
45K
1200
160 mA
4800 s
40K
1000
800
600
PS COUNT
PS COUNT
35K
80 mA
400
30K
25K
2400 s
20K
15K
40 mA
150 s
1200 s
10K
200 20 mA
600 s
5K
0 10 mA
0
300 s
0
50
100
150
200
0
50
100
200
250
DISTANCE (mm)
DISTANCE (mm)
Figure 6. PS Response vs. Distance and LED
Current (1200 ms Integration Time, Black
Reflector (RGB = 16, 16, 15))
Figure 7. PS Response vs. Distance and
Integration Time (80 mA LED Current, White
Reflector (RGB = 220, 224, 223))
3500
2500
2.3 V
3.0 V
3.6 V
3000
Ambient
CFL 3000K (2kLux)
Halogen (40kLux)
Incandescent (6kLux)
White LED (7kLux)
2000
PS COUNT
2500
PS COUNT
150
2000
1500
1500
1000
1000
500
500
0
0
0
50
100
150
200
0
250
50
100
150
200
250
DISTANCE (mm)
DISTANCE (mm)
Figure 8. PS Response vs. Distance and Supply
Voltage (1200 ms Integration Time, 40 mA LED
Current, White Reflector (RGB = 220, 224, 223))
Figure 9. PS Ambient Rejection (1200 ms
Integration Time, 100 mA LED Current, White
Reflector (RGB = 220, 224, 223))
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NOA2301
TYPICAL CHARACTERISTICS
180
25
160
20
140
IDD (A)
IDD (A)
120
15
10
100
80
60
40
5
20
0
0
2.0
2.5
3.0
3.5
4.0
2.0 2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6 3.8
VDD (V)
VDD (V)
Figure 10. Supply Current vs. Supply Voltage
TINT = 300 ms, TR = 100 ms
Figure 11. Supply Current vs. Supply Voltage
TINT = 1200 ms, TR = 50 ms
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NOA2301
Description of Operation
Proximity Sensor Architecture
obviously cannot exceed the LED pulse width or there
would be no sampling of the data when the LED is
illuminated. There is also a minimum step size of 125 ns.
The delay values are programmed as follows:
0 or 1: No delay
2−31: Selects (N−1)*125 ns
N must be less than or equal to the
PS_LED_FREQUENCY Value
The default delay is 0x05 (500 ns)
Table 6 shows some common LED pulse frequencies and
sample delays and the resulting register values.
NOA2301 combines an advanced digital proximity
sensor, LED driver and a tri−mode I2C interface as shown in
Figure 1. The LED driver draws a modulated current
through the external IR LED to illuminate the target. The
LED current is programmable over a wide range. The
infrared light reflected from the target is detected by the
proximity sensor photo diode. The proximity sensor
employs a sensitive photo diode fabricated in
ON Semiconductor’s standard CMOS process technology.
The modulated light received by the on−chip photodiode is
converted to a digital signal using a variable slope
integrating ADC with a default resolution (at 300 s) of
12−bits, unsigned. The signal is processed to remove all
unwanted signals resulting in a highly selective response to
the generated light signal. The final value is stored in the
PS_DATA register where it can be read by the I2C interface.
Table 6. COMMON LED PULSE FREQUENCY SETTINGS
LED Pulse
Frequency
(KHz)
Sample
Delay
(ns)
PS_LED_
FREQUENCY
Register
(0x0D) Value
PS_SAMPLE_
DELAY
Register
(0x0E) Value
Proximity Sensor LED Frequency and Delay Settings
200
250
0x14
0x03
The LED current modulation frequency is user selectable
from approximately 128 KHz to 2 MHz using the PS_LED_
FREQUENCY register. An internal precision 4 MHz
oscillator provides the frequency reference. The 4 MHz
clock is divided by the value in register 0x0D to determine
the pulse rate. The default is 0x10 (16) which results in an
LED pulse frequency of 250 KHz (4 s period). Values
below 200 KHz and above 1 MHz are not recommended.
Switching high LED currents can result in noise injected
into the proximity sensor receiver causing inaccurate
readings. The PS receiver has a user programmable delay
from the LED edge to when the receiver samples the data
(PS_SAMPLE_DELAY – register 0x0E). Longer delays
may reduce the effect of switching noise but also reduce the
sensitivity.
Since the value of the delay is dependent on the pulse
frequency, its value must be carefully computed. The value
200
500
0x14
0x05
200
750
0x14
0x07
250
250
0x10
0x03
250
500
0x10
0x05
500
250
0x08
0x03
500
500
0x08
0x05
1000
250
0x04
0x03
Device
Address
A[6:0] WRITE
011 0111
0
ACK
0
I2C Interface
The NOA2301 acts as an I2C slave device and supports
single register and block register read and write operations.
All data transactions on the bus are 8 bits long. Each data
byte transmitted is followed by an acknowledge bit. Data is
transmitted with the MSB first.
Register
Address
D[7:0] ACK
0000 0110 0
Register
Data
D[7:0] ACK
0000 0000 0
0x6E
7
Start
Condition
8
8
Figure 12. I2C Write Command
Figure 12 shows an I2C write operation. Write
transactions begin with the master sending an I2C start
sequence followed by the seven bit slave address (NOA2301
= 0x37) and the write(0) command bit. The NOA2301 will
acknowledge this byte transfer with an appropriate ACK.
Next the master will send the 8 bit register address to be
written to. Again the NOA2301 will acknowledge reception
with an ACK. Finally, the master will begin sending 8 bit
data segment(s) to be written to the NOA2301 register bank.
Stop
Condition
The NOA2301 will send an ACK after each byte and
increment the address pointer by one in preparation for the
next transfer. Write transactions are terminated with either
an I2C STOP or with another I2C START (repeated START).
Figure 13 shows an I2C read command sent by the master
to the slave device. Read transactions begin in much the
same manner as the write transactions in that the slave
address must be sent with a write(0) command bit.
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NOA2301
Device
Address
A[6:0] WRITE
011 0111 0
0x6E
Register
Address
D[7:0] ACK
ACK
0
0000 0110 0
Register
Data
D[7:0] ACK
0000 0000 0
7
8
8
Device
Address
Register
Data [A]
Register
Data [A+1]
Start Condition
Stop Condition
A[6:0] READ
011 0111 1
0x6F
ACK
0
D[7:0] ACK
bbbb bbbb 0
7
Start Condition
D[7:0] NACK
bbbb bbbb 1
8
8
Figure 13. I2C Read Command
Stop Condition
characteristics of its I/O cells in preparation for I2C
transactions at the I2C high speed data protocol rates. From
then on, standard I2C commands may be issued by the
master, including repeated START commands. When the
I2C master terminates any I2C transaction with a STOP
sequence, the master and all slave devices immediately
revert back to standard/fast mode I/O performance.
By using a combination of high−speed mode and a block
write operation, it is possible to quickly initialize the
NOA2301 I2C register bank.
After the NOA2301 sends an ACK, the master sends the
register address as if it were going to be written to. The
NOA2301 will acknowledge this as well. Next, instead of
sending data as in a write, the master will re−issue an I2C
START (repeated start) and again send the slave address and
this time the read(1) command bit. The NOA2301 will then
begin shifting out data from the register just addressed. If the
master wishes to receive more data (next register address),
it will ACK the slave at the end of the 8 bit data transmission,
and the slave will respond by sending the next byte, and so
on. To signal the end of the read transaction, the master will
send a NACK bit at the end of a transmission followed by an
I2C STOP.
The NOA2301 also supports I2C high−speed mode. The
transition from standard or fast mode to high−speed mode is
initiated by the I2C master. A special reserve device address
is called for and any device that recognizes this and supports
high speed mode immediately changes the performance
NOA2301 Data Registers
NOA2301 operation is observed and controlled by
internal data registers read from and written to via the
external I2C interface. Registers are listed in Table 7.
Default values are set on initial power up or via a software
reset command (register 0x01).
The I2C Slave Address of the NOA2301 is 0x37.
Table 7. NOA2301 DATA REGISTERS
Address
Type
Name
Description
0x00
R
PART_ID
0x01
RW
RESET
0x02
RW
INT_CONFIG
0x0D
RW
PS_LED_FREQUENCY
0x0E
RW
PS_SAMPLE_DELAY
PS Sample Delay
0x0F
RW
PS_LED_CURRENT
PS LED pulse current
0x10
RW
PS_TH_UP_MSB
PS Interrupt upper threshold, most significant bits
NOA2301 part number and revision IDs
Software reset control
Interrupt pin functional control settings
PS LED Pulse Frequency
0x11
RW
PS_TH_UP_LSB
PS Interrupt upper threshold, least significant bits
0x12
RW
PS_TH_LO_MSB
PS Interrupt lower threshold, most significant bits
0x13
RW
PS_TH_LO_LSB
PS Interrupt lower threshold, least significant bits
0x14
RW
PS_FILTER_CONFIG
0x15
RW
PS_CONFIG
0x16
RW
PS_INTERVAL
PS Interval time configuration
0x17
RW
PS_CONTROL
PS Operation mode control
0x40
R
INTERRUPT
0x41
R
PS_DATA_MSB
PS measurement data, most significant bits
0x42
R
PS_DATA_LSB
PS measurement data, least significant bits
PS Interrupt Filter configuration
PS Integration time configuration
Interrupt status
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10
NOA2301
PART_ID Register (0x00)
The PART_ID register provides part and revision identification. These values are hard−wired at the factory and cannot be
modified.
Table 8. PART_ID Register (0x00)
Bit
7
6
Field
5
4
3
2
Part number ID
Field
Bit
Default
Part number ID
7:4
0101
Revision ID
3:0
NA
1
0
Revision ID
Description
Part number identification
Silicon revision number
RESET Register (0x01)
Software reset is controlled by this register. Setting this
register followed by an I2C_STOP sequence will
immediately reset the NOA2301 to the default startup
standby state. Triggering the software reset has virtually the
same effect as cycling the power supply tripping the internal
Power on Reset (POR) circuitry.
Table 9. RESET Register (0x01)
Bit
7
6
5
4
Field
3
2
1
0
NA
Field
NA
SW_reset
Bit
Default
7:1
XXXXXXX
0
0
SW_reset
Description
Don’t care
Software reset to startup state
INT_CONFIG Register (0x02)
INT_CONFIG register controls the external interrupt pin function.
Table 10. INT_CONFIG Register (0x02)
Bit
7
6
5
Field
Field
NA
Edge_triggered
auto_clear
polarity
4
3
NA
Bit
Default
7:3
XXXXX
2
0
1
0
1
0
2
1
0
edge_triggered
auto_clear
polarity
Description
Don’t care
0
Interrupt pin stays asserted while the INTERRUPT register bit is set (level)
1
Interrupt pin pulses at the end of each measurement while the INTERRUPT
register bit is set
0
When an interrupt is triggered, the interrupt pin remains asserted until cleared
by an I2C read of INTERRUPT register
1
Interrupt pin state is updated after each measurement
0
Interrupt pin active low when asserted
1
Interrupt pin active high when asserted
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11
NOA2301
PS_LED_FREQUENCY Register (0x0D)
The LED FREQUENCY register controls the frequency
of the LED pulses. The LED modulation frequency is
determined by dividing 4 MHz by the register value. Valid
divisors are 2−31. The default value is 16 which results in an
LED pulse frequency of 250 KHz (one pulse every 4 s).
Table 11. PS_LED_FREQUENCY Register (0x0D)
Bit
7
6
Field
5
4
3
NA
Field
2
1
0
LED_modulation frequency
Bit
Default
NA
7:5
XXX
LED_modulation _frequency
4:0
10000
Description
Don’t care
Defines the divider of the 4MHz clock to generate the LED pulses.
Valid values are 2−31
PS_SAMPLE_DELAY Register (0x0E)
decimal value of the register. Default value is 0x05 (500 ns).
N must be less than or equal to the value in register 0x0D
(PS_LED_FREQUENCY). See the Description of
Operation section for more information on programming
this register.
The PS_SAMPLE_DELAY register controls the time
delay after an LED pulse edge before the resulting signal is
sampled by the proximity sensor. This can be used to reduce
the effect of noise caused by the LED current switching.
There is no delay for programmed values of 0x00 or 0x001.
For other values the delay is (N−1)*125 ns, where N is the
Table 12. PS_SAMPLE_DELAY Register (0x0E)
Bit
7
6
Field
5
4
3
NA
Field
2
1
0
sample_delay
Bit
Default
NA
7:5
XXX
sample_delay
4:0
00101
Description
Don’t care
Defines the delay from the LED pulse edge before the pulse is sampled
PS_LED_CURRENT Register (0x0F)
The LED_CURRENT register controls how much current
the internal LED driver sinks through the IR LED during
modulated illumination. The current sink range is 5 mA plus
a binary weighted value of the LED_Current register times
5 mA, for an effective range of 10 mA to 160 mA in steps of
5 mA. The default setting is 50 mA. A register setting of 00
turns off the LED Driver.
Table 13. PS_LED_CURRENT Register (0x0F)
Bit
7
6
Field
Field
5
4
NA
Bit
Default
NA
7:5
XXX
LED_Current
4:0
01001
3
2
1
0
LED_Current
Description
Don’t care
Defines current sink during LED modulation. Binary weighted value times 5 mA plus 5 mA
www.onsemi.com
12
NOA2301
PS_TH Registers (0x10 – 0x13)
threshold hysteresis value where the interrupt would be
cleared. Setting the PS_hyst_trig low reverses the function
such that the PS_TH_LO register sets the lower threshold at
which an interrupt will be set and the PS_TH_UP represents
the hysteresis value at which the interrupt would be
subsequently cleared. Hysteresis functions only apply in
“auto_clear” INT_CONFIG mode.
The controller software must ensure the settings for LED
current, sensitivity range, and integration time (LED pulses)
are appropriate for selected thresholds. Setting thresholds to
extremes (default) effectively disables interrupts.
With hysteresis not enabled (see PS_CONFIG register),
the PS_TH registers set the upper and lower interrupt
thresholds of the proximity detection window. Interrupt
functions compare these threshold values to data from the
PS_DATA registers. Measured PS_DATA values outside
this window will set an interrupt according to the
INT_CONFIG register settings.
With hysteresis enabled, threshold settings take on a
different meaning. If PS_hyst_trig is set, the PS_TH_UP
register sets the upper threshold at which an interrupt will be
set, while the PS_TH_LO register then sets the lower
Table 14. PS_TH_UP Registers (0x10 – 0x11)
Bit
7
6
5
Field
4
3
2
1
0
1
0
PS_TH_UP_MSB(0x10), PS_TH_UP_LSB(0x11)
Field
Bit
Default
Description
PS_TH_UP_MSB
7:0
0xFF
Upper threshold for proximity detection, MSB
PS_TH_UP_LSB
7:0
0xFF
Upper threshold for proximity detection, LSB
Table 15. PS_TH_LO Registers (0x12 – 0x13)
Bit
7
6
5
Field
4
3
2
PS_TH_LO_MSB(0x12), PS_TH_LO_LSB(0x13)
Field
Bit
Default
Description
PS_TH_LO_MSB
7:0
0x00
Lower threshold for proximity detection, MSB
PS_TH_LO_LSB
7:0
0x00
Lower threshold for proximity detection, LSB
PS_FILTER_CONFIG Register (0x14)
to set an interrupt. The default setting of 1 out of 1 effectively
turns the filter off and any single measurement exceeding
thresholds can trigger an interrupt. N must be greater than or
equal to M. A setting of 0 for either M or N is not allowed
and disables the PS interrupt.
PS_FILTER_CONFIG register provides a hardware
mechanism to filter out single event occurrences or similar
anomalies from causing unwanted interrupts. Two 4 bit
registers (M and N) can be set with values such that M out
of N measurements must exceed threshold settings in order
Table 16. PS_FILTER_CONFIG Register (0x14)
Bit
7
6
Field
5
4
3
2
filter_N
Field
1
filter_M
Bit
Default
Description
filter_N
7:4
0001
Filter N
filter_M
3:0
0001
Filter M
www.onsemi.com
13
0
NOA2301
PS_CONFIG Register (0x15)
consumed by the LED. The default is 1200 s integration
period.
Hyst_enable and hyst_trigger work with the PS_TH
(threshold) settings to provide jitter control of the INT
function.
Proximity measurement sensitivity is controlled by
specifying the integration time. The integration time sets the
number of LED pulses during the modulated illumination.
The LED modulation frequency remains constant with a
period of 1.5 s. Changing the integration time affects the
sensitivity of the detector and directly affects the power
Table 17. PS_CONFIG Register (0x15)
Bit
7
Field
6
NA
Field
NA
hyst_enable
5
4
3
hyst_enable
hyst_trigger
NA
Bit
Default
7:6
XX
5
0
hyst_trigger
4
0
NA
3
X
2:0
011
integration_time
2
1
0
integration_time
Description
Don’t Care
0
Disables hysteresis
1
Enables hysteresis
0
Lower threshold with hysteresis
1
Upper threshold with hysteresis
Don’t care
000
150 s integration time
001
300 s integration time
010
600 s integration time
011
1200 s integration time
100
1800 s integration time
101
2400 s integration time
110
3600 s integration time
111
4800 s integration time
PS_INTERVAL Register (0x16)
The PS_INTERVAL register sets the wait time between
consecutive proximity measurements in PS_Repeat mode.
The register is binary weighted times 10 in milliseconds plus
10 ms. The range is therefore 10 ms to 1.28 s. The default
startup value is 0x04 (50 ms).
Table 18. PS_INTERVAL Register (0x16)
Bit
7
Field
NA
Field
NA
Interval
Bit
6
5
4
3
2
1
0
interval
Default
7
X
6:0
0x04
Description
Don’t care
0x00 to 0x7F
Interval time between measurement cycles. Binary weighted value
times 10 ms plus a 10 ms offset.
www.onsemi.com
14
NOA2301
PS_CONTROL Register (0x17)
The PS_CONTROL register is used to control the
functional mode and commencement of proximity sensor
measurements. The proximity sensor can be operated in
either a single shot mode or consecutive measurements
taken at programmable intervals.
Both single shot and repeat modes consume a minimum
of power by immediately turning off LED driver and sensor
circuitry after each measurement. In both cases the quiescent
current is less than the IDDSTBY parameter. These automatic
power management features eliminate the need for power
down pins or special power down instructions.
Table 19. PS_CONTROL Register (0x17)
Bit
7
6
5
Field
4
3
2
NA
Field
1
0
PS_Repeat
PS_OneShot
Bit
Default
7:2
XXXXXX
PS_Repeat
1
0
Initiates new measurements at PS_Interval rates
PS_OneShot
0
0
Triggers proximity sensing measurement. In single shot mode this bit clears
itself after cycle completion.
NA
Description
Don’t care
INTERRUPT Register (0x40)
The INTERRUPT register displays the status of the interrupt pin. If “auto_clear” is disabled (see INT_CONFIG register),
reading this register also will clear the interrupt.
Table 20. INTERRUPT Register (0x40)
Bit
7
6
Field
5
4
NA
Field
NA
3
2
INT
Bit
Default
7:5
XXX
1
0
PS_intH
PS_intL
Description
Don’t care
INT
4
0
NA
3:2
XX
Status of external interrupt pin (1 is asserted)
PS_intH
1
0
Interrupt caused by PS exceeding maximum
PS_intL
0
0
Interrupt caused by PS falling below the minimum
Don’t care
PS_DATA Registers (0x41 – 0x42)
The PS_DATA registers store results from completed
proximity measurements. When an I2C read operation
begins, the current PS_DATA registers are locked until the
operation is complete (I2C_STOP received) to prevent
possible data corruption from a concurrent measurement
cycle.
Table 21. PS_DATA Registers (0x41 – 0x42)
Bit
7
6
5
Field
4
3
2
PS_DATA_MSB(0x41), PS_DATA_LSB(0x42)
Field
Bit
Default
Description
PS_DATA_MSB
7:0
0x00
Proximity measurement data, MSB
PS_DATA_LSB
7:0
0x00
Proximity measurement data, LSB
www.onsemi.com
15
1
0
NOA2301
Proximity Sensor Operation
Sending an I2C_STOP sequence at the end of the write
signals the internal state machines to wake up and begin the
next measurement cycle. Figure 14 and Figure 15 illustrate
the activity of key signals during a proximity sensor
measurement cycle. The cycle begins by starting the
precision oscillator and powering up the proximity sensor
receiver. Next, the IR LED current is modulated according
to the LED current setting at the chosen LED frequency and
the values during both the on and off times of the LED are
stored (illuminated and ambient values). Finally, the
proximity reading is calculated by subtracting the ambient
value from the illuminated value and storing the result in the
16 bit PS_Data register. In One−shot mode, the PS receiver
is then powered down and the oscillator is stopped. If Repeat
mode is set, the PS receiver is powered down for the
specified interval and the process is repeated. With default
configuration values (receiver integration time = 1200 s),
the total measurement cycle will be less than 2 ms.
NOA2301 operation is divided into three phases: power
up, configuration and operation. On power up the device
initiates a reset which initializes the configuration registers
to their default values and puts the device in the standby
state. At any time, the host system may initiate a software
reset by writing 0x01 to register 0x01. A software reset
performs the same function as a power−on−reset.
The configuration phase may be skipped if the default
register values are acceptable, but typically it is desirable to
change some or all of the configuration register values.
Configuration is accomplished by writing the desired
configuration values to registers 0x02 through 0x17.
Writing to configuration registers can be done with either
individual I2C byte−write commands or with one or more
I2C block write commands. Block write commands specify
the first register address and then write multiple bytes of data
in sequence. The NOA2301 automatically increments the
register address as it acknowledges each byte transfer.
Proximity sensor measurement is initiated by writing
appropriate values to the CONTROL register (0x17).
I2C Stop
50 − 200μs
PS Power
9μs
0 − 100μs
4MHz Osc On
~600μs
LED Burst
8 clks 12μs
Integration Time
Integration
100 − 150μs
Data Available
Figure 14. Proximity Sensor One−Shot Timing
(Repeat)
Interval
I2C Stop
PS Power
50 − 200μs
9μs
0 − 100μs
4MHz Osc On
LED Burst
~600μs
8 clks 12μs
Integration Time
Integration
100 − 150μs
Data Available
Figure 15. Proximity Sensor Repeat Timing
www.onsemi.com
16
NOA2301
Example Programming Sequence
The following pseudo code configures the NOA2301
proximity sensor in repeat mode with 50 ms wait time
between each measurement and then runs it in an interrupt
driven mode. When the controller receives an interrupt, the
interrupt determines if the interrupts was caused by the
proximity sensor and if so, reads the PS_Data from the
device, sets a flag and then waits for the main polling loop
to respond to the proximity change.
external subroutine I2C_Read_Byte (I2C_Address, Data_Address);
external subroutine I2C_Read_Block (I2C_Address, Data_Start_Address, Count, Memory_Map);
external subroutine I2C_Write_Byte (I2C_Address, Data_Address, Data);
external subroutine I2C_Write_Block (I2C_Address, Data_Start_Address, Count, Memory_Map);
subroutine Initialize_PS () {
MemBuf[0x02]
MemBuf[0x0F]
MemBuf[0x10]
MemBuf[0x11]
MemBuf[0x12]
MemBuf[0x13]
MemBuf[0x14]
MemBuf[0x15]
MemBuf[0x16]
MemBuf[0x17]
=
=
=
=
=
=
=
=
=
=
0x02;
0x09;
0x8F;
0xFF;
0x70;
0x00;
0x11;
0x09;
0x0A;
0x02;
//
//
//
//
//
//
//
//
//
//
INT_CONFIG assert interrupt until cleared
PS_LED_CURRENT 50mA
PS_TH_UP_MSB
PS_TH_UP_LSB
PS_TH_LO_MSB
PS_TH_LO_LSB
PS_FILTER_CONFIG turn off filtering
PS_CONFIG 300us integration time
PS_INTERVAL 50ms wait
PS_CONTROL enable continuous PS measurements
I2C_Write_Block (I2CAddr, 0x02, 37, MemBuf);
}
subroutine I2C_Interupt_Handler () {
// Verify this is a PS interrupt
INT = I2C_Read_Byte (I2CAddr, 0x40);
if (INT == 0x11 || INT == 0x12) {
// Retrieve and store the PS data
PS_Data_MSB = I2C_Read_Byte (I2CAddr, 0x41);
PS_Data_LSB = I2C_Read_Byte (I2CAddr, 0x42);
NewPS = 0x01;
}
}
subroutine main_loop () {
I2CAddr = 0x37;
NewPS = 0x00;
Initialize_PS ();
loop {
// Do some other polling operations
if (NewPS == 0x01) {
NewPS = 0x00;
// Do some operations with PS_Data
}
}
}
www.onsemi.com
17
NOA2301
Physical Location of Photodiode Sensor
The physical locations of the NOA2301 proximity sensor photodiode is shown in Figure 16 referenced to the lower left hand
corner of the package.
Photodiode
Pin 1
1.022 mm
0.15 mm × 0.15 mm
0.836 mm
Figure 16. Photodiode Locations
www.onsemi.com
18
NOA2301
PACKAGE DIMENSIONS
CUDFN8, 2x2, 0.5P
CASE 505AP
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
D
ÍÍ
ÍÍ
ÍÍ
E
DIM
A
A1
b
D
D2
E
E2
e
L
TOP VIEW
A
0.05 C
0.05 C
NOTE 4
A1
SIDE VIEW
D2
1
C
8X
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
L
(*Note: Clear package, no marking is present)
4
RECOMMENDED
MOUNTING FOOTPRINT*
E2
8
5
e
e/2
8X
8X
1.55
b
0.10 C A B
0.05 C
MILLIMETERS
MIN
MAX
0.55
0.65
0.00
0.05
0.20
0.30
2.00 BSC
1.30
1.50
2.00 BSC
0.70
0.90
0.50 BSC
0.25
0.35
0.47
NOTE 3
BOTTOM VIEW
0.95
2.30
1
0.50
PITCH
8X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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